JPH04288811A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To facilitate to analyze defective data and the claims of customers after production and to make it possible of perform quick countermeasures against troubles such as the occurrence of defective products by providing the display for indicating addresses of or areas within a semiconductor wafer in each effective chip of the semiconductor wafer. CONSTITUTION:The position of the orientation flat of a semiconductor wafer 1 is used as the reference of a position, and addresses are imparted to semiconductor chips 4, 4.... Thus, the imparted addresses are indicated. It is preferable to form the display 6 of the address of an aluminum film at the first layer or at the second layer because the display 6 can be observed through a microscope at the stage when the product is formed. the formation of the address display 6 is performed by aluminum photoetching wherein an exposure mask in which the paterns of the address displays 6, 6... of all semiconductor chips 4, 4... are formed is used for the exposure. Or, the own area of a plurality of areas obtained by dividing the inside of the semiconductor wafer into a plurality of parts can be displayed in each effective chip.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention facilitates the analysis of semiconductor device manufacturing methods, particularly defective data and customer complaints after semiconductor device manufacturing, and enables prompt response to troubles such as the occurrence of defective products. The present invention relates to a method for manufacturing a semiconductor device.

0002

2. Description of the Related Art FIG. 3 shows a semiconductor wafer. In the drawing, 1 is a semiconductor wafer, 2 is an orientation flat, 3, 3, ... is a 1PC on which a dummy pattern is formed for checking characteristics such as hFE, resistance, breakdown voltage, etc. [1PC (first pellet check)] These dummy pattern chips are provided in 5 locations: the center and 4 locations around it. 4, 4, . . . are portions that become effective chips (semiconductor chips). 5 is an invalid area, and the chip here does not become a product.

Characteristics such as hFE, resistance, and breakdown voltage of each semiconductor chip within the semiconductor wafer 1 were determined based on the measurement results of the dummy pattern chips 3, 3, . . . at five locations. Conventionally, each semiconductor chip 4, 4, . . . , including its dummy pattern chips 3, 3, .

0004

[Problems to be Solved by the Invention] Conventionally, each chip did not have any indication of its own position within the semiconductor wafer, such as a number indicating its own position within the semiconductor wafer. There was a problem in that it was not possible to quickly analyze customer complaints, and it was not possible to quickly investigate the cause of defects. That is, the characteristics such as hFE, resistance, breakdown voltage, etc. of the semiconductor device in the semiconductor wafer were determined by measuring the characteristics of the 1PC dummy pattern chips 3, 3, etc. located at the five locations mentioned above. , 3, . . . are not measured. However, dummy pattern chip 3,
The characteristics of the chips outside of dummy pattern chips 3, 3, ... are due to non-uniform impurity concentration due to non-uniform temperature distribution during diffusion, etc., and resistance variations due to uneven opening of photoresist film, etc. It is often inferior to its characteristics. Nevertheless, if the characteristics of the dummy pattern chips 3, 3, . As a result, there were occasional customer complaints. Furthermore, when there is a defect in a part of the pattern of the exposure mask, the defect occurs in the semiconductor chip 4 located at the position corresponding to the defect, regardless of whether it is outside or inside the dummy pattern chips 3, 3, etc. It turns out.

However, at the stage where the semiconductor chip 4 is completely independent after being diced, it is not known to which position on the semiconductor wafer 1 the semiconductor chip 4 belongs, so it is difficult to investigate the cause of the failure of the semiconductor chip 4. It was extremely time consuming and difficult to make fundamental improvements quickly. In other words, the cause of the defect may be, for example, a problem with a certain part of the mask in a certain exposure process, or uneven temperature distribution inherent in a certain diffusion device, and as soon as the position of the defective semiconductor chip within the semiconductor wafer is known, There are many things that can be pinpointed. However, since each semiconductor chip 4, 4, ... had no indication indicating its position in the semiconductor wafer 1, it took a long time to investigate the cause of the defect, and the semiconductor chips 4, 4, ... had the same cause of defect. In some cases, the product continued to be shipped for a long time until the cause was determined.

The present invention has been made to solve these problems, and it facilitates the analysis of defect data and customer complaints after the manufacture of semiconductor devices, and enables quick response to troubles such as the occurrence of defective products. The purpose is to make it possible.

