JPH0429072A - Detection of defectively soldered part of circuit board - Google Patents
Detection of defectively soldered part of circuit boardInfo
- Publication number
- JPH0429072A JPH0429072A JP2135837A JP13583790A JPH0429072A JP H0429072 A JPH0429072 A JP H0429072A JP 2135837 A JP2135837 A JP 2135837A JP 13583790 A JP13583790 A JP 13583790A JP H0429072 A JPH0429072 A JP H0429072A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- liquid crystal
- defective
- heat
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 title description 3
- 238000005476 soldering Methods 0.000 claims abstract description 41
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 39
- 230000002950 deficient Effects 0.000 claims abstract description 38
- 239000003094 microcapsule Substances 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims description 14
- 230000005611 electricity Effects 0.000 claims description 3
- 238000007689 inspection Methods 0.000 abstract description 15
- HVYWMOMLDIMFJA-DPAQBDIFSA-N cholesterol Chemical compound C1C=C2C[C@@H](O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2 HVYWMOMLDIMFJA-DPAQBDIFSA-N 0.000 abstract description 4
- 230000020169 heat generation Effects 0.000 abstract description 3
- 235000012000 cholesterol Nutrition 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 230000007704 transition Effects 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 9
- 238000002845 discoloration Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、電気機器等の回路基板の製造時におけるはん
だ付けの不良部の検出法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for detecting defective soldering during the manufacture of circuit boards for electrical equipment and the like.
（発明の概要）
本発明は、電気機器等の回路基板の製造時におけるはん
だ付けの不良部の検出法において、回路基板上に所定温
度で変色する液晶のマイクロカプセルを配してはんな付
け箇所に通電し、はんた°付け不良部の高抵抗に起因す
る発熱を前記液晶のマイクロカプセルの変色で検出する
ことにより、部品が両面に搭載されていて両面に凹凸の
ある両面搭載基板の場合でも液晶のマイクロカプセルの
変色を検出することてはんだ付け不良部が検出てきるよ
うにしたものである。(Summary of the Invention) The present invention is a method for detecting defective soldering during the manufacture of circuit boards for electrical equipment, etc., in which liquid crystal microcapsules that change color at a predetermined temperature are placed on a circuit board and soldered. By applying electricity to the spot and detecting the heat generated due to the high resistance of the defective soldering part by the discoloration of the microcapsules of the liquid crystal, it is possible to detect a double-sided board with parts mounted on both sides and uneven surfaces. Even in such cases, defective soldering can be detected by detecting discoloration of the liquid crystal microcapsules.
（従来の技術）
従来の回路基板のはんだ付け不良部の検出法の例として
、第４図乃至第６図に示したものが知られている。(Prior Art) As an example of a conventional method for detecting a soldering defect on a circuit board, the methods shown in FIGS. 4 to 6 are known.
第４図は第１従来例を示しており、導体パターン付きプ
リント基板２１上に電気部品２２を配置し、プリント基
板２１の導体パターンと電気部品２２のｔ極（端子）を
はんだ付けすることにより、回路基板２３が構成されて
いる。前記はんだ付けを行なった際、プリント基板２１
の導体パターンと電気部品２２の電極間の電気的接合の
不良部、つまりはんだ付けの不良部を検出する方法とし
て、人間の目視２４により、回路基板２３のはんだ付け
が施されている箇所の外観を検査してはんだ、付け不良
部を検出するものである。FIG. 4 shows a first conventional example, in which an electrical component 22 is placed on a printed circuit board 21 with a conductor pattern, and the conductor pattern of the printed circuit board 21 and the t-pole (terminal) of the electrical component 22 are soldered. , a circuit board 23 is configured. When performing the soldering, the printed circuit board 21
As a method for detecting defective electrical connections between the conductor pattern and the electrodes of the electrical component 22, that is, defective soldering, the external appearance of the soldered portions of the circuit board 23 is determined by human visual inspection 24. This test detects defects in soldering and soldering.
第５図は第２従来例を示しており、第１従来例と同様の
構成である回路基板２３のはんだ付け不良部の検出法と
して、はんだ付けが施されている箇所の外観をテレビカ
メラ２５で撮像し、画像処理部２６で所要の画像処理を
行なうことにより、はんだ付け不良部を検出するもので
ある。FIG. 5 shows a second conventional example. As a method for detecting defective soldering on a circuit board 23 having the same configuration as the first conventional example, the external appearance of the soldered area is observed using a television camera 25. A defective soldering part is detected by taking an image and performing necessary image processing in the image processing section 26.
