JPH04286193A - High-frequency part - Google Patents

Abstract

PURPOSE:To enable miniaturization in the height direction by monolithic-molding a plurality of electrodes and a bottom shield plate with a resin, forming a conductive pattern on an electrode section in the upper section of the molded form, fixing a wiring board, on which an electronic part is mounted, by a tooling hole and electrically connecting the wiring board. CONSTITUTION:A resin molded form 1 is monolithic-molded by a plurality of L-shaped electrodes 2 and a bottom shield plate 3 made of a metal on the bottom. A wiring pattern 8 is formed to the electrode section of the upper section of the molded form 1, and an electronic part 9, to which a wiring board 7, to which the electronic part 9 is mounted, is connected, is bonded with a substrate 4. A leading-out electrode 12 is arranged and molded so as to be brought into contact with four electrodes 2 disposed to at least each corner section of a plurality of the electrodes 2. The whole is sealed by covering the electronic part 9 with a shield case made of a metal so as to be connected to the leading-out electrode 12 arranged and molded in this manner. Accordingly, the height direction is inhibited, and the method can contribute to miniaturization.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to high frequency components used in high frequency equipment.

0002

[Prior Art] Figure 6 shows the configuration of a typical conventional high-frequency component.
Explain using.

FIG. 6 is a sectional view showing a conventional high frequency device mounted with high frequency components, in which various electronic components 9 are mounted on the upper and lower surfaces of a wiring board 7. Further, a plurality of lead electrodes 12 are drawn out downward from the wiring board 7, and metal shield covers 3 and 10 are placed over the outer peripheries of these electrodes to prevent unnecessary radio waves from entering and flying out.

Further, the extraction electrode 12 passes through the through hole b of the shield cover 3 and is drawn out to the lower part, and further penetrates the through hole 4a of the substrate 4 and is connected to the solder 13 on the back side thereof.
The high frequency component was mounted on the board 4 by fixing it with the board 4.

[0005]

[Problems to be Solved by the Invention] However, with the configuration of the above-mentioned conventional example, there is a limit to the miniaturization of components, and for example, in small products such as mobile phones, it is necessary to connect the extraction electrode 12 through the through hole 4a as a means for attaching it to the board 4. The structure of leading to the back surface and fixing with solder 13 requires the height of the soldering part, which poses a big problem for miniaturization in the height direction.

[0006] An object of the present invention is to provide a high-frequency component that can be miniaturized and adopted in a wider range of fields.

[0007]

[Means for Solving the Problems] In order to solve the above problems, a high frequency component according to the present invention includes a bottom shield plate having a plurality of electrode parts formed by vertically bending, and a ground electrode connected to the above electrode parts. A resin molded body, in which multiple L-shaped lead-out electrodes, including parts that are connected to each other, are arranged in parallel on both ends and integrally molded, is connected to a substrate, a conductive pattern is formed on the upper electrode part, and electronic components are mounted. The wiring board is fixed and electrically connected through positioning holes, and metal is attached to the above-mentioned parts so as to be connected to lead-out electrodes arranged and molded so as to be in contact with at least four electrodes arranged at each corner of the plurality of electrodes. The structure is such that the entire high-frequency component is shielded by covering it with a shield case made by the manufacturer.

[0008]

[Operation] With this configuration, it is possible to suppress the height direction and contribute to miniaturization. Furthermore, a metal bottom shield plate is integrally molded on the bottom of the resin molded body, and this is electrically connected to the ground electrode.Furthermore, the whole is covered with a shield case, and a part of it is connected to the ground electrode. The whole can be shielded.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A high frequency component according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 5.

FIG. 1 is a perspective view showing an integrally molded resin molded body, and the resin molded body 1 is formed by integrally molding a plurality of L-shaped electrodes 2 and a metal bottom shield plate 3 at the bottom. . Note that the reference numeral 12 is the other end of the L-shaped electrode 2, which will be hereinafter referred to as an extraction electrode and will be described below.

