JPH04309283A - Manufacture of ceramic circuit board - Google Patents
Manufacture of ceramic circuit boardInfo
- Publication number
- JPH04309283A JPH04309283A JP7484991A JP7484991A JPH04309283A JP H04309283 A JPH04309283 A JP H04309283A JP 7484991 A JP7484991 A JP 7484991A JP 7484991 A JP7484991 A JP 7484991A JP H04309283 A JPH04309283 A JP H04309283A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- ceramic wiring
- metal plate
- ceramic
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 238000007747 plating Methods 0.000 claims abstract description 15
- 238000005219 brazing Methods 0.000 claims abstract description 11
- 238000005498 polishing Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 238000005260 corrosion Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 230000010354 integration Effects 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】［発明の目的］[Object of the invention]
【０００２】0002
【産業上の利用分野】本発明は、セラミック配線基板の
製造方法に係り、特に放熱機能および機械的な固定可能
に金属板を備えたセラミック配線基板の製造方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a ceramic wiring board, and more particularly to a method of manufacturing a ceramic wiring board having a heat dissipation function and a metal plate capable of being mechanically fixed.
【０００３】0003
【従来の技術】たとえば、電子機器類の小形化や回路機
能の向上などに対応して、電子部品を一主面に搭載・実
装するセラミック配線基板においては、機械的に精度よ
く所定位置に回固定し得るとともに、放熱性を考慮して
前記電子部品を搭載・実装しない他主面にたとえばＣｕ
／Ｗ板を一体的にロー付けしたものが使用されている。
たとえば機械的な位置精度および固定性、耐震動性
など要求されるセラミックモジュールは、図１に概略構
成を平面的に、また図２に断面的に示すような構成を成
しており、次のようにして製造されている。先ず、一主
面に少なくとも所要の導体パターン１を有する大型で異
形なセラミック配線板２を用意し、部品を搭載しない他
主面（裏面）メタライズ層３を形成する。一方、前記異
形なセラミック配線板２の外形サイズより大きく、たと
えば四隅に固定用ボルトネジを挿入する固定用の透孔４
が設けられ、また機械加工公差に加工されＮｉめっき処
理の施されたＣｕ／Ｗ系の金属板５を用意する。[Prior Art] For example, in response to the miniaturization of electronic devices and improvement of circuit functions, ceramic wiring boards that mount and mount electronic components on one main surface are mechanically rotated to predetermined positions with high precision. In addition, in consideration of heat dissipation, the main surface on which the electronic components are not mounted or mounted is made of, for example, Cu.
/W plates integrally brazed together are used. For example, a ceramic module that requires mechanical positional accuracy, fixation, and vibration resistance has a schematic configuration shown in plan in Figure 1 and a cross-sectional view in Figure 2. It is manufactured in this way. First, a large and irregularly shaped ceramic wiring board 2 having at least a required conductor pattern 1 on one main surface is prepared, and a metallized layer 3 is formed on the other main surface (back surface) on which no components are mounted. On the other hand, through-holes 4 for fixing, which are larger than the outer size of the irregularly shaped ceramic wiring board 2, and into which fixing bolts and screws are inserted, for example, at the four corners.
A Cu/W-based metal plate 5 is prepared, which is provided with a metal plate 5 that is machined to a tolerance of machining and is plated with Ni.
【０００４】しかる後、前記セラミック配線板２のメタ
ライズ層３が形成されている他主面（裏面）に、Ｃｕ／
Ｗ系の金属板５の一主面を位置合わせして配置し、周縁
部をたとえばＡｇロー付け（８００℃程度）６すること
によって一体化し、所要のセラミック配線基板７を構成
する。次いで、この異形なセラミック配線基板７主面に
、所要の電子部品８を搭載・実装してから、前記セラミ
ック配線基板７の一主面に予め設けておいたウエルドリ
ング９に、メタルキャップ１０の開口端縁部１０ａ を
たとえばレーザービームによって溶接し、気密に封止す
ることによって、セラミックモジュールを製造している
。[0004] After that, Cu/
One main surface of the W-based metal plate 5 is aligned and arranged, and the peripheral portion is integrated by, for example, Ag brazing (about 800° C.) 6 to form a desired ceramic wiring board 7. Next, after mounting and mounting required electronic components 8 on the main surface of this irregularly shaped ceramic wiring board 7, a metal cap 10 is attached to a weld ring 9 that has been provided in advance on one main surface of the ceramic wiring board 7. The ceramic module is manufactured by welding the opening edge 10a with, for example, a laser beam and hermetically sealing it.
