JPH04129737A - Electric laminated sheet - Google Patents
Electric laminated sheetInfo
- Publication number
- JPH04129737A JPH04129737A JP25147590A JP25147590A JPH04129737A JP H04129737 A JPH04129737 A JP H04129737A JP 25147590 A JP25147590 A JP 25147590A JP 25147590 A JP25147590 A JP 25147590A JP H04129737 A JPH04129737 A JP H04129737A
- Authority
- JP
- Japan
- Prior art keywords
- allyl ester
- resin
- ester resin
- acid
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 36
- -1 allyl ester Chemical class 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 18
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 11
- 239000011342 resin composition Substances 0.000 claims abstract description 11
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 15
- 239000011889 copper foil Substances 0.000 abstract description 14
- 229920006395 saturated elastomer Polymers 0.000 abstract description 14
- 150000005846 sugar alcohols Polymers 0.000 abstract description 8
- 150000007519 polyprotic acids Polymers 0.000 abstract description 5
- 239000000178 monomer Substances 0.000 abstract description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 abstract description 3
- 125000004185 ester group Chemical group 0.000 abstract description 3
- 150000002148 esters Chemical class 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- 229920000728 polyester Polymers 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 18
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000013078 crystal Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N propylene glycol Substances CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000000123 paper Substances 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 150000001298 alcohols Chemical class 0.000 description 5
- ZDNFTNPFYCKVTB-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,4-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C=C1 ZDNFTNPFYCKVTB-UHFFFAOYSA-N 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 239000002655 kraft paper Substances 0.000 description 4
- 150000002978 peroxides Chemical class 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 235000015278 beef Nutrition 0.000 description 2
- 235000013405 beer Nutrition 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 238000005809 transesterification reaction Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- NIDNOXCRFUCAKQ-UMRXKNAASA-N (1s,2r,3s,4r)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1[C@H]2C=C[C@@H]1[C@H](C(=O)O)[C@@H]2C(O)=O NIDNOXCRFUCAKQ-UMRXKNAASA-N 0.000 description 1
- DJKGDNKYTKCJKD-BPOCMEKLSA-N (1s,4r,5s,6r)-1,2,3,4,7,7-hexachlorobicyclo[2.2.1]hept-2-ene-5,6-dicarboxylic acid Chemical compound ClC1=C(Cl)[C@]2(Cl)[C@H](C(=O)O)[C@H](C(O)=O)[C@@]1(Cl)C2(Cl)Cl DJKGDNKYTKCJKD-BPOCMEKLSA-N 0.000 description 1
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 1
- XSZYESUNPWGWFQ-UHFFFAOYSA-N 1-(2-hydroperoxypropan-2-yl)-4-methylcyclohexane Chemical compound CC1CCC(C(C)(C)OO)CC1 XSZYESUNPWGWFQ-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- PMUPSYZVABJEKC-UHFFFAOYSA-N 1-methylcyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1(C)CCCCC1C(O)=O PMUPSYZVABJEKC-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- CHUGKEQJSLOLHL-UHFFFAOYSA-N 2,2-Bis(bromomethyl)propane-1,3-diol Chemical compound OCC(CO)(CBr)CBr CHUGKEQJSLOLHL-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ODGCZQFTJDEYNI-UHFFFAOYSA-N 2-methylcyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1(C)C=CCCC1C(O)=O ODGCZQFTJDEYNI-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- XIRDTMSOGDWMOX-UHFFFAOYSA-N 3,4,5,6-tetrabromophthalic acid Chemical compound OC(=O)C1=C(Br)C(Br)=C(Br)C(Br)=C1C(O)=O XIRDTMSOGDWMOX-UHFFFAOYSA-N 0.000 description 1
- WZHHYIOUKQNLQM-UHFFFAOYSA-N 3,4,5,6-tetrachlorophthalic acid Chemical compound OC(=O)C1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1C(O)=O WZHHYIOUKQNLQM-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- 241000283690 Bos taurus Species 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- XEUCQOBUZPQUMQ-UHFFFAOYSA-N Glycolone Chemical compound COC1=C(CC=C(C)C)C(=O)NC2=C1C=CC=C2OC XEUCQOBUZPQUMQ-UHFFFAOYSA-N 0.000 description 1
- UWIULCYKVGIOPW-UHFFFAOYSA-N Glycolone Natural products CCOC1=C(CC=CC)C(=O)N(C)c2c(O)cccc12 UWIULCYKVGIOPW-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 235000018936 Vitellaria paradoxa Nutrition 0.000 description 1
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Natural products CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 1
- 150000001253 acrylic acids Chemical class 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001334 alicyclic compounds Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- GBMDVOWEEQVZKZ-UHFFFAOYSA-N methanol;hydrate Chemical compound O.OC GBMDVOWEEQVZKZ-UHFFFAOYSA-N 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003022 phthalic acids Chemical class 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-M pivalate Chemical compound CC(C)(C)C([O-])=O IUGYQRQAERSCNH-UHFFFAOYSA-M 0.000 description 1
- 229950010765 pivalate Drugs 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229940070710 valerate Drugs 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気機器、電子機器、通信機器等に使用される
電気用積層板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrical laminate used in electrical equipment, electronic equipment, communication equipment, etc.
