JPH0427408U - - Google Patents

Info

Publication number
JPH0427408U
JPH0427408U JP1990068360U JP6836090U JPH0427408U JP H0427408 U JPH0427408 U JP H0427408U JP 1990068360 U JP1990068360 U JP 1990068360U JP 6836090 U JP6836090 U JP 6836090U JP H0427408 U JPH0427408 U JP H0427408U
Authority
JP
Japan
Prior art keywords
light
plate
reflecting mirror
emitting
receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990068360U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990068360U priority Critical patent/JPH0427408U/ja
Publication of JPH0427408U publication Critical patent/JPH0427408U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Optical Couplings Of Light Guides (AREA)

Description

【図面の簡単な説明】
第１図はこの考案による発光モジユールの実施
例を示す正面図、第２図はその底面図、第３図は
その反射鏡２６の部分の拡大断面図、第４図はこ
の考案による受光モジユールの実施例を示す正面
図、第５図はその底面図、第６図はこの考案によ
る光リンクの実施例を示す底面図、第７図はその
側面図、第８図はこの光リンクを組込んだプラグ
の例を簡略に示す断面図、第９図は従来の発光モ
ジユールを示す斜視図、第１０図は従来の光リン
クを示す正面図である。
補正 平２．９．２１ 実用新案登録請求の範囲を次のように補正する
。
【実用新案登録請求の範囲】 (1) 発光素子チツプとその発光素子チツプの駆
動回路とが板状モールド体内に埋込まれ、 上記発光素子チツプの発光面は上記板状モール
ド体の一板面と対向し、 その板状モールド体のその一板面に、上記発光
面と斜めに対向した反射鏡が取付けられ、 その反射鏡は、上記発光面よりの出射光を上記
一板面に沿う方向に反射させるように構成されて
いる発光モジユール。 (2) 受光素子チツプとその受光素子チツプの出
力を増幅する回路とが板状モールド体内に埋込ま
れ、 上記受光素子チツプの受光面は上記板状モール
ド体の一板面と対向し、 その板状モールド体のその一板面に、上記受光
面と斜めに対向した反射鏡が取付けられ、 その反射鏡は、上記一板面に沿つて入射された
光を上記受光面に反射させるように構成されてい
る受光モジユール。 (3) 請求項１の発光モジユールと請求項２の受
光モジユールとが、その各反射鏡取付け面を互い
に外側としてその反対の面が互いに対接されてい
る光リンク。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 発光素子チツプとその発光素子チツプの駆
    動回路とが板状モールド体内に埋込まれ、 上記発光素子チツプの発光面は上記板状モール
    ド体の一板面の中央部と対向し、 その板状モールド体のその一板面に、上記発光
    面と斜めに対向した反射鏡が取付けられ、 その反射鏡は、上記発光面よりの出射光を上記
    一板面に沿う方向に反射させるように構成されて
    いる発光モジユール。 (2) 受光素子チツプとその受光素子チツプの出
    力を増幅する回路とが板状モールド体内に埋込ま
    れ、 上記受光素子チツプの受光面は上記板状モール
    ド体の一板面の中央部と対向し、 その板状モールド体のその一板面に、上記受光
    面と斜めに対向した反射鏡が取付けられ、 その反射鏡は、上記一板面に沿つて入射された
    光を上記受光面に反射させるように構成されてい
    る受光モジユール。 (3) 請求項１の発光モジユールと請求項２の受
    光モジユールとが、その各反射鏡取付け面を互い
    に外側としてその反対の面が互いに対接されてい
    る光リンク。
JP1990068360U 1990-06-27 1990-06-27 Pending JPH0427408U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990068360U JPH0427408U (ja) 1990-06-27 1990-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990068360U JPH0427408U (ja) 1990-06-27 1990-06-27

Publications (1)

Publication Number Publication Date
JPH0427408U true JPH0427408U (ja) 1992-03-04

Family

ID=31602733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990068360U Pending JPH0427408U (ja) 1990-06-27 1990-06-27

Country Status (1)

Country Link
JP (1) JPH0427408U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015219267A (ja) * 2014-05-14 2015-12-07 ホシデン株式会社 光伝送モジュール
WO2020183981A1 (ja) * 2019-03-12 2020-09-17 アルプスアルパイン株式会社 集光レンズ、及び光モジュール

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758115A (en) * 1980-09-26 1982-04-07 Toshiba Corp Photocoupler
JPS5925282A (ja) * 1982-08-02 1984-02-09 Fujitsu Ltd 光伝送路付光半導体パツケ−ジ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758115A (en) * 1980-09-26 1982-04-07 Toshiba Corp Photocoupler
JPS5925282A (ja) * 1982-08-02 1984-02-09 Fujitsu Ltd 光伝送路付光半導体パツケ−ジ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015219267A (ja) * 2014-05-14 2015-12-07 ホシデン株式会社 光伝送モジュール
WO2020183981A1 (ja) * 2019-03-12 2020-09-17 アルプスアルパイン株式会社 集光レンズ、及び光モジュール

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