JPH04284699A - Mounting method for electronic component and electronic component mounting apparatus - Google Patents

Abstract

PURPOSE:To simultaneously connect a multi-terminal narrow pitch LSI together with the other chip type electronic component to a board by reflow soldering by providing a step of holding special electronic component, a step of supplying solder, a step of mounting the component, etc. CONSTITUTION:An electronic component 18 is mounted at a predetermined position on a circuit board 28 so as to reflow solder it. In such a mounting method for the component, an electronic component holding step of sucking and holding a desired electronic component 18 by a suction nozzle 10, a solder supply step of supplying pastelike solder to the electrodes of the component 18 held by the nozzle 10, and an electronic component mounting step of mounting the component 18 supplied with the solder at a predetermined position on the board 28, are provided. An electronic component mounting apparatus has an electronic component sucking station 13, a solder supply station 15 having a plurality of solder supply nozzles 26, an electronic component mounting station 27, etc.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method and an electronic component mounting apparatus for mounting electronic components onto a circuit board by reflow soldering.

0002

2. Description of the Related Art In response to demands for higher density and smaller electronic devices, the terminal pitch of surface-mounted LSI packages is becoming narrower and narrower. Along with that, LSI
The number of input/output terminals is increasing. Surface-mounted plastic QFP (flat package with terminals protruding in four directions)
The minimum terminal pitch for digital LSIs has decreased to 1.0m over the past 10 years.
It is 0.5 mm or less from m, which is less than half. However, no matter how many terminals the LSI has and its pitch becomes narrower, this LSI
It is meaningless unless the technology to implement it can follow suit. For this reason, severe conditions are being imposed on mounting technology.

[0003] Conventionally, relatively large-scale mass-produced electronic devices using surface mount components have been assembled using the following steps. First, cream solder (paste-like solder) is screen printed on the printed circuit board at the position where the LSI is to be mounted. By this screen printing, cream solder is supplied to the positions corresponding to the terminals of the LSI at the same pitch as the terminals. Position and place the LSI at that position. After that, the solder is melted in a heating furnace and the printed circuit board and LSI are bonded. This soldering method is called reflow soldering. With this method, multiple Q
It is suitable for mass production because the FP can be joined together with other electronic components (chip-type electronic components) in a single soldering process.

However, as the pitch of LSI terminals becomes narrower, conventional reflow soldering is reaching its limits. Cream solder printing is no longer able to keep up with this narrowing of the pitch. That is, the narrower the terminal pitch, the smaller the opening of the board (screen) on which solder is printed. This makes it difficult for solder particles to escape through the openings of the screen, and the solder does not stick to the terminals well (unsoldered). Also, if you reduce the viscosity of the solder so that the solder can come out from the above opening, the solder may sag and stick to the adjacent terminal (solder bridge), or a large amount of solder may stick to the terminal. Put it away (too much solder). Another problem is that as printing is repeated many times, the viscosity of the solder changes and the amount of cream solder supplied to the terminal changes, resulting in inconsistent soldering conditions.

Among the components to be mounted on the circuit board, components other than the above-mentioned multi-terminal narrow-pitch LSI are collectively bonded by conventional reflow soldering, and then the multi-terminal narrow-pitch LSI is bonded using a heating head. If the method involves individually mounting each component, it is possible to handle soldering involving such a multi-terminal narrow-pitch LSI. However, such implementation is not efficient and also requires multi-terminal LS.
It is not possible to solder I and other electronic components (chip type electronic components) using the same method. For this reason, production efficiency is poor and it is difficult to adapt to mass-produced products.

[0006]

[Problem to be Solved by the Invention] Conventionally, a cleaner was placed on a substrate.
Previously, multi-terminal LSIs and chip-type electronic components were bonded together by screen printing multi-terminal solder and reflow soldering, but this method could not cope with the narrower pitch of LSI terminals, and conventional reflow soldering was used. Bulk joining by attaching has reached its limit.

[0007] This invention improves the solder supply method to supply multi-terminal narrow pitch LSI along with other chip type electronic components.
It is an object of the present invention to provide an electronic component mounting method and an electronic component mounting device that can collectively bond electronic components onto a board by reflow soldering.