【０００５】[0005]
【発明が解決しようとする課題】上記構成のセラミック
モジュールの場合は、他主面（裏面）に一体的に配設し
たＣｕ／Ｗ系の金属板５によって、機械的固定が可能に
なるとともに、放熱性機能も向上するので、電子部品８
として高速素子や高発熱性素子などを高密度に実装し得
ることになり、セラミックモジュールの大型化が可能に
なるという利点がある。しかし、一方では次のような問
題がある。すなわち、前記製造方法において、金属板５
としてたとえば厚さ１．５ｍｍ 程度のＣｕ／Ｗ板を、
一般的な加工公差たとえば平面度０．１ｍｍ 程度に仕
上げたものを用いても、大型化したセラミック配線板２
にＡｇロー付け（８００℃程度）６すると、セラミック
配線板２との熱膨張差などによって引っ張られ（反りや
ウネリを生じ）、平面度が０．２ｍｍ 以上になる。特
に、セラミックモジュールとしての実装スペースを最大
限に活用し得る図１に図示する異形で大型の場合は、前
記反りやウネリの生じに伴い平面度が０．３ｍｍ以上に
なる。[Problems to be Solved by the Invention] In the case of the ceramic module having the above structure, the Cu/W metal plate 5 integrally disposed on the other main surface (back surface) enables mechanical fixing, and Since the heat dissipation function is also improved, electronic components 8
This has the advantage that high-speed elements, high-heat generating elements, etc. can be mounted with high density, and it is possible to increase the size of the ceramic module. However, on the other hand, there are the following problems. That is, in the manufacturing method, the metal plate 5
For example, a Cu/W plate with a thickness of about 1.5 mm,
Even if a ceramic wiring board finished with a general processing tolerance of, for example, 0.1mm flatness is used, the large ceramic wiring board 2
When Ag brazing (about 800° C.) 6 is applied to the ceramic wiring board 2, it is stretched due to the difference in thermal expansion with the ceramic wiring board 2 (causing warpage and waviness), and the flatness becomes 0.2 mm or more. Particularly, in the case of the irregularly shaped and large-sized ceramic module shown in FIG. 1, which can maximize the use of the mounting space as a ceramic module, the flatness becomes 0.3 mm or more due to the above-mentioned warping and waviness.
【０００６】前記金属板５の平面度低下に伴い、構成し
たセラミックモジュールを取り付け面にネジ止めして固
定する場合、その固定作業中にセラミック配線板２にク
ラックが発生することがしばしばある。また、固定後に
おいても振動や衝撃試験で、セラミック配線板２にクラ
ックが発生し易い傾向が認められる。このようなセラミ
ックモジュールにおける不具合を解消するため、前記取
り付け面にネジ止めして固定する際、取り付け面との間
に適宜スペーサーを介挿させざるを得ないので、放熱性
が損なわれることになる。[0006] Due to the decrease in flatness of the metal plate 5, when the constructed ceramic module is fixed to a mounting surface by screws, cracks often occur in the ceramic wiring board 2 during the fixing operation. Further, even after fixing, it is recognized that the ceramic wiring board 2 tends to be prone to cracking in vibration and impact tests. In order to solve this problem with ceramic modules, when fixing them to the mounting surface with screws, it is necessary to insert a spacer as appropriate between the mounting surface and the heat dissipation performance is impaired. .
【０００７】本発明は上記事情に対処してなされたもの
で、セラミック配線板が異形で大型の場合でも、一体化
された金属板が良好な平面度を呈し、取り付け面にネジ
止めして固定する場合などもクラックを発生する恐れの
低減されたセラミック配線基板を容易に得ることのでき
る製造方法の提供を目的とする。The present invention was made in response to the above-mentioned circumstances, and even when the ceramic wiring board is irregularly shaped and large, the integrated metal plate exhibits good flatness and can be fixed by screwing to the mounting surface. It is an object of the present invention to provide a manufacturing method that can easily obtain a ceramic wiring board with a reduced risk of cracking even when it is used.
【０００８】［発明の構成］[Configuration of the invention]
【０００９】[0009]
【課題を解決するための手段】本発明に係るセラミック
配線基板の製造方法は、少なくとも所要の回路パターン
を有するセラミック配線板の部品を搭載しない裏面に、
このセラミック配線板よりもサイズが大でかつ固定用の
透孔が端縁部に設けられた金属板をロー付け一体化する
工程と、前記ロー付け一体化した金属板の露出する主面
（裏面）を研磨加工して平面化する工程と、前記研磨加
工した金属面にＮｉめっきおよび金めっきを順次施す工
程とを具備することを特徴とする。[Means for Solving the Problems] A method for manufacturing a ceramic wiring board according to the present invention provides a method for manufacturing a ceramic wiring board having at least a required circuit pattern on the back side on which no components are mounted.
