JPH04277557A - Resin composition for optical disk substrate - Google Patents
Resin composition for optical disk substrateInfo
- Publication number
- JPH04277557A JPH04277557A JP3065641A JP6564191A JPH04277557A JP H04277557 A JPH04277557 A JP H04277557A JP 3065641 A JP3065641 A JP 3065641A JP 6564191 A JP6564191 A JP 6564191A JP H04277557 A JPH04277557 A JP H04277557A
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin
- resin composition
- organic silane
- optical disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 27
- 239000000758 substrate Substances 0.000 title claims description 32
- 239000011342 resin composition Substances 0.000 title claims description 20
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 32
- 229910000077 silane Inorganic materials 0.000 claims abstract description 28
- 239000011159 matrix material Substances 0.000 claims abstract description 22
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 18
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 18
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 10
- -1 silane compound Chemical class 0.000 claims description 29
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 238000009833 condensation Methods 0.000 claims description 4
- 230000005494 condensation Effects 0.000 claims description 4
- 230000018044 dehydration Effects 0.000 claims description 4
- 238000006297 dehydration reaction Methods 0.000 claims description 4
- 230000007062 hydrolysis Effects 0.000 claims description 3
- 238000006460 hydrolysis reaction Methods 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 2
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 125000005587 carbonate group Chemical group 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 claims description 2
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 claims description 2
- 125000000962 organic group Chemical group 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 239000010409 thin film Substances 0.000 abstract description 25
- 230000008859 change Effects 0.000 abstract description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract description 3
- 238000013329 compounding Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 238000010521 absorption reaction Methods 0.000 description 13
- 239000010408 film Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 8
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 150000004756 silanes Chemical class 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052771 Terbium Inorganic materials 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- XYPTZZQGMHILPQ-UHFFFAOYSA-N 2-methyl-6-trimethoxysilylhex-1-en-3-one Chemical compound CO[Si](OC)(OC)CCCC(=O)C(C)=C XYPTZZQGMHILPQ-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- ALKCFGAAAKIGBJ-UHFFFAOYSA-N 6-[dimethoxy(methyl)silyl]-2-methylhex-1-en-3-one Chemical compound CO[Si](C)(OC)CCCC(=O)C(C)=C ALKCFGAAAKIGBJ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- UGHNVVDSHOLXFS-UHFFFAOYSA-N C(C1CO1)OCCC[Si](C(=C)C)(C(=C)C)C(=C)C Chemical compound C(C1CO1)OCCC[Si](C(=C)C)(C(=C)C)C(=C)C UGHNVVDSHOLXFS-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- CBVJWBYNOWIOFJ-UHFFFAOYSA-N chloro(trimethoxy)silane Chemical compound CO[Si](Cl)(OC)OC CBVJWBYNOWIOFJ-UHFFFAOYSA-N 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- ZLDHYRXZZNDOKU-UHFFFAOYSA-N n,n-diethyl-3-trimethoxysilylpropan-1-amine Chemical compound CCN(CC)CCC[Si](OC)(OC)OC ZLDHYRXZZNDOKU-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZUEKXCXHTXJYAR-UHFFFAOYSA-N tetrapropan-2-yl silicate Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)OC(C)C ZUEKXCXHTXJYAR-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、記録情報を光学的に書
込みおよび書変えることができる相変化型の光ディスク
基板用の樹脂組成物に関し、より詳細には、磁気変化を
応用した光磁気ディスクや相変化型の光ディスクなどの
光ディスク基板材料において、レーザー光線に対して十
分な透過性を有すると共に、無機質膜に対する密着性の
良好な基板を与える樹脂組成物に関するものである。[Field of Industrial Application] The present invention relates to a resin composition for a phase change type optical disk substrate on which recorded information can be optically written and rewritten, and more particularly, to a magneto-optical disk that applies magnetic change. The present invention relates to a resin composition that provides a substrate material for optical disks such as optical disks and phase-change optical disks, which has sufficient transparency to laser beams and has good adhesion to inorganic films.
【0002】0002
【従来の技術】現在、情報記録用として採用されている
のは磁気記録方式が主流であり、特に磁気フロッピーデ
ィスクや磁気ハードディスクは情報記録の信頼性、アク
セス速度、記録保存性、記憶容量等においても優れたも
のであるところから、主にコンピューター等の外部記憶
装置等に組み込まれている。[Prior Art] Currently, magnetic recording methods are mainly used for recording information. In particular, magnetic floppy disks and magnetic hard disks have poor reliability in information recording, access speed, record storage performance, storage capacity, etc. Because it is also excellent, it is mainly incorporated into external storage devices such as computers.
【0003】一方、光学式記録方式は、より高密度の情
報記憶が可能であるので、データストレージメディアと
して実用化されつつある。この記録方式に用いられる基
本的なディスク構造は、透明媒体上に記録用の無機金属
薄膜を積層した構造を有しており、磁気記録方式では達
成できなかった大容量の記録が可能となった。On the other hand, optical recording systems are being put into practical use as data storage media because they enable higher density information storage. The basic disk structure used in this recording method has a structure in which an inorganic metal thin film for recording is layered on a transparent medium, making it possible to record large volumes that could not be achieved with magnetic recording methods. .
【0004】これらの光ディスク用基板材料では、ディ
スク本体をレーザー光線が透過し得る様に高度の透明性
が要求されるので、基板材料としては主として無機ガラ
スや透明樹脂が用いられている。These substrate materials for optical disks are required to have a high degree of transparency so that laser beams can pass through the disk body, so inorganic glass or transparent resin is mainly used as the substrate material.