従来より、電気用積層板としては、紙−フェノール、ガ
ラスーエボキンなどが一般に用いられている。ここで電
気用積層板とは、例えば各種電子部品の基板等に用いら
れる肉厚が0.15〜5mmの積層板を意味するもので
ある。Conventionally, paper-phenol, glass-evoquin, and the like have been generally used as electrical laminates. Here, the electrical laminate refers to a laminate having a wall thickness of 0.15 to 5 mm, which is used, for example, as a substrate for various electronic components.
ところが、紙−フェノール積層板を製造する場合には、
フェノール樹脂の硬化に伴い水等の反応副生物か発生し
、この反応副生物が積層板の物性に悪影響を与えるとい
う問題があり、これを避けるためには、通常大型のプレ
ス機などで過大な圧力をかける必要が生じる。さらに、
紙−フェノール積層板は、誘電率、誘電正接、耐トラツ
キング等の電気特性が悪いという欠点がある。さらに、
紙−フェノールまたはガラスーエポキン積層板を製造す
る場合、通常樹脂を溶剤に溶かして溶液とし、この溶液
を基材に含浸させ、この含浸させた基材から溶剤を除去
することによりプリプレグと称する中間体を形成し、こ
のプリプレグを高温加圧下で積層することにより積層板
か製造されていた。However, when manufacturing paper-phenol laminates,
As the phenolic resin hardens, reaction by-products such as water are generated, and this reaction by-product has a negative effect on the physical properties of the laminate. It becomes necessary to apply pressure. moreover,
Paper-phenol laminates have the disadvantage of poor electrical properties such as dielectric constant, dielectric loss tangent, and tracking resistance. moreover,
When manufacturing paper-phenolic or glass-epoxy laminates, an intermediate called prepreg is usually produced by dissolving the resin in a solvent to form a solution, impregnating the base material with this solution, and removing the solvent from the impregnated base material. A laminate was manufactured by laminating the prepregs under high temperature and pressure.
しかしながら、このようなプリプレグ法で積層板を製造
した場合は、原料価格や設備費が高くなり、また工程も
複雑であるという問題がある。However, when a laminate is manufactured using such a prepreg method, there are problems in that raw material costs and equipment costs are high, and the process is complicated.
このような問題点を解決すべく、紙を基材とした不飽和
ポリエステル樹脂による積層板が提案されたか、不飽和
ポリエステル樹脂は元来耐熱性か乏しいため、その積層
板も熱間時の剛性か小さく、強度か不足するなどの問題
かある。In order to solve these problems, a paper-based laminate made of unsaturated polyester resin was proposed, or because unsaturated polyester resin has inherently poor heat resistance, the laminate also has poor rigidity when hot. There may be problems such as being small or lacking in strength.
本発明は、上記事情に鑑みてなされたもので、プリプレ
グ法を用いずに製造でき、且つ剛性、強度、はんだ耐熱
性、銅箔のビール強度、耐トラ。The present invention has been made in view of the above circumstances, and can be manufactured without using the prepreg method, and has rigidity, strength, solder heat resistance, beer strength of copper foil, and torment resistance.
キング性か良好な銅張積層板を提供することを目的とす
るものである。The purpose of this invention is to provide a copper-clad laminate with good kingability.
本発明者らは種々検討の結果、アリルエステル樹脂組成
物100重量部に対し、水酸化アルミニウム5〜100
重量部を配合してなる樹脂液を基材に含浸し、積層、硬
化してなる電気用積層板により上記目的か達成されるこ
とを見いだし、本発明を完成するに至った。As a result of various studies, the present inventors found that 5 to 100 parts of aluminum hydroxide per 100 parts by weight of the allyl ester resin composition.
It has been discovered that the above object can be achieved by an electrical laminate made by impregnating a base material with a resin liquid containing the following parts by weight, laminating and curing the resin liquid, and have completed the present invention.
