JPH0426983B2 - - Google Patents
Info
- Publication number
- JPH0426983B2 JPH0426983B2 JP59217242A JP21724284A JPH0426983B2 JP H0426983 B2 JPH0426983 B2 JP H0426983B2 JP 59217242 A JP59217242 A JP 59217242A JP 21724284 A JP21724284 A JP 21724284A JP H0426983 B2 JPH0426983 B2 JP H0426983B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- workpiece
- take
- surface plates
- sun gear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000969 carrier Substances 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、上下定盤間に、太陽歯車とインター
ナル歯車によつて自転しながら公転するキヤリア
を介在させ、このキヤリアによつて保持された被
加工物を研磨する研磨機に係り、特に加工後に被
加工物を自動的に取出すためのキヤリアの位置決
め方法に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides a carrier that rotates and revolves between the upper and lower surface plates by a sun gear and an internal gear, and is held by this carrier. The present invention relates to a polishing machine for polishing a processed workpiece, and particularly to a method for positioning a carrier for automatically taking out the workpiece after processing.
この種の研磨機における被加工物の取出しは、
この取出しのために上定盤を上昇させると、被加
工物のいくつかはキヤリアから外れて上定盤側に
付着してしまうため、自動化が困難であると共
に、人手による取出しもめんどうであつた。そこ
で、本願の一発明者は、上定盤をわずかに上昇さ
せ、上定盤の被加工物に対する圧力を零にしなが
ら実質的には被加工物を上下定盤で挟持した状態
にしたまま、キヤリアを上下定盤間から外方へ引
出して同キヤリアの穴内に置かれた被加工物を受
け台にて受取るようにした取出し方法を提案した
（特開昭58−215031号）。
To take out the workpiece in this type of polishing machine,
When the upper surface plate is raised for this purpose, some of the workpieces come off the carrier and stick to the upper surface plate, making it difficult to automate and also tedious to take out manually. . Therefore, one inventor of the present application raised the upper surface plate slightly to reduce the pressure on the workpiece on the upper surface plate to zero, while keeping the workpiece substantially sandwiched between the upper and lower surface plates. A method of taking out a carrier was proposed in which the carrier was pulled out from between the upper and lower surface plates and the workpiece placed in the hole of the carrier was received on a receiving stand (Japanese Patent Laid-Open No. 58-215031).
ところで、前記のような研磨機における被加工
物の取出しを全自動で行なうためには、上下定盤
間にあるキヤリアを取出し位置に位置決めする必
要があり、このとき前記の説明からも明らかなよ
うに上定盤を上昇させてしまうと被加工物がキヤ
リアから外れてしまうため、好ましくない。本発
明の目的は、被加工物をキヤリア内に納めたまま
キヤリアを所定の取出位置に位置決めできると共
に、複数のキヤリアの位置決めおよびそれに続く
取出しを短時間に正確に行うことのできる研磨機
におけるキヤリア位置決め方法を提供するにあ
る。
By the way, in order to fully automatically take out the workpiece in the polishing machine as described above, it is necessary to position the carrier between the upper and lower surface plates at the take-out position. If the upper surface plate is raised immediately, the workpiece will come off the carrier, which is undesirable. An object of the present invention is to provide a carrier for a polishing machine that can position a carrier at a predetermined take-out position while a workpiece is housed in the carrier, and that can accurately position and subsequently take out a plurality of carriers in a short time. To provide a positioning method.
上記目的を達成するため本発明は、キヤリアと
インターナル歯車とのかみ合いを解除し、上下定
盤でキヤリアおよび被加工物を実質的に挟持した
状態で上下定盤および太陽歯車を同一方向へ同一
回転数で回転させることによりキヤリアを自転さ
せることなく公転させ、上下定盤間から突出して
いるキヤリアの外周部を取出台の位置に対応して
設けたセンサで検知し、この検知結果に基づいて
上下定盤および太陽歯車の回転を停止させ、取出
台に対するキヤリアの位置決めを行なうことを特
徴とするものである。
In order to achieve the above object, the present invention disengages the carrier and the internal gear, and moves the upper and lower surface plates and the sun gear in the same direction with the carrier and the workpiece substantially sandwiched between the upper and lower surface plates. By rotating at the rotational speed, the carrier revolves around itself without rotating, and the outer periphery of the carrier that protrudes from between the upper and lower surface plates is detected by a sensor installed corresponding to the position of the take-out table.Based on this detection result, The feature is that the rotation of the upper and lower surface plates and the sun gear is stopped, and the carrier is positioned relative to the take-out table.
上記の手段によれば、被加工物はキヤリアから
外れず、キヤリアは上下定盤および太陽歯車の回
転によつて太陽歯車の中心の回りを自転すること
なく上下定盤および太陽歯車と一体となつて正確
に公転する。このキヤリアの公転による移動は、
キヤリアの外周部が上下定盤から突出しているた
め、センサによつて検知可能である。前記センサ
をキヤリアの引出し位置に対応して設けて置け
ば、キヤリアは所定の位置に自動的に位置決めさ
れる。この位置決めと前述した特開昭58−215031
号公報に記載されている取出し方法を組み合せる
ことにより被加工物の取出しが全自動で行なわれ
るようになる。このとき、インターナル歯車はキ
ヤリアから外れているため、キヤリアを取出すた
めにインターナル歯車をキヤリアから解除する必
要がなく、また次のキヤリアの位置決めのために
インターナル歯車をキヤリアに再びかみ合わせる
必要もない。そこで、キヤリアの位置決めとそれ
に続くキヤリアの取出しが短時間で行われる。
According to the above means, the workpiece does not come off the carrier, and the carrier becomes integral with the upper and lower surface plates and the sun gear without rotating around the center of the sun gear due to the rotation of the upper and lower surface plates and the sun gear. It revolves accurately. This movement due to the carrier's revolution is
Since the outer periphery of the carrier protrudes from the upper and lower surface plates, it can be detected by a sensor. If the sensor is provided in correspondence with the pulled-out position of the carrier, the carrier is automatically positioned at a predetermined position. This positioning and the above-mentioned Japanese Patent Application Laid-Open No. 58-215031
By combining the take-out methods described in the above publication, the workpiece can be taken out fully automatically. At this time, the internal gear is disengaged from the carrier, so there is no need to release the internal gear from the carrier in order to take out the carrier, and there is no need to re-engage the internal gear with the carrier in order to position the next carrier. Nor. Therefore, the positioning of the carrier and the subsequent removal of the carrier are carried out in a short time.
以下本発明の一実施例を示す第１図ないし第３
図について説明する。第１図において、１は上定
盤、２は下定盤で、これらは円板状をなし、それ
らの主軸１ａ，２ａは図示しない回転駆動源に連
結されている。両定盤１，２の互いに対向する面
には研磨布などによる研磨面１ｂ，２ｂが設けら
れ、これらの間で後述するウエハなどの被加工物
７の両表面を研磨するようになつている。
The following Figures 1 to 3 show one embodiment of the present invention.
The diagram will be explained. In FIG. 1, 1 is an upper surface plate, and 2 is a lower surface plate, which are disk-shaped, and their main shafts 1a and 2a are connected to a rotational drive source (not shown). Polishing surfaces 1b and 2b made of polishing cloth or the like are provided on opposing surfaces of both surface plates 1 and 2, and both surfaces of a workpiece 7 such as a wafer, which will be described later, are polished between these surfaces. .
下定盤２の中心部には、研磨面２ｂより突出す
る太陽歯車３が設けられると共に、下定盤２の外
側にはインターナル歯車４が昇降可能に設けられ
ている。太陽歯車３とインターナル歯車４との間
には、上下定盤１，２間に介在される複数個のキ
ヤリア５（第２図参照）が置かれている。これら
のキヤリア５は円板状をなし、その外周部には上
記太陽歯車３およびインターナル歯車４にかみ合
う歯部６が設けられると共に内部には複数枚の被
加工物７を保持する穴８が設けられている。 A sun gear 3 protruding from the polishing surface 2b is provided at the center of the lower surface plate 2, and an internal gear 4 is provided on the outside of the lower surface plate 2 so as to be movable up and down. A plurality of carriers 5 (see FIG. 2) are placed between the sun gear 3 and the internal gear 4 and are interposed between the upper and lower surface plates 1 and 2. These carriers 5 are disk-shaped, and have teeth 6 on their outer peripheries that mesh with the sun gear 3 and internal gear 4, and have holes 8 inside for holding a plurality of workpieces 7. It is provided.
前記下定盤２の外方には、被加工物７の取出台
９が設置されている。この取出台９は、第１図お
よび第２図において左右方向へ移動可能に設けら
れ、インターナル歯車４が第１図に鎖線で示す駆
動位置から実線で示すように下降させた状態にあ
るとき、その上方に突出して先端が下定盤２の外
周に接近し、上面が下定盤２の研磨面２ｂと等し
いか若干低くなるようになつている。 A table 9 for taking out the workpiece 7 is installed outside the lower surface plate 2. This takeout table 9 is provided so as to be movable in the left and right directions in FIGS. 1 and 2, and when the internal gear 4 is in the lowered state as shown in the solid line from the drive position shown in the chain line in FIG. , protrudes upward so that its tip approaches the outer periphery of the lower surface plate 2, and its upper surface is equal to or slightly lower than the polishing surface 2b of the lower surface plate 2.
下定盤２の外側上方には、第１図に示す繰り出
し位置にて上下定盤１，２の間から外方へ突出し
ているキヤリア５の外周を検知するセンサ１０が
設けられている。このセンサ１０は、キヤリア５
が太陽歯車３の中心を中心として例えば第２図に
おいて時計方向などのように所定方向へ移動して
くるキヤリア５の外周部を検知したとき、同キヤ
リア５が第２図に示すように取出台９に対応する
位置にあるように関連付けて設置されており、キ
ヤリア５を検知したとき、キヤリア５の前記移動
を停止させ、キヤリア５を取出台９に対応する位
置に位置決めするようになつている。 A sensor 10 is provided outside and above the lower surface plate 2 to detect the outer periphery of the carrier 5 that protrudes outward from between the upper and lower surface plates 1 and 2 at the extended position shown in FIG. This sensor 10 is a carrier 5
When the carrier 5 detects the outer periphery of the carrier 5 moving in a predetermined direction, such as clockwise in FIG. When the carrier 5 is detected, the movement of the carrier 5 is stopped and the carrier 5 is positioned at a position corresponding to the take-out table 9. .
また取出台９の上方には、第１，２図において
左右方向に進退するキヤリア引出棒１１が設けら
れ、その先端にキヤリア把持治具１２が取付けら
れている。さらにまた、取出台９の上方には、第
３図に示すように、同図において上下方向と左右
方向へ移動可能な被加工物押出体１３が設けられ
ている。 Further, above the take-out table 9, there is provided a carrier pull-out rod 11 that moves back and forth in the left-right direction in FIGS. 1 and 2, and a carrier gripping jig 12 is attached to the tip thereof. Furthermore, as shown in FIG. 3, above the take-out table 9, a workpiece extrusion body 13 is provided which is movable in the vertical and horizontal directions in the figure.
次いで本装置の作用と共に本発明のキヤリア位
置決め方法について説明する。研磨時には、取出
台９、キヤリア引出棒１１、キヤリア把持治具１
２ならびに被加工物押出体１３は、第１ないし３
図において右方へ後退しており、インターナル歯
車４が、第１図において鎖線で示す駆動位置にあ
り、上下定盤１，２間に置かれたキヤリア５の歯
部６にかみ合い、図示しない駆動源から回転を与
えられ、太陽歯車３の回転とによつてキヤリア５
を上下定盤１，２間で自転および公転させる。上
下定盤１，２は主軸１ａ，１ｂを介して図示しな
い回転駆動源から回転を与えられ、キヤリア５の
穴８内に保持されて上下定盤１，２間を移動する
被加工物７の上下両表面を研磨する。 Next, the operation of this device and the carrier positioning method of the present invention will be explained. During polishing, the take-out table 9, carrier pull-out rod 11, carrier gripping jig 1
2 and the workpiece extrusion body 13 are the first to third
It has retreated to the right in the figure, and the internal gear 4 is in the drive position shown by the chain line in FIG. Rotation is applied from the drive source, and the carrier 5 is rotated by the rotation of the sun gear 3.
is rotated and revolved between upper and lower surface plates 1 and 2. The upper and lower surface plates 1 and 2 are rotated by a rotational drive source (not shown) via the main shafts 1a and 1b, and the workpiece 7 is held in the hole 8 of the carrier 5 and moved between the upper and lower surface plates 1 and 2. Polish both the top and bottom surfaces.
このようにして被加工物７の研磨が終了したな
らば、研磨のために被加工物７に対して付与して
いた上定盤１の下向きの押圧力を解除し、被加工
物７に対する上定盤１の接圧力が零となるよう上
定盤１を図示しない昇降装置によりわずかに上昇
させる。この上昇量は、被加工物７がキヤリア５
の穴８から抜け出ない程度のわずかな量である。 When the polishing of the workpiece 7 is completed in this way, the downward pressing force applied to the workpiece 7 for polishing is released, and the downward pressing force applied to the workpiece 7 is released. The upper surface plate 1 is slightly raised by a lifting device (not shown) so that the contact force of the surface plate 1 becomes zero. This amount of rise is such that the workpiece 7 is on the carrier 5.
The amount is so small that it will not slip out of the hole 8.
次いで、インターナル歯車４を第１図に実線で
示す位置に下降させ、上下定盤１，２および太陽
歯車３を同一方向へ同一回転数で低速回転させ
る。これによりキヤリア５は太陽歯車３の中心を
中心として上下定盤１，２と共にを比較的低速で
移動する。キヤリア５の歯部６を含む外周部は、
上下定盤１，２の外周より突出しているため、キ
ヤリア５の移動により該キヤリア５の外周部がセ
ンサ１０による検知位置に達すると、センサ１０
がこれを検知し、太陽歯車３および上下定盤１，
２の回転を停止させ、前記センサ１０によつて検
知されたキヤリア５を取出台９に対応する位置に
位置決めして停止させる。 Next, the internal gear 4 is lowered to the position shown by the solid line in FIG. 1, and the upper and lower surface plates 1, 2 and the sun gear 3 are rotated in the same direction at the same number of rotations at low speed. As a result, the carrier 5 moves at a relatively low speed around the center of the sun gear 3 together with the upper and lower surface plates 1 and 2. The outer periphery of the carrier 5 including the teeth 6 is
Since it protrudes from the outer periphery of the upper and lower surface plates 1 and 2, when the outer periphery of the carrier 5 reaches the detection position by the sensor 10 due to movement of the carrier 5, the sensor 10
detects this, and the sun gear 3 and upper and lower surface plates 1,
2 is stopped, and the carrier 5 detected by the sensor 10 is positioned at a position corresponding to the take-out table 9 and stopped.
次いで、取出台９を第１図に示すように前進さ
せ、キヤリア引出棒１１を繰り出し、キヤリア把
持治具１２によつてキヤリア５の外周部を把持
し、キヤリア５を上下定盤１，２間から取出台９
上へ引出す。被加工物７はキヤリア５と共に取出
台９上に引出される。そこで、キヤリア５を若干
上昇させれば、被加工物７はキヤリア５の穴８か
ら抜け出して取出台９上に残されるので、キヤリ
ア５のみを搬出する。次いで、第３図に示すよう
に、被加工物押出体１３により取出台９上に残さ
れている被加工物７の同図において左端側を右方
へ押し、被加工物７を図示しない格納箱内へ納め
る。 Next, the take-out table 9 is advanced as shown in FIG. Take-out table 9
Pull it up. The workpiece 7 is pulled out onto the take-out table 9 together with the carrier 5. Therefore, if the carrier 5 is slightly raised, the workpiece 7 will slip out of the hole 8 of the carrier 5 and remain on the take-out stand 9, so that only the carrier 5 will be carried out. Next, as shown in FIG. 3, the left end side of the workpiece 7 left on the take-out table 9 is pushed to the right by the workpiece pusher 13, and the workpiece 7 is stored (not shown). Place it in the box.
こうして１つのキヤリア５およびそれに保持さ
れている被加工物７の取出しが終了したならば、
被加工物引出棒１１、被加工物把持治具１２なら
びに被加工物押出体１３を元位置へ復帰させ、前
記と同様にして残りのキヤリア５を太陽歯車３を
中心として移動させ、該キヤリア５をセンサ１０
で検出し、位置決めし、以下前記と同様にして該
キヤリア５および被加工物７を取出す。 Once the removal of one carrier 5 and the workpiece 7 held therein is completed,
The workpiece pull-out rod 11, workpiece gripping jig 12, and workpiece extrusion body 13 are returned to their original positions, and the remaining carrier 5 is moved around the sun gear 3 in the same manner as described above. The sensor 10
The carrier 5 and the workpiece 7 are then taken out in the same manner as described above.
以上述べたように本発明によれば、被加工物を
キヤリアの穴内に確実に保持したままキヤリアを
所定の位置に位置決めすることができ、これによ
りキヤリアおよび被加工物の自動取出しが可能に
なり、さらに複数のキヤリアの位置決めおよび取
出動作の途中で、インターナル歯車を昇降させる
必要がないため、簡単かつ短時間でキヤリアの位
置決めさらにはそれに続くキヤリアの取出しを行
なうことができる効果が得られる。
As described above, according to the present invention, the carrier can be positioned at a predetermined position while the workpiece is securely held in the hole of the carrier, and this makes it possible to automatically take out the carrier and the workpiece. Furthermore, since there is no need to raise and lower the internal gear during the positioning and take-out operations of a plurality of carriers, it is possible to easily and quickly position the carriers and subsequently take out the carriers.
第１図は本発明の一実施態様を示すもので第２
図の−線による概要展開断面図、第２図は第
１図の−線による断面図、第３図は被加工物
の押出状態を示す部分概要展開断面図である。
１……上定盤、２……下定盤、３……太陽歯
車、４……インターナル歯車、５……キヤリア、
７……被加工物、９……取出台、１０……セン
サ、１１……キヤリア引出棒、１２……キヤリア
把持治具、１３……被加工物押出体。
Fig. 1 shows one embodiment of the present invention, and Fig. 2 shows one embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along the line - in FIG. 1, and FIG. 3 is a partially expanded cross-sectional view showing the state of extrusion of the workpiece. 1...Upper surface plate, 2...Lower surface plate, 3...Sun gear, 4...Internal gear, 5...Carrier,
7...Workpiece, 9...Takeout stand, 10...Sensor, 11...Carrier pull-out rod, 12...Carrier grip jig, 13...Workpiece extrusion body.
Claims (1)
によつて自転しながら公転するキヤリアを介在さ
せ、このキヤリアに保持された被加工物を研磨
し、研磨後に前記下定盤の外方に設けた取出台上
に前記被加工物と共に前記キヤリアを引出すよう
にした研磨機において、前記キヤリアと前記イン
ターナル歯車とのかみ合いを解除し、前記上下定
盤で前記キヤリアおよび前記被加工物を実質的に
挟持した状態で前記上下定盤および前記太陽歯車
を同一方向へ同一回転数で回転させることにより
前記キヤリアを自転させることなく公転させ、前
記上下定盤間から突出している前記キヤリアの外
周部を前記取出台の位置に対応して設けたセンサ
で検知し、この検知結果に基づいて前記上下定盤
および前記太陽歯車の前記公転を停止させ、前記
取出台に対する前記キヤリアの位置決めを行なう
ことを特徴とする研磨機におけるキヤリア位置決
め方法。1 A carrier that revolves while rotating by a sun gear and an internal gear is interposed between the upper and lower surface plates, and the workpiece held by this carrier is polished, and after polishing, a carrier is provided outside the lower surface plate. In a polishing machine in which the carrier is pulled out together with the workpiece onto a take-out table, the carrier and the internal gear are disengaged, and the carrier and the workpiece are substantially removed by the upper and lower surface plates. By rotating the upper and lower surface plates and the sun gear in the same direction and at the same rotation speed in a sandwiched state, the carrier is made to revolve without rotating, and the outer peripheral portion of the carrier that protrudes from between the upper and lower surface plates is rotated. The position of the take-out stand is detected by a sensor provided corresponding to the position of the take-out stand, and based on the detection result, the revolution of the upper and lower surface plates and the sun gear is stopped, and the carrier is positioned with respect to the take-out stand. Carrier positioning method in a polishing machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59217242A JPS6195876A (en) | 1984-10-18 | 1984-10-18 | Positioning method for carrier of polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59217242A JPS6195876A (en) | 1984-10-18 | 1984-10-18 | Positioning method for carrier of polishing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6195876A JPS6195876A (en) | 1986-05-14 |
| JPH0426983B2 true JPH0426983B2 (en) | 1992-05-08 |
Family
ID=16701077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59217242A Granted JPS6195876A (en) | 1984-10-18 | 1984-10-18 | Positioning method for carrier of polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6195876A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61219568A (en) * | 1985-03-25 | 1986-09-29 | Mitsubishi Metal Corp | Method and device for stopping and polishing work at constant position |
| JPS6328562A (en) * | 1986-07-22 | 1988-02-06 | Otani Reiji | Meshedly charging method for lapping carrier |
| JPH0413566A (en) * | 1990-05-08 | 1992-01-17 | Showa Alum Corp | Polishing device |
| JPH05285828A (en) * | 1992-04-09 | 1993-11-02 | Hitachi Zosen Corp | Polishing device |
| JP5379461B2 (en) * | 2008-12-10 | 2013-12-25 | Ｈｏｙａ株式会社 | Mask blank substrate manufacturing method, mask blank manufacturing method, and mask manufacturing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58215031A (en) * | 1982-06-07 | 1983-12-14 | Toshiba Corp | Taking out of wafer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59109447U (en) * | 1983-01-06 | 1984-07-24 | ホ−ヤ株式会社 | Double-sided processing equipment |
-
1984
- 1984-10-18 JP JP59217242A patent/JPS6195876A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58215031A (en) * | 1982-06-07 | 1983-12-14 | Toshiba Corp | Taking out of wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6195876A (en) | 1986-05-14 |
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