JPH04271189A - Manufacture of printed wiring board and device thereof - Google Patents

Abstract

PURPOSE:To speed up an etching rate and obtain a higher etch factor product by introducing a printed board on the surface on which a conductor is formed into an etching solution and turning said conductor into an anode and then charging between the anode and a cathode. CONSTITUTION:An electrolytic etching tank 11 is filled with an etching solution 5, into which a printed board 1 is introduced by driving a conveyor 2. DC current is applied to a cathode 13 made of a copper plate connected with a plasma electrode from a power supply device 14, thereby carrying out electrolytic etching. The copper clad formed on the surface of the printed board as a conductive layer is affected by the chemical action of the etching solution 5 so that copper may be dissolved out from the copper clad, promoting the dissolving of the copper. On the other hand, in the cathode 13, copper ions receive electrons so that the metal copper may be separated out. Therefore, it is satisfactory to replenish the same amount of etching solution which is used for the etching.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for manufacturing printed wiring boards.

0002

2. Description of the Related Art FIG. 6 is a sectional view showing a conventional printed wiring board manufacturing apparatus. In the figure, 1 is a printed circuit board with a copper foil pasted as a conductive layer on its surface, 2 is a conveyor that transports the printed circuit board 1, 3 is a chamber that accommodates the conveyor 2, and 4 is a printed circuit board that is transported within the chamber 3. This is a shower pipe that sprays an etching solution 5 onto the surface of the shower head 1.

In the conventional method for manufacturing printed wiring boards, first, an etching solution 5 is ejected from a shower pipe 4 disposed in a chamber 3, and a printed circuit board 1 to be processed, on which an etching resist pattern has been formed using a photographic method, is transferred to a conveyor. 2
is introduced into the chamber 3 to melt the copper foil other than the circuit pattern portion protected by the etching resist on the printed circuit board 1, thereby forming a circuit pattern. At this time, the exposed copper foil on the printed circuit board 1 is dissolved in the etching solution 5 and etched (Cu→Cu2++2e-).
, a printed wiring board is obtained.

0004

[Problems to be Solved by the Invention] Since the conventional printed wiring board manufacturing method and apparatus are configured as described above, the etching rate of the printed circuit board 1 depends on the ability of the copper to dissolve in the etching solution, and the etching rate is If the copper concentration in the solution exceeds the limit, it is necessary to renew the etching solution, and the etching process takes time, resulting in a decrease in performance and a worsening of the etch factor. .

[0005] This invention was made in order to solve the above-mentioned problems, and it is possible to perform etching in a short time, replenishment of etching solution is only required by taking out the solution, and a product with a good etch factor can be obtained. The purpose of the present invention is to provide a method and apparatus for manufacturing a printed wiring board.

[0006]

[Means for Solving the Problems] The present invention provides the following printed wiring board manufacturing method and apparatus. (1) A method for producing a printed wiring board, in which a printed circuit board with a conductive layer formed on its surface is introduced into an etching solution, and the conductive layer is used as an anode, and electricity is applied between the cathode and the cathode to perform electrolytic etching to form a circuit pattern. .

(2) An electrolytic etching tank containing an etching solution, and a carbon fiber-made printed circuit board, which is provided so that the printed circuit board with a conductive layer formed on the surface thereof is introduced into the etching solution while being in contact with the conductive layer. A printed wiring board comprising a conveyor, a cathode placed at a position facing the introduced printed circuit board, and a power supply device that conducts electricity between the conveyor and the cathode and performs electrolytic etching using the conductor layer of the printed circuit board as an anode. Manufacturing equipment.

[0008]

[Operation] In the printed wiring board manufacturing method and apparatus of the present invention, electrolytic etching is performed using the conductive layer of the printed circuit board introduced into an etching solution as an anode to form a circuit pattern and manufacture a printed wiring board. At this time, in the printed wiring board manufacturing apparatus of the present invention, the printed circuit board is introduced into the etching solution in contact with the conductor layer by a conveyor made of carbon fiber, and electricity is applied through the conveyor.

In the printed wiring board manufacturing method and apparatus of the present invention, the etching rate of the conductor layer (copper) is increased by electrolysis, the processing time is shortened, and the etch factor is also improved. Furthermore, by depositing copper on the cathode, the copper concentration in the etching solution can be maintained constant, extending the life of the etching solution. Furthermore, an apparatus using a conveyor made of carbon fiber allows continuous processing.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a printed wiring board manufacturing apparatus according to an embodiment, and in the figure, the same reference numerals as in FIG. 6 indicate the same or corresponding parts.

Reference numeral 11 denotes an electrolytic etching tank in which an etching solution 5 is contained. The conveyor 2 is a wheel conveyor made of carbon fiber, and the printed circuit board 1 is placed in the horizontal direction.
A plurality of them are arranged side by side in two rows, upper and lower, and are electrically connected by conductor frames 12, respectively. 13 is a cathode made of a copper plate placed at a position facing the printed circuit board 1 at the bottom of the electrolytic etching bath 11;
is a power supply device whose positive pole is connected to the conveyor 2 and whose negative pole is connected to the cathode 13.

