JPH04293799A - Electroplating method - Google Patents

Electroplating method

Info

Publication number
JPH04293799A
JPH04293799A JP5869991A JP5869991A JPH04293799A JP H04293799 A JPH04293799 A JP H04293799A JP 5869991 A JP5869991 A JP 5869991A JP 5869991 A JP5869991 A JP 5869991A JP H04293799 A JPH04293799 A JP H04293799A
Authority
JP
Japan
Prior art keywords
plating
current density
plated
passing speed
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP5869991A
Other languages
Japanese (ja)
Inventor
Shigeru Takahashi
滋 高橋
Ikuji Yokota
横田郁治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP5869991A priority Critical patent/JPH04293799A/en
Publication of JPH04293799A publication Critical patent/JPH04293799A/en
Withdrawn legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To provide the electroplating method. CONSTITUTION:Electroplating is operated without lowering a current density to a non-plating region by selecting plural pieces of discharge surfaces 5 of electrodes 4 according to the passing speed of a material 3 to be plated and energizing these surfaces. A prescribed plating deposition is surely obtd. even at a low passing speed and an exact plating compsn. is obtd. as well. The merchandise value of the plated product is improved and the yield is improved as well.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、電気めっき方法に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroplating method.

【0002】0002

【従来の技術と発明が解決しようとする課題】電解めっ
きにおいては、一般に複数個のめっきタンクを連設して
、鋼帯等の被めっき材に連続的にめっきを施し、所定付
着量に制御するものである。そこで薄付着量の場合、あ
るいは低速通板時等は、複数個のパスの中何れか1又は
2以上のパスへの通電を停止して所定付着量を与えるも
のである。これはめっきにおける電流密度をいかなる通
板状態の場合にも、適性電流密度範囲内に納める事によ
り、付着量制御及び外観等の品質管理をする事を目的と
してなされるものである。
[Prior art and problems to be solved by the invention] In electrolytic plating, generally multiple plating tanks are installed in series to continuously plate the material to be plated, such as steel strip, and control the coating amount to a predetermined amount. It is something to do. Therefore, in the case of a thin coating amount or during low-speed sheet passing, the current supply to one or more of the plurality of passes is stopped to provide a predetermined coating amount. This is done for the purpose of controlling the coating amount and controlling the quality of appearance etc. by keeping the current density during plating within the appropriate current density range under any condition of sheet passing.

【0003】しかしながら、特に薄めっきの場合(例え
ば、通電パスが1又は2程度のもの)や、適性電流密度
範囲が非常に狭いもの等の場合には、上記の方法では、
通電を停止する事のできるパス数が不足したり、パス数
変更付近の条件において、電流密度が低くなり、適性電
流密度範囲を外れてしまう事がある。(なお、この適性
電流密度範囲は、めっき浴の種類、組成等により異なる
ものである)。
However, in the case of particularly thin plating (for example, one with only one or two current passing paths) or one with a very narrow suitable current density range, the above method
If the number of passes that can stop energization is insufficient, or if the number of passes is changed, the current density may become low and fall outside the appropriate current density range. (This appropriate current density range varies depending on the type, composition, etc. of the plating bath.)

【0004】このような場合、商品価値が低下し、歩留
が低下することになる。このような歩留低下を解決する
ことが強く要求されているところである。
[0004] In such a case, the commercial value will decrease and the yield will decrease. There is a strong demand for a solution to such a decrease in yield.

【0005】[0005]

【課題を解決するための手段】本発明の特徴とするとこ
ろは、被めっき材の通板速度に応じて、電極の複数個放
電面を選択して通電し、電流密度を不めっき領域へ低下
させることなく操業することを特徴とする、電気めっき
方法である。
[Means for Solving the Problems] The present invention is characterized in that a plurality of discharge surfaces of the electrode are selected and energized according to the passing speed of the material to be plated, and the current density is reduced to the non-plated area. This is an electroplating method characterized by the fact that it operates without any interference.

【0006】本発明方法においては、被めっき材の通板
速度を低速に切換えたとき、電極の複数個放電面を選択
して通電することにより、不めっき領域の低電流密度に
低下させることなく、通電するものである。
In the method of the present invention, when the passing speed of the material to be plated is switched to a low speed, by selectively applying current to a plurality of discharge surfaces of the electrode, the current density is not reduced to a low current density in the unplated area. , which conducts electricity.

