JPH04291742A - Supplier of slender chip - Google Patents

Abstract

PURPOSE:To surely thrust up slender chips such as LED chips by thrust pins of a die ejector. CONSTITUTION:Slender chips P on a wafer 1 are observed by a camera 16 to detect their positional shifts in the rotational direction. Next, a plurality of thrust pins 9 provided on a die ejector 4 are rotated by gears 13,14 and a motor 15 as rotating means to run along the longitudinal direction of chips P, which are thrust up by these pins 9 and picked up onto a transfer head 20.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a feeding device for elongated chips, which allows elongated chips such as LED chips to be reliably pushed up using a plurality of push-up pins and fed to a transfer head.

0002

[Prior Art] When chips mounted on a wafer are mounted on a substrate such as a lead frame, the chips on the wafer are pushed up using the push-up pins of a die ejector, and the chips are picked up by being attracted to the nozzle of a transfer head. , to be transferred and mounted on the board.

0003

[Problems to be Solved by the Invention] By the way, when pushing up an elongated chip such as an LED chip using the push-up pin, if the elongated chip is even slightly misaligned in the rotational direction, the pin will come off the chip and the chip will be pushed up. You can't push it up. Incidentally, the size of the LED chip is, for example, 30 mm vertically and 0.5 mm horizontally.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an elongated chip supply device that can reliably push up elongated chips such as LED chips and supply them to a transfer head.

[0005]

[Means for Solving the Problems] The present invention includes a wafer having an elongated chip, a die ejector located below the wafer and pushing up the elongated chip, and a camera for observing the elongated chip from above. , the die ejector is provided with a pepper pot having a plurality of push-up pins along the length of the elongated chip, and based on the observation result of the camera, the pepper pot is moved horizontally relative to the elongated chip. It is equipped with a rotating means for rotating.

[0006]

[Operation] In the above structure, before the elongated chip on the wafer is pushed up by the push-up pin, the chip is observed with a camera to detect any positional deviation in the rotational direction.

Next, the pepperpot is horizontally rotated relative to the chip, the plurality of pins are aligned along the length of the long and thin chip, and the chip is pushed up by the pins and picked up by the transfer head. let

[0008]

Embodiments Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is an overall view of an elongated chip supply device. A wafer 1 is held on a base plate 2. On the wafer 1, an elongated chip P such as an LED chip is adhered. The base plate 2 is supported by an XY table 3 and moves in the XY direction.

A die ejector 4 is provided below the wafer 1 and has a pepper pot 5 and a cap 6 attached to the head of the pepper pot 5.

As shown in FIG. 2, a lifting rod 7 is housed inside the pepper pot 5. A pedestal 8 is attached to the upper part of the lifting rod 7, and a plurality of push-up pins 9 are erected on the pedestal 8.

The pins 9 are arranged in a straight line along the length of the elongated chip P. Correspondingly, the cap 6 has a plurality of pin holes 10 arranged in a straight line. perforated (see also Figure 1). 11 is a spring coil spring for the lifting rod 7, and 12 is a thrusting rod. When the lifting rod 12 is raised and lowered by being driven by a drive means (not shown), the lifting rod 7 is also raised and lowered, and the pin 9 is projected and retracted from the pin hole 10.

13 is a gear attached to the lower part of the pepper pot 5, 14 is a gear that engages with this gear 13, and 15 is a motor. When the motor 15 is driven, the pepper pot 5 horizontally rotates about its axis.

In FIG. 1, a camera 16 is provided above the wafer 1 and observes the elongated chip P. 2
0 is a transfer head and has a nozzle 21. An adsorbent 22 is provided at the lower end of this nozzle 21 . As shown in FIG. 4, an elongated adsorption section 23 is provided on the lower surface of the adsorption body 22, and a plurality of adsorption holes 24 are formed in a straight line along the elongated chip P in this adsorption section 23. It has been drilled.

This device has the above-mentioned configuration, and its operation will be explained next. Before the chip P on the wafer 1 is picked up by the transfer head 20, the chip P is observed by the camera 16 to detect a positional shift in the rotational direction.

As shown by the solid line in FIG.
Push up. Further, as shown by the chain line in FIG. 3, if there is a positional deviation in the rotational direction of the chip P, the motor 15 is driven to rotate the pepper pot 5 and the plurality of pins 9 are moved along the length direction of the elongated chip P. Then, the pin 9 is made to protrude to push up the chip P, and the transfer head 20 picks it up.

In the above embodiment, the pepper pot 5 is rotated, but the wafer 1 is rotated horizontally and the pin 9 is rotated.
may be arranged along the length direction of the chip P.

[0018]

[Effects of the Invention] As explained above, the present invention provides a wafer having an elongated chip, a wafer below the wafer,
There is a die ejector that pushes up the elongated chip, and a camera that observes the elongated chip from above, the die ejector has a pepper pot having a plurality of push-up pins along the length direction of the elongated chip, and Based on the observation results of the camera, a rotation means is provided to horizontally rotate this pepperpot relative to the elongated chip, so elongated chips such as LED chips can be reliably pushed up with push-up pins and transferred. It can be picked up by the head.

[Brief explanation of the drawing]

FIG. 1: Overall view of the elongated chip supply device of the present invention.

[Figure 2
]A cross-sectional view for explaining the operation of the elongated chip supply device of the present invention during pickup.

FIG. 3 is a plan view of the main parts of the elongated chip supply device of the present invention.

FIG. 4 is a perspective view of a nozzle in the elongated chip supply device of the present invention.

[Explanation of symbols]

1 Wafer 4 Die ejector 5 Pepperpot 9 Push-up pin 13 Gear 14 Gear 15 Motor 16 Camera

Claims (1)

[Claims] Claim 1: A wafer having an elongated chip; a die ejector located below the wafer that pushes up the elongated chip; and a camera that observes the elongated chip from above; a pepper pot having a plurality of push-up pins along the length direction, and a rotation means for horizontally rotating the pepper pot relative to the elongated tip based on the observation result of the camera. A feeding device for elongated chips characterized by: