JPH04290282A - Pattern structure - Google Patents
Pattern structureInfo
- Publication number
- JPH04290282A JPH04290282A JP5296191A JP5296191A JPH04290282A JP H04290282 A JPH04290282 A JP H04290282A JP 5296191 A JP5296191 A JP 5296191A JP 5296191 A JP5296191 A JP 5296191A JP H04290282 A JPH04290282 A JP H04290282A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- land
- bead core
- solid pattern
- output terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011324 bead Substances 0.000 claims abstract description 23
- 239000007787 solid Substances 0.000 claims abstract description 22
- 230000000644 propagated effect Effects 0.000 claims abstract description 4
- 230000005855 radiation Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、ビーズコアが実装され
たプリント基板に於けるパターン構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern structure in a printed circuit board on which bead cores are mounted.
【０００２】近年、電子機器を構成するプリント基板に
おいては、プリント基板に実装される電子部品の高速化
，高密度実装化が推進されるようになり、電波ノイズに
よる影響を極力避けるよう形成されるようになった。[0002] In recent years, printed circuit boards constituting electronic devices are being formed to avoid the effects of radio noise as much as possible, as the electronic components mounted on the printed circuit boards are being mounted at higher speeds and with higher density. It became so.
【０００３】通常、スィッチングなどによるクロック信
号が伝播されるパターンを有するプリント基板では、こ
のような電波ノイズを避けるために、ビーズコアをプリ
ント基板に実装し、パターンからの電波放射を減少させ
ることが行われている。[0003] Normally, in order to avoid such radio noise on a printed circuit board that has a pattern through which a clock signal is propagated due to switching, etc., bead cores are mounted on the printed circuit board to reduce radio wave radiation from the pattern. It is being said.
【０００４】0004
【従来の技術】従来は図３の従来の説明図に示すように
構成されていた。図３の（ａ） は斜視図，（ｂ）は回
路図である。2. Description of the Related Art Conventionally, a device has been constructed as shown in the conventional explanatory diagram of FIG. FIG. 3(a) is a perspective view, and FIG. 3(b) is a circuit diagram.
【０００５】図３の（ａ） に示すように、プリント基
板１ に配設された出力端子ＴＯに接続される第１のラ
ンド２ と、プリント基板１に配設された出力端子ＴＯ
にパターン５ を介して接続される第２のランド３ と
を設け、第１のランド２ にはビーズコア４ のリード
端子４Ａを、第２のランド３ にはビーズコア４ のリ
ード端子４Ｂをそれぞれ接続し、プリント基板１ にビ
ーズコア４ を実装するように構成されている。As shown in FIG. 3(a), a first land 2 connected to the output terminal TO disposed on the printed circuit board 1 and a first land 2 connected to the output terminal TO disposed on the printed circuit board 1
A second land 3 is connected to the pattern 5 through the pattern 5, and the lead terminal 4A of the bead core 4 is connected to the first land 2, and the lead terminal 4B of the bead core 4 is connected to the second land 3. , a bead core 4 is mounted on a printed circuit board 1 .
【０００６】また、このようなプリント基板１ に於い
ては、第１のランド２，第２のランド３およびパターン
５ が配設された下層にはアース層７ が形成されてい
る。そこで、出力端子ＴＯと、入力端子ＴＩとの間に接
続されるパターン５ にはビーズコア４ を設け、パタ
ーン５ からの電波放射を減衰させることが行われてい
た。Further, in such a printed circuit board 1, a ground layer 7 is formed below the first land 2, second land 3, and pattern 5. Therefore, a bead core 4 is provided in the pattern 5 connected between the output terminal TO and the input terminal TI to attenuate the radio wave radiation from the pattern 5.
【０００７】このような構成では、（ｂ） に示すよう
に、出力端子ＴＯにビーズコア４ によるインピーダン
スＺＢと、パターン５ によるインピーダンスＺＰとが
加わることになり、場合の電波放射の減衰量Ｄ は下記
の（１） 式に示す値となる。In such a configuration, as shown in (b), an impedance ZB due to the bead core 4 and an impedance ZP due to the pattern 5 are added to the output terminal TO, and the amount of attenuation D of radio wave radiation in this case is as follows. The value is shown in equation (1).
【０００８】[0008]
【数１】[Math 1]
【０００９】[0009]
【発明が解決しようとする課題】しかし、このようなビ
ーズコア４ を出力端子ＴＯに設ける構成に於けるビー
ズコア４ は、数百ＭＨｚ 以上の周波数では、インピ
ーダンスＺＢが小さくなるため、電波放射を減衰させる
効果が小さくなる問題を有していた。[Problem to be Solved by the Invention] However, in the configuration in which such a bead core 4 is provided at the output terminal TO, the impedance ZB of the bead core 4 becomes small at frequencies of several hundred MHz or more, and thus attenuates radio wave radiation. The problem was that the effect was small.