【0007】例えば、電極のめっき鋼帯対称面に複数個
の放電面を設け、めっき鋼帯の通板速度に応じてめっき
鋼帯へ通電する放電面の数を調整し、不めっき領域とな
らない電流密度でめっきを施すものである。
For example, a plurality of discharge surfaces are provided on the symmetrical surface of the plated steel strip of the electrode, and the number of discharge surfaces that conduct electricity to the plated steel strip is adjusted according to the passing speed of the plated steel strip, thereby preventing an unplated area. Plating is performed using current density.

【0008】即ち、通板速度が低速になるほど、電極の
通電する放電面の数を減少し、通電する放電面は、目標
とするめっき量を施すために電流密度を高く維持して通
電し、低電流密度による不めっきを解消するものである
That is, as the plate passing speed becomes slower, the number of current-carrying discharge surfaces of the electrode is reduced, and the current-carrying discharge surfaces are energized while maintaining a high current density in order to apply a target plating amount. This eliminates non-plating caused by low current density.

【0009】実操業としては、例えば、めっき浴組成等
から不めっき領域となる低電流密度域を把握しておき、
通板速度に応じて、目標とするめっき量との関係から通
電する電極の放電面を不めっきとならない電流密度で通
電する数に調整するものである。
[0009] In actual operation, for example, the low current density area that is the non-plating area is known from the plating bath composition, etc.
Depending on the plate passing speed, and in relation to the target plating amount, the number of electrodes to be energized is adjusted to a number that allows energization at a current density that does not result in unplated surfaces.

【0010】このような本発明方法においては、クロム
めっき、錫めっき、金属めっき、亜鉛めっき等の電気め
っきに有効に適用することができる。
The method of the present invention can be effectively applied to electroplating such as chromium plating, tin plating, metal plating, and zinc plating.

【0011】次に本発明方法の実施態様例を図面により
説明する。図1及び図2において、めっき浴1を満たし
たタンク2内へ鋼帯3を導き、電極4を陽極、鋼帯3を
陰極として通電し、電解めっきを施すに際し、鋼帯3の
通板速度に応じて電極4の通電する放電面5a、5b、
5cの数を調整し、不めっき領域にならない電流密度で
目標とする電解めっきを施すものである。図中6は、コ
ンダクターロールである。
Next, embodiments of the method of the present invention will be explained with reference to the drawings. 1 and 2, a steel strip 3 is introduced into a tank 2 filled with a plating bath 1, and electricity is applied using an electrode 4 as an anode and the steel strip 3 as a cathode to perform electrolytic plating. The discharge surfaces 5a, 5b of the electrode 4 are energized according to the
By adjusting the number of 5c, target electrolytic plating is performed at a current density that does not result in an unplated area. 6 in the figure is a conductor roll.

【0012】0012

【実施例】次に本発明方法の実施例を比較例とともに挙
げる。
[Examples] Next, examples of the method of the present invention will be described together with comparative examples.

【0013】実施例−1 (1)めっき浴組成 CrO3 :50g/l、H2 SO4 :0.3g/
l、Na2 SiF6 :0.5g/l(浴温:40℃
)(2)鋼帯巾:1000mm (3)電極放電面積:0.2m2 ×3個このような条
件で、通板速度400m/分、電流密度60A/dm2
 で、放電面3個から通電し、±10mg/m2 のク
ロムめっき(金属)を施し、次いで、ライン入側で鋼帯
コイル(鋼帯)の接続(溶接)をするため、通板速度を
200m/分に低下させたので、放電面2個からの通電
を停止し、1個の放電面(0.2m2 )からの通電(
電流密度60A/dm2 )で、目標とする±10mg
/m2 の金属クロムめっきを継続して施した。
Example-1 (1) Plating bath composition CrO3: 50g/l, H2SO4: 0.3g/l
l, Na2 SiF6: 0.5 g/l (bath temperature: 40°C
) (2) Steel strip width: 1000mm (3) Electrode discharge area: 0.2m2 x 3 pieces Under these conditions, the threading speed was 400m/min, and the current density was 60A/dm2.
Then, electricity was applied from three discharge surfaces, chrome plating (metal) of ±10 mg/m2 was applied, and then the steel strip coil (steel strip) was connected (welded) at the line entry side, so the threading speed was increased to 200 m. /min, the current flow from the two discharge surfaces was stopped and the current flow from one discharge surface (0.2 m2) was stopped.
Current density 60A/dm2), target ±10mg
/m2 metal chromium plating was continuously applied.