第６図は第３従来例を示しており、第１従来例と同様の
構成である回路基板２３において、電気部品２２が配置
されていない基板面上に、所定温度で変色する液晶をフ
ィルムに塗布又は印刷してなるシート状に形成された液
晶板２７を配置するとともに、検査用電源２８を用いて
回路基板２３の検査箇所に定格電流を通電する。これに
より、はんだ付け不良部がある場合、該不良部の高抵抗
に起因する発熱で前記液晶板２７のはんだ付け不良部に
対応する部分が変色し、回路基板２３のはんだ付け不良
部を検出することができる。（発明が解決しようとする
課題）
ところで、上記の第１及び第２従来例は、人間の目視や
テレビカメラによる画像処理の手段を用いてはんだ付け
した箇所の外観を見て検査を行なうので、実際に電気部
品の電極とプリント基板の導体パターン間が電気的に正
しく接合されているか否かは確認できず、はんだ付け部
分の機能保証としては不十分であった。FIG. 6 shows a third conventional example, in which a circuit board 23 having the same configuration as the first conventional example has a liquid crystal that changes color at a predetermined temperature on a film on the surface of the circuit board on which no electrical components 22 are arranged. A liquid crystal plate 27 formed in a sheet shape by coating or printing is arranged, and a rated current is applied to the inspection portion of the circuit board 23 using an inspection power source 28. As a result, when there is a defective soldering part, the part of the liquid crystal plate 27 corresponding to the defective soldering part changes color due to heat generated due to the high resistance of the defective part, and the defective soldering part of the circuit board 23 is detected. be able to. (Problems to be Solved by the Invention) Incidentally, in the first and second conventional examples described above, the appearance of the soldered parts is inspected using human visual observation or image processing means using a television camera. It was not possible to confirm whether or not the electrodes of the electrical component and the conductor pattern of the printed circuit board were actually electrically connected correctly, and the function of the soldered part was not guaranteed.
上記第３従来例では、回路基板の検査箇所に検査用電源
を用いて通電し、はんだ付け不良部の発熱による液晶板
の変色を検出することではんだ付け不良部の検出を行な
うので、はんだ付け部分の機能保証としては十分である
が、検出の際に回路基板の部品が搭載されていない面に
液晶板を密着、配置しなければならないので、検査でき
る基板が片面に部品が搭載されているものに限定される
問題点があった。In the third conventional example above, defective soldering is detected by applying power to the inspection point on the circuit board using an inspection power supply and detecting discoloration of the liquid crystal panel due to heat generation in the defective soldering. Although this is sufficient to guarantee the functionality of the parts, the liquid crystal plate must be placed in close contact with the side of the circuit board that has no components mounted during detection, so the board that can be inspected may have components mounted on one side. The problem was that it was limited to certain items.
本発明は、上記の点に鑑み、対象基板に部品が片面又は
両面に搭載されているかにかかわらず、はんだ付け箇所
の良否が確認できる回路基板のはんだ付け不良部の検出
法を提供することを目的とする。In view of the above points, it is an object of the present invention to provide a method for detecting defective soldering parts on a circuit board, which allows checking the quality of the soldering parts, regardless of whether components are mounted on one or both sides of the target board. purpose.
（課題を解決するための手段〉
上記目的を達成するために、本発明は、回路基板上に所
定温度で変色する液晶のマイクロカプセルを配するとと
もに、回路基板のはんだ付け箇所に通電し、はんだ付け
不良部の高抵抗に起因する発熱を前記液晶のマイクロカ
プセルの変色て検出するようにしている。(Means for Solving the Problems) In order to achieve the above object, the present invention provides liquid crystal microcapsules that change color at a predetermined temperature on a circuit board, and energizes the soldering points of the circuit board to solder the solder. Heat generated due to high resistance in the defective attachment portion is detected by discoloration of the microcapsules of the liquid crystal.