A process of brazing and integrating a metal plate that is larger in size than this ceramic wiring board and having through-holes for fixing at the edge, and an exposed main surface (back surface) of the metal plate that is brazed and integrated. ) and a step of sequentially applying Ni plating and gold plating to the polished metal surface.
【００１０】0010
【作用】本発明に係るセラミック配線基板の製造方法に
おいては、セラミック配線板にロー付け一体化した金属
板の露出する主面（裏面）を研磨加工して平面化するし
、平面に研磨加工した金属面へさらにＮｉめっきおよび
金めっきを順次施している。つまり、Ａｇロー付けなど
によって生じた反りやウネリに伴い低下した平面度は、
研磨加工やＮｉめっきおよび金めっき処理によって解消
され、再び所望のすぐれた平面度を呈するに至る。[Operation] In the method for manufacturing a ceramic wiring board according to the present invention, the exposed main surface (back surface) of the metal plate integrated with the ceramic wiring board by brazing is polished to make it flat. Further, Ni plating and gold plating are sequentially applied to the metal surface. In other words, the flatness decreased due to warping and waviness caused by Ag brazing, etc.
This is eliminated by polishing, Ni plating, and gold plating, and the desired excellent flatness is achieved again.
【００１１】[0011]
【実施例】以下、本発明の実施例を説明する。[Examples] Examples of the present invention will be described below.
【００１２】先ず、金型あるいはＮＣ加工によって所要
のビアホールなど形成された、前記図１などに示された
ような、異形のグリーンシートを用意する。次いでこの
クリーント面に、たとえば印刷法によって導電性ペース
トを印刷し、所定の導電パターン１を形成し乾燥させる
。しかる後、このグリーンシート複数枚を位置合わせし
て積層し、一体的焼結（焼成）して厚さ１．５ 〜２．
０ ｍｍ程度の異形のセラミック配線板２を得た。First, an irregularly shaped green sheet as shown in FIG. 1 is prepared, in which required via holes and the like are formed by molding or NC processing. Next, a conductive paste is printed on this clean surface by, for example, a printing method to form a predetermined conductive pattern 1, and then dried. After that, the plurality of green sheets are aligned, stacked, and integrally sintered (fired) to a thickness of 1.5 to 2.5 mm.
A ceramic wiring board 2 having an irregular shape of about 0 mm was obtained.
【００１３】前記で得た異形のセラミック配線板２の裏
面、つまりＩＣ素子などの電子部品８を搭載・実装する
面と反対の面をメタライズ３化し、さらにそのメタライ
ズ３化面にＮｉめっき層を被着形成した。さらに、電子
部品８を搭載・実装する面には、メタルキャップ１０の
開口端縁部１０ａ がロー付けされるウエルドリング９
を被着形成した。[0013] The back surface of the irregularly shaped ceramic wiring board 2 obtained above, that is, the surface opposite to the surface on which electronic components 8 such as IC elements are mounted/mounted, is metallized 3, and a Ni plating layer is further applied to the metallized 3 surface. Adhesion was formed. Furthermore, a weld ring 9 to which an opening edge 10a of the metal cap 10 is soldered to the surface on which the electronic component 8 is mounted/mounted.
was deposited.
【００１４】一方、前記異形のセラミック配線板２より
も外形サイズがやや大きく、また四隅に機械加工によっ
て固定用の透孔４を穿設した、たとえば厚さ１．５ｍｍ
程度のＣｕ／Ｗ板５を用意した。このＣｕ／Ｗ板５は
、平面度０．１ｍｍ に加工されており、また、少なく
とも裏面に、換言するとセラミック配線板２の裏面と対
接させない面に、Ｎｉめっき層が被着形成してある。On the other hand, the outer size is slightly larger than the irregularly shaped ceramic wiring board 2, and the four corners are machined to have through holes 4 for fixing, for example, a thickness of 1.5 mm.
A Cu/W board 5 of about 100 mL was prepared. This Cu/W board 5 is processed to have a flatness of 0.1 mm, and a Ni plating layer is formed on at least the back surface, in other words, the surface that does not come into contact with the back surface of the ceramic wiring board 2. .