【0005】透明樹脂として現在汎用されているのは、
ポリカーボネート樹脂である。但し、ポリカーボネート
樹脂は成形加工時の条件により複屈折を生じることがあ
るので、その様な問題を改善するために、ポリスチレン
等との複合ポリマーとすることも検討されている。他方
、ポリカーボネート樹脂の上記欠点を改善し得る透明樹
脂として、例えば「プラスチックス」第41巻(10月
号)81〜85頁(1990年)、あるいは特開平2−
133413号公報等に開示されている様なアモルファ
スポリオレフィン樹脂が開発され、実用化の検討が進め
られている。The currently widely used transparent resins are:
It is polycarbonate resin. However, polycarbonate resins may exhibit birefringence depending on the conditions during molding, so in order to improve this problem, it is also being considered to form composite polymers with polystyrene or the like. On the other hand, as transparent resins that can improve the above-mentioned drawbacks of polycarbonate resins, for example, "Plastics" Vol.
Amorphous polyolefin resins such as those disclosed in Publication No. 133413 and the like have been developed, and studies for practical use are underway.
【0006】[0006]
【発明が解決しようとする課題】現在汎用されているポ
リカーボネート樹脂は、一般の透明樹脂の中では加工性
や機械的性質の比較的優れたものであるが、ガラスに比
べると複屈折を生じ易く、且つ耐熱性や吸水性、データ
保存の信頼性等に問題がある。これらの中で最も大きな
問題は複屈折と耐吸水性であり、複屈折を起こすと記録
されたビットの場所によっては記録情報が不鮮明となっ
て読取り誤差を生じることがある。また、耐吸水性に関
しては、ポリカーボネート樹脂自身は比較的吸水率の低
いものであり(0.2 〜 0.3%程度)、吸水によ
り物性や光学的特性が低下するといった恐れは殆ど生じ
ないが、記録薄膜成分であるテルビウムやガドリニウム
などの稀金属は、該樹脂中の僅かな水分の影響により腐
食劣化を起こし易いため、情報の記録が不十分になった
り、保存中に記録情報が消滅するといった問題を引き起
こし、更には記録膜成分として形成される無機質薄膜と
の密着性が不十分でビットエラーレートが多発したり、
極端な場合は、時間の経過と共にあるいは高温や高湿度
環境下での使用に際して無機質薄膜の剥離やクラックが
発生するといった問題を生じることもある。その為吸水
性は更に低くすることが望まれる。[Problems to be Solved by the Invention] Polycarbonate resins currently in general use have relatively excellent processability and mechanical properties among general transparent resins, but they are more prone to birefringence than glass. , and there are problems with heat resistance, water absorption, reliability of data storage, etc. The biggest problems among these are birefringence and water absorption resistance, and when birefringence occurs, recorded information may become unclear depending on the location of the recorded bits, leading to reading errors. In addition, regarding water absorption resistance, polycarbonate resin itself has a relatively low water absorption rate (about 0.2 to 0.3%), so there is almost no fear that physical properties or optical properties will deteriorate due to water absorption. Rare metals such as terbium and gadolinium, which are components of the recording thin film, are susceptible to corrosion and deterioration due to the influence of a small amount of moisture in the resin, resulting in insufficient recording of information or loss of recorded information during storage. Furthermore, the adhesion with the inorganic thin film formed as a recording film component is insufficient, resulting in frequent bit error rates.
In extreme cases, problems such as peeling or cracking of the inorganic thin film may occur over time or when used in high temperature or high humidity environments. Therefore, it is desirable to further lower the water absorption.
【0007】一方、アモルファスポリオレフィン樹脂は
、ポリカーボネート樹脂よりも更に吸水率が低く且つ複
屈折率も小さいが、無機質合金薄膜との密着性に関して
は、ポリカーボネート樹脂と同様の問題を残している。
また、ガラス製基板は信頼性に優れたものであるが、加
工性が悪く、作製に高コストがかかる。これらの問題点
に着目して幾つかの改良技術が開発されているが、現在
のところ十分に満足し得るものは開発されていない。On the other hand, amorphous polyolefin resins have lower water absorption and birefringence than polycarbonate resins, but they still have the same problems as polycarbonate resins in terms of adhesion to inorganic alloy thin films. Further, although glass substrates have excellent reliability, they have poor workability and are expensive to manufacture. Several improved techniques have been developed to address these problems, but at present no one that is fully satisfactory has been developed.
【0008】また、特開平1−187471号公報に開
示されている様に、樹脂基板と無機質薄膜の密着性を向
上させる方法では、密着性は向上する反面該密着性改善
処理によって基板に応力が発生するので、処理後この歪
を除去しなければならず、後処理が非常に面倒になる。[0008] Furthermore, as disclosed in JP-A-1-187471, a method for improving the adhesion between a resin substrate and an inorganic thin film improves the adhesion, but at the same time, stress is applied to the substrate due to the adhesion improvement treatment. Therefore, this distortion must be removed after processing, making post-processing very troublesome.
【0009】本発明は上記の様な事情に着目してなされ
たものであって、その目的は、透明性及び耐吸水性が良
好で且つ無機質薄膜との密着性に優れ、しかも成形加工
性に優れた光ディスク基板用樹脂組成物を提供しようと
するものである。The present invention was made in view of the above circumstances, and its purpose is to provide a film that has good transparency and water absorption resistance, excellent adhesion to inorganic thin films, and has good moldability. The present invention aims to provide an excellent resin composition for optical disc substrates.
