JPH0427304B2 - - Google Patents
Info
- Publication number
- JPH0427304B2 JPH0427304B2 JP59093055A JP9305584A JPH0427304B2 JP H0427304 B2 JPH0427304 B2 JP H0427304B2 JP 59093055 A JP59093055 A JP 59093055A JP 9305584 A JP9305584 A JP 9305584A JP H0427304 B2 JPH0427304 B2 JP H0427304B2
- Authority
- JP
- Japan
- Prior art keywords
- liter
- furan
- composition
- hydrogen peroxide
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 36
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 16
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 10
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 6
- 238000000354 decomposition reaction Methods 0.000 claims description 6
- 150000002500 ions Chemical class 0.000 claims description 6
- 239000003381 stabilizer Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 5
- IEOPZUMPHCZMCS-UHFFFAOYSA-N 2-(methoxymethyl)oxolane Chemical compound COCC1CCCO1 IEOPZUMPHCZMCS-UHFFFAOYSA-N 0.000 claims description 4
- OKAMTPRCXVGTND-UHFFFAOYSA-N 2-methoxyoxolane Chemical compound COC1CCCO1 OKAMTPRCXVGTND-UHFFFAOYSA-N 0.000 claims description 4
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 229910001385 heavy metal Inorganic materials 0.000 claims description 4
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- 229940087596 sodium phenolsulfonate Drugs 0.000 claims description 3
- BLXAGSNYHSQSRC-UHFFFAOYSA-M sodium;2-hydroxybenzenesulfonate Chemical compound [Na+].OC1=CC=CC=C1S([O-])(=O)=O BLXAGSNYHSQSRC-UHFFFAOYSA-M 0.000 claims description 3
- 238000004090 dissolution Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 48
- 239000000243 solution Substances 0.000 description 20
- 239000003795 chemical substances by application Substances 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 6
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 6
- -1 platinum ions Chemical class 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229910001431 copper ion Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LUBJCRLGQSPQNN-UHFFFAOYSA-N 1-Phenylurea Chemical compound NC(=O)NC1=CC=CC=C1 LUBJCRLGQSPQNN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- CPJSUEIXXCENMM-UHFFFAOYSA-N phenacetin Chemical compound CCOC1=CC=C(NC(C)=O)C=C1 CPJSUEIXXCENMM-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 150000003378 silver Chemical class 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 150000002240 furans Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229960003893 phenacetin Drugs 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229940009188 silver Drugs 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- JNMRHUJNCSQMMB-UHFFFAOYSA-N sulfathiazole Chemical compound C1=CC(N)=CC=C1S(=O)(=O)NC1=NC=CS1 JNMRHUJNCSQMMB-UHFFFAOYSA-N 0.000 description 1
- 229960001544 sulfathiazole Drugs 0.000 description 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-N sulfurothioic S-acid Chemical compound OS(O)(=O)=S DHCDFWKWKRSZHF-UHFFFAOYSA-N 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
- C23C16/488—Protection of windows for introduction of radiation into the coating chamber
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US525080 | 1983-08-22 | ||
| US06/525,080 US4437932A (en) | 1983-08-22 | 1983-08-22 | Dissolution of metals utilizing a furan derivative |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6050186A JPS6050186A (ja) | 1985-03-19 |
| JPH0427304B2 true JPH0427304B2 (enExample) | 1992-05-11 |
Family
ID=24091833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59093055A Granted JPS6050186A (ja) | 1983-08-22 | 1984-05-11 | 銅または銅合金溶解法および溶解用組成物 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US4437932A (enExample) |
| JP (1) | JPS6050186A (enExample) |
| KR (1) | KR920006354B1 (enExample) |
| CA (1) | CA1194390A (enExample) |
| CH (1) | CH666057A5 (enExample) |
| DE (1) | DE3430342A1 (enExample) |
| FR (1) | FR2555600B1 (enExample) |
| GB (1) | GB2147546B (enExample) |
| IT (1) | IT1176624B (enExample) |
| MX (1) | MX161653A (enExample) |
| NL (1) | NL8401752A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999010230A1 (en) | 1997-08-22 | 1999-03-04 | Kvaerner Oil & Gas Australia Pty. Ltd. | Buoyant substructure for offshore platform |
| GB2346842B (en) | 1999-02-19 | 2002-03-20 | Kvaerner Oil & Gas Usa Inc | Floating substructure with ballasting system |
| US7794531B2 (en) * | 2007-01-08 | 2010-09-14 | Enthone Inc. | Organic solderability preservative comprising high boiling temperature alcohol |
| CN109972144A (zh) * | 2019-04-10 | 2019-07-05 | 深圳市松柏实业发展有限公司 | 铜蚀刻液及其废液的再生利用方法和循环再生利用系统 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5118228A (ja) * | 1974-08-05 | 1976-02-13 | Mitsubishi Gas Chemical Co | Kinzokuhyomenshorieki |
| US4174253A (en) * | 1977-11-08 | 1979-11-13 | Dart Industries Inc. | Dissolution of metals utilizing a H2 O2 -H2 SO4 solution catalyzed with hydroxy substituted cycloparaffins |
| US4158593A (en) | 1977-11-08 | 1979-06-19 | Dart Industries Inc. | Dissolution of metals utilizing a H2 O2 -sulfuric acid solution catalyzed with selenium compounds |
| US4141850A (en) * | 1977-11-08 | 1979-02-27 | Dart Industries Inc. | Dissolution of metals |
-
1983
- 1983-08-22 US US06/525,080 patent/US4437932A/en not_active Expired - Fee Related
-
1984
- 1984-02-17 MX MX200361A patent/MX161653A/es unknown
- 1984-02-23 CA CA000448146A patent/CA1194390A/en not_active Expired
- 1984-02-24 KR KR1019840000909A patent/KR920006354B1/ko not_active Expired
- 1984-03-15 GB GB08406797A patent/GB2147546B/en not_active Expired
- 1984-04-03 FR FR848405240A patent/FR2555600B1/fr not_active Expired - Fee Related
- 1984-05-11 JP JP59093055A patent/JPS6050186A/ja active Granted
- 1984-05-30 NL NL8401752A patent/NL8401752A/nl not_active Application Discontinuation
- 1984-08-15 CH CH3920/84A patent/CH666057A5/de not_active IP Right Cessation
- 1984-08-17 DE DE19843430342 patent/DE3430342A1/de not_active Withdrawn
- 1984-08-21 IT IT22381/84A patent/IT1176624B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| CH666057A5 (de) | 1988-06-30 |
| FR2555600B1 (fr) | 1990-11-02 |
| KR850002836A (ko) | 1985-05-20 |
| MX161653A (es) | 1990-12-03 |
| GB8406797D0 (en) | 1984-04-18 |
| IT1176624B (it) | 1987-08-18 |
| DE3430342A1 (de) | 1985-03-14 |
| JPS6050186A (ja) | 1985-03-19 |
| GB2147546A (en) | 1985-05-15 |
| KR920006354B1 (ko) | 1992-08-03 |
| US4437932A (en) | 1984-03-20 |
| FR2555600A1 (fr) | 1985-05-31 |
| NL8401752A (nl) | 1985-03-18 |
| GB2147546B (en) | 1987-01-28 |
| IT8422381A0 (it) | 1984-08-21 |
| CA1194390A (en) | 1985-10-01 |
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