CN118123171A - AlN ceramic substrate copper-clad self-adaptive brazing clamping tool - Google Patents
AlN ceramic substrate copper-clad self-adaptive brazing clamping tool Download PDFInfo
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- CN118123171A CN118123171A CN202410324501.9A CN202410324501A CN118123171A CN 118123171 A CN118123171 A CN 118123171A CN 202410324501 A CN202410324501 A CN 202410324501A CN 118123171 A CN118123171 A CN 118123171A
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- Prior art keywords
- ceramic substrate
- adaptive
- bottom plate
- aln ceramic
- brazing
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- 239000000758 substrate Substances 0.000 title claims abstract description 38
- 239000000919 ceramic Substances 0.000 title claims abstract description 30
- 238000005219 brazing Methods 0.000 title claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 23
- 230000003044 adaptive effect Effects 0.000 claims description 10
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 claims description 3
- 230000006978 adaptation Effects 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910017945 Cu—Ti Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Ceramic Products (AREA)
Abstract
The invention relates to the technical field of ceramic metallization, and discloses an AlN ceramic substrate copper-clad self-adaptive brazing clamping tool, which comprises the following components: the top surface of the bottom plate is of a concave spherical structure; the movable plate is of a convex spherical structure, the movable plate is matched with the concave spherical structure on the top surface of the bottom plate, and the movable plate is arranged on the bottom plate. The tool formed by combining the bottom plate of the concave spherical structure and the movable plate of the convex spherical structure can move in any direction through the spherical contact of the bottom plate and the movable plate so as to solve the problem that the thicknesses of the workpieces are not parallel.
Description
Technical Field
The invention relates to the technical field of ceramic metallization, in particular to an AlN ceramic substrate copper-clad self-adaptive brazing clamping tool.
Background
With the rise and application of third-generation semiconductors, semiconductor devices are gradually developed towards high power, miniaturization, integration, multifunction and the like, and higher requirements are also put on the performance of packaging substrates. The ceramic substrate (also called ceramic circuit board) has the characteristics of high heat conductivity, good heat resistance, low thermal expansion coefficient, high mechanical strength, good insulativity, corrosion resistance, radiation resistance and the like, and is widely applied to electronic device packaging.
The preparation technology of the AlN ceramic copper-clad substrate includes direct bonding copper ceramic substrate (DBC), active metal soldering ceramic substrate (AMB), direct copper plating ceramic substrate (DPC), laser activated metal ceramic substrate (LAM) and the like. Wherein AMB technology is developed based on DBC technology. The ceramic substrate prepared by adopting the AMB process has the advantages of higher heat conductivity, better copper layer binding force, smaller heat resistance, higher reliability and the like.
However, during AMB brazing, the quality of the raw materials is affected. Defects such as unevenness and warpage of raw materials affect the quality of the AMB copper-clad finished product.
Therefore, there is a need for an adaptive clamping device that can accommodate for non-flatness and warp errors of a workpiece while clamping and securing the workpiece. Avoiding uneven thickness of the brazing layer and affecting the bonding strength, heat conductivity and other performances of the product.
Disclosure of Invention
The invention aims to provide an AlN ceramic substrate copper-clad self-adaptive brazing clamping tool, which solves the problems in the prior art, and the tool formed by combining a bottom plate of a concave spherical structure and a movable plate of a convex spherical structure can move in any direction through spherical contact of the bottom plate and the movable plate so as to compensate the problem that the thicknesses of workpieces are not parallel.
In order to achieve the above object, the present invention provides the following solutions: the invention provides an AlN ceramic substrate copper-clad self-adaptive brazing clamping tool, which comprises the following components: the top surface of the bottom plate is of a concave spherical structure; the movable plate is of a convex spherical structure, the movable plate is matched with the concave spherical structure on the top surface of the bottom plate, and the movable plate is arranged on the bottom plate.
Further, a positioning assembly is arranged between the adjacent tools, the positioning assemblies are distributed at four sides between the adjacent tools, and the positioning assemblies are fixed between the adjacent tools through fixing pieces.