【0010】0010
【課題を解決するための手段】上記課題を解決すること
のできた本発明に係る光ディスク基板用樹脂組成物の構
成は、記録情報を光学的に書込み及び書変えができる光
ディスクの基板用樹脂組成物において、該樹脂組成物は
、マトリックス樹脂100重量部に対して、下記一般式
[I]で示される有機シラン化合物或いはその一部が加
水分解し脱水縮合して生成した有機シラン化合物を10
〜500重量部含有するものであるところに要旨を有す
るものである。
(但し、式中Xは炭素数1〜6のアルコキシル基、ハロ
ゲン、水酸基、アルコキシアルキル基、イソプロペニル
基あるいは酸素ラジカルを示し、Yは炭素数1〜4の炭
化水素基、Zは炭素数1〜20でエポキシ基、アミノ基
、イミノ基、スルホニル基、チオール基、(メタ)アク
リロイル基、カーボネート基、フェニル基、ビニル基の
何れかの反応性基を含む有機基を示し、またaおよびb
は夫々独立して0〜2の整数で且つaとbの和が3以下
の整数を表わす)。[Means for Solving the Problems] The composition of the resin composition for optical disc substrates according to the present invention that has solved the above problems is a resin composition for optical disc substrates on which recorded information can be optically written and rewritten. In the resin composition, 10 parts by weight of an organic silane compound represented by the following general formula [I] or a part thereof produced by hydrolysis and dehydration condensation is added to 100 parts by weight of the matrix resin.
The gist is that the content is 500 parts by weight. (However, in the formula, X represents an alkoxyl group having 1 to 6 carbon atoms, a halogen, a hydroxyl group, an alkoxyalkyl group, an isopropenyl group, or an oxygen radical, Y is a hydrocarbon group having 1 to 4 carbon atoms, and Z represents a carbon number 1 ~20 represents an organic group containing a reactive group such as an epoxy group, an amino group, an imino group, a sulfonyl group, a thiol group, a (meth)acryloyl group, a carbonate group, a phenyl group, or a vinyl group, and a and b
are each independently an integer of 0 to 2, and the sum of a and b represents an integer of 3 or less).
【0011】[0011]
【作用】まず本発明で使用されるマトリックス樹脂につ
いて述べる。マトリックス樹脂は、光学的及び物理化学
的特性の優れたものであればどの様なものであっても使
用できるが、中でもバランスのとれた特性を発揮するも
のとしてポリカーボネート樹脂が挙げられる。尚ポリカ
ーボネート樹脂の好ましい粘度平均分子量は1,000
〜 100,000、より好ましくは 10,000
〜 30,000 の範囲であり、分子量が小さくなる
と成形品が脆くなる傾向があり、一方分子量が大き過ぎ
ると流動性が低下し成形性が悪くなるので、光ディスク
基板用としては不向きになる。また、ポリカーボネート
樹脂にポリスチレンやABS樹脂等をブレンドして複合
化された樹脂も、後述する有機シラン化合物との相溶性
や親和性が得られるものであれば使用可能である。また
ポリカーボネート樹脂以外の好ましい樹脂として、アモ
ルファスポリオレフィン樹脂も使用できる。[Operation] First, the matrix resin used in the present invention will be described. Any matrix resin can be used as long as it has excellent optical and physicochemical properties, but among them, polycarbonate resin is one that exhibits well-balanced properties. The preferred viscosity average molecular weight of the polycarbonate resin is 1,000.
~100,000, more preferably 10,000
- 30,000, and if the molecular weight is small, the molded product tends to become brittle, while if the molecular weight is too large, fluidity decreases and moldability deteriorates, making it unsuitable for optical disk substrates. Further, a composite resin obtained by blending polycarbonate resin with polystyrene, ABS resin, etc. can also be used as long as it has compatibility and affinity with the organic silane compound described below. Moreover, an amorphous polyolefin resin can also be used as a preferable resin other than polycarbonate resin.
【0012】次に、本発明で使用される有機シラン化合
物は前記一般式[I]で示されるものであり、その具体
例としては、例えばテトラメトキシシラン、テトラエト
キシシラン、テトライソプロポキシシラン、トリメトキ
シ(メチル)シラン、トリエトキシ(メチル)シラン、
トリメトキシ(ビニル)シラン、トリエトキシ(ビニル
)シラン、トリメトキシ(クロル)シラン、クロロプロ
ピルトリメトキシシラン、γ−グリシドキシプロピルト
リメトキシシラン、γ−グリシドキシプロピルトリイソ
プロペニルシラン、γ−グリシドキシプロピル(メチル
)ジメトキシシラン、β−(3,4−エポキシシクロヘ
キシル)エチルトリメトキシシラン、γ−メタクリロイ
ルプロピルトリメトキシシラン、γ−メタクリロイルプ
ロピル(メチル)ジメトキシシラン、4−フェニルプロ
ピルトリメトキシシラン、γ−メルカプトプロピルトリ
メトキシシラン、γ−メルカプトプロピル(メチル)ジ
メトキシシラン、γ−アミノプロピルトリメトキシシラ
ン、γ−ジエチルアミノプロピルトリメトキシシラン、
N−(β−アミノエチル)−γ−アミノプロピルトリメ
トキシシラン、N−β−(アミノエチル)−γ−アミノ
プロピルメチルジメトキシシラン、N−フェニル−γ−
アミノプロピルトリメトキシシラン等の有機シラン化合
物、および、これらの化合物が加水分解及び部分脱水縮
合したプレポリマーあるいはポリジメチルシロキサン、
ポリジフェニルシロキサン、ビスフェノールとシロキサ
ンのブロックコポリマーなどが例示される。Next, the organic silane compound used in the present invention is represented by the general formula [I], and specific examples thereof include tetramethoxysilane, tetraethoxysilane, tetraisopropoxysilane, and trimethoxysilane. (methyl)silane, triethoxy(methyl)silane,
Trimethoxy(vinyl)silane, triethoxy(vinyl)silane, trimethoxy(chloro)silane, chloropropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriisopropenylsilane, γ-glycidoxy Propyl(methyl)dimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-methacryloylpropyltrimethoxysilane, γ-methacryloylpropyl(methyl)dimethoxysilane, 4-phenylpropyltrimethoxysilane, γ-mercapto Propyltrimethoxysilane, γ-mercaptopropyl(methyl)dimethoxysilane, γ-aminopropyltrimethoxysilane, γ-diethylaminopropyltrimethoxysilane,
N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, N-β-(aminoethyl)-γ-aminopropylmethyldimethoxysilane, N-phenyl-γ-
Organic silane compounds such as aminopropyltrimethoxysilane, prepolymers or polydimethylsiloxanes obtained by hydrolysis and partial dehydration condensation of these compounds,
Examples include polydiphenylsiloxane and block copolymers of bisphenol and siloxane.