[0008]

[Means for Solving the Problems] A first means of the present invention is an electronic component mounting method for mounting an electronic component at a predetermined position on a circuit board for reflow soldering.
an electronic component holding step in which a desired electronic component is suction-held by a suction nozzle; a solder supply step in which paste-like solder is supplied to the electrode portion of the electronic component suction-held by the suction nozzle; - The present invention is characterized by comprising an electronic component mounting step of mounting an electronic component supplied with a strip of solder at a predetermined position on the circuit board. Further, a second means of the present invention includes a main holder that performs index rotation, a plurality of sub-holders that are rotatably provided around the main holder and hold suction heads with respect to the main holder, and An electronic component suction station where one of the plurality of sub-holders is positioned facing each other by index rotation of the main holder, and a suction head held by the sub-holder picks up an electronic component, and an index of the main holder. By rotation, among the plurality of sub-holders, the sub-holder holding the suction head that has suctioned the electronic component at the electronic component suction station is positioned facing the electronic component, and the electronic component held by the suction head is mounted on the circuit board. An electronic component mounting station and a suction head that has sucked electronic components at the electronic component suction station are installed on the way to the electronic component mounting station, and paste is applied to each electrode of the electronic component that has been sucked. The present invention is characterized in that it includes a solder supply station consisting of a plurality of solder supply nozzles that supply a shape of solder.

[0009]

[Operation] According to this structure, a desired amount of solder can be reliably supplied to each electrode of the electronic component, and the electronic component can be mounted at a predetermined position on the circuit board.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

Reference numeral 1 in FIG. 1 is an index shaft whose upper end is connected to an intermittent drive device (not shown). This index shaft 1 is provided with its axis vertical, and is intermittently rotated by 45 degrees in the circumferential direction by intermittent drive means (not shown) connected to its upper end.

A cylindrical cam 2 is fitted onto the outside of the index shaft 1. This cylindrical cam 2 has a loop-shaped cam groove 3 continuous in the circumferential direction. This cam groove 3 constitutes a three-dimensional cam, and has a top dead center 3a and a bottom dead center 3b.
It penetrates from the outer peripheral surface to the inner peripheral surface of the cylindrical cam 2. This cylindrical cam 2 is fixed by a fixing means (not shown) so that it does not rotate. That is, the index shaft 1 is configured to rotate while sliding on the inner diameter portion of the cylindrical cam 2.

At the lower end of the index shaft 1, one ends of eight pins (not shown) are attached at intervals of 45 degrees in the circumferential direction so as to be slidable in the vertical direction. Each of the pins has a midway portion passing through the cam groove 3 of the cylindrical cam 2, and the other end portion thereof horizontally protruding radially outward from the outer circumferential surface of the cylindrical cam 2. One end of a columnar arm 6, which is disposed horizontally so as to be continuous with the pin, is integrally attached to the other end of each of the pins. The arm 6 is provided so as to slide one end surface along the outer peripheral surface of the cylindrical cam 2. That is, when the index shaft 1 rotates, the pin (not shown) rotates in the circumferential direction and moves vertically along the cam groove 3 of the cylindrical cam 2. As a result, the arm 6, which is mounted horizontally on the extension line of the pin (not shown), also rotates along the outer circumferential surface of the cylindrical cam 2 and moves in the vertical direction along with the pin. . The index shaft 1, pin, cylindrical cam 2, and arm 6 constitute the main holder of this electronic component mounting device.

A rotary shaft 7 is provided at the other end of the arm 6.
is rotatably provided with its axis vertical. A sub-holder 8 is integrally provided at the lower end of the rotating shaft 7. This sub-holder 8 is configured in a cylindrical shape, with its central axis aligned with the axis of the rotating shaft 7, and
It rotates integrally with the rotating shaft 7. A driven gear part 8b is provided at the upper end of the outer circumferential surface of this sub-holder 8, and meshes with a drive gear part 30a of a selector 30, which will be described later, so that the selector 30 performs intermittent rotational positioning in 90 degree increments in the circumferential direction. It is now possible to do so. Inside the sub-holder 8, holding holes (not shown) whose upper end is closed and whose lower end opens on the lower surface of the sub-holder 8 are spaced apart by 90 degrees in the circumferential direction on a concentric circle centered on the rotation center of the sub-holder 8. It is perforated. A nozzle holder 9 is slidably inserted into each holding hole with its lower end protruding from the lower surface of the sub-holder 8, and the nozzle holder 9 is normally attached to the sub-holder 8 by a spring (not shown). is biased upward. In addition, the lower end side of the nozzle holder 9 has a suction nozzle 1.
The upper end of 0 is integrally held. This suction nozzle 1
0 has a lower end as a suction portion 10a, and an upper end connected to a vacuum means (not shown) via the nozzle holder 9 and sub-holder 8. These nozzle holder 9 and suction nozzle 10 constitute a suction head. Further, the sub-holder 8 has a through hole 11 having a smaller diameter than the holding hole (not shown), which has one end opened in the upper end surface of the sub-holder 8, and the other end communicated with the hole, so that the through hole 11 has a diameter smaller than the holding hole (not shown). It is perforated so as to face the. The nozzle holder 9 is inserted through the through hole 11 into the rod-shaped pressing member 12a.
, 12b, the upper end surface of which is pressed, allows it to slide in the vertical direction. Also,
The nozzle holder 9 and the suction nozzle 10 are configured to rotate around the axis of the suction nozzle 10 by a rotation drive means (not shown).

