JPH0428460U - - Google Patents
Info
- Publication number
- JPH0428460U JPH0428460U JP6997490U JP6997490U JPH0428460U JP H0428460 U JPH0428460 U JP H0428460U JP 6997490 U JP6997490 U JP 6997490U JP 6997490 U JP6997490 U JP 6997490U JP H0428460 U JPH0428460 U JP H0428460U
- Authority
- JP
- Japan
- Prior art keywords
- led
- pellets
- stem
- molded part
- multicolor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims 3
- 239000003086 colorant Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6997490U JPH0428460U (zh) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6997490U JPH0428460U (zh) | 1990-06-29 | 1990-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428460U true JPH0428460U (zh) | 1992-03-06 |
Family
ID=31605741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6997490U Pending JPH0428460U (zh) | 1990-06-29 | 1990-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428460U (zh) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999050915A1 (fr) * | 1998-03-27 | 1999-10-07 | Yoshio Takada | Emetteur de lumiere |
| JP2000004050A (ja) * | 1998-03-27 | 2000-01-07 | Yoshio Takada | 発光体 |
| JP2008060068A (ja) * | 2006-08-03 | 2008-03-13 | Hitachi Maxell Ltd | 照明装置および表示装置 |
| JP2010177501A (ja) * | 2009-01-30 | 2010-08-12 | Sony Corp | 光学素子パッケージおよび光学素子パッケージの製造方法 |
| JP2013140384A (ja) * | 2010-10-20 | 2013-07-18 | Macroblock Inc | 発光ダイオードパッケージ構造体及び発光ダイオード立体表示装置 |
-
1990
- 1990-06-29 JP JP6997490U patent/JPH0428460U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999050915A1 (fr) * | 1998-03-27 | 1999-10-07 | Yoshio Takada | Emetteur de lumiere |
| JP2000004050A (ja) * | 1998-03-27 | 2000-01-07 | Yoshio Takada | 発光体 |
| JP2010161420A (ja) * | 1998-03-27 | 2010-07-22 | Yoshio Takada | 発光体 |
| JP2008060068A (ja) * | 2006-08-03 | 2008-03-13 | Hitachi Maxell Ltd | 照明装置および表示装置 |
| JP2010177501A (ja) * | 2009-01-30 | 2010-08-12 | Sony Corp | 光学素子パッケージおよび光学素子パッケージの製造方法 |
| JP2013140384A (ja) * | 2010-10-20 | 2013-07-18 | Macroblock Inc | 発光ダイオードパッケージ構造体及び発光ダイオード立体表示装置 |