【００１０】そこで、本発明では、このような数百ＭＨ
ｚ 以上となる高い周波数に於ける電波放射の減衰効果
を向上させることを目的とする。[0010] Therefore, in the present invention, such several hundred MH
The purpose is to improve the attenuation effect of radio wave radiation at high frequencies above z.
【００１１】[0011]
【課題を解決するための手段】図１は本発明の原理説明
図であり、図１に示すように、アース層７ が形成され
たプリント基板１ の上層に配設された第１のランド２
と、第２のランド３ との間にビーズコア４ を実装
すると共に、該第１のランド２ を出力端子ＴＯに接続
し、該第２のランド２ を所定の面積Ｓ を有するベタ
パターン６ に接続し、該ベタパターン６ と、入力端
子ＴＩとの間にパターン５ を接続し、該パターン５
の接続によって該出力端子ＴＯからの信号が該ビーズコ
ア４ と該ベタパターン６ とを介して入力端子ＴＩに
伝播されるように構成する。[Means for Solving the Problems] FIG. 1 is an explanatory diagram of the principle of the present invention. As shown in FIG.
A bead core 4 is mounted between and a second land 3, and the first land 2 is connected to the output terminal TO, and the second land 2 is connected to a solid pattern 6 having a predetermined area S. Then, connect the pattern 5 between the solid pattern 6 and the input terminal TI, and connect the pattern 5 to the input terminal TI.
The configuration is such that the signal from the output terminal TO is propagated to the input terminal TI via the bead core 4 and the solid pattern 6.
【００１２】このように構成することによって前述の課
題は解決される。[0012] With this configuration, the above-mentioned problem is solved.
【００１３】[0013]
【作用】即ち、第１のランド２ と、第２のランド３
との間にビーズコア４ を実装すると共に、第２のラン
ド３ に所定の面積Ｓ を有するベタパターン６ を設
け、更にベタパターン６ と入力端子との間にパターン
５ を形成するようにしたものである。[Operation] That is, the first land 2 and the second land 3
A bead core 4 is mounted between the two lands, a solid pattern 6 having a predetermined area S is provided on the second land 3, and a pattern 5 is formed between the solid pattern 6 and the input terminal. be.
【００１４】したがって、出力端子ＴＯ側からの信号が
ビーズコア４ と、ベタパターン６ と、パターン５
とを介して入力端子ＴＩに接続されるようにすることで
、ベタパターン６ とアース層７ との間に所定の静電
容量を発生させ、ビーズコア４ に於ける減衰効果の向
上を図ることができる。Therefore, the signal from the output terminal TO side is transmitted to the bead core 4, the solid pattern 6, and the pattern 5.
By connecting to the input terminal TI through the bead core 4, a predetermined capacitance is generated between the solid pattern 6 and the earth layer 7, and the damping effect in the bead core 4 can be improved. can.
【００１５】[0015]
【実施例】以下本発明を図２を参考に詳細に説明する。
図２は本発明による一実施例の説明図で、（ａ） は斜
視図，（ｂ）は回路図である。全図を通じて、同一符号
は同一対象物を示す。EXAMPLES The present invention will be explained in detail below with reference to FIG. FIG. 2 is an explanatory diagram of an embodiment according to the present invention, in which (a) is a perspective view and (b) is a circuit diagram. The same reference numerals indicate the same objects throughout the figures.
【００１６】図２の（ａ） に示すように、ビーズコア
４ のリード端子４Ｂが固着された第２のランド３ と
、入力端子ＴＩに接続されるパターン５ との間に所定
の面積Ｓ を有するベタパターン６ を設けるようにし
たもので、その他は前述と同じ構成である。As shown in FIG. 2(a), there is a predetermined area S between the second land 3 to which the lead terminal 4B of the bead core 4 is fixed and the pattern 5 connected to the input terminal TI. A solid pattern 6 is provided, and the other configurations are the same as those described above.
【００１７】このようなベタパターン６ を設けること
で、ベタパターン６ とアース層７ との間に静電容量
が発生し、（ｂ） に示すように、パターン５ の始点
から入力端子ＴＩ側を見たインピーダンスＺＰに対して
、ベタパターン６ によるインピーダンスＺＣが加わる
ことになる。By providing such a solid pattern 6, capacitance is generated between the solid pattern 6 and the earth layer 7, and as shown in (b), the input terminal TI side is connected from the starting point of the pattern 5. The impedance ZC due to the solid pattern 6 is added to the impedance ZP seen.
【００１８】したがって、この場合の減衰量Ｄ０は下記
の（２） 式に示す値となる。[0018] Therefore, the attenuation amount D0 in this case becomes a value shown in the following equation (2).