That is, the sub holder 8 has a first station 1 which is shifted by 45 degrees in the circumferential direction toward the rotation direction (indicated by arrow A) of the index shaft 1.
It is intermittently positioned above the third to eighth stations. Here, when the first station 13 is located at the top dead center 3a of the cam groove 3 of the cylindrical cam 2, the sub holder 8 attached to the other end of the arm 6 corresponds to the first station 13. It is assumed that the station is That is, as shown in FIG. 2, the sub-holder 8 corresponding to the first station 13 is located at the highest position compared to the sub-holders located at other stations, and Fourth station 14, 15, 1
The height of the sub holder 8 corresponding to 6 becomes lower in order, and the height of the sub holder 8 corresponding to the 5th
The sub-holder 8 corresponding to the station 17 is located at the lowest position. And, although not shown,
As one goes to the sixth and seventh stations, the position of the sub-holder 8 corresponding to that station becomes higher again.

The suction nozzle 10 provided on the sub-holder 8 is intermittently positioned at 90 degrees in the rotational direction of the shaft 7 (indicated by arrow B in FIG. 1) by an intermittent drive means (not shown). Then, the sub-holder 8 is positioned at second to fourth positions in the circumferential direction of the sub-holder 8, with the position on the extension line of the arm 6 being the first position. Also,
As described above, each suction nozzle 10 is independently slid vertically by the pressing members 12a and 12b, and the suction nozzle 10 is moved by a rotational drive means (not shown).
It is designed to be rotated around the center line.

As shown in FIG. 2, a component tray 22 containing a large number of electronic components 18 is arranged at the first station 13 where the sub-holder 8 is positioned. The component tray 22 is fixed on a first XY table 23, and the electronic component 18 to be attached to the suction nozzle 10 is fixed on the first XY table 23.
It is designed to be positioned and driven in the X-Y direction so that they face each other.

Furthermore, a first imaging camera 24 is arranged at the second station 14. This first imaging camera 24 is provided so that its imaging surface 24a faces the first position of the sub-holder 8 where the suction nozzle 10 is positioned. By this first imaging camera 24,
The posture of the electronic component 18 sucked by the suction nozzle 10 can be imaged. Furthermore, the type of electronic component 18 that has been sucked is determined based on the imaging signal from the first imaging camera 24. That is, it is determined whether the electronic component 18b is a multi-terminal LSI 18a or another electronic component 18b (chip type electronic component). On the other hand, the second station 14 corrects the tilt angle of the picked-up electronic component 18 based on this imaging signal. That is, this electronic component 18 is connected to the circuit board 28.
The angle is corrected when the camera is attached to the camera. This correction is performed by rotating the nozzle holder 9 and suction nozzle 10 using a rotation drive means (not shown).