【0013】上記有機シラン化合物とマトリックス樹脂
とのブレンド方法は特に限定されるものではなく、常法
をそのまま或は適当に改善して利用できるが、代表的な
方法として例示するならば、(1) マトリックス樹脂
を加熱して溶融状態とし、これに有機シラン化合物を加
えて均一にブレンドした後射出成形する方法(この方法
はマトリックス樹脂と有機シラン化合物の相溶性が良い
場合に有用である)、(2)マトリックス樹脂を有機溶
剤に分散あるいは溶解させておき、これに有機シラン化
合物を加えて混合する方法、などが挙げられる。The method of blending the organic silane compound and the matrix resin is not particularly limited, and conventional methods can be used as they are or with appropriate improvement; however, as a typical method, (1) ) A method in which the matrix resin is heated to a molten state, an organic silane compound is added thereto, blended uniformly, and then injection molded (this method is useful when the matrix resin and the organic silane compound have good compatibility), (2) A method in which the matrix resin is dispersed or dissolved in an organic solvent, and an organic silane compound is added thereto and mixed.
【0014】次に、マトッリクス樹脂と有機シラン化合
物との配合組成比については、配合されるマトリックス
樹脂及び有機シラン化合物の種類や混合ブレンド状態、
更には基板とした状態での要求特性(機械特性や耐久性
等)によって好適配合組成が変わってくるので一律に決
めることはできないが、光ディスク基板用としての特性
を確保するには、マトリックス樹脂100重量部に対し
て、有機シラン化合物を10〜500重量部、好ましく
は50〜200重量部の範囲で含有させる必要がある。
しかして有機シラン化合物の配合量が不足する場合は、
ディスク基板上に設けられる無機質薄膜との密着性を十
分に高めることができず、逆に多過ぎると、樹脂組成物
の弾力性が悪くなり、基板としての適性を欠くものとな
る。Next, the composition ratio of the matrix resin and the organic silane compound depends on the type and blending state of the matrix resin and the organic silane compound to be blended,
Furthermore, the preferred composition varies depending on the required properties (mechanical properties, durability, etc.) of the substrate, so it cannot be determined uniformly, but in order to ensure the properties for optical disk substrates, matrix resin 100 The organic silane compound must be contained in an amount of 10 to 500 parts by weight, preferably 50 to 200 parts by weight. However, if the amount of organic silane compound is insufficient,
Adhesion to the inorganic thin film provided on the disk substrate cannot be sufficiently improved, and conversely, if the amount is too high, the elasticity of the resin composition deteriorates, making it unsuitable as a substrate.
【0015】本発明における必須の構成成分は以上の通
りであるが、このほか必要に応じて有機シラン化合物の
配合効果を補強するための成分として、酸化珪素微粒子
あるいは珪素以外の金属酸化物微粒子を適量配合するこ
ともできる。ここで用いられる酸化珪素微粒子としては
、粒径が2〜100nmであるものが望ましく、その具
体例としてはコロイダルシリカあるいば空気酸化法によ
って得られるエアロゾル等が挙げられる。また更に他の
成分としてチタンやアルミニウム、ジルコニウム、スズ
等のカップリング剤を加えたり、あるいは酸化防止剤や
各種安定剤等を添加することも可能である。[0015] The essential components in the present invention are as described above, but in addition to these, if necessary, silicon oxide fine particles or metal oxide fine particles other than silicon may be added as a component to reinforce the blending effect of the organic silane compound. It can also be blended in an appropriate amount. The silicon oxide fine particles used here preferably have a particle size of 2 to 100 nm, and specific examples include colloidal silica and aerosols obtained by air oxidation. Furthermore, it is also possible to add coupling agents such as titanium, aluminum, zirconium, and tin as other components, or to add antioxidants and various stabilizers.
