JP2717599B2 - Electroplating control method - Google Patents
Electroplating control methodInfo
- Publication number
- JP2717599B2 JP2717599B2 JP2307196A JP30719690A JP2717599B2 JP 2717599 B2 JP2717599 B2 JP 2717599B2 JP 2307196 A JP2307196 A JP 2307196A JP 30719690 A JP30719690 A JP 30719690A JP 2717599 B2 JP2717599 B2 JP 2717599B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating solution
- steel strip
- amount
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は電気めっきのめっき量制御方法に関するもの
である。Description: TECHNICAL FIELD The present invention relates to a plating amount control method for electroplating.
（従来技術と発明が解決しようとする課題） 電気めっきにおいては複数個のめっきパスを直列に配
置し、鋼帯等の被めっき材を順次通過せしめて所定のめ
っき付着量にめっきするものである。このようなめっき
方法で、めっき量の制御としては、電流密度の増減、め
っきパスの１部を無通電（めっきせず、空パス）にす
る、無通電タンクを復活する等の操業により行なわれて
いる。(Prior Art and Problems to be Solved by the Invention) In electroplating, a plurality of plating paths are arranged in series, and a plating target material such as a steel strip is sequentially passed to plate to a predetermined plating adhesion amount. . In such a plating method, the control of the plating amount is performed by operations such as increasing or decreasing the current density, making a part of the plating pass non-conductive (no plating, an empty pass), and restoring the non-conductive tank. ing.
しかし、最近薄目付のめっき成品が多用されるようにな
ってきた。このような薄目付めっき鋼板等の製造は、１
個のめっきパスで十分可能である。このように１個のめ
っきパスでのめっき付着量制御は電流密度の調整のみと
なり、めっき付着量制御の範囲が狭く薄目付めっき鋼板
の広い用途には適応できない等の欠点がある。However, recently, thin plated products have been frequently used. Manufacture of such thin-plated steel sheets is performed by
One plating pass is enough. As described above, the control of the coating weight in one plating pass involves only the adjustment of the current density, and has a drawback that the range of the coating weight control is narrow and cannot be applied to a wide range of applications of thin plated steel sheets.
（課題を解決するための手段） 本発明は、竪型めっきタンク中の液面を調整し、鋼帯
対称部位のめっき液中電極の面積を調整することを特徴
とする、電気めっきのめっき量制御方法に関するもので
ある。(Means for Solving the Problems) The present invention adjusts the liquid level in a vertical plating tank, and adjusts the area of the electrode in the plating solution at a symmetrical portion of the steel strip, wherein the amount of electroplating is adjusted. It relates to a control method.
本発明においては上記のごとく、鋼帯に対称する部位
のめっき液中の電極面積を調整することによって、鋼帯
の単位時間当りの通電面積を増減し、めっき量の制御を
施すものである。In the present invention, as described above, by controlling the electrode area in the plating solution at a portion symmetrical to the steel strip, the energization area per unit time of the steel strip is increased or decreased, and the plating amount is controlled.
次にめっき液中の電極面積を調整する方法としては、
例えば第１図のごとく、めっきタンク１内の鋼帯２通過
位置両側に電極３を配置し、めっき液４を満して鋼帯２
を陰極とし、電極３を陽極としてめっきするに際し、め
っき液循環タンク５からの供給回路６で、図示のごと
く、ピストン７を操作し、めっきタンク１内のめっき液
面4aから4bまでの間になるごとく調整し、鋼帯２に対称
する部位のめっき液４中の電極３面積を調整して鋼帯２
に対する通電面積を増減してめっき量の制御を行なうも
のである。Next, as a method of adjusting the electrode area in the plating solution,
For example, as shown in FIG. 1, the electrodes 3 are arranged on both sides of the steel tank 2 passing position in the plating tank 1, and the steel strip 2 is filled with the plating solution 4.
Is used as a cathode and the electrode 3 is used as an anode. In a supply circuit 6 from a plating solution circulating tank 5, a piston 7 is operated as shown in FIG. Adjust as much as possible, and adjust the area of the electrode 3 in the plating solution 4 at a portion symmetrical to the steel strip 2 to adjust the steel strip 2
To control the amount of plating by increasing or decreasing the current-carrying area.
又例えば第２図のごとく、めっきタンク１の鋼帯２通過
位置両側に電極３を配置し、めっき液４を満して鋼帯２
を陰極とし、電極３を陽極としてめっきする。めっき液
４は、めっき液導入ポンプ8,8aを介してタンク１内へ供
給し、一方めっき液導出ポンプ9,9aを介してタンク１内
のめっき液の１部を導出し、調整タンク（図示せず）へ
導き液調整後、導入ポンプ8,8aからタンク１内へ供給し
つつ、めっきするに際し、めっき液４の供給量、導出量
の調整により、めっき液面4aの位置を調整して、鋼帯２
に対称する部位のめっき液４中の電極３面積を調整しめ
っき量の制御を行なうものである。Also, for example, as shown in FIG.
Is used as a cathode and the electrode 3 is used as an anode. The plating solution 4 is supplied into the tank 1 through the plating solution introduction pumps 8 and 8a, and a part of the plating solution in the tank 1 is drawn out through the plating solution derivation pumps 9 and 9a, and is adjusted in the adjustment tank (see FIG. (Not shown), the plating solution is adjusted and the position of the plating solution surface 4a is adjusted by adjusting the supply amount and the lead-out amount of the plating solution 4 during plating while supplying the solution from the introduction pumps 8 and 8a into the tank 1. , Steel strip 2
In this case, the area of the electrode 3 in the plating solution 4 at a symmetrical position is adjusted to control the amount of plating.
このようなめっき量制御方法は例えば、通板速度一定で
めっき量を調整（増減）、通板速度の変化に応じてめっ
き量が一定になるごとく調整することができ、これらの
調整は、電流密度の調整と併用して行なうこともできる
ものである。Such a plating amount control method can, for example, adjust (increase or decrease) the plating amount at a constant passing speed, and adjust the plating amount according to a change in the passing speed so that the plating amount becomes constant. It can be performed in combination with the adjustment of the density.
このような本発明のめっき量調整方法は、例えば、Z
n,Cr,Sn,Al,Fe,Ni,Cu,Pb,Ag,Au等単独又はこれら金属の
合金あるいは他の金属を含む合金めっき等に有利に適用
することができる。Such a plating amount adjustment method of the present invention, for example, Z
The present invention can be advantageously applied to plating of n, Cr, Sn, Al, Fe, Ni, Cu, Pb, Ag, Au or the like alone or an alloy of these metals or an alloy containing other metals.
（実施例） 次に本発明の実施例を挙げる。(Example) Next, an example of the present invention will be described.
錫めっき鋼板の製造に際し、竪型めっきタンクで、次
記のごとく実施した。In the production of the tin-plated steel sheet, it was carried out in a vertical plating tank as described below.
１）浴組成：Sn2+:28g/l,PSA:14g/l、（H2SO4換算） ２）電流密度:40A/dm2 ３）めっき時間:1.2秒 ４）めっき液（浴）中での鋼帯（巾900mm）対称の有効
電極長さ:1000mm（片面）、 巾:1000mm ５）通板速度:50m/分 このような条件でめっき量2.8g/m2の錫めっきを施し、
次に錫めっき量を1.4g/m2に減少させるため、次記のご
とく調整した。1) Bath composition: Sn 2+ : 28 g / l, PSA: 14 g / l, (converted to H 2 SO 4 ) 2) Current density: 40 A / dm 2 3) Plating time: 1.2 seconds 4) In plating solution (bath) steel strip with (width 900 mm) symmetry of the effective electrode length: 1000 mm (one side), width: 1000 mm 5) passing plate speed: 50 m / min subjected to tin plating coating weight 2.8 g / m 2 under these conditions,
Next, in order to reduce the amount of tin plating to 1.4 g / m 2 , the following adjustment was made.
１）めっき液（浴）中での鋼帯対称の有効電極長さ:500
mm（片面） ２）めっき時間:0.6秒 他の条件は同一 上記有効電極長さ:500mm（片面）に減少するため、めっ
き液（浴）の上面（液面）を下げ、めっき液中での鋼帯
対称の電極の１部を露出（めっき液外）せしめ、めっき
時間は必然的に短縮した。1) Effective length of steel strip symmetrical electrode in plating solution (bath): 500
mm (one side) 2) Plating time: 0.6 seconds Other conditions are the same. Effective electrode length: To reduce to 500 mm (one side), lower the top surface (liquid level) of plating solution (bath), A part of the steel strip symmetrical electrode was exposed (outside the plating solution), and the plating time was inevitably reduced.
一方検査目的で通板速度を25mm/分と低速にしたゝめ
めっき量増加を防止するため次記のごとく調整した。On the other hand, for the purpose of inspection, the passing speed was made as low as 25 mm / min.
１）めっき液（浴）中での鋼帯対称の有効電極面積長:2
50mm（片面） ２）めっき時間:0.6秒 上記同様にめっきタンク中のめっき液（浴）面を下げ、
めっき液中での鋼帯対称の電極をより露出（めっき液
外）し、めっき液中での鋼帯対称電極面積を縮少せし
め、めっき時間を同一にして、めっき付着量の増加を抑
えることができた。1) Effective electrode area length of steel strip symmetry in plating solution (bath): 2
50mm (one side) 2) Plating time: 0.6 seconds Lower plating solution (bath) in plating tank as above
Exposing the steel strip symmetrical electrode in the plating solution more (outside of the plating solution), reducing the area of the steel strip symmetrical electrode in the plating solution, keeping the plating time the same, and suppressing the increase in plating adhesion. Was completed.
（発明の効果） かくすることにより、電気めっきにおけるめっき付着
量の制御が確実にでき、品質を向上させるとともに歩留
を向上することができる。(Effect of the Invention) By doing so, it is possible to reliably control the amount of plating applied in electroplating, thereby improving the quality and improving the yield.
又実操業において、確実に、しかも迅速に、かつ容易に
できることから安定操業ができる。Also, in actual operation, stable operation can be performed because it can be performed reliably, quickly, and easily.
更に設備的なコストも安く、かつライニングコストもほ
とんどかゝらず、安価に実施できる等の優れた効果が得
られる。Further, excellent effects such as low equipment cost, little lining cost, and low cost can be obtained.
第１図及び第２図は本発明の一例を示す説明図である。 １…タンク、２…鋼帯 ３…電極、４…めっき液 ５…めっき液循環タンク 4a,4b…液面、６…供給回路 ７…ピストン 8,8a…めっき液導入ポンプ 9,9a…めっき液導出ポンプ FIG. 1 and FIG. 2 are explanatory diagrams showing an example of the present invention. DESCRIPTION OF SYMBOLS 1 ... Tank 2 ... Steel strip 3 ... Electrode 4 ... Plating solution 5 ... Plating solution circulation tank 4a, 4b ... Liquid level, 6 ... Supply circuit 7 ... Piston 8,8a ... Plating solution introduction pump 9,9a ... Plating solution Derived pump
───────────────────────────────────────────────────── フロントページの続き (72)発明者 関口 正俊 愛知県東海市東海町５―３ 新日本製鐵 株式会社名古屋製鐵所内 (56)参考文献 特開 昭60−245799（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masatoshi Sekiguchi 5-3 Tokai-cho, Tokai-shi, Aichi Nippon Steel Corporation Nagoya Works (56) References JP-A-60-245799 (JP, A)
Claims (1)
対称部位のめっき液中電極の面積を調整することを特徴
とする、電気めっきのめっき量制御方法。1. A method for controlling a plating amount of electroplating, comprising adjusting a liquid level in a vertical plating tank and adjusting an area of an electrode in a plating solution at a symmetric portion of a steel strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2307196A JP2717599B2 (en) | 1990-11-15 | 1990-11-15 | Electroplating control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2307196A JP2717599B2 (en) | 1990-11-15 | 1990-11-15 | Electroplating control method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04180591A JPH04180591A (en) | 1992-06-26 |
| JP2717599B2 true JP2717599B2 (en) | 1998-02-18 |
Family
ID=17966201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2307196A Expired - Fee Related JP2717599B2 (en) | 1990-11-15 | 1990-11-15 | Electroplating control method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2717599B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5484974B2 (en) * | 2010-03-22 | 2014-05-07 | 新日鉄住金エンジニアリング株式会社 | Continuous electroplating method, plating solution circulation method, and continuous electroplating apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60245799A (en) * | 1984-05-18 | 1985-12-05 | Sumitomo Metal Ind Ltd | Method for controlling amount of plating deposited |
-
1990
- 1990-11-15 JP JP2307196A patent/JP2717599B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04180591A (en) | 1992-06-26 |
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