JPH04307785A - Printed wiring board and soldering device therefor - Google Patents

Abstract

PURPOSE:To offer a printed wiring board contrived to increase the efficiency of a work and a soldering device for the board by a method wherein in the printed wiring board, which is used for an electronic equipment, and the soldering device for the board, a problem that a metallic pallet is needed in a soldering process and a manhour is increased, is solved. CONSTITUTION:Soldering forbidden regions 16, 17 and 18 are linearly provided on the side of a soldering surface of a printed wiring board 11 and at the same time, a soldering device is formed into a constitution, wherein the device is contrived so as to bridge a support member 20 for supporting the board 11 at a position, where corresponds to the region 17, of the device, whereby the warpage of the 24 to be mounted can be prevented. As a result, it becomes possible to perform a soldering work without a metallic pallet and an increase in the efficiency of a work for the board 1 can be contrived.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board used in electronic equipment and a soldering device therefor.

0002

2. Description of the Related Art Hereinafter, a conventional printed wiring board and its soldering device will be explained with reference to the drawings.

FIG. 5 is a plan view showing the soldering side of a conventional printed wiring board. In FIG. 5, reference numeral 1 denotes a parent printed board, and this parent printed board 1 includes a child printed board 2, a grandchild printed board 3, a waste board 4, and a spare board 5.
It was arranged and configured so that it could be divided into two parts.

[0004] Furthermore, electronic components (not shown) are inserted into the parent printed circuit board 1 constructed in this manner at predetermined positions and soldered using a soldering device.

Next, a soldering process using this soldering device will be explained. The main printed circuit board 1 into which electronic components have been inserted may warp due to the weight of the inserted electronic components and the heat within the soldering device. The parent printed circuit boards 1 are mounted one by one on a metal pallet 6, mounted on a conveyor of a soldering device, and soldered in a jet-type soldering tank.After this soldering process, the mother printed circuit boards 1 and the metal pallets 6 are removed from the soldering device. Then, the main printed circuit board 1 mounted on the metal pallet 6 was removed.

[0006]

However, in the conventional configuration described above, one metal pallet 6 is required for one parent printed circuit board 1, and it is necessary to prepare a large number of metal pallets 6 for mass production. Not only that, but also, each parent printed circuit board must be mounted on the metal pallet 6 before the soldering process, and it must be removed from the metal pallet 6 again after the soldering process, which is a time-consuming process. It also had its challenges.

The present invention has been made to solve these problems, and aims to provide a printed wiring board and its soldering apparatus that do not require a metal pallet, and to improve work efficiency.

[0008]

[Means for Solving the Problem] In order to solve this problem, the printed wiring board and its soldering device of the present invention provide a soldering prohibited area linearly on the soldering surface side of the printed wiring board 11, and The attaching device has a structure in which a support member for supporting the printed wiring board is installed at a position corresponding to the soldering prohibited area provided on the printed wiring board.

[0009]

[Operation] With this configuration, a printed wiring board with a soldering prohibited area can be used to insert electronic components because the soldering device is provided with a support member that supports this printed wiring board at a position corresponding to the soldering prohibited area. It is possible to prevent the printed wiring board from warping due to its weight and heat during soldering work. Therefore, there is no need for a metal pallet, and there is no need to attach or detach the printed wiring board to or from the metal pallet, making it possible to improve work efficiency.

0010

Embodiments (Embodiment 1) Hereinafter, a printed wiring board and its soldering apparatus according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the soldering surface of a printed wiring board according to a first embodiment of the present invention, and FIG. 2 is a plan view showing the configuration of a soldering device for soldering the printed wiring board according to the same embodiment. FIG. 3 is a sectional view of a main part showing a soldering process according to the same embodiment.

In FIG. 1, reference numeral 11 denotes a parent printed board, and this parent printed board 11 includes a child printed board 12, a grandchild printed board 13, a waste board 14, and a spare board 15.
are arranged and configured so that they can be divided.

Further, 16, 17, and 18 are solder-prohibited areas formed by applying a resist, and are formed on the parent printed circuit board 11.
The solder prohibited areas 16 and 18 are formed in a straight line in the soldering work direction, and the solder prohibited areas 16 and 18 are formed at both ends of the main printed circuit board 11. However, since no printed wiring is provided on the disposable board 14, no solder resist is applied thereto.

In the solder prohibited area 17, a resist is applied in a straight line at a weight-balanced position of the main printed board 11 so that the main printed board 11 does not warp due to the weight of the electronic component 24.

Note that the spare board 15 is arranged on an extension of the solder-prohibited area 17, and this spare board 15 is provided with holes and wiring patterns into which the electronic components 24 are inserted.
No resist is applied here. However, since the preliminary board 15 is located exactly on the extension of the solder-prohibited area 17, no solder is welded to the wiring patterns or holes for inserting electronic components in the preliminary board 15 during soldering work.

Further, the child printed circuit board 12, grandchild printed circuit board 13, and spare board 15 are rectangular to facilitate division.

