JPH04284695A - Radiant structure for integrated circuit device - Google Patents

Abstract

PURPOSE:To bring a surface of an integrated circuit device into close contact with a contact surface of a radiator under a predetermined pressure. CONSTITUTION:An integrated circuit device 10 is composed of a circuit board 1 inserted into a mounting hole 1a and having a mounting hole 1b opened at its periphery, a radiator 2 protruding at a seat 2a in such a manner that the device 10 is brought into contact with a mounting surface having a threaded hole 2b opened corresponding to the hole 1b, and a mounting screw 3 engaged with a spring 3a. The board 1 is mounted on the mounting surface 2c of the radiator 2 through the spring 3a by the screw 3 to bring the device 10 into elastic contact with the contact surface of the seat 2a.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation structure for an integrated circuit device. Recent communication equipment needs to be mounted in high density to meet the demand for miniaturization. IC and LSI on circuit board
When such integrated circuit devices are mounted in a high density, if the temperature of the integrated circuit device becomes high due to heat generation, there is a risk that the characteristics will be deteriorated.Therefore, it is desired to improve the heat dissipation of the integrated circuit device.

0002

2. Description of the Related Art The heat dissipation structure of a conventional integrated circuit device, taking an IC as an example, is as shown in the side sectional view of FIG.
10 through the mounting hole 11a and mounting hole 11b.
a circuit board 11 with a hole in it, a receiving seat 12a with a flat contact surface that makes contact with the back surface of the IC 10, and a protrusion 12b with a flat mounting surface with a screw hole 12b-1 corresponding to the mounting hole 11b. and a mounting screw 13 for attaching the circuit board 11 to the heat radiator 12.
By screwing the IC10 to the receiving seat 1,
2a, and the heat generated by the IC 10 is radiated from the heat sink 12 through the receiving seat 12a.

0003

[Problem to be Solved by the Invention] However, according to the above-mentioned heat dissipation structure, if the contact surface of the receiving seat protruding from the heat dissipation body and the mounting surface of the protrusion are not in the same plane, it is difficult to place the circuit board on the protrusion. When fixed to the mounting surface, there were problems in that the back side of the IC did not come into close contact with the contact surface of the receiving seat, creating a gap that resulted in poor heat conduction, or conversely, contacting the IC too strongly and applying pressure, causing damage to the IC.

In view of the above-mentioned problems, an object of the present invention is to provide a heat dissipation structure for an integrated circuit device, which allows the integrated circuit device to come into close contact with the contact surface of a heat dissipation body under a constant pressure.

[0005]

[Means for Solving the Problems] In order to achieve the above object, in the heat dissipation structure for an integrated circuit device of the present invention, the integrated circuit device is mounted through a mounting hole on a circuit board with mounting holes drilled around the mounting hole. , a heat radiator having a receiving seat protruding from a mounting surface with a screw hole corresponding to the mounting hole for contacting the integrated circuit device, and a mounting screw into which a spring is inserted; By attaching the circuit board to the surface with a spring and a mounting screw, the integrated circuit device is configured to elastically come into close contact with the contact surface of the receiving seat.

[0006]

[Function] The heat dissipator has a receiving seat protruding from the mounting surface, the circuit board has a mounting hole around the mounted integrated circuit device, and the circuit board is screwed with a spring-loaded mounting screw. It is possible to press the board with a constant spring pressure by the spring, absorb dimensional variations, and bring the integrated circuit device into close contact with the contact surface of the receiving seat.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The gist of the present invention will be explained in detail below based on embodiments shown in the drawings. As shown in the side sectional view of FIG. 1 and the partially cutaway perspective view of FIG. A screw hole 2b corresponding to the mounting hole 1b is formed on the circuit board 1 having a mounting hole 1b formed therein, and a screw hole 2b corresponding to the mounting hole 1b is formed on the mounting surface 2c, and a predetermined height H (
When the circuit board 1 is installed, the circuit board 1 is attached to the mounting surface 2c.
A heat dissipating body 2 protruding from a receiving seat 2a having a flat contact surface (as long as it floats from the ground), and a mounting screw (pan head machine screw) 3 having a spring 3a, that is, a helical spring inserted into the shaft part. Configure.

The circuit board 1 is screwed into the screw hole 2b of the heat sink 2 with the mounting screw 3 through the spring 3a, but when tightening the screw, the spring pressure that presses the circuit board 1 is limited to the point where the back side of the IC 10 is on the receiving seat 2a. Adjustment is made so that the spring is in close contact with the contact surface and the circuit board 1 does not warp excessively. (The spring pressure is adjusted by specifying the number of times the screw is tightened, thereby making the amount of deflection of the spring constant and giving a constant spring pressure.) In this way, the heat dissipation body protrudes the receiving seat from the mounting surface, and the circuit board is mounted. By drilling mounting holes around the IC and screwing the circuit board to the mounting surface of the heat sink using mounting screws via springs, the spring absorbs dimensional variations and applies constant spring pressure to the circuit board. Since the IC can be pressed with a spring, it is possible to bring the IC into close contact with the contact surface of the seat, and it is possible to prevent the circuit board from being excessively warped.

[0009] The mounting screws described above are ordinary pan head machine screws, but as shown in the side cross-sectional view of Fig. 3, the mounting screws 3 are made into stepped screws 3-1 with a threaded portion at the tip. When the spring 3-1a is completely screwed in, the spring 3a is deflected to a certain dimension and a predetermined spring pressure is obtained, thereby making the screw tightening work even easier. Further, the above-described integrated circuit device can be applied not only to one integrated circuit device but also to a plurality of integrated circuit devices, and it goes without saying that in any case, it is desirable to apply a thermal compound to the contact surface.

0010

[Effects of the Invention] As detailed above, according to the present invention,
Since the integrated circuit device can be brought into close contact with the contact surface of the heat sink with a spring under a constant pressure, it is possible to prevent characteristic defects of the integrated circuit device, damage due to pressure, and excessive warping of the circuit board. It exhibits extremely useful effects in industry, such as being able to improve the heat dissipation efficiency of.

[Brief explanation of the drawing]

[Fig. 1] Side sectional view of one embodiment according to the present invention

[Figure 2]
A perspective view of the main parts of Fig. 1, including a partial cutaway.

[Figure 3] Figure 1
Side sectional view of another example of the mounting screw of

[Figure 4] Side sectional view according to conventional technology

[Explanation of symbols]

1 is the circuit board 1a is the mounting hole 1b is the mounting hole 2 is a heat sink 2a is the receiving seat 2b is a screw hole 2c is the mounting surface 3 is the mounting screw 3a is a spring 10 is an integrated circuit device (IC)

Claims (2)

[Claims] Claim 1: An integrated circuit device (10) is attached to a mounting hole (1a).
), and a circuit board (1) with a mounting hole (1b) drilled around it, and a mounting surface with a screw hole (2b) corresponding to the mounting hole (1b), with the integrated circuit device ( 10)
It consists of a heat sink (2) protruding from a receiving seat (2a) that comes in contact with the heat sink (2), and a mounting screw (3) into which a spring (3a) is fitted, and a mounting surface (2c) of the heat sink (2). Circuit board (1
) is attached via a spring (3a) with a mounting screw (3), whereby an integrated circuit device (10) is elastically brought into close contact with a contact surface of a receiving seat (2a). . [Claim 2] The mounting screw (3) according to claim 1 is
A stepped screw (3-1) with a threaded portion at the tip, characterized in that when screwed in to the step (3-1a), the fitted spring (3a) is deflected to a certain dimension and a constant spring pressure is obtained. Heat dissipation structure for integrated circuit devices.