【0016】本発明で使用される樹脂組成物は、基板と
して成形した状態で十分な透明性を有することが必要で
あり、任意の厚さのディスク基板(現在は1.2mmの
ものが主流である)の全光線透過率が80%以上で、透
過する光線に対してノイズとなる散乱光の程度を示す曇
価が10%以下、より好ましくは5%以下であることが
望ましく、こうした要求特性を満たす様に有機シラン化
合物の種類や配合量、分散状態等を調整することが望ま
しい。The resin composition used in the present invention must have sufficient transparency when molded as a substrate, and can be used for disk substrates of any thickness (currently 1.2 mm is the mainstream). It is desirable that the total light transmittance of (a) is 80% or more, and the haze value, which indicates the degree of scattered light that becomes noise with respect to the transmitted light, is 10% or less, more preferably 5% or less, and these required characteristics It is desirable to adjust the type, amount, dispersion state, etc. of the organosilane compound so as to satisfy the following conditions.
【0017】ここで曇価は、別名ヘーズと呼ばれる値で
あり、例えばJIS K7105の特殊光学的特性の
項に規定されている様に、試料を透過した光線透過量及
び散乱光量を測定し、これらを各々全光線透過率(Tt
)及び拡散透過率(Td)とするとき、曇価(H)は、
H=(Td/Tt)×100(%)
の式で算出される。[0017] The haze value here is a value also called haze. For example, as stipulated in the special optical properties section of JIS K7105, the amount of light transmitted through the sample and the amount of scattered light are measured, and these are calculated. The total light transmittance (Tt
) and diffuse transmittance (Td), haze value (H) is:
It is calculated using the formula H=(Td/Tt)×100(%).
【0018】この曇価が10%を超えると、散乱光量が
増加して記録・読取りが困難になる。尚この価は、有機
シラン化合物中に含まれる官能基の種類やその配合量等
によって変ってくるので、有機シラン化合物の種類や配
合量は、その都度適性に選定することが望まれる。When the haze value exceeds 10%, the amount of scattered light increases, making recording and reading difficult. Note that this value varies depending on the type of functional group contained in the organic silane compound and its amount, so it is desirable to appropriately select the type and amount of the organic silane compound in each case.
【0019】また全光線透過率は、前述の様に80%以
上となる透明性を有するものであることが望まれるが、
マトリックス樹脂としてポリカーボネート樹脂またはア
モルファスポリオレフィン樹脂の光学用グレードを用い
た場合は、曇価が10%以下としたものであれば、大抵
の場合この条件は満たされる。しかしポリカーボネート
樹脂やアモルファスポリオレフィン樹脂等に各種変成を
加えた樹脂を用いた場合は、全光線透過率が80%を下
回ることも起こり得るので注意しなければならない。[0019]Also, it is desirable that the total light transmittance is 80% or more as mentioned above.
When an optical grade polycarbonate resin or amorphous polyolefin resin is used as the matrix resin, this condition is satisfied in most cases as long as the haze value is 10% or less. However, when using a polycarbonate resin, amorphous polyolefin resin, or the like that has undergone various modifications, care must be taken because the total light transmittance may fall below 80%.
【0020】この様にして得られる樹脂組成物は、たと
えば常法により押出機等によりペレット状等に成形し、
スタンパー等を用いて射出成形等によってディスク基板
とすればよい。The resin composition thus obtained is molded into pellets using an extruder or the like in a conventional manner, and
A disk substrate may be formed by injection molding or the like using a stamper or the like.
【0021】かくして得られる基板への記録薄膜の形成
方法も常法に従って行なえばよく、たとえば窒化珪素や
酸化珪素などの誘電体膜とTb,Fe,Co,Gd,N
dなどの合金ターゲットをスパッタリング等の方法で形
成し、その上層に、アルミニウムや窒化アルミニウム等
の反射膜を形成して記録薄膜とする方法等を採用するこ
とができる。The method for forming a recording thin film on the substrate obtained in this manner may be carried out according to a conventional method. For example, a dielectric film such as silicon nitride or silicon oxide and Tb, Fe, Co, Gd, N
It is possible to adopt a method in which an alloy target such as d is formed by a method such as sputtering, and a reflective film of aluminum, aluminum nitride, or the like is formed on the upper layer to form a recording thin film.
【0022】また、上記薄膜形成の前にはアニールを行
なうのが一般的であるが、本発明の樹脂組成物を使用す
ると、マトリックス樹脂のみからなる基板を用いた場合
に比べて、比較的緩やかなアニール条件でも真空度に到
達させることができるという利点が得られる。Furthermore, although it is common practice to perform annealing before forming the above-mentioned thin film, when the resin composition of the present invention is used, the annealing process is relatively gentle compared to the case where a substrate consisting only of matrix resin is used. The advantage is that the degree of vacuum can be reached even under such annealing conditions.
【0023】この様に本発明では、特定の有機シラ化合
物がマトリックス樹脂中に分散し、場合によっては一部
がマトリックス樹脂と反応することにより、複合材料と
しての線膨張率が低下して、表層として設けられる無機
質薄膜との間に生じる応力を最小限に抑えることができ
るばかりでなく、樹脂中に分散された有機シラン化合物
は薄膜形成時に行なわれるスパッタリング等の表面活性
化によって表面に珪素成分を露出せしめ、その表面に積
層される無機質薄膜との密着性および化学的安定性が高
められるという作用も発揮する。As described above, in the present invention, the specific organic silica compound is dispersed in the matrix resin, and in some cases, a part of it reacts with the matrix resin, so that the coefficient of linear expansion of the composite material decreases, and the surface layer Not only can the stress generated between the resin and the inorganic thin film that is provided as a thin film be minimized, but the organic silane compound dispersed in the resin can also be used to deposit silicon components on the surface through surface activation such as sputtering performed during thin film formation. It also exhibits the effect of increasing the adhesion and chemical stability with the inorganic thin film that is exposed and laminated on the surface.