（作用）
本発明の回路基板のはんだ付け不良部の検出法において
は、検査対象の回路基板上に所定温度で変色する液晶の
マイクロカプセルを配しているので、部品が搭載されて
いる凹凸のある基板上でも液晶のマイクロカプセルを一
様に配することができ、この状態ではんだ付け箇所に通
電すると、はんだ付け不良部の高抵抗に起因する発熱が
生じて前記液晶のマイクロカプセルが変色し、この変色
を検出することではんだ付け不良部が検出てきる。(Function) In the method of detecting defective soldering on a circuit board of the present invention, liquid crystal microcapsules that change color at a predetermined temperature are placed on the circuit board to be inspected, so that unevenness on which parts are mounted is removed. Liquid crystal microcapsules can be uniformly arranged even on a certain board, and when electricity is applied to the soldering points in this state, heat is generated due to the high resistance of the soldering defect, causing the liquid crystal microcapsules to discolor. By detecting this discoloration, defective soldering can be detected.
（実施例）
以下、本発明に係る回路基板のはんだ付け不良部の検出
法の実施例を図面に従って説明する。(Example) Hereinafter, an example of the method for detecting a defective soldering portion of a circuit board according to the present invention will be described with reference to the drawings.
第１図において、導体パターン付きプリント基板１の両
面に電気部品２を配置し、前記導体パター〉′付きプリ
ント基板１の導体パターンと電気部品２の電極（端子）
をはんだ付けすることにより、回路基板３が構成されて
いる。そして、該回路基板３の周囲に囲み４を装着する
。該囲み４は、可撓性テープ等を巻き付けるなどの手段
で、少なくとも回路基板３の上面側の電気部品２が搭載
されている面より高くなるように隙間なく装着されてい
る。In FIG. 1, electrical components 2 are arranged on both sides of a printed circuit board 1 with a conductor pattern, and the conductor pattern of the printed circuit board 1 with the conductor pattern and the electrode (terminal) of the electrical component 2 are arranged.
The circuit board 3 is constructed by soldering. Then, a enclosure 4 is attached around the circuit board 3. The enclosure 4 is mounted without any gaps by wrapping a flexible tape or the like so that it is at least higher than the upper surface of the circuit board 3 on which the electrical components 2 are mounted.
次に、回路基板３の上面側に所定温度で変色する所要量
の液晶マイクロカプセル５を供給する。Next, a required amount of liquid crystal microcapsules 5 which change color at a predetermined temperature are supplied to the upper surface of the circuit board 3.
該液晶マイクロカプセル５は、電気部品２の耐熱温度範
囲内でかつ検査時の周囲温度より高い温度に定められた
所定温度に達すると変色するように作成された液晶（コ
レステロール液晶）を、直径１０μｍ位の球状に樹脂で
覆い封止したものである。The liquid crystal microcapsules 5 contain a liquid crystal (cholesterol liquid crystal) with a diameter of 10 μm that is made to change color when it reaches a predetermined temperature that is within the heat-resistant temperature range of the electrical component 2 and higher than the ambient temperature at the time of inspection. It is a spherical shape covered with resin and sealed.
液晶マイクロカプセルの基板面への供給と共に、矢印Ｆ
の如く回路基板３に上下方向あるいは左右方向の振動を
加え、少なくとも検査領域のはんだ付け箇所に分布する
ように一様に拡散させる。この際、回路基板３の周囲に
は囲み４が装着されているため、回路基板３の周辺部に
も一様に液晶マイクロカプセル５を配することができる
。Along with supplying the liquid crystal microcapsules to the substrate surface, arrow F
Vibration is applied to the circuit board 3 in the vertical direction or in the horizontal direction as shown in FIG. At this time, since the enclosure 4 is attached around the circuit board 3, the liquid crystal microcapsules 5 can be uniformly arranged around the circuit board 3 as well.
そして、第２図に示すように、回路基板３の上面側に液
晶マイクロカプセル５を配した状態で、両面の検査箇所
に検査用電源６を用いて定格電流を通電する。第３図は
回路基板３上の特定の検査箇所を拡大して説明したもの
で、電気部品２の電極７とプリント基板１側の導体パタ
ーン８とのけんだ９による接合箇所に検査用電源６を用
いて通電している。他の検査箇所にも同様に通電する。Then, as shown in FIG. 2, with the liquid crystal microcapsules 5 arranged on the upper surface side of the circuit board 3, a rated current is applied to the test points on both sides using the test power supply 6. FIG. 3 is an enlarged explanation of a specific inspection point on the circuit board 3, where an inspection power supply 6 is placed at the joint 9 between the electrode 7 of the electrical component 2 and the conductor pattern 8 on the printed circuit board 1 side. It is energized using. The other inspection points are also energized in the same way.
