JPH0427317B2 - - Google Patents
Info
- Publication number
- JPH0427317B2 JPH0427317B2 JP25998884A JP25998884A JPH0427317B2 JP H0427317 B2 JPH0427317 B2 JP H0427317B2 JP 25998884 A JP25998884 A JP 25998884A JP 25998884 A JP25998884 A JP 25998884A JP H0427317 B2 JPH0427317 B2 JP H0427317B2
- Authority
- JP
- Japan
- Prior art keywords
- band
- plating
- hole
- shaped
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 46
- 238000002347 injection Methods 0.000 claims description 13
- 239000007924 injection Substances 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 3
- 239000011295 pitch Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 12
- 230000000873 masking effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25998884A JPS61139671A (ja) | 1984-12-11 | 1984-12-11 | 部分メツキ用の回転ホイ−ル装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25998884A JPS61139671A (ja) | 1984-12-11 | 1984-12-11 | 部分メツキ用の回転ホイ−ル装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61139671A JPS61139671A (ja) | 1986-06-26 |
JPH0427317B2 true JPH0427317B2 (enrdf_load_stackoverflow) | 1992-05-11 |
Family
ID=17341719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25998884A Granted JPS61139671A (ja) | 1984-12-11 | 1984-12-11 | 部分メツキ用の回転ホイ−ル装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61139671A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03219084A (ja) * | 1989-11-15 | 1991-09-26 | Fuji Plant Kogyo Kk | 部分メッキ用シール材、その製造方法、および部分メッキ方法 |
JP5914083B2 (ja) * | 2011-10-19 | 2016-05-11 | Dowaメタルテック株式会社 | 部分めっき装置及び部分めっき方法 |
-
1984
- 1984-12-11 JP JP25998884A patent/JPS61139671A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61139671A (ja) | 1986-06-26 |
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