[0007]

A method of manufacturing a semiconductor device according to the present invention is characterized in that each effective chip of a semiconductor wafer is provided with an indication indicating the address or area of the position within the semiconductor wafer.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a semiconductor device according to the present invention will be explained in detail below according to the illustrated embodiments. FIGS. 1(A) and 1(B) are for explaining one embodiment of the method for manufacturing a semiconductor device of the present invention, and FIG. 1(A) shows the addresses given to each semiconductor chip 4, 4, . . . FIG. 3B is a plan view showing a part of the semiconductor wafer of FIG. In this semiconductor device manufacturing method, each semiconductor chip 4, 4, . . . as shown in FIG. give a street address.

[0009]Then, each semiconductor chip 4, 4, . . . displays a given address. FIG. 1B shows a display example, and 6 is a display indicating an address. It is preferable to form the address display 6 using the first or second layer of aluminum film, since this allows observation under a microscope even when the product is manufactured. Then, the formation of the address display 6 is performed by making an exposure mask on which a pattern of address display 6, 6, ... for all the semiconductor chips 4, 4, ... is formed, and then performing an aluminum photo-etching process using the mask for exposure. This is done by

The position of the display 6 in each semiconductor chip 4, 4, . . . may be, for example, near the photoresist alignment mark 7 as shown by the solid line in FIG. As shown, it may be near the part indicating the type of IC. Further, it may be placed anywhere that does not interfere with the formation of the circuit of the semiconductor chip 4, such as near the mask number. Further, the display 6 may be an Arabic numeral, a Roman numeral, or a special code.

As described above, according to the present semiconductor device manufacturing method, since the address marking 6 indicating the position within the semiconductor wafer 1 is formed on each semiconductor chip 4, 4, . Even if 4, . Therefore, when there is a customer complaint, failure analysis can be performed more quickly and drastic measures can be taken quickly. Therefore, it is possible to improve yield and quality.

FIGS. 2(A) and 2(B) are for explaining another embodiment of the method for manufacturing a semiconductor device of the present invention.
is a plan view of the entire wafer showing how to set the area, (B
) is a plan view of a portion of a wafer showing how addresses with areas of each semiconductor chip are set. This example is shown in Figure 2.
As shown in (A) of FIG. 2, the entire semiconductor wafer 1 is divided into several, for example, eight areas (A, B,...H), and as shown in (B) of FIG. , . . . are given an address as the area (for example, A) and a number (14) indicating the position within the area. Although not shown, as in the embodiment of FIG. 1, each semiconductor chip 4, 4, . ing. Note that each semiconductor chip 4, 4, . . . may display only an indication indicating the area to which it belongs, such as A, B, .

[0013]

The method of manufacturing a semiconductor device of the present invention is characterized in that a number indicating a position or area within the semiconductor wafer is displayed in each effective chip of the semiconductor wafer. Therefore, according to the method for manufacturing a semiconductor device of the present invention, it is possible to know where or in which area the semiconductor chip was located on the semiconductor wafer even after the semiconductor device has been manufactured, making it easier to analyze defects in the event of a customer complaint. It becomes possible to take drastic measures quickly.

[Brief explanation of the drawing]

[Fig. 1] (A) and (B) are for explaining one embodiment of the method for manufacturing a semiconductor device of the present invention, (A) is a plan view of a semiconductor wafer showing an address, and (B) is a plan view of a semiconductor wafer showing an address. FIG. 2 is a plan view of a semiconductor chip showing a display.

[Fig. 2] (A) and (B) are for explaining another embodiment of the method for manufacturing a semiconductor device of the present invention, in which (A) is a cross-sectional view of a semiconductor wafer showing areas, and (B) is a cross-sectional view of a semiconductor wafer. FIG. 2 is a plan view of a semiconductor wafer showing the area-addressed addresses of chips.

FIG. 3 is a plan view of a semiconductor wafer showing a conventional example.

[Explanation of symbols]

1 Semiconductor wafer 4 Semiconductor chip (effective chip) 6 Display showing address

Claims (2)

[Claims] 1. A method for manufacturing a semiconductor device, characterized in that a number indicating a position within the semiconductor wafer is displayed in each effective chip of the semiconductor wafer. 2. A method for manufacturing a semiconductor device, characterized in that, in each effective chip of a semiconductor wafer, an area to which the semiconductor wafer belongs is displayed among a plurality of areas obtained by dividing the semiconductor wafer into a plurality of areas.