Further, the positioning assembly comprises an upper positioning block and two lower positioning blocks, and the upper positioning blocks are arranged between the two lower positioning blocks in a staggered manner.
Further, the upper positioning block and the two lower positioning blocks are respectively provided with a second positioning hole, the bottom plate is provided with a first positioning hole, and the fixing piece penetrates through the first positioning holes and the second positioning holes to fix the upper positioning block and the lower positioning block between the adjacent tools.
Further, the fixing piece comprises a bolt, and the bolt penetrates through the bottom plate, the upper positioning block and the lower positioning block through the first positioning hole and the second positioning hole.
Furthermore, the base plate and the movable plate are made of high-temperature-resistant tungsten-molybdenum alloy or graphite.
Further, a plurality of layers of workpieces are arranged between the adjacent tools, and the workpieces are positioned between the four groups of upper positioning blocks and the lower positioning blocks.
Further, a backing plate is arranged between the adjacent workpieces.
Further, the workpiece comprises oxygen-free copper and an AIN substrate, wherein the oxygen-free copper is distributed on the upper side and the lower side of the AIN substrate.
The invention discloses the following technical effects:
The tool is formed by assembling a bottom plate with a concave spherical structure on the top and a movable plate with a convex spherical structure, the bottom plate and the movable plate are in spherical contact, and can move in any direction to compensate the uneven degree and the warping of a plurality of workpieces, so that the workpieces are uniformly stressed in the hot-press brazing process, the brazing layer thickness of the workpieces is uniform, and the whole bonding surface is uniform and consistent, so that the AlN ceramic copper-clad plate with excellent quality is obtained.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a state diagram of the invention when clamping a flat workpiece;
FIG. 3 is a state diagram of the invention when clamping an uneven workpiece;
FIG. 4 is a schematic view of a multi-layer tooling assembly according to the present invention;
FIG. 5 is a cross-sectional view of a multi-layer tooling assembly according to the present invention;
FIG. 6 is a schematic view of the structure of a workpiece according to the present invention;
FIG. 7 is a schematic view of a multi-layered workpiece according to the present invention;
Wherein, 1, the bottom plate; 2. a movable plate; 3. a lower positioning block; 4. an upper positioning block; 5, a workpiece; 501. oxygen-free copper; 502. an AIN substrate; 6. a backing plate; 7. and a fixing plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
As shown in fig. 1-7, the invention provides an AlN ceramic substrate copper-clad adaptive brazing clamping tool, comprising: the top surface of the bottom plate 1 is of a concave spherical structure; the movable plate 2, the movable plate 2 is the convex spherical structure, the movable plate 2 with the concave spherical structure looks adaptation of bottom plate 1 top surface, the movable plate 2 is installed on bottom plate 1.
As shown in fig. 2 and 3, the spherical contact between the bottom plate 1 and the movable plate 2 can move towards any direction to compensate for the non-parallel problem of the workpiece 5, the workpiece 5 is positioned between the upper and lower adjacent tools, the bottom of the workpiece 5 contacts with the movable plate 2, the top of the workpiece 5 contacts with the lower surface of the bottom plate 1 of another group of tools or the fixed plate 7 positioned at the uppermost part of the whole, the fixed plate 7 plays a role in fixing the top-layer workpiece, and when the workpiece 5 is in an uneven state, the movable plate 2 rolls and inclines to enable the workpiece 5 to keep a horizontal state, so as to compensate for the uneven problem of the workpiece 5.
The bottom plate 1 and the movable plate 2 are made of high-temperature-resistant tungsten-molybdenum alloy or graphite.
And positioning assemblies are arranged between the adjacent tools and distributed at four sides between the adjacent tools, and are fixed between the adjacent tools through fixing pieces.
As shown in fig. 4 and fig. 5, a plurality of groups of tools are combined and used, the upper and lower adjacent tools are fixed through a positioning assembly, and a workpiece 5 is placed between the upper and lower adjacent tools.