はんだ付け接合が不良である場合、この接合不良部の抵
抗値は高いので、検査用電源６で定格電流を流すと高抵
抗に起因して発熱し、前記液晶マイクロカプセル５のは
んだ付けの接合不良部に対応する部分が発熱により変色
し、回路基板３のはんだ付け不良部の位置が検出される
。If the soldered joint is defective, the resistance value of this defective joint is high, so when the rated current is passed through the test power supply 6, heat is generated due to the high resistance, and the soldered joint of the liquid crystal microcapsule 5 is defective. The part corresponding to the part changes color due to heat generation, and the position of the defective soldering part of the circuit board 3 is detected.
このように回路基板３の上側となるどちら力）−方の面
上に液晶マイクロカプセル５を配し、両面の検査箇所の
各部を検査用電源を用いて同時に通電させる。液晶マイ
クロカプセル５が配されてＵ）ない方にはんだ付け不良
部がある場合も、その箇所が発熱し、プリント基板１を
介した熱伝導により反対面（上面）に配されている液晶
マイクロカプセル５が変色することで検出できる。これ
番こより、回路基板３の両面のはんだ付け不良部が同時
に検出可能である。In this way, the liquid crystal microcapsules 5 are arranged on the upper side of the circuit board 3, and each part of the inspection points on both sides is energized simultaneously using the inspection power source. Even if there is a defective soldering part on the side where the liquid crystal microcapsules 5 are not placed, heat will be generated in that part, and the liquid crystal microcapsules placed on the opposite side (top side) will generate heat due to heat conduction through the printed circuit board 1. 5 can be detected by changing color. This makes it possible to detect defective soldering on both sides of the circuit board 3 at the same time.
なお、液晶マイクロカプセル５の変色の検出番よ、人間
の目視やテレビカメラを用いた画像処理等の手段で実行
可能である。Note that the detection of discoloration of the liquid crystal microcapsules 5 can be performed by means such as human visual observation or image processing using a television camera.
検査後、回路基板３の周囲に装着されてし）る囲み４を
取り外し、液晶マイクロカプセル５も除去する。はんだ
付け不良部の検出を行なった後の液晶マイクロカプセル
５は、検査前の周囲温度になると元の変色前の色に戻る
ので、検査後回収して何度も繰り返し使用可能である。After the inspection, the enclosure 4 attached around the circuit board 3 is removed, and the liquid crystal microcapsules 5 are also removed. The liquid crystal microcapsules 5 after detecting defective soldering parts return to the original color before the change of color when the ambient temperature reaches the temperature before the test, so they can be collected after the test and used over and over again.
上記実施例では、回路基板３の両面に電気部品２が搭載
されている場合を示したか、片面に搭載されている場合
にも、はんな付け不良部の検出は同様の手段で容易に可
能である。この場合、回路基板のどちらか一方の上側と
なる面上に液晶マイクロカプセルを配し、検査箇所の各
部を検査用電源を用いて同時に通電させ変色を検出し、
はんだ付け不良部を検出する。In the above embodiment, the case is shown in which the electrical component 2 is mounted on both sides of the circuit board 3, but even when the electrical component 2 is mounted on one side, it is possible to easily detect a soldering defect by the same means. It is. In this case, a liquid crystal microcapsule is placed on one of the upper surfaces of the circuit board, and each part of the inspection area is energized simultaneously using an inspection power source to detect discoloration.
Detects soldering defects.
また、上記実施例では両面同時に検査しているが、片面
ずつはんだ付け不良部の検出を行なってもよい。Further, in the above embodiment, both sides are inspected simultaneously, but defective soldering portions may be detected on one side at a time.
（発明の効果）
以上説明したように、本発明の回路基板のはんだ付け不
良部の検出法によれば、液晶のマイクロカプセルを用い
ているので、部品が両面に搭載されている凹凸のある基
板についても液晶のマイクロカプセルを一様に配するこ
とができ、はんだ付け不良部の高抵抗に起因する発熱を
前記液晶のマイクロカプセルの変色で確実に検出するこ
とができる。これにより、従来の外観検査では確認でき
なかったはんだ付け箇所の機能保証ができる。(Effects of the Invention) As explained above, according to the method for detecting defective soldering on a circuit board according to the present invention, since liquid crystal microcapsules are used, a board with uneven surfaces on which components are mounted on both sides can be used. Also, the liquid crystal microcapsules can be uniformly arranged, and the heat generated due to the high resistance of the defective soldering part can be reliably detected by the discoloration of the liquid crystal microcapsules. This makes it possible to guarantee the functionality of soldered points, which could not be confirmed with conventional visual inspections.
第１図は本発明に係る回路基板のはんだ付け不良部の検
出法の実施例において回路基板に液晶マイクロカプセル
を供給する工程を示す説明図、第２図は同実施例におい
て検査用電源を用いて検査箇所に電流を流す工程を示す
説明図、第３図は特定の検査箇所を拡大して示す部分拡
大図、第４図は回路基板のはんだ付け不良部の検出法の
第１従来例を示す説明図、第５図は第２従来例を示す説
明図、第６図は第３従来例を示す説明図である。
１・・プリント基板、２・電気部品、３・・回路基板、
４ ・囲み、５・・液晶マイクロカプセル、６検査用電
源、７・電極、８・・導体パターン、９・はんだ。FIG. 1 is an explanatory diagram showing the process of supplying liquid crystal microcapsules to a circuit board in an embodiment of the method for detecting defective soldering on a circuit board according to the present invention, and FIG. 3 is a partially enlarged view showing a specific inspection location, and FIG. 4 is a first conventional example of a method for detecting defective soldering on a circuit board. FIG. 5 is an explanatory diagram showing the second conventional example, and FIG. 6 is an explanatory diagram showing the third conventional example. 1. Printed circuit board, 2. Electrical components, 3. Circuit board,
4. Box, 5. Liquid crystal microcapsule, 6. Power source for testing, 7. Electrode, 8. Conductor pattern, 9. Solder.
Claims (2)
カプセルを配するとともに、回路基板のはんだ付け箇所
に通電し、はんだ付け不良部の高抵抗に起因する発熱を
前記液晶のマイクロカプセルの変色で検出することを特
徴とする回路基板のはんだ付け不良部の検出法。(1) Liquid crystal microcapsules that change color at a predetermined temperature are placed on the circuit board, and electricity is applied to the soldered parts of the circuit board to absorb the heat generated by the high resistance of the defective soldering parts and discolor the liquid crystal microcapsules. A method for detecting defective soldering on a circuit board.
領域に前記液晶のマイクロカプセルを一様に配する請求
項１記載の回路基板のはんだ付け不良部の検出法。(2) The method for detecting defective soldering on a circuit board according to claim 1, wherein the circuit board is vibrated and the liquid crystal microcapsules are uniformly distributed at least in an area to be inspected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2135837A JPH0429072A (en) | 1990-05-25 | 1990-05-25 | Detection of defectively soldered part of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2135837A JPH0429072A (en) | 1990-05-25 | 1990-05-25 | Detection of defectively soldered part of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0429072A true JPH0429072A (en) | 1992-01-31 |
Family
ID=15160924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2135837A Pending JPH0429072A (en) | 1990-05-25 | 1990-05-25 | Detection of defectively soldered part of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429072A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003107120A (en) * | 2001-09-27 | 2003-04-09 | Toppan Printing Co Ltd | Conduction inspection sheet, conduction inspection method and conduction inspection device using the sheet |
| CN103353578A (en) * | 2013-07-30 | 2013-10-16 | 青岛海信宽带多媒体技术有限公司 | Fault detection method of circuit board device |
-
1990
- 1990-05-25 JP JP2135837A patent/JPH0429072A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003107120A (en) * | 2001-09-27 | 2003-04-09 | Toppan Printing Co Ltd | Conduction inspection sheet, conduction inspection method and conduction inspection device using the sheet |
| CN103353578A (en) * | 2013-07-30 | 2013-10-16 | 青岛海信宽带多媒体技术有限公司 | Fault detection method of circuit board device |
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