【数２】
通常、数百ＭＨｚ に於けるベタパターン６ によるン
ピーダンスＺＣは、ＺＰに比較して非常に小さいため、
減衰量Ｄ は下記の（３） 式に示す値となる。[Equation 2] Normally, the impedance ZC due to the solid pattern 6 at several hundred MHz is very small compared to ZP, so
The attenuation amount D is a value shown in the following equation (3).
【００１９】[0019]
【数３】
したがって、ＺＣが非常に小さい値になると、減衰量Ｄ
は増加することになり、数百ＭＨｚ 以上となる高い
周波数に於ける電波放射の減衰を従来に比較して、大幅
に大きくすることができることが明らかである。[Equation 3] Therefore, when ZC becomes a very small value, the attenuation amount D
It is clear that the attenuation of radio wave radiation at high frequencies of several hundred MHz or more can be significantly increased compared to the conventional method.
【００２０】また、このような構成では、ビーズコア４
に接続されるパターン５ にベタパターン６ を設け
ることで良く、特別な部品を実装することなく行えるた
め、減衰量を増加させることが、安価に行えることにな
る。[0020] Furthermore, in such a configuration, the bead core 4
It is sufficient to provide the solid pattern 6 on the pattern 5 connected to the pattern 5, and this can be done without mounting any special parts, so that the amount of attenuation can be increased at low cost.
【００２１】[0021]
【発明の効果】以上説明したように、本発明によれば、
ビーズコア４ が実装された箇所に、所定の面積を有す
るベタパターンを形成することで、ベタパターンにより
静電容量を発生させ、数百ＭＨｚ 以上となる高い周波
数に於ける電波放射の減衰量を増加させることができる
。[Effects of the Invention] As explained above, according to the present invention,
By forming a solid pattern with a predetermined area at the location where Bead Core 4 is mounted, the solid pattern generates capacitance and increases the amount of attenuation of radio wave radiation at high frequencies of several hundred MHz or more. can be done.
【００２２】したがって、従来に比較し、電波放射によ
る障害が減少し、品質の向上が図れ、また、特別な部品
を設ける必要がないため、安価に製造が行え、コストの
低減が図れる。[0022] Therefore, compared to the conventional art, interference due to radio wave radiation is reduced, quality can be improved, and since there is no need to provide special parts, manufacturing can be carried out at low cost and costs can be reduced.
【図１】 本発明の原理説明図[Figure 1] Diagram explaining the principle of the present invention
【図２】 本発明による一実施例の説明図[Fig. 2] Explanatory diagram of an embodiment according to the present invention
【図３】
従来の説明図[Figure 3]
Conventional illustration
１ プリント基板
２ 第１のランド３ 第２のランド
４ ビーズコア５ パ
ターン
６ ベタパターン７ アース層
ＴＯ 出力端子ＴＩ
入力端子1 Printed circuit board
2 1st land 3 2nd land
4 Bead core 5 Pattern
6 Solid pattern 7 Earth layer
TO Output terminal TI
input terminal
Claims (1)
ト基板（１） の上層に配設された第１のランド（２）
と、第２のランド（３） との間にビーズコア（４）
を実装すると共に、該第１のランド（２） を出力端
子（ＴＯ）に接続し、該第２のランド（２） を所定の
面積（Ｓ） を有するベタパターン（６） に接続し、
該ベタパターン（６）と、入力端子（ＴＩ）との間にパ
ターン（５） を接続し、該パターン（５） の接続に
よって該出力端子（ＴＯ）からの信号が該ビーズコア（
４） と該ベタパターン（６） とを介して入力端子（
ＴＩ）に伝播されることを特徴とするパターン構造。[Claim 1] A first land (2) disposed on the upper layer of a printed circuit board (1) on which a ground layer (7) is formed.
Bead core (4) is placed between the land and the second land (3).
At the same time, the first land (2) is connected to the output terminal (TO), the second land (2) is connected to the solid pattern (6) having a predetermined area (S),
A pattern (5) is connected between the solid pattern (6) and the input terminal (TI), and by connecting the pattern (5), a signal from the output terminal (TO) is transmitted to the bead core (
4) and the solid pattern (6) to the input terminal (
A pattern structure characterized by being propagated to TI).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3052961A JP2819847B2 (en) | 1991-03-19 | 1991-03-19 | Pattern structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3052961A JP2819847B2 (en) | 1991-03-19 | 1991-03-19 | Pattern structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04290282A true JPH04290282A (en) | 1992-10-14 |
| JP2819847B2 JP2819847B2 (en) | 1998-11-05 |
Family
ID=12929490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3052961A Expired - Fee Related JP2819847B2 (en) | 1991-03-19 | 1991-03-19 | Pattern structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2819847B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008260434A (en) * | 2007-04-12 | 2008-10-30 | Ihi Corp | Can communication system |
-
1991
- 1991-03-19 JP JP3052961A patent/JP2819847B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008260434A (en) * | 2007-04-12 | 2008-10-30 | Ihi Corp | Can communication system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2819847B2 (en) | 1998-11-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
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