【0024】[0024]
【実施例】以下、実施例を挙げて更に詳細に説明するが
、本発明はもとよりこれらの実施例に限定されるもので
はない。尚、実施例中の「部」とあるのは、特記しない
限り「重量部」を意味するものとする。[Examples] The present invention will be explained in more detail with reference to Examples, but the present invention is not limited to these Examples. Note that "parts" in the examples mean "parts by weight" unless otherwise specified.
【0025】実施例1
粘度平均分子量が約2万のポリカーボネート樹脂ペレッ
ト100部を、100部の塩化メチレンに加えて懸濁溶
解させた。これに100部のテトラエトキシシランを添
加して十分に混練し、分散させた。次いで塩化メチレン
を減圧下に留去して原料樹脂組成物を得た。この組成物
を押出機でペレット化した後、射出成形機を用いて直径
130mm、厚さ1.2mmの光磁気ディスク基板を成
形した。Example 1 100 parts of polycarbonate resin pellets having a viscosity average molecular weight of about 20,000 were suspended and dissolved in 100 parts of methylene chloride. 100 parts of tetraethoxysilane was added to this and thoroughly kneaded to disperse it. Next, methylene chloride was distilled off under reduced pressure to obtain a raw resin composition. This composition was pelletized using an extruder, and then a magneto-optical disk substrate having a diameter of 130 mm and a thickness of 1.2 mm was molded using an injection molding machine.
【0026】次にこの基板をスパッタ装置にセットし、
真空下90℃で30分間アニールを行なった後、アルゴ
ンガス及び酸素ガスを1対1の割合で流入させながら高
周波電場を印加し、10分間プラズマ処理を施した。こ
のプラズマ処理面に、スパッタリング法によって厚さ0
.1μmの窒化珪素膜を形成し、更にその上にTb・F
e・Co合金を0.1μm、窒化珪素を0.1μmの厚
さに形成した後、反射層として0.1μmの厚さのアル
ミニウム層を形成し、光磁気ディスクを得た。Next, this substrate is set in a sputtering device,
After annealing under vacuum at 90° C. for 30 minutes, a high frequency electric field was applied while argon gas and oxygen gas were introduced at a ratio of 1:1, and plasma treatment was performed for 10 minutes. This plasma-treated surface is coated with a thickness of 0 by sputtering.
.. A 1 μm silicon nitride film is formed, and then Tb/F is added on top of it.
After forming e.Co alloy to a thickness of 0.1 μm and silicon nitride to a thickness of 0.1 μm, an aluminum layer with a thickness of 0.1 μm was formed as a reflective layer to obtain a magneto-optical disk.
【0027】得られたディスクの特性を表2に示す。
尚、特性評価法は以下の基準で実施した。
[評価基準]
ヘーズ:東洋機器社製直読ヘーズメーター(No.20
6型)を用いて直読した。
密着性試験:薄膜の形成されたディスクを、温度80℃
、相対湿度90%の雰囲囲気に500時間放置した後、
クロスカットテープテストを実施した。即ち、試験製品
の表面に1mm2の桝目を100個形成し、粘着テープ
を押し付けた後、垂直方向にテープを引き剥がして、製
品表面の薄膜の状態を調べ、残存桝目の数で表示した。
耐熱性:薄膜を形成したディスクを、温度80℃、相対
湿度90%の雰囲気に500時間放置した後、光学顕微
鏡および偏光顕微鏡にてピンホールの有無をチェックし
、バースト的な変化の発生していないものを良好とした
。
信頼性:薄膜の形成されたディスクを、温度80℃、相
対湿度90%の雰囲気に500時間放置し、試験前後に
おけるビットエラーレート(BER)の測定を実施し、
初期の値および試験後の値が5×10−5以下であるも
のを良好とした。
複屈折:エリプソメーターを用いて測定した。尚使用波
長は630nmとした。
線膨張係数:厚さ1.2mmのテストピースを用いて、
室温から100℃までの領域における線膨張率の平均値
を測定した。
吸水量:厚さ1.2mmのテストピースを純水に浸漬し
、室温下で48時間放置した後の重量変化から吸水率を
算出した。Table 2 shows the characteristics of the obtained disk. The characteristics evaluation method was performed based on the following criteria. [Evaluation Criteria] Haze: Direct reading haze meter (No. 20 manufactured by Toyo Kiki Co., Ltd.)
6 type) was used for direct reading. Adhesion test: The disk on which the thin film was formed was heated to 80°C.
, after being left in an atmosphere with relative humidity of 90% for 500 hours,
A cross-cut tape test was conducted. That is, 100 squares of 1 mm2 were formed on the surface of the test product, an adhesive tape was pressed, and then the tape was peeled off in the vertical direction to examine the state of the thin film on the product surface and expressed as the number of squares remaining. Heat resistance: After leaving the disk on which the thin film was formed for 500 hours in an atmosphere with a temperature of 80°C and a relative humidity of 90%, the presence or absence of pinholes was checked using an optical microscope and a polarizing microscope to confirm that no burst changes had occurred. Those without were considered good. Reliability: The disk on which the thin film was formed was left in an atmosphere with a temperature of 80°C and a relative humidity of 90% for 500 hours, and the bit error rate (BER) was measured before and after the test.
Those whose initial value and post-test value were 5×10 −5 or less were considered good. Birefringence: Measured using an ellipsometer. The wavelength used was 630 nm. Coefficient of linear expansion: Using a test piece with a thickness of 1.2 mm,
The average value of linear expansion coefficient in the range from room temperature to 100°C was measured. Water absorption: A test piece with a thickness of 1.2 mm was immersed in pure water, and the water absorption rate was calculated from the weight change after leaving it at room temperature for 48 hours.