A soldering device for soldering the printed wiring board will be described with reference to FIG. 2.

FIG. 2 is a plan view showing the configuration of the soldering apparatus. In FIG. 2, reference numeral 19 is a jet type solder bath, which is supported at a position corresponding to the soldering prohibited area 17 of the parent printed circuit board 11 shown in FIG. A member 20 is installed. Reference numeral 21 denotes gripping claws disposed at both ends of the conveyor, which hold the main printed circuit board 1.
This is for holding and transporting 1. Further, 22 is a member for attaching the support member 20.

[0018] The attachment position of the support member 20 to the attachment material can be changed arbitrarily.
For example, even if the arrangement of the solder prohibited area 17 of the parent printed circuit board 11 is changed, the soldering device only needs to change the mounting position of the support member 20.

FIG. 3 shows how an electronic component 24 mounted on a printed wiring board is soldered using the soldering apparatus configured as described above. In this way, during the soldering work, the main printed circuit board 1 on which the electronic components 24 are mounted
Since the solder prohibited area 17 provided in 1 is supported by the support member 20, and the solder prohibited areas 16 and 18 are supported by the clamping claws 21, warping of the parent printed circuit board 11 can be prevented. Therefore, it becomes possible to perform soldering work without individually mounting the parent printed circuit boards 11 on the metal pallet 6 described in the conventional example.

(Embodiment 2) A printed wiring board and its soldering apparatus according to a second embodiment of the present invention will be described below with reference to the drawings. FIG. 4 is a plan view showing the soldering surface of a printed wiring board according to a second embodiment of the present invention, and its configuration is almost the same as that of FIG. 1 explained in the first embodiment. The same parts are given the same numbers to simplify the explanation.

The configuration differs from that of FIG. 1 in the arrangement of the slave printed circuit board 12 and in that a solder-prohibited area 23 is newly provided at the divided portion of the slave printed circuit board 12. With this configuration, restrictions on the electronic components 24 to be mounted can be set to a minimum, and furthermore, the solder prohibited area 23 can be newly added, so that warping of the parent printed circuit board 11 can be further prevented.

In the second embodiment, the supporting member 20 is also required in the soldering device at a position corresponding to the soldering prohibited area 23.

[0023]

As described above, the printed wiring board and its soldering device according to the present invention have a structure in which the soldering device is provided with a support member that supports the printed wiring board at a position corresponding to the soldering prohibited area of the printed wiring board. This prevents the printed wiring board from warping due to the weight of the electronic components to be mounted and the heat generated during soldering. Therefore, not only is there no need for a metal pallet, but there is also no need to attach or detach the printed wiring board to or from the metal pallet, making it possible to improve work efficiency.

[0024] Furthermore, by setting the configuration in such a way that the installation position of the support member of the printed wiring board corresponding to the soldering prohibited area can be arbitrarily changed, a new printed wiring board can be installed without changing the soldering equipment. This has the effect of making it possible to respond to

Furthermore, if a plurality of printed wiring boards are arranged so as to be divisible, restrictions on mounting electronic components can be reduced by providing areas where soldering is prohibited at the divided portions. There is.

Furthermore, if the spare board is arranged on an extension of the soldering prohibited area, the supporting member of the printed wiring board will prevent solder from adhering to the spare board even after soldering, and the holes for inserting electronic components will be prevented. Since it is not filled with solder, it can be used very efficiently as a repair board.

[Brief explanation of drawings]

FIG. 1 is a plan view of the solder side of a printed wiring board in a first embodiment of the present invention.

[Fig. 2] Plan view of the soldering device in the same embodiment.

[Figure 3
] Cross-sectional view of main parts showing the soldering process in the same example

FIG. 4 is a plan view of the soldering surface side of the printed wiring board according to the second embodiment of the present invention.

[Figure 5] Plan view of the soldering side of a conventional printed wiring board

[Figure 6] A perspective view showing a metal pallet used in the conventional soldering process

[Explanation of symbols]

11 Main printed circuit board 12 Child printed circuit board 13 Grandson printed circuit board 14 Discarded board 15 Spare board 16, 17, 18　Solder prohibited area

Claims (5)

[Claims] 1. A printed wiring board, which has at least one linear solder-prohibited area on both ends of the soldering surface side and on a surface other than these ends. Claim 2: A support member for supporting the printed wiring board is installed in a jet-flow type solder bath equipped with clamping claws for holding both ends of the printed wiring board at a position corresponding to a soldering prohibited area provided on the printed wiring board. Soldering equipment. 3. The printed wiring board according to claim 1, wherein the solder prohibited area is formed by coating a resist. 4. The printed wiring board according to claim 1, wherein a plurality of rectangular printed wiring boards are arranged so as to be divisible, and solder prohibited areas are formed in the divided portions. 5. The divisible printed wiring board includes a spare board, and the spare board has a soldering part and is disposed on an extension of a solder-prohibited area provided on the printed wiring board. printed wiring board.