すなわち、紙−フェノール積層板やカラスーエポキン積
層板の製造上の問題点を、プリプレグ法を用いないで積
層板を製造できるアリルエステル樹脂によって解決し、
しかもこの樹脂を用いて水酸化アルミニウムを配合し、
積層板を製造することにより、不飽和ポリエステル樹脂
を用いて製造された積層板よりも諸物性か高く、且つフ
ェ/−ル樹脂を用いて製造された積層板よりも電気特性
か良好であり、はんだ耐熱性、銅箔ビール強度、耐トラ
ツキング性に優れた積層板を得ることかできるのである
。That is, we solved the problems in manufacturing paper-phenol laminates and Karasu-Epoquin laminates by using allyl ester resin, which allows laminates to be manufactured without using the prepreg method.
What's more, this resin is used to blend aluminum hydroxide,
By manufacturing a laminate, it has higher physical properties than a laminate manufactured using unsaturated polyester resin, and has better electrical properties than a laminate manufactured using fer/fer resin, It is possible to obtain a laminate with excellent soldering heat resistance, copper foil beer strength, and tracking resistance.
以下、本発明の内容を詳細に説明する。Hereinafter, the content of the present invention will be explained in detail.
まス、本発明でのアリルエステル樹脂について説明する
。First, the allyl ester resin used in the present invention will be explained.
本発明にいうアリルエステル樹脂とは飽和多塩基酸と飽
和多価アルコールより形成されてなる飽和ポリエステル
の末端にアリルエステル基を有する樹脂をいう。The allyl ester resin as used in the present invention refers to a resin having an allyl ester group at the end of a saturated polyester formed from a saturated polybasic acid and a saturated polyhydric alcohol.
飽和多塩基酸としては、例えば二塩基酸としてオルソフ
タル酸、オルソフタル酸無水物、イソフタル酸、テレフ
タル酸等のフタル酸類、テトラヒドロフタル酸、メチル
テトラヒドロフタル酸、エンドメチレンテトラヒトロフ
タル酸、メチルエンドメチレンテトラヒトロフタル酸、
ヘキサヒドロフタル酸、メチルへキサヒドロフタル酸、
及びそれらの酸無水物等のヒドロフタル酸類、マロン酸
、コハク酸、グルタル酸、アジピン酸等の脂肪族二塩基
酸、テトラブロムフタル酸、テトラクロルフタル酸、ク
ロレンド酸、及びこれらの酸無水物等のハロゲン化二塩
基酸があげられる。三官能以上の多塩基酸としてはトリ
メリット酸、ピロメリット酸、及びそれらの酸無水物が
あげられる。これらは、単独でもまたは混合しても用い
ることができる。Examples of saturated polybasic acids include dibasic acids such as orthophthalic acid, orthophthalic anhydride, isophthalic acid, phthalic acids such as terephthalic acid, tetrahydrophthalic acid, methyltetrahydrophthalic acid, endomethylenetetrahydrophthalic acid, methylendomethylenetetra human phthalic acid,
Hexahydrophthalic acid, methyl hexahydrophthalic acid,
and hydrophthalic acids such as their acid anhydrides, aliphatic dibasic acids such as malonic acid, succinic acid, glutaric acid, adipic acid, tetrabromophthalic acid, tetrachlorophthalic acid, chlorendic acid, and acid anhydrides thereof, etc. Examples include halogenated dibasic acids. Examples of trifunctional or higher-functional polybasic acids include trimellitic acid, pyromellitic acid, and acid anhydrides thereof. These can be used alone or in combination.
飽和多価アルコールとしては、エチレングリコール、■
、2−プロピレングリコール、1,4ブタンジオール、
1,6−ヘキサンジオール、ネオペンチルグリコール、
1,4−シクロヘキサンジメタツール、バラキンレンゲ
リコール等の脂肪族、脂環族または芳香族を含んだ二価
のアルコールの他、一般式HO(CHRCH,O)□H
(RはHまたはC@ 82 B * 1+ mは1〜5
の整数、nは2〜]0の整数)であられされるエチレン
オキサイド、プロピレンオキサイド等のアルキレンオキ
サイドの付加反応によって得られる二価のアルコールが
あげられる。三価以上の多価アルコールとしては、例え
ばグリセリン、トリメチロールプロパン等の脂肪族の三
価のアルコールやペンタエリスリトール、ソルビトール
等の四価以上のアルコールがあげられる。また、ジブロ
モネオペンチルグリコール、テトラブロモビスフェノー
ルAエチレンオキサイド付加物のようなハロゲン原子を
含む脂肪族、脂環族または芳香族のハロゲン化多価アル
コールがあげられる。これらは、単独でもまたは混合し
ても用いることができる。Saturated polyhydric alcohols include ethylene glycol, ■
, 2-propylene glycol, 1,4 butanediol,
1,6-hexanediol, neopentyl glycol,
In addition to dihydric alcohols containing aliphatic, alicyclic or aromatic compounds such as 1,4-cyclohexane dimetatool and baraquinolengelicol, alcohols with the general formula HO(CHRCH,O)□H
(R is H or C@82 B*1+ m is 1-5
n is an integer of 2 to ]0), and n is an integer of 2 to 0). Examples of trihydric or higher polyhydric alcohols include aliphatic trihydric alcohols such as glycerin and trimethylolpropane, and tetrahydric or higher alcohols such as pentaerythritol and sorbitol. Further examples include aliphatic, alicyclic or aromatic halogenated polyhydric alcohols containing a halogen atom, such as dibromoneopentyl glycol and tetrabromobisphenol A ethylene oxide adduct. These can be used alone or in combination.