At the third station 15, a pair of cylinder nozzles 26, 26 for applying cream solder to the electrode parts 19, 19 of the chip type electronic component 18b are installed.
6a facing upward. As shown in FIG. 3, this cylinder nozzle 26 consists of a cylinder part 26b for pressurizing cream solder and a nozzle part 26a for discharging the pressurized cream solder. That is, if it is determined based on the imaging signal from the first imaging camera 24 that the electronic component 18 picked up by the suction nozzle 10 is a chip-type electronic component 18b, the third station 14 picks up the chip-type electronic component 18b. Cream solder is supplied to the electrode portions 19, 19. The pair of cylinder nozzles 26, 26 are attached to an XYZθ moving means (not shown), and can move in the vertical direction and change the interval therebetween based on the imaging signal of the first camera 24. Further, it can be moved horizontally along the electrode 19. On the other hand, this cylinder nozzle 26 is connected to a tank 31 via a first pump 25a. Then, the first pump 25a controls the discharge pressure, discharge time, etc. of cream solder in accordance with the picked-up chip-type electronic component 18b based on the image signal from the first image pickup camera 24, and dispenses an appropriate amount of cream solder. Cream solder can be supplied to the electrode portion 19.

[0020] The fourth station has a multi-terminal LSI 18
A prismatic cylinder nozzle 27 for supplying cream solder to the terminal portion a is arranged with its discharge nozzle 27a facing upward. The prismatic cylinder nozzle 27 is provided with a plurality of discharge nozzles 27a on its upper end surface, each corresponding to each terminal of the LSI that is attracted. For example, in the case of a 256-pin QFP in which 64 terminals protrude on one side, 64 discharge nozzles 27a on each side, a total of 256 discharge nozzles 27a, are arranged on the upper end surface of the prismatic cylinder nozzle 27. This prismatic cylinder nozzle 27 is
The first imaging camera 24 is attached to the YZθ moving means.
Based on the image pickup signal, the discharge nozzle 27a is opposed to the terminal portion of the LSI 18a, and is raised to supply cream solder to the terminal portion of the multi-terminal LSI 18a. This prismatic cylinder nozzle is the second pump 2.
5b. The pump 25b controls the discharge pressure, discharge time, etc. in the same manner as the cylinder nozzle 26, thereby controlling the multi-terminal LSI 27.
It is possible to supply an appropriate amount of cream solder to the terminal section.

As shown in FIG. 2, a circuit board 28 on which electronic components 18 are mounted is disposed at a fifth station 17 spaced apart from the first station 13 by 180 degrees in the circumferential direction. The circuit board 28 is fixed on a second XY table 29 in the same way as the component tray 22, and the position where the suction nozzle 10 that has suctioned the electronic component 18 and the electronic component 18 on the circuit board 28 are mounted is fixed. They are positioned and driven in the X-Y direction so that they face each other.

A sixth station (not shown) is provided with a blowing device for removing defective electronic components. In other words, electronic components to which cream solder has been supplied are imaged by an imaging means (not shown) to show the supply status, and at this time, it is determined that the electronic components are defective due to reasons such as there being terminals to which cream solder has not been supplied. Electronic parts 18
is the circuit board 2 placed in the fifth station 17.
It cannot be installed on top of 8. Then, at this sixth station, it is blown away by the blowing device and removed.

As shown in FIG. 1, a selector 30 for intermittently rotating the sub-holder 8 about the rotation axis of the shaft 7 is provided above the seventh station. This selector 30 has a rotating shaft 30b arranged with its axis perpendicular.
A drive gear 30a is integrally attached to the lower end of the rotating shaft 30b. This driving gear 30a is adapted to mesh with a driven gear portion 8a formed at the upper end of the sub-holder 8, and the upper end of the rotating shaft 30b is connected to a driving means (not shown). In other words,
As the selector 30 rotates, the holder 8 is intermittently rotated around the shaft 7, and the suction nozzle 10 having the diameter that best matches the size of the electronic component 18 to be suctioned next is selected. It is positioned at position 1.

[0024] Using this electronic component mounting device, the circuit board 2
When mounting the electronic component 18 on the electronic component 18, first, the suction nozzle 10 having the diameter most suitable for the size of the electronic component 18 to be suctioned at the seventh station is selected,
The sub holder 8 is positioned at the first position. The intermittent rotation of the index shaft 1 causes its sub-holder 8 to
is positioned above the first station 13, the component tray 22 is driven and the electronic component 1 to be mounted is moved.
8 is positioned to face the suction part 10a of the selected suction nozzle 10. When the suction nozzle 10 and the electronic component 18 are opposed to each other, the press rod 12a is driven downward, and the suction nozzle 10 is pressed down by the press rod 12a. At this time, a suction force is generated in the suction part 10a of the suction nozzle 10 by a vacuum means (not shown), and the electronic component 18 is applied to the suction part 10a.
It can be held by adsorption.