【００１５】このようにして、一主面に少なくとも所要
の導体パターン１を有する大型で異形なセラミック配線
板２と、前記異形なセラミック配線板２の外形サイズよ
り大きく、たとえば四隅に固定用ボルトネジを挿入する
固定用の透孔４が設けられ、また機械加工公差に加工さ
れＮｉめっき処理の施されたＣｕ／Ｗ系の金属板５とを
用意した後、これらセラミック配線板２およびＣｕ／Ｗ
系の金属板５を位置合わせして、セラミック配線板２の
周縁部をＣｕ／Ｗ系の金属板５面に、たとえばＡｇロー
付け（８００ ℃）６して、両者を一体化した。この状
態では、前記一体化されたセラミック配線板−Ｃｕ／Ｗ
系の金属板の金属板５に反りやウネリなどが生じ、平面
度が０．２５ｍｍ程度になっていた。In this way, a large and irregularly shaped ceramic wiring board 2 having at least the required conductor pattern 1 on one principal surface, and fixing bolts and screws larger than the external size of the irregularly shaped ceramic wiring board 2, for example, are installed at the four corners. After preparing a Cu/W metal plate 5 which is provided with a fixing hole 4 to be inserted and which is machined to tolerances and subjected to Ni plating treatment, these ceramic wiring board 2 and the Cu/W metal plate 5 are prepared.
After aligning the metal plates 5 of the ceramic wiring board 2, the peripheral edge of the ceramic wiring board 2 was brazed with Ag (800° C.) 6, for example, to the surface of the Cu/W metal plate 5 to integrate the two. In this state, the integrated ceramic wiring board-Cu/W
The metal plate 5 of the system metal plate had warps and undulations, and its flatness was about 0.25 mm.
【００１６】しかる後、前記一体化した異形なセラミッ
ク配線基板７のＣｕ／Ｗ系の金属板５面を、たとえば回
転研磨機で研磨処理して平面化（平坦化）して、前記セ
ラミック配線板−Ｃｕ／Ｗ系の金属板５のロー付け６、
一体化で生じた反りやウネリを解消した。この研磨加工
後、その加工面にＮｉめっき処理およびＡｕめっき処理
を順次施して、耐蝕性などを付与した所望の異形なセラ
ミック配線基板７を得た。 このような構成を成す異
形なセラミック配線基板７は、高機能ないし大容量化を
要求されるセラミックモジュールの構成に適する。すな
わち、前記一体化した異形なセラミック配線基板７の主
面に、所要の電子部品８を高密度に搭載・実装し得るし
、またこの主面に予め設けておいたウエルドリング９に
、メタルキャップ１０の開口端縁部１０ａ をたとえば
レーザービームによって溶接し、気密に封止することに
よって、所望のセラミックモジュールを構成することが
できる。
しかも、前記セラミック配線基板７のＣｕ／Ｗ系の金属
板５面は、放熱に大きく寄与するばかりでなく、平面度
も良好であるため、固定作業などにおいてセラミック配
線板２が破損するようなことも大幅に低減・解消する。Thereafter, the five surfaces of the Cu/W-based metal plate of the integrated irregularly shaped ceramic wiring board 7 are flattened (flattened) by polishing, for example, with a rotary polishing machine, and the ceramic wiring board - Brazing 6 of Cu/W metal plate 5,
The warping and undulations caused by the integration were eliminated. After this polishing process, the processed surface was sequentially subjected to Ni plating process and Au plating process to obtain a desired irregularly shaped ceramic wiring board 7 imparted with corrosion resistance and the like. The irregularly shaped ceramic wiring board 7 having such a configuration is suitable for the configuration of a ceramic module that is required to have high functionality or a large capacity. That is, the required electronic components 8 can be mounted and mounted with high density on the main surface of the integrated irregularly shaped ceramic wiring board 7, and a metal cap can be attached to the weld ring 9 previously provided on this main surface. A desired ceramic module can be constructed by welding the ten opening edges 10a with, for example, a laser beam and hermetically sealing them. Furthermore, the five surfaces of the Cu/W metal plate of the ceramic wiring board 7 not only greatly contribute to heat dissipation, but also have good flatness, so that the ceramic wiring board 2 will not be damaged during fixing work or the like. will also be significantly reduced or eliminated.