【0028】実施例2〜6
実施例1における有機シラン化合物の種類及び使用量を
表1に示すものに代えた以外は実施例1と同様にして、
光磁気ディスクを得た。得られたディスクの特性評価結
果を表2に示す。Examples 2 to 6 The same procedure as in Example 1 was carried out except that the type and amount of the organic silane compound used in Example 1 were changed to those shown in Table 1.
A magneto-optical disk was obtained. Table 2 shows the characteristics evaluation results of the obtained discs.
【0029】実施例7
実施例1におけるポリカーボネート樹脂の代えてアモル
ファルポリオレフィン樹脂を使用し、また溶剤としてシ
クロヘキサンを用いた以外は実施例1と同様にして、光
磁気ディスクを得た。得られたディスクの特性評価結果
を表2に示す。Example 7 A magneto-optical disk was obtained in the same manner as in Example 1, except that an amorphous polyolefin resin was used in place of the polycarbonate resin in Example 1, and cyclohexane was used as the solvent. Table 2 shows the characteristics evaluation results of the obtained discs.
【0030】実施例8〜12
実施例2〜6における有機シラン化合物に代えて、各々
その加水分解物を用いた。即ち表1に示す有機シラン化
合物を100部のメタノールに溶解し、次いで0.1規
定の塩酸水をゆっくり加えて有機シラン化合物の加水分
解を行ない、更に室温下で24時間放置することにより
部分的に脱水縮合させてシラン溶液としたものを使用し
た以外は、実施例1と同様にして素材樹脂ペレットの製
造、ディスク基板及び薄膜形成による光ディスクの作製
を行なった。得られた光ディスクは、実施例1と同様に
優れた特性を備えた信頼性のある光磁気ディスク製品で
あった。Examples 8 to 12 In place of the organic silane compounds in Examples 2 to 6, their hydrolysates were used. That is, the organic silane compounds shown in Table 1 were dissolved in 100 parts of methanol, then 0.1 N hydrochloric acid was slowly added to hydrolyze the organic silane compounds, and the organic silane compounds were left at room temperature for 24 hours to partially dissolve the organic silane compounds. An optical disc was produced in the same manner as in Example 1, except that a silane solution obtained by dehydration and condensation was used to produce a raw material resin pellet, a disc substrate, and a thin film. The obtained optical disk was a reliable magneto-optical disk product with excellent characteristics similar to those of Example 1.
【0031】実施例13
実施例8におけるポリカーボネート樹脂の代わりにアモ
ルファスポリオレフィン樹脂を使用し、また溶剤として
シクロヘキサンを用いた以外は実施例8と同様にして、
光磁気ディスクを得た。得られたディスクの特性評価結
果を表2に示す通りであり、特性の優れた信頼性のある
光磁気ディスク製品であった。Example 13 The same procedure as in Example 8 was carried out, except that an amorphous polyolefin resin was used instead of the polycarbonate resin in Example 8, and cyclohexane was used as the solvent.
A magneto-optical disk was obtained. The characteristics evaluation results of the obtained disk are shown in Table 2, and it was a reliable magneto-optical disk product with excellent characteristics.
【0032】実施例14
有機シラン化合物として、メタクリロイルオキシプロピ
ルトリメトキシシラン100部をシクロヘキサン100
部に溶解し、次いでこれに0.1規定の酢酸水溶液30
部を加えて加水分解を行ない、さらに24時間放置する
ことにより一部脱水縮合させ、得られた反応生成物をシ
ラン成分として使用し、またマトリックス樹脂としては
アモルファスポリオレフィン樹脂100部を溶剤として
シクロヘキサンに懸濁溶解させて使用した以外は前記実
施例8と同様にして光ディスクを得た。得られたディス
クの特性及び信頼性は、実施例8で得たものと同様優れ
たものであった。Example 14 As an organic silane compound, 100 parts of methacryloyloxypropyltrimethoxysilane was mixed with 100 parts of cyclohexane.
and then add 30% of 0.1 N acetic acid aqueous solution to this.
The reaction product obtained was used as a silane component, and as a matrix resin, 100 parts of an amorphous polyolefin resin was mixed with cyclohexane as a solvent. An optical disc was obtained in the same manner as in Example 8 except that the suspension was used. The characteristics and reliability of the obtained disk were as excellent as those obtained in Example 8.
【0033】比較例1
実施例1における樹脂組成物として、有機シラン化合物
の添加を省略し、且つ記録薄膜成形時にプラズマ処理を
行なわなかった以外は実施例1と同様にして、光磁気デ
ィスクを得た。得られたディスクは、高湿度の耐久性試
験で部分的に薄膜の剥離が起こり、またビットエラーレ
ートの測定で局所的な欠陥部が発生した。Comparative Example 1 A magneto-optical disk was obtained in the same manner as in Example 1, except that the addition of an organic silane compound to the resin composition in Example 1 was omitted and the plasma treatment was not performed during forming the recording thin film. Ta. The resulting disc showed partial peeling of the thin film during a high-humidity durability test, and local defects occurred when measuring the bit error rate.
【0034】比較例2
実施例1における有機シラン化合物の使用量を5部とし
た以外は全く同様にして実験を行なったところ、比較例
1と同様に耐久性が不十分であった。Comparative Example 2 An experiment was conducted in exactly the same manner as in Example 1, except that the amount of organic silane compound used was 5 parts. As in Comparative Example 1, durability was insufficient.