Once a predetermined electronic component 18 has been attracted, the pressing rod 12a is driven upward, and the sub-holder 8 is intermittently driven to the second station 14. At the second station 14, the posture of the electronic component 18 sucked by the suction nozzle 10 is imaged by the first imaging camera 24, and the posture is corrected. That is, the first
The circuit board 2 of the electronic component 18 is
The tilt angle θ with respect to 8 is imaged. Based on the imaging signal from the imaging camera 24, the suction nozzle 10 is rotated by the angle θ about its central axis. As a result, the inclination angle of the electronic component 18 is corrected and the electronic component 18 is corrected to be mounted on the circuit board 28.

Next, when the electronic component 18 picked up by the first imaging camera 24 is determined to be a chip type electronic component 18b, the sub holder 8 that is sucking the chip type electronic component 18b is placed in the third It is intermittently driven above the station 15. An appropriate amount of cream solder is supplied to the electrode portions 19, 19 of the chip type electronic component 18b by a pair of cylinder nozzles 26, 26 arranged at the third station 15.

When it is determined that the electronic component 18 sucked by the imaging camera 24 is a multi-terminal LSI 18a, the sub holder 8 sucking the multi-terminal LSI 18a is placed above the fourth station 16. is driven intermittently. An appropriate amount of cream solder is supplied to each terminal of the LSI chip 18a by a prismatic cylinder nozzle 27 disposed at the fourth station 16.

[0028] Adsorbed electronic components 18 (18a, 18b)
), the sub holder 8 is intermittently driven above the fifth station 17. When the sub-holder 8 is positioned above the fifth station 17, the XY table 29 is driven, and the electronic component 18 and the circuit board 2 that have been sucked by the suction nozzle 10 are moved.
It is positioned so that the mounting position on 8 faces the mounting position. When the electronic component 18 and the mounting position on the circuit board 28 face each other, the second pressing rod 12b slides downward and engages with the upper end surface of the nozzle holder 9, so that the suction nozzle 1
Press 0 to lower it. As a result, the electronic component 1
8 can be mounted at a predetermined position on the circuit board 28. In addition, if there is a defect such as poor supply of cream solder, the electronic component 18 is not mounted on the circuit board 28 and is intermittently driven to the sixth station. It is blown away by a blowing device installed at the station.

Such a mounting operation is performed for all electronic components 18 to be mounted on the circuit board 28. Once all the electronic components are mounted on the circuit board via cream solder, the circuit board is passed through a heating furnace and joined together by reflow soldering.

According to this configuration, even if the pitch of the other terminals of the LSI 18a becomes narrower and the diameter of the discharge nozzle 27a of the prismatic cylinder nozzle 27 for supplying solder becomes smaller, the cream solder is forcibly discharged by the cylinder. Since the cream solder is pushed out, the solder cream can be reliably supplied without adhering to the terminal portion. Furthermore, since the amount of solder supplied can be controlled, there is no possibility that the amount of solder supplied is too large and the cream solder sag. This allows an appropriate amount of solder to be supplied even to narrow pitch terminals. In other words, even if the LSI 18a has many terminals at a narrower pitch, it can be reliably mounted on the circuit board 28 via cream solder, so such a multi-terminal LSI 18
a and the chip type electronic component 18b can be collectively joined to the circuit board 28 by reflow soldering. For example, even if the LSI 18a has a pitch of 0.5 mm or less, it can be connected all at once in the same way as other chip-type electronic components 18b, without having to be individually mounted.

Further, according to this electronic component supply device, the heights of the first to eighth stations are shifted, and the circuit board 28 is placed at the fifth station 17, which is the lowest. Therefore, even if the circuit board 28 is large, it will not interfere with devices placed in other stations. This allows the circuit board 28 to be larger than the main holder.
It can also be applied when implementing. Further, according to this electronic component mounting apparatus, since the screen printing process can be omitted, the process of mounting electronic components can be simplified, and work efficiency can be improved. Note that this invention is not limited to the one embodiment described above, and can be modified in various ways without changing the gist of the invention.

For example, in the above embodiment, the suction head rotates in a rotary index type, but the electronic component mounting method of the present invention uses a linear movement type mounting device in which the suction head moves linearly. can be adapted to. Component trays 22 are provided at both ends of this mounting device.
The circuit board 28 may be placed in advance, and the cylinder nozzle for supplying the cream solder may be placed in the middle.

