JPH0427408U - - Google Patents

Info

Publication number
JPH0427408U
JPH0427408U JP1990068360U JP6836090U JPH0427408U JP H0427408 U JPH0427408 U JP H0427408U JP 1990068360 U JP1990068360 U JP 1990068360U JP 6836090 U JP6836090 U JP 6836090U JP H0427408 U JPH0427408 U JP H0427408U
Authority
JP
Japan
Prior art keywords
light
plate
reflecting mirror
emitting
receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990068360U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990068360U priority Critical patent/JPH0427408U/ja
Publication of JPH0427408U publication Critical patent/JPH0427408U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Optical Couplings Of Light Guides (AREA)
JP1990068360U 1990-06-27 1990-06-27 Pending JPH0427408U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990068360U JPH0427408U (enExample) 1990-06-27 1990-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990068360U JPH0427408U (enExample) 1990-06-27 1990-06-27

Publications (1)

Publication Number Publication Date
JPH0427408U true JPH0427408U (enExample) 1992-03-04

Family

ID=31602733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990068360U Pending JPH0427408U (enExample) 1990-06-27 1990-06-27

Country Status (1)

Country Link
JP (1) JPH0427408U (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015219267A (ja) * 2014-05-14 2015-12-07 ホシデン株式会社 光伝送モジュール
WO2020183981A1 (ja) * 2019-03-12 2020-09-17 アルプスアルパイン株式会社 集光レンズ、及び光モジュール

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758115A (en) * 1980-09-26 1982-04-07 Toshiba Corp Photocoupler
JPS5925282A (ja) * 1982-08-02 1984-02-09 Fujitsu Ltd 光伝送路付光半導体パツケ−ジ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758115A (en) * 1980-09-26 1982-04-07 Toshiba Corp Photocoupler
JPS5925282A (ja) * 1982-08-02 1984-02-09 Fujitsu Ltd 光伝送路付光半導体パツケ−ジ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015219267A (ja) * 2014-05-14 2015-12-07 ホシデン株式会社 光伝送モジュール
WO2020183981A1 (ja) * 2019-03-12 2020-09-17 アルプスアルパイン株式会社 集光レンズ、及び光モジュール

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