アリルエステル樹脂の製造法は既に公知であり、例えば
特願昭63−262217号に述べられている。例えば
、アリルエステル樹脂はジアリルテレフタレートのよう
な飽和二塩基酸のジアリルエステルと飽和多価アルコー
ルとをエステル交換触媒と共に反応器に仕込みアリルア
ルコールを留出させながら反応させ製造される。工業的
に更に有効な方法としては、ジアリルテレフタレートの
代わりにジメチルテレフタレートのような飽和二塩基酸
のジアルキルエステルをアリルアルコール、多価アルコ
ール及びエステル交換触媒と共に反応器に仕込み、メタ
ノール等の副生ずるアルコールを留出させながら反応さ
せて得ることかできる。The method for producing allyl ester resins is already known and is described, for example, in Japanese Patent Application No. 63-262217. For example, an allyl ester resin is produced by charging a diallyl ester of a saturated dibasic acid such as diallyl terephthalate and a saturated polyhydric alcohol together with a transesterification catalyst into a reactor and reacting the allyl alcohol while distilling off the allyl alcohol. A more industrially effective method is to charge a dialkyl ester of a saturated dibasic acid, such as dimethyl terephthalate, in place of diallyl terephthalate, together with allyl alcohol, polyhydric alcohol, and a transesterification catalyst, to remove by-produced alcohols such as methanol. It can be obtained by reacting while distilling off.
また、反応温度によってはハイドロキノンのような重合
禁止剤を反応液中に共存させてもよい。このようにして
飽和ボリュステルの末端にアリルエステル基を有するア
リルエステル樹脂を製造することができる。Further, depending on the reaction temperature, a polymerization inhibitor such as hydroquinone may be allowed to coexist in the reaction solution. In this way, an allyl ester resin having an allyl ester group at the end of a saturated voluster can be produced.
本発明に使用できるアリルエステル樹脂の種類は、一種
類でも二種類以上混合してもよい。飽和多塩基酸と飽和
多価アルコールの種類を種々選択することによって、耐
熱性、電気特性等のバランスの良い積層板を得ることが
できる。The types of allyl ester resins that can be used in the present invention may be one type or a mixture of two or more types. By selecting various types of saturated polybasic acid and saturated polyhydric alcohol, a laminate with a good balance of heat resistance, electrical properties, etc. can be obtained.