【0035】比較例3
実施例1における有機シラン化合物の使用量を800部
とした以外は全く同様にして実験を行なったところ、得
られた基板は脆く、薄膜形成後無数のクラック(ひび割
れ)が入り記録の書き込みが不可能であった。Comparative Example 3 An experiment was conducted in exactly the same manner as in Example 1 except that the amount of organic silane compound used was 800 parts. The resultant substrate was brittle and had numerous cracks after the thin film was formed. It was not possible to write entry records.
【0036】[0036]
【表1】[Table 1]
【0037】[0037]
【表2】[Table 2]
【0038】[0038]
【発明の効果】本発明は以上の様に構成されており、マ
トリックス樹脂と有機シラン化合物を特定比率で複合す
ることによって、これを用いて形成した基板は、それ自
身の耐吸水性が高められると共に、誘電膜や磁気記録膜
との密着性が飛躍的に高められ、信頼性の高い光ディス
クを得ることができる。[Effects of the Invention] The present invention is constructed as described above, and by combining the matrix resin and the organic silane compound in a specific ratio, the substrate formed using the same can have its own water absorption resistance enhanced. At the same time, the adhesion between the dielectric film and the magnetic recording film is dramatically improved, and a highly reliable optical disc can be obtained.
【0039】また上記マトリックス樹脂は有機シラン化
合物と一部縮合反応して複合構造を形成することにより
、耐熱性及び耐吸水性が向上すると共に、薄膜形成時の
加工温度を高くできると共に、線膨張係数も低下するの
で、表層に無機質誘電膜を形成したときに生じる応力の
発生も抑えられ、製品の耐熱性、耐吸水性および寸法精
度に優れたディスク基板を得ることができる。Furthermore, the above matrix resin undergoes a partial condensation reaction with an organic silane compound to form a composite structure, thereby improving heat resistance and water absorption resistance, increasing the processing temperature during thin film formation, and reducing linear expansion. Since the coefficient is also reduced, stress that occurs when an inorganic dielectric film is formed on the surface layer is also suppressed, and a disk substrate with excellent heat resistance, water absorption resistance, and dimensional accuracy can be obtained.
【0040】更に本発明の樹脂組成物中には、有機シラ
ン化合物が分散されてマトリックス樹脂の配向を乱して
いるので、基板としたときの複屈折も抑えられる等、物
理的および光学的特性において様々の特徴を発揮する。Furthermore, since the organic silane compound is dispersed in the resin composition of the present invention to disturb the orientation of the matrix resin, it has good physical and optical properties such as suppressing birefringence when used as a substrate. It exhibits various characteristics in.
Claims (3)
可能な光ディスクの基板用樹脂組成物において、該樹脂
組成物は、マトリックス樹脂100重量部に対して、下
記一般式で示される有機シラン化合物或いはその一部が
加水分解し脱水縮合して生成した有機シラン化合物を1
0〜500重量部含有するものであることを特徴とする
光ディスク基板用樹脂組成物。 (但し、式中Xは炭素数1〜6のアルコキシル基、ハロ
ゲン、水酸基、アルコキシアルキル基、イソプロペニル
基あるいは酸素ラジカルを示し、Yは炭素数1〜4の炭
化水素基、Zは炭素数1〜20でエポキシ基、アミノ基
、イミノ基、スルホニル基、チオール基、(メタ)アク
リロイル基、カーボネート基、フェニル基、ビニル基の
何れかの反応性基を含む有機基を示し、またaおよびb
は夫々独立して0〜2の整数で且つaとbの和が3以下
の整数を表わす)1. A resin composition for a substrate of an optical disk on which recorded information can be optically written and rewritten, the resin composition comprising an organic silane compound represented by the following general formula, based on 100 parts by weight of a matrix resin. Alternatively, an organic silane compound produced by hydrolysis and dehydration condensation of a part of it is
A resin composition for an optical disc substrate, characterized in that the resin composition contains 0 to 500 parts by weight. (However, in the formula, X represents an alkoxyl group having 1 to 6 carbon atoms, a halogen, a hydroxyl group, an alkoxyalkyl group, an isopropenyl group, or an oxygen radical, Y is a hydrocarbon group having 1 to 4 carbon atoms, and Z represents a carbon number 1 ~20 represents an organic group containing a reactive group such as an epoxy group, an amino group, an imino group, a sulfonyl group, a thiol group, a (meth)acryloyl group, a carbonate group, a phenyl group, or a vinyl group, and a and b
are each independently an integer from 0 to 2, and the sum of a and b represents an integer of 3 or less)
樹脂である請求項1記載の光ディスク基板用樹脂組成物
。2. The resin composition for an optical disc substrate according to claim 1, wherein the matrix resin is a polycarbonate resin.
オレフィン樹脂である請求項1記載の光ディスク基板用
樹脂組成物。3. The resin composition for an optical disc substrate according to claim 1, wherein the matrix resin is an amorphous polyolefin resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3065641A JPH04277557A (en) | 1991-03-05 | 1991-03-05 | Resin composition for optical disk substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3065641A JPH04277557A (en) | 1991-03-05 | 1991-03-05 | Resin composition for optical disk substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04277557A true JPH04277557A (en) | 1992-10-02 |
Family
ID=13292853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3065641A Withdrawn JPH04277557A (en) | 1991-03-05 | 1991-03-05 | Resin composition for optical disk substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04277557A (en) |
-
1991
- 1991-03-05 JP JP3065641A patent/JPH04277557A/en not_active Withdrawn
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