Reference numeral 2a designates electrode terminals drawn out perpendicularly from each corner of the bottom shield plate 3, as shown in FIG.
In this case, the contact is made with the electrodes 2 placed at four corners of the 12 electrodes 2 placed. This contact state is shown in Figure 2.
, shown in Figure 3. Note that FIG. 3 shows an example in which the shape of the extraction electrode portion 12 is formed into a two-stage L-shape.

FIG. 4 is a perspective view showing the state in which the high frequency component according to the present invention is mounted. FIG.
A wiring board 7 mounted on both sides is mounted and soldered to connect the electrode 2 of the resin molded body 1 and the circuit formed on the wiring board 7. At this time, square holes or concave notches 6 are provided in the wiring board 7 at positions corresponding to the plurality of electrodes 2 in order to position and fix the wiring board 7 (in FIG. 4, the concave notches are shown). ).

With this configuration, the wiring board 7 is made of resin molded body 1.
A ring of solder is inserted into each electrode 2 that is fixed at a desired position and then in contact with the electrode of the wiring board 7, and the solder is passed through a reflow oven that melts the solder.
and the corresponding electrodes of the wiring board 7 are electrically connected.

[0014] As a matter of course, a conductive pattern 8 made of copper wiring runs on the wiring board 7, and electronic components 9 are mounted on both sides by soldering using this pattern, but the melting temperature of this soldering is It must be higher than the melting temperature of the annular solder.

Further, the resin molded body 1 is soldered to the lead electrode 12 using cream solder 5, so that the resin molded body 1 is attached to the substrate 4.
It is connected to the desired position.

FIG. 5 is a perspective view showing a state in which a metal shield case 10 is placed over the resin molded body 1 to which the wiring board 7 described in FIG. 4 is connected. Because the four corners of the extended extraction electrode 12 are configured as ground terminals, a metal shield case 1 is attached to this extraction electrode 12.
By bringing a part of 0 (position 11) into contact and electrically connecting, the whole is shielded and grounded.

[0017]

[Effects of the Invention] As described above, in the high frequency component according to the present invention, a plurality of electrodes and a bottom shield plate are integrally molded with resin, a conductive pattern is formed on the upper electrode part, and a wiring board on which electronic components are mounted is positioned. In addition to being fixed and electrically connected through the holes, each electrode is drawn out in the horizontal direction at the bottom of the resin molded body, allowing for surface mounting with the main body board and miniaturization in the height direction.

Furthermore, by fixing and electrically connecting the metal shield case to the ground terminals (at least a plurality of terminals are required) of the extraction electrode, the metal shield case becomes ground potential with this high frequency component itself, and the whole can be shielded.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an integrally molded resin molded body according to an embodiment of the present invention.

[Fig. 2] A perspective view showing an electrode part of a resin molded body according to an embodiment of the present invention.

FIG. 3 is a perspective view showing an electrode part of a resin molded body according to an embodiment of the present invention.

FIG. 4 is a perspective view showing a state in which high-frequency components are mounted according to an embodiment of the present invention.

[Fig. 5] A perspective view of a shield case covering a mounted high-frequency component according to an embodiment of the present invention.

[Figure 6] Cross-sectional view showing the state in which conventional high-frequency components are mounted

[Explanation of symbols]

1 Resin molded body 2 Electrode 2a　Electrode terminal 3 Bottom shield plate 4 Board 5 Cream solder 6　Square hole or concave notch 7 Wiring board 8 Conductive pattern 9 Electronic parts 10 Shield case 11 Positioning 12 Extraction electrode 13 Solder

Claims (2)

[Claims] [Claim 1] A bottom shield plate having a plurality of electrode parts formed by vertically bending, and a plurality of L-shaped extraction electrodes including a part connected to the electrode part and serving as a ground electrode, arranged in parallel at both ends. A resin molded body that has been integrally molded is connected to a board, a wiring board on which multiple parts are mounted is connected to the top of this resin molded body, and a part of the shield case that covers each of the above parts is connected to the above lead electrode. A high-frequency component configured to be fixed on a board so as to be connected to the board. 2. The high frequency device according to claim 1, wherein a square hole or a concave notch is provided in a connecting portion of a wiring board connected to the plurality of electrodes, so that the electrodes fit into each other. parts.