本発明において積層板を製造するにあたり、上記アリル
エステル樹脂と共にラジカル重合可能な架橋性モノマー
を使用し、樹脂組成物とすることができ、公知のものは
いずれも使用可能であるが、例えば、ジアリルオルソフ
タレート、ジアリルイソフタレート、ジアリルテレフタ
レートのようなシアリルテレフタレート類、スチレン、
α−メチルスチレン、p−メチルスチレン、p−クロル
スチレン、フロムスチレノ、ンビニルヘンセノのような
置換スチレン類、(メタンアクリル酸メチル、(メタ)
アクリル酸エチル、(メタ)アクリル酸ブチル、(メタ
)アクリル酸2−エチルヘキ/ル、(メタ)アクリル酸
ラウリル、(メタ)アクリル酸ヘン/ル、ブロム化フェ
ニル(メタ)アクリル酸エステルのようなアクリル酸ま
たはメタアクリル酸エステル類、エチレングリコールン
(メタ)アクリレ−)、1.4−ブタンジオール/(メ
タ)アクリレート、トリメチロールプロパントリ(メタ
)アクリレート、ンアクリル化イソシアヌレート、ペン
タエリスリトールトリ (メタ)アクリレート、ペンタ
エリスリトールテトラ(メタ)アクリレート、グリセリ
ンン(メタ)アクリレート、aオペンチルグリコールジ
(メタ)アクリレート、ビスフェノールAン(メタ)ア
クリレート等のビニル多官能アクリル酸またはメタアク
リル酸エステル類、ポリウレタン(メタ)アクリレート
、ポリエーテル(メタ)アクリレート、エピクロルヒド
リン変性ビスフェ/−ルAジ(メタ)アクリレート、ポ
リエチレングリコール/(メタ)アクリレート、ポリエ
チレングリコールジ(メタ)アクリレート等のビニル多
官能オリゴエステル類等が含まれる。In producing the laminate in the present invention, a radically polymerizable crosslinking monomer can be used together with the allyl ester resin to form a resin composition. Any known resin composition can be used, but for example, diallyl Sialyl terephthalates such as orthophthalate, diallyl isophthalate, diallyl terephthalate, styrene,
Substituted styrenes such as α-methylstyrene, p-methylstyrene, p-chlorostyrene, flomstyrene, vinylhenseno, (methylmethaneacrylate, (meth)
Such as ethyl acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, hexyl (meth)acrylate, brominated phenyl (meth)acrylate, etc. Acrylic acid or methacrylic acid esters, ethylene glycolone (meth)acrylate), 1,4-butanediol/(meth)acrylate, trimethylolpropane tri(meth)acrylate, acrylated isocyanurate, pentaerythritol tri( Vinyl polyfunctional acrylic acids or methacrylic esters such as meth)acrylate, pentaerythritol tetra(meth)acrylate, glycerine(meth)acrylate, a-opentyl glycol di(meth)acrylate, and bisphenol A(meth)acrylate; Vinyl polyfunctional oligoesters such as polyurethane (meth)acrylate, polyether (meth)acrylate, epichlorohydrin-modified bispher/-A di(meth)acrylate, polyethylene glycol/(meth)acrylate, polyethylene glycol di(meth)acrylate, etc. is included.
架橋性モノマーは目的に応じて二種類またはそれ以上を
組み合わせて用いても何ら差しつかえ無い。本発明にお
いて架橋性モノマーを配合すると、本来固形もしくは粘
稠な液体であるアリルエステル樹脂の粘度を下げること
かでき、かつ溶剤等を使用したプリプレグ状態を経るこ
となく、積層板の製造工程を簡略化することができる。There is no problem in using two or more types of crosslinking monomers in combination depending on the purpose. In the present invention, by blending a crosslinking monomer, the viscosity of the allyl ester resin, which is originally a solid or viscous liquid, can be lowered, and the manufacturing process of the laminate can be simplified without going through the prepreg state using a solvent etc. can be converted into
本発明におけるアリルエステル樹脂は汎用の有機過酸化
物を用いて硬化させることができ、有機過酸化物と共に
または単独で、光に感応する重合開始剤や放射線、電子
線に感応する重合開始剤等の、公知の重合開始剤も利用
できる。The allyl ester resin in the present invention can be cured using a general-purpose organic peroxide, and may be used together with the organic peroxide or alone, such as a polymerization initiator that is sensitive to light, a polymerization initiator that is sensitive to radiation, or an electron beam. Known polymerization initiators can also be used.
有機過酸化物としては、例えば、メチルエチルケトンパ
ーオキサイド、アセチルアセトンパーオキサイド等のケ
トンパーオキサイド類、1.】ビス(t−ブチルパーオ
キ/)33.5−)ジメチル7り口へ牛サン、ローブチ
ル−44−ビス(t−−1チルバーオキ/)バレレート
等のパーオキシケタール類、t−プチルハイドロバーオ
牛サイド、クメンハイドロパーオキサイド、p−メンタ
ンハイドロパーオキサイド等のハイドロパーオキサイド
類、ジ−t−ブチルパーオキ7、ツクミルパーオキサイ
ド、2,5−ジメチル−25ジ(t−ブチルパーオキ/
)ヘキサン等のジアルキルパーオキサイド類、ラウロイ
ルバーオキサイド、ヘンシイルバーオキサイド等のシア
/ルパーオ牛すイド類、ジー1so−プロビルパーオ牛
ンジカーボネート、シミリスチルバーオキ7ノカーボネ
ート、ビス(4−t−ブチル/クロへ牛/ル)バーオキ
/ジカーホ不一ト等のバーオキ/ツカ−ボネート類、t
−ブチルパーオキ/ピバレート、t−プチルバーオキン
ー2−エチルヘキサノエート、t−ブチルパーオキジベ
ンゾエート等のバーオキ/エステル類があげられる。こ
れらは−種類または二種類以上混合して、樹脂の種類、
硬化条件に応して用いることかできる。Examples of organic peroxides include ketone peroxides such as methyl ethyl ketone peroxide and acetylacetone peroxide; 1. ] Bis(t-butyl peroxide/) 33.5-) dimethyl 7-dimethyl beef san, peroxyketals such as lobethyl-44-bis(t--1 tilburoxy/) valerate, t-butylhydrobao beef side , cumene hydroperoxide, p-menthane hydroperoxide and other hydroperoxides, di-t-butyl peroxide 7, tsucumyl peroxide, 2,5-dimethyl-25 di(t-butyl peroxide/
) Dialkyl peroxides such as hexane, shea/luperoxides such as lauroyl peroxide and hensyl peroxide, di-1so-propylene dicarbonate, cimilyl peroxide, bis(4-t-butyl) /Kurohegyu/ru) Baroki/Dicarbonate, etc.
Examples include peroxy/esters such as -butyl peroxy/pivalate, t-butyl peroxy-2-ethylhexanoate, and t-butyl peroxy dibenzoate. These are - types or a mixture of two or more types, types of resin,
It can be used depending on the curing conditions.
本発明においてアリルエステル樹脂には必要に応じて充
填材、補強材、離ル剤、着色剤、硬化促進剤、安定剤等
を併用して積層板の性能を一層高めることも可能である
。In the present invention, fillers, reinforcing materials, release agents, coloring agents, curing accelerators, stabilizers, etc. may be used in combination with the allyl ester resin to further enhance the performance of the laminate.
次に、本発明において使用される水酸化アルミニウムは
、キブ苛イト結晶構造を有するもの、ヘーマイト結晶構
造を有するもの、及びハイヤライト結晶構造を有するも
のであり、いずれもアルミニウムの原料物質として工業
的に製造されている。Next, the aluminum hydroxide used in the present invention is one having a kibutite crystal structure, one having a hemite crystal structure, and one having a hyarite crystal structure, all of which are industrially used as raw materials for aluminum. Manufactured in
本発明を実施するにあたっては、水酸化アルミニウムの
熱分解温度を考慮して牛ブサイト結晶構造を有するもの
の使用か望ましい。キブサイト結晶構造を有する水酸化
アルミニウムは、結晶系が単斜晶系であり、その結晶構
造はa−8,62人b−5.480人、c−9.70人
及びヘータ(β)角か85°82′を有し、屈折率はa
−1,568β−1588及びγ−】 567を有する
。その熱分解温度は160’C以上である。また、平均
粒子径が100ミクロン以下のものが好ましく、特に0
5〜60ミクロンのものか最適である。市販の商品名と
しては、例えば昭和電工(株)社製の水酸化アルミニウ
ムであるハイ/ライトH−32、ハイシライトH−42
等である。In carrying out the present invention, it is preferable to use aluminum hydroxide having a bovine bushite crystal structure in consideration of its thermal decomposition temperature. Aluminum hydroxide with a kibsite crystal structure has a monoclinic crystal structure, and its crystal structure is a-8,62, b-5,480, c-9,70, and heta (β) angle. 85°82', and the refractive index is a
-1,568β-1588 and γ-] 567. Its thermal decomposition temperature is 160'C or higher. In addition, those with an average particle diameter of 100 microns or less are preferable, particularly 0.
A thickness of 5 to 60 microns is optimal. Commercially available product names include, for example, Hi/Lite H-32 and Hisilite H-42, which are aluminum hydroxide manufactured by Showa Denko K.K.
etc.
水酸化アルミニウムの使用量はアリルエステル樹脂組成
物100重量部に対し、5〜100!量部であり、10
〜80重量部が好ましい。5重量部未満の場合は、耐ト
ラツキング性に対する効果が発現せず、100重量部を
超えると樹脂液の粘度が上昇してしまい、基材への含浸
か難しくなる。The amount of aluminum hydroxide used is 5 to 100 parts by weight per 100 parts by weight of the allyl ester resin composition! Quantity parts, 10
~80 parts by weight is preferred. If it is less than 5 parts by weight, no effect on tracking resistance will be exhibited, and if it exceeds 100 parts by weight, the viscosity of the resin liquid will increase, making it difficult to impregnate the base material.