【００１７】なお、上記では異形なセラミック配線基板
の製造例について説明したが、異形なセラミック配線基
板に限定されるものでなく、比較的大型な方形のセラミ
ック配線基板の製造にも適用し得る。さらに、一体化さ
れる金属板もＣｕ／Ｗ系以外のものであってもよい。Although an example of manufacturing an irregularly shaped ceramic wiring board has been described above, the present invention is not limited to irregularly shaped ceramic wiring boards, and can also be applied to manufacturing a relatively large rectangular ceramic wiring board. Furthermore, the metal plates to be integrated may also be made of materials other than Cu/W.
【００１８】[0018]
【発明の効果】上記のように、本発明に係るセラミック
配線基板の製造方法によれば、セラミック配線板の裏面
側に一体化された金属板の反りやウネリなどを除去ない
し解消し、最終的にその平面度が大幅に向上・改善され
る。したがって、取り付け・固定作業中もしくは固定後
において、振動や衝撃によってセラミック配線基板にク
ラックが生じる恐れも全面的に解消されるばかりでなく
、すぐれた放熱性などを保持・発揮する。かくして本発
明に係るセラミック配線基板の製造方法は、信頼性の高
いセラミックモジュールの構成に、大きく寄与するもの
といえる。[Effects of the Invention] As described above, according to the method of manufacturing a ceramic wiring board according to the present invention, warpage and waviness of the metal plate integrated on the back side of the ceramic wiring board can be removed or eliminated, and the final Its flatness is greatly improved. Therefore, not only is the fear of cracks occurring in the ceramic wiring board due to vibration or impact during or after installation and fixing work completely eliminated, but it also maintains and exhibits excellent heat dissipation properties. Thus, it can be said that the method for manufacturing a ceramic wiring board according to the present invention greatly contributes to the construction of a highly reliable ceramic module.
【図１】セラミックモジュールの構造例を示す平面図。FIG. 1 is a plan view showing a structural example of a ceramic module.
【図２】セラミックモジュールの構造例の要部を示す断
面図。FIG. 2 is a sectional view showing a main part of a structural example of a ceramic module.
１…導電パターン ２…セラミック配線板
３…メタライズ層 ４…固定用透孔 ５
…金属板 ６…ロー付け ７セラミック配
線基板 ８…電子部品 ９…ウエルドリン
グ １０…メタルキャップ １０ａ …メ
タルキャップの開口端縁部1... Conductive pattern 2... Ceramic wiring board
3...Metallized layer 4...Through hole for fixing 5
…Metal plate 6…Brazing 7Ceramic wiring board 8…Electronic component 9…Weld ring 10…Metal cap 10a…Opening edge of metal cap
Claims (1)
るセラミック配線板の部品を搭載しない裏面に、このセ
ラミック配線板よりもサイズが大でかつ固定用の透孔が
端縁部に設けられた金属板をロー付け一体化する工程と
、前記ロー付け一体化した金属板の露出する主面（裏面
）を研磨加工して平面化する工程と、前記研磨加工した
金属面にＮｉめっきおよび金めっきを順次施す工程とを
具備することを特徴とするセラミック配線基板の製造方
法。Claim 1: A metal plate larger in size than the ceramic wiring board and having through-holes for fixing provided at the edge of the ceramic wiring board having at least the required circuit pattern on the back side on which no components are mounted. a step of brazing and integrating, a step of polishing and flattening the exposed main surface (back surface) of the metal plate integrated by brazing, and sequentially applying Ni plating and gold plating to the polished metal surface. A method for manufacturing a ceramic wiring board, comprising the steps of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7484991A JPH04309283A (en) | 1991-04-08 | 1991-04-08 | Manufacture of ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7484991A JPH04309283A (en) | 1991-04-08 | 1991-04-08 | Manufacture of ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04309283A true JPH04309283A (en) | 1992-10-30 |
Family
ID=13559177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7484991A Withdrawn JPH04309283A (en) | 1991-04-08 | 1991-04-08 | Manufacture of ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04309283A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107211531A (en) * | 2015-02-10 | 2017-09-26 | 大陆泰密克微电子有限责任公司 | Electronic unit and the method for producing electronic unit |
-
1991
- 1991-04-08 JP JP7484991A patent/JPH04309283A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107211531A (en) * | 2015-02-10 | 2017-09-26 | 大陆泰密克微电子有限责任公司 | Electronic unit and the method for producing electronic unit |
| JP2018512724A (en) * | 2015-02-10 | 2018-05-17 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｏｎｔｉ Ｔｅｍｉｃ ｍｉｃｒｏｅｌｅｃｔｒｏｎｉｃ ＧｍｂＨ | Electronic component and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980711 |