To explain the method for manufacturing a printed wiring board using the above-mentioned apparatus, an etching solution 5 is contained in an electrolytic etching bath 11, and the printed circuit board 1 is introduced into the etching solution 5 by driving the conveyor 2. do. Then, electrolytic etching is performed by passing a direct current between the carbon fiber conveyor 2 connected to the positive electrode from the power supply device 14 and the cathode 13 made of a copper plate connected to the negative electrode. At this time, due to the chemical action of the etching solution 5, copper is dissolved from the copper foil as a conductive layer formed on the surface of the printed circuit board 1, but the dissolution of the copper is promoted by electrolysis. That is, when electricity is applied, electrons move from the exposed copper foil of the printed circuit board 1 that is in electrical contact with the conveyor 2 to the anode (conveyor 2) (Cu→Cu2
++2e-), copper is ionized, dissolved in the etching solution, and etched. On the other hand, at the cathode 13, copper ions receive electrons and metallic copper is deposited. By thus dissolving unnecessary copper foil that is not protected by the etching resist on the printed circuit board 1, a circuit pattern is formed and a printed wiring board is manufactured.

FIG. 2 is a front view of a conveyor in another embodiment, and FIG. 3 is a plan view thereof. In the figure, conveyor 2
1 is a belt conveyor consisting of two sets of upper and lower endless belts 15 made of carbon fiber nets and rollers 16 that drive the belts, and a printed circuit board 1 is sandwiched between the endless belts 15 made of carbon fiber nets for conveyance and energization. It is supposed to be done.

FIG. 4 is a plan view of a conveyor in another embodiment. In the figure, the conveyor 2 is a chain conveyor consisting of a chain 17 that moves in parallel and a chucking 18 that supports the printed circuit board 1 between the chains 17. ing.

FIG. 5 is a perspective view showing a vertical batch type printed wiring board manufacturing apparatus according to still another embodiment, in which the printed circuit board 1 is suspended from a conductive holder 20 by a chuck 19 and is exposed to an etching solution. It is scheduled to be introduced during the 5th. The cathode 13 is suspended from a conductive holder 22 by a clip 21 and immersed in the etching solution 5. 23 is an aeration device which sends air from an air compressor or an air blower 24 to diffuse the etching solution 5.
It is designed to stir.

In the method of manufacturing a printed wiring board using the above-described apparatus, the printed circuit board 1 is suspended from the holder 20 by the chucking 19 and introduced into the etching solution 5, and the power supply device 1
Electricity is applied from step 4 to perform electrolytic etching in a batch manner to manufacture a printed wiring board.

[0017] In the above embodiments, the horizontal conveyor type and vertical batch type were shown as examples, but the printed circuit board may be transferred and electrolytically etched by other methods.

[0018]

[Effects of the Invention] According to the printed wiring board manufacturing method and apparatus of the present invention, since electrolytic etching is performed using an etching solution, the etching rate is increased by chemical etching and electrolytic etching, and therefore, the etching speed is increased in a short time. A product that can be etched and has a high etch factor can be obtained. Moreover, since the copper eluted into the etching solution is deposited on the cathode, the etching solution needs to be replenished only by the amount of the solution taken out, and etching can be performed at low cost.

Further, in the printed wiring board manufacturing apparatus of the present invention, since the printed circuit board is transported and energized by the conveyor made of carbon fiber, the conveyor is not melted by electrolysis and electrolytic etching can be performed efficiently.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a printed wiring board manufacturing apparatus according to an embodiment.

FIG. 2 is a front view of a conveyor in another embodiment.

FIG. 3 is a plan view of FIG. 2;

FIG. 4 is a plan view of a conveyor in another embodiment.

FIG. 5 is a transparent perspective view showing a printed wiring board manufacturing apparatus according to another embodiment.

FIG. 6 is a sectional view of a conventional printed wiring board manufacturing apparatus.

[Explanation of symbols]

1 Printed circuit board 2 Conveyor 5 Etching liquid 11 Electrolytic etching bath 13 Cathode 14 Power supply device 15 Endless belt 23　Air diffuser

Claims (2)

[Claims] [Claim 1] A circuit pattern is formed by introducing a printed circuit board with a conductor layer formed on its surface into an etching solution, and performing electrolytic etching by passing electricity between the conductor layer as an anode and a cathode. A method of manufacturing a printed wiring board. 2. An electrolytic etching bath containing an etching solution, and a carbon fiber conveyor provided to introduce a printed circuit board having a conductive layer on its surface into the etching solution while in contact with the conductive layer. , a cathode disposed at a position facing the introduced printed circuit board, and a power supply device that conducts electricity between the conveyor and the cathode and performs electrolytic etching using the conductor layer of the printed circuit board as an anode. Printed wiring board manufacturing equipment.