アリルエステル樹脂あるいはこれを主体とした樹脂組成
物に水酸化アルミニウムを配合した樹脂液は公知方法に
従って積層板の製造に使用することかできる。即ち、基
材に上記樹脂液を含浸し、含浸した基材を複数枚積層し
、片面もしくは両面にあらかじめ接着剤を塗布した銅箔
を重ね、無圧または加圧下で加熱、硬化、成形すること
によって、銅張積層板を製造することかできる。勿論、
−見積層板を成形しておき、これに接着剤を塗布した銅
箔を重ねて張り合わせることかできる。A resin liquid prepared by blending aluminum hydroxide with an allyl ester resin or a resin composition mainly composed of the allyl ester resin can be used for manufacturing a laminate according to a known method. That is, a base material is impregnated with the above-mentioned resin liquid, a plurality of impregnated base materials are laminated, a copper foil coated with an adhesive is layered on one or both sides, and then heated, cured, and molded without pressure or under pressure. Copper-clad laminates can be manufactured by: Of course,
- It is possible to form a laminate and then laminate it with copper foil coated with an adhesive.
上記基材は、従来の積層板に用いられている基材と同し
ものが使用でき、例えば、ガラス繊維布、ガラス不織布
等のガラス系基材、クラフト紙、リンター紙、コツトン
紙等のセルロース系紙基材、無機質繊維系のシート状ま
たは帯状基材等をさす。The above base material can be the same as the base material used for conventional laminates, such as glass base materials such as glass fiber cloth and glass non-woven fabric, cellulose such as kraft paper, linter paper, cotton paper, etc. Refers to paper base materials, inorganic fiber sheet or band base materials, etc.
基材として紙を用いる場合、含浸性や品質の観点から風
乾時の密度が0.3〜0.7g/cm3であるようなセ
ルロース繊維を主体とした紙、例えばクラフト紙が好ま
しい。When paper is used as the base material, from the viewpoint of impregnability and quality, it is preferable to use paper mainly composed of cellulose fibers, such as kraft paper, which has a density of 0.3 to 0.7 g/cm 3 when dried in air.
これら基材は、含浸用樹脂組成物で含浸する前にあらか
じめ、尿素樹脂、メラミン樹脂、グアナミン樹脂等のN
−メチロール(1m、フェノール樹脂、シランカップリ
ング剤等によって含浸乾燥処理を施すことにより、電気
特性の向上を図ることも可能である。Before impregnating these base materials with the impregnating resin composition, N
- It is also possible to improve the electrical properties by impregnating and drying with methylol (1 m, phenol resin, silane coupling agent, etc.).
また、銅箔は電気回路用銅張積層板に一般に用いられる
銅箔、即ち電解銅箔や圧延銅箔を指し、これら銅箔への
接着剤の塗布は通常のロールツーター、フレードコータ
ーあるいはワイヤーバーコーター等適宜選択して行えば
よい。接着剤を塗布した銅箔は加熱処理を行い、溶剤を
除去すると共に半ば硬化を進めた状態で使用に供するの
が好ましい。Copper foil generally refers to copper foil commonly used for copper-clad laminates for electrical circuits, such as electrolytic copper foil and rolled copper foil, and the application of adhesive to these copper foils is carried out using a normal roll-to-ter, flade coater, or wire bar. This may be done by appropriately selecting a coater or the like. The copper foil coated with the adhesive is preferably heat-treated to remove the solvent and to be used in a partially cured state.
以下、本発明を実施例によって詳しく述べるが、本発明
の要旨を逸脱しない限り、これらの実施例のみに限定さ
れるものではない。なお、この明細書を通じて、温度は
すべて0Cであり、部及び%は特記しない限り重量基準
である。Hereinafter, the present invention will be described in detail with reference to examples, but the present invention is not limited to these examples unless it departs from the gist of the present invention. Throughout this specification, all temperatures are 0C, and parts and percentages are by weight unless otherwise specified.
製造例1 アリルエステル樹脂(1)の製造蒸留装置を
具備したIQの反応器に、ジアリルテレフタレート60
0g (2,44moρ)、プロピレングリコール95
.9 g (1,26mo12) 、ジブチル錫オキサ
イド01gを仕込んで窒素気流下で180°Cに加熱し
、生成してくるアリルアルコールヲ留去シた。アリルア
ルコールが140g(2,41mog)留出したところ
で、反応器内を50 m+nHgまで減圧にし留去速度
を速めた。プロピレングリコールと当量のアリルアルコ
ールが留出した後、反応液を薄膜蒸留器を用いて200
℃に維持しなから1 mmHgにおいて未反応のジアリ
ルテレフタレートを留出した。反応液をバットにあけ、
冷却、粉砕して粉状のアリルエステル樹脂(1)を得た
。Production Example 1 Production of allyl ester resin (1) Diallyl terephthalate 60 was added to an IQ reactor equipped with a distillation device.