The suction nozzle 10 also has a suction section 10a.
After suctioning the electronic component 18 with the suction part 10a facing downward, the suction part 10a is turned over so that it faces upward, and a cleaner is applied from above.
The structure may be such that cream solder is supplied to the electrode portion of the electronic component using a cylinder nozzle for supplying cream solder.

Further, in the above embodiment, the arms 6..., the sub-holders 8..., which are provided on the index shaft 1,
Although the number of stations is eight, the number may be increased depending on other requests to improve mounting accuracy. For example, the number of stations may be 20 as shown in FIG. The symbols in the figure indicate station numbers. In this case, the first station corresponds to the top dead center 3a of the cam groove 3 of the cylindrical cam 2, and the eleventh station similarly corresponds to the bottom dead center 3b. There is. That is, the first station picks up the part, the third station images the attitude of the picked part, the fourth station sets the tilt angle of the part,
The fifth station cleans the electrodes of chip-type electronic components.
The sixth station supplies cream solder to the terminals of the multi-terminal LSI, the seventh station images the cream solder supply, and the eighth station measures the tilt angle of the component. At the 11th station, components are mounted on the circuit board. At the 14th station, defective products such as those due to poor cream solder supply are eliminated. At the 16th station, nozzles are selected using the selector. , 18th stage
The rotation angle of the nozzle returns to the origin in the 19th stage.
Check that there is no dust attached to the nozzle part of the suction nozzle.

In the above-mentioned embodiment, the electronic components 18 are stored in the component tray 22, but each electronic component 18 is placed on a feeding tape and is sequentially fed. Also good. That is, one type of component is arranged in the tape at regular intervals in a groove formed in the tape. The tape is wound to form a reel. A plurality of reels containing different types of parts are provided, and any reel can be called up as needed. A predetermined electronic component 18 is supplied from an arbitrary tape so as to face the suction part 10a of the suction nozzle 10.

[0036]

As described above, in the present invention, a cylinder nozzle is used to supply paste-like solder to the electrode portion of an electronic component, and then the solder is attached to a predetermined position on a board.

According to this configuration, even if the LSI mounted on the board has multiple terminals at a narrow pitch, it is possible to reliably supply an appropriate amount of solder to each terminal, so that such an LSI can be reflow-soldered. It can be mounted on a circuit board by attaching it.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of the invention.

FIG. 2 is a schematic side view.

FIG. 3 is an explanatory diagram showing the same solder supply method.

FIG. 4 is a process diagram showing the steps of another embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1... Index shaft, 2... Cylindrical cam, 6... Arm (these constitute the main holder), 8... Sub-holder, 10... Suction nozzle, 13... First station (electronic component suction station)
15...4th station (solder supply station), 17...5th station (electronic component mounting station), 14...3rd station (solder supply station) ), 26...Cylinder nozzle (solder supply nozzle), 27a...Discharge nozzle (solder supply nozzle),
28...Circuit board

Claims (2)

[Claims] 1. An electronic component mounting method for mounting an electronic component at a predetermined position on a circuit board for reflow soldering, comprising: an electronic component holding step of sucking and holding a desired electronic component with a suction nozzle; A solder supply step in which paste-like solder is supplied to the electrode portions of the electronic components suction-held by the suction nozzle, and the electronic components, whose electrode portions have been supplied with the paste-like solder, are placed on a predetermined position on the circuit board. 1. A method for mounting an electronic component, comprising a step of mounting an electronic component in a position. [Claim 2] A main holder that performs index rotation;
a plurality of sub-holders that are rotatably provided around the main holder and hold suction heads;
By index rotation of the main holder, one of the plurality of sub-holders is positioned to face each other;
an electronic component suction station where a suction head held by the sub-holder suctions an electronic component; and an electronic component suction station where the electronic component is suctioned by the electronic component suction station among the plurality of sub-holders by index rotation of the main holder. An electronic component mounting station in which sub-holders holding the heads are positioned facing each other and the electronic components held by the suction heads are mounted on a circuit board; and a suction head on which the electronic components are suctioned by the electronic component suction station. is provided on the way to the electronic component mounting station, and includes a solder supply station consisting of a plurality of solder supply nozzles that supply paste-like solder to each electrode of the electronic component that has been sucked. An electronic component mounting device characterized by: