JPH0429155B2 - - Google Patents
Info
- Publication number
- JPH0429155B2 JPH0429155B2 JP61082850A JP8285086A JPH0429155B2 JP H0429155 B2 JPH0429155 B2 JP H0429155B2 JP 61082850 A JP61082850 A JP 61082850A JP 8285086 A JP8285086 A JP 8285086A JP H0429155 B2 JPH0429155 B2 JP H0429155B2
- Authority
- JP
- Japan
- Prior art keywords
- coil
- chip
- drive coil
- film
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 238000004804 winding Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000015654 memory Effects 0.000 description 14
- 238000005520 cutting process Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 125000006850 spacer group Chemical group 0.000 description 8
- 230000000452 restraining effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 208000027418 Wounds and injury Diseases 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 208000004221 Multiple Trauma Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61082850A JPS63119093A (ja) | 1986-04-10 | 1986-04-10 | 磁気バブルメモリデバイス |
| EP87400826A EP0241386A3 (de) | 1986-04-10 | 1987-04-10 | Magnetische Blasenspeicheranordnung und Verfahren zu deren Herstellung |
| US07/037,142 US4868786A (en) | 1986-04-10 | 1987-04-10 | Magnetic bubble memory with main and auxiliary printed wiring film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61082850A JPS63119093A (ja) | 1986-04-10 | 1986-04-10 | 磁気バブルメモリデバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63119093A JPS63119093A (ja) | 1988-05-23 |
| JPH0429155B2 true JPH0429155B2 (de) | 1992-05-18 |
Family
ID=13785846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61082850A Granted JPS63119093A (ja) | 1986-04-10 | 1986-04-10 | 磁気バブルメモリデバイス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63119093A (de) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5086938A (de) * | 1973-12-01 | 1975-07-12 | ||
| JPS50145033A (de) * | 1974-05-11 | 1975-11-21 | ||
| JPS5826382A (ja) * | 1981-08-07 | 1983-02-16 | Hitachi Ltd | 磁気バブルメモリデバイスの製造方法 |
| JPS6116087A (ja) * | 1984-07-02 | 1986-01-24 | Hitachi Ltd | 磁気バブルメモリデバイス |
-
1986
- 1986-04-10 JP JP61082850A patent/JPS63119093A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5086938A (de) * | 1973-12-01 | 1975-07-12 | ||
| JPS50145033A (de) * | 1974-05-11 | 1975-11-21 | ||
| JPS5826382A (ja) * | 1981-08-07 | 1983-02-16 | Hitachi Ltd | 磁気バブルメモリデバイスの製造方法 |
| JPS6116087A (ja) * | 1984-07-02 | 1986-01-24 | Hitachi Ltd | 磁気バブルメモリデバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63119093A (ja) | 1988-05-23 |
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