The positioning assembly comprises an upper positioning block 4 and two lower positioning blocks 3, wherein the upper positioning block 4 is arranged between the two lower positioning blocks 3, the two lower positioning blocks 3 are arranged in parallel, and the upper positioning block 4 and the two lower positioning blocks 3 are arranged in a staggered manner.
The mounting is the bolt, be provided with first locating hole on the bottom plate 1, first locating hole is provided with a plurality of, go up locating piece 4 and all be provided with the second locating hole on the lower locating piece 3, the second locating hole corresponds with the hole site in first locating hole, the bolt runs through bottom plate 1 and last locating piece 4 and lower locating piece 3 through first locating hole and second locating hole, and then realize fixing between upper and lower bottom plate 1, accomplish the fixation between the adjacent frock, bottom plate 1 relative fixed of adjacent frock is motionless, fly leaf 2 can move towards arbitrary direction relative bottom plate 1, rely on fly leaf 2 to remove the work piece 5 of placing between adjacent frock and leveling.
As shown in fig. 5, a plurality of layers of workpieces 5 are arranged between two adjacent workpieces 5, a backing plate 6 is arranged between the two adjacent workpieces 5, the workpieces 5 are located between four groups of upper positioning blocks 4 and lower positioning blocks 3, the upper positioning blocks 4 and the lower positioning blocks 3 play a role in fixing the workpieces 5, and the accumulated unevenness of the stacked layers of the workpieces can be compensated in multiple directions, wherein the workpiece 5 at the bottommost part of the workpieces 5 contacts with a movable plate 2, the workpiece 5 at the topmost part contacts with the lower surface of a bottom plate 1 of another group of tools, the lower surface of the bottom plate 1 of the other group of tools plays a role in fixing, downward acting force is applied to the workpieces 5 in the process of sequentially stacking the workpieces 5, the movable plate 2 rolls, the uneven workpieces are leveled, and then another group of adjacent tools (the workpieces 5 are placed in the tool combination) are stacked, so that the whole installation is completed.
The workpieces 5 comprise oxygen-free copper 501 and an AIN substrate 502, the oxygen-free copper 501 is distributed on the upper side and the lower side of the AIN substrate, a backing plate is arranged between the upper adjacent workpiece 5 and the lower adjacent workpiece 5, and multiple layers of workpieces 5 are vertically arranged. The multilayer workpiece 5 is placed between adjacent tools. The bottom plates 1 adjacent to each other up and down are fixed through the upper positioning blocks 4 and the lower positioning blocks 3, wherein the movable plate 2 can move towards any direction relative to the bottom plates 1, workpieces between adjacent tools can be leveled in the moving process of the movable plate 2, and uneven and warping caused by stacking of multiple layers of workpieces 5 are avoided.
The implementation process comprises the following steps:
1. Workpiece preparation
S1, preparation of raw materials
An AlN substrate 502 with a thickness of 0.25-1mm, a medium-temperature active metal solder composed of Ag-Cu-Ti, and oxygen-free copper 501 with a thickness of 0.2-1 mm.
S2, pretreatment of raw materials:
and carrying out surface etching on the surface of the AlN substrate 502 by using plasma etching equipment for 20-30min. And then using absolute ethyl alcohol and deionized water for ultrasonic cleaning for 5-10min, and using absolute ethyl alcohol and deionized water for ultrasonic cleaning for 5-10min on the surface of the oxygen-free copper 501.
S3, an active metal brazing layer is made on the AIN substrate:
the active metal brazing material is coated on the AlN ceramic substrate in a screen printing mode, and the thickness of the active metal brazing material is 10-50 mu m.
S4, attaching copper foil on the active metal brazing layer:
the copper foil is aligned with the ceramic plate and bonded to the coated active metal solder layer.
2. Workpiece clamping
The workpieces 5 are assembled by taking the oxygen-free copper 501, the AlN substrate 502 and the oxygen-free copper 501 as a group, a plurality of groups of workpieces 5 are stacked, the workpieces 5 are clamped by using the tools at intervals by using the backing plates 6, and the plurality of groups of tools are combined.
3. AIN substrate is brazed in a vacuum autoclave
S1, placing the assembled workpiece and tool combination on a workbench of a hot pressing furnace, pressing down a pressure head above the workbench to the top surface of the tool, vacuumizing to 5X10-3Pa, pressurizing to 1MPa, heating to 400 ℃, and keeping for 30min.
S2, continuously heating to 850-950 ℃, keeping the vacuum degree at 5X10-3Pa for 80min, and cooling. Thus obtaining the AlN ceramic copper-clad substrate.
In the description of the present invention, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
The above embodiments are only illustrative of the preferred embodiments of the present invention and are not intended to limit the scope of the present invention, and various modifications and improvements made by those skilled in the art to the technical solutions of the present invention should fall within the protection scope defined by the claims of the present invention without departing from the design spirit of the present invention.
Claims (9)
1. AlN ceramic substrate covers copper self-adaptation clamping frock of brazing, its characterized in that includes:
The bottom plate (1), the top of the bottom plate (1) is of a concave spherical structure;
The movable plate (2), the movable plate (2) is protruding type sphere structure, the movable plate (2) with concave type sphere structure looks adaptation of bottom plate (1) top surface, the movable plate (2) install in on bottom plate (1).
2. The AlN ceramic substrate copper clad adaptive brazing clamping tooling of claim 1, wherein: and positioning assemblies are arranged between the adjacent tools and distributed at four sides between the adjacent tools, and are fixed between the adjacent tools through fixing pieces.
3. The AlN ceramic substrate copper clad adaptive brazing clamping tooling of claim 2, wherein: the positioning assembly comprises an upper positioning block (4) and two lower positioning blocks (3), wherein the upper positioning block (4) is arranged between the two lower positioning blocks (3) in a staggered mode.
4. The AlN ceramic substrate copper clad adaptive brazing clamping tooling of claim 3, wherein: the upper positioning block (4) and the lower positioning block (3) are respectively provided with a second positioning hole, the bottom plate (1) is provided with a first positioning hole, and the fixing piece penetrates through the first positioning holes and the second positioning holes to fix the upper positioning block (4) and the lower positioning block (3) between the adjacent tools.
5. The AlN ceramic substrate copper clad adaptive brazing clamping tooling of claim 4, wherein: the fixing piece comprises a bolt, and the bolt penetrates through the bottom plate (1) and the upper positioning block (4) and the lower positioning block (3) through the first positioning hole and the second positioning hole.
6. The AlN ceramic substrate copper clad adaptive brazing clamping tooling of claim 1, wherein: the base plate (1) and the movable plate (2) are made of high-temperature-resistant tungsten-molybdenum alloy or graphite.
7. The AlN ceramic substrate copper clad adaptive brazing clamping tooling of claim 3, wherein: a plurality of layers of workpieces (5) are arranged between the adjacent tools, and the workpieces (5) are positioned between the four groups of upper positioning blocks (4) and the lower positioning blocks (3).
8. The AlN ceramic substrate copper clad adaptive brazing clamping tooling of claim 7, wherein: a backing plate (6) is arranged between the adjacent workpieces (5).
9. The AlN ceramic substrate copper clad adaptive brazing clamping tooling of claim 8, wherein: the workpiece (5) comprises oxygen-free copper (501) and an AIN substrate (502), wherein the oxygen-free copper (501) is distributed on the upper side and the lower side of the AIN substrate (502).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410324501.9A CN118123171A (en) | 2024-03-21 | 2024-03-21 | AlN ceramic substrate copper-clad self-adaptive brazing clamping tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410324501.9A CN118123171A (en) | 2024-03-21 | 2024-03-21 | AlN ceramic substrate copper-clad self-adaptive brazing clamping tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118123171A true CN118123171A (en) | 2024-06-04 |
Family
ID=91229977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410324501.9A Pending CN118123171A (en) | 2024-03-21 | 2024-03-21 | AlN ceramic substrate copper-clad self-adaptive brazing clamping tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118123171A (en) |
-
2024
- 2024-03-21 CN CN202410324501.9A patent/CN118123171A/en active Pending
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