0g (2,44moρ), propylene glycol 95
.. 9 g (1,26 mo12) and 01 g of dibutyltin oxide were charged and heated to 180°C under a nitrogen stream to distill off the allyl alcohol produced. When 140 g (2.41 mog) of allyl alcohol had been distilled off, the pressure inside the reactor was reduced to 50 m+nHg to accelerate the distillation rate. After allyl alcohol in an amount equivalent to propylene glycol was distilled off, the reaction solution was distilled to 200 ml using a thin film distiller.
While maintaining the temperature at 1 mmHg, unreacted diallyl terephthalate was distilled off. Pour the reaction solution into a vat,
It was cooled and pulverized to obtain a powdery allyl ester resin (1).
製造例2 臭素を含有するアリルエステル樹脂(2)の
製造
第1表に示した条件を除いてはアリルエステル樹脂(1
)と同様に操作し、臭素を含有するアリルエステル樹脂
(2)を得た。Production Example 2 Production of allyl ester resin (2) containing bromine Except for the conditions shown in Table 1, allyl ester resin (1
) to obtain a bromine-containing allyl ester resin (2).
実施例1〜5及び比較例1〜2
坪量155g/m’、厚さ300μmのクラフト紙をメ
ラミン樹脂(日本カーバイド社製S−305)の水−メ
タノール溶液に浸して風乾後、120℃−30分乾燥さ
せた。クラフト紙100重量部に対するメラミン樹脂の
付着量は18重量部であった。この紙基材を第2表に示
した樹脂組成物の配合液中に浸漬し樹脂液を含浸させ、
7枚を重ねあわせ、片面に接着剤付銅箔(三井金属鉱業
製MK−6])を重ね合わせ、更に両面に50μmのポ
リエステルフィルムを重ね合わせた後、プレス機で加熱
、加圧成型した。その条件は1/lO’c−]00分−
20kg/ cm’であった。プレス後、熱風乾燥炉中
で150’C−5時間加熱を行い、厚さ1 、6 mm
の銅張積層板を得た。該銅張積層板の物性測定結果を第
3表に示す。Examples 1 to 5 and Comparative Examples 1 to 2 Kraft paper with a basis weight of 155 g/m' and a thickness of 300 μm was soaked in a water-methanol solution of melamine resin (S-305 manufactured by Nippon Carbide Co., Ltd.) and air-dried at 120°C. It was dried for 30 minutes. The amount of melamine resin adhered to 100 parts by weight of kraft paper was 18 parts by weight. This paper base material is immersed in the blended solution of the resin composition shown in Table 2 to impregnate it with the resin solution,
Seven sheets were stacked, an adhesive-coated copper foil (MK-6 manufactured by Mitsui Mining and Mining Co., Ltd.) was stacked on one side, and a 50 μm polyester film was further stacked on both sides, followed by heating and pressure molding with a press machine. The conditions are 1/lO'c-]00 min-
It was 20 kg/cm'. After pressing, it was heated in a hot air drying oven at 150'C for 5 hours to a thickness of 1.6 mm.
A copper-clad laminate was obtained. Table 3 shows the results of measuring the physical properties of the copper-clad laminate.
第3表の結果から明らかなように、本発明の電気用積層
板は、はんだ耐熱性が優れ、銅箔の剥離強度も高く、ま
た耐トラツキング性の良好なことがわかる。As is clear from the results in Table 3, the electrical laminate of the present invention has excellent solder heat resistance, high copper foil peel strength, and good tracking resistance.
本発明の電気用積層板にあっては、プリプレグ法を用い
ずに製造でき、かつ剛性、強度、はんだ耐熱性、銅箔の
剥離強度、耐トラツキング性などが良好であるなどの効
果を得ることができる。The electrical laminate of the present invention can be manufactured without using the prepreg method, and has advantages such as good rigidity, strength, soldering heat resistance, copper foil peel strength, and tracking resistance. I can do it.
Claims (1)
化アルミニウム5〜100重量部を配合してなる樹脂液
を基材に含浸し、積層、硬化してなる電気用積層板。An electrical laminate is obtained by impregnating a base material with a resin liquid prepared by blending 5 to 100 parts by weight of aluminum hydroxide with 100 parts by weight of an allyl ester resin composition, then laminating and curing the resin liquid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25147590A JPH04129737A (en) | 1990-09-20 | 1990-09-20 | Electric laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25147590A JPH04129737A (en) | 1990-09-20 | 1990-09-20 | Electric laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04129737A true JPH04129737A (en) | 1992-04-30 |
Family
ID=17223370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25147590A Pending JPH04129737A (en) | 1990-09-20 | 1990-09-20 | Electric laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04129737A (en) |
-
1990
- 1990-09-20 JP JP25147590A patent/JPH04129737A/en active Pending
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