【0014】次いで、鋼帯の接続が終了し、通板速度を
300m/分に増速したので2個の放電面からの通電(
60A/dm2 )に切換え、更に通板速度が400m
/分になったとき、3個の放電面からの通電(60A/
dm2 )に切換え、何れも目標とする±10mg/m
2 の金属クロムめっきを施した。
[0014] Next, the connection of the steel strips was completed, and the threading speed was increased to 300 m/min.
60A/dm2), and the threading speed was further increased to 400m.
/ minute, electricity is applied from the three discharge surfaces (60A/minute).
dm2), with the target of ±10mg/m in both cases.
2 metal chrome plating was applied.

【0015】比較例 めっき浴組成、鋼帯巾ともに実施例と同一条件で、電極
放電面積0.6m2 (一体構成)で、電流密度60A
/dm2 、通板速度400m/分で±10mg/m2
 の金属クロムめっきを施し、次いで通板速度を200
m/分に低下させたので、電流密度30A/dm2 と
低電流密度にしたところ、ほとんどクロム酸化物の析出
状態で金属クロムは、1mg/m2 未満となり、成品
格落となった。
Comparative Example The plating bath composition and steel strip width were the same as in the example, the electrode discharge area was 0.6 m2 (integrated structure), and the current density was 60 A.
/dm2, ±10mg/m2 at threading speed of 400m/min
metal chrome plating, and then the threading speed was increased to 200
When the current density was lowered to 30 A/dm2, the amount of metallic chromium was less than 1 mg/m2, with most of the chromium oxide being precipitated, and the product was rejected.

【0016】そこで電流密度を57A/dm2 まで上
げたところ、金属クロムは、13mg/m2 析出され
、目標のめっき量をオーバーし、これも成品格落となっ
た。
When the current density was increased to 57 A/dm2, 13 mg/m2 of metallic chromium was deposited, which exceeded the target plating amount, and the product was also rejected.

【0017】[0017]

【発明の効果】かくすることにより、通板速度の変化に
よる金属クロムめっき量の変動を確実に解消し、成品歩
留を著しく向上することができる。
[Effects of the Invention] By doing so, it is possible to reliably eliminate fluctuations in the amount of metal chromium plating due to changes in the sheet passing speed, and to significantly improve the product yield.

【0018】又実操業においても電極の放電面を選択し
て通電することから容易に、しかも確実にできる等の優
れた効果が得られる。
[0018] Also, in actual operation, by selectively applying current to the discharge surface of the electrode, excellent effects such as easy and reliable operation can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明方法の実施態様例を示す側面説明図。FIG. 1 is a side view showing an embodiment of the method of the present invention.

【図2】電極の正面説明図。FIG. 2 is an explanatory front view of an electrode.

【符号の説明】[Explanation of symbols]

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  被めっき材の通板速度に応じて、電極
の複数個放電面を選択して通電し、電流密度を不めっき
領域へ低下させることなく操業することを特徴とする、
電気めっき方法。
[Claim 1] The method is characterized in that a plurality of discharge surfaces of the electrodes are selectively energized according to the passing speed of the material to be plated, and the operation is performed without reducing the current density to the non-plated area.
Electroplating method.
JP5869991A 1991-03-22 1991-03-22 Electroplating method Withdrawn JPH04293799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5869991A JPH04293799A (en) 1991-03-22 1991-03-22 Electroplating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5869991A JPH04293799A (en) 1991-03-22 1991-03-22 Electroplating method

Publications (1)

Publication Number Publication Date
JPH04293799A true JPH04293799A (en) 1992-10-19

Family

ID=13091777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5869991A Withdrawn JPH04293799A (en) 1991-03-22 1991-03-22 Electroplating method

Country Status (1)

Country Link
JP (1) JPH04293799A (en)

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A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19980514