JPH04269475A - Electric connecting member and connecting method of electric circuit part using same - Google Patents

Abstract

PURPOSE:To prevent the generation of a continuity failure and increase in electric resistance resulted from connecting work by using an electric connecting member obtained by burying a number of conductive members in a holding body made of an insulating material to reduce the pressurization and heating required for the connection of electric circuit parts. CONSTITUTION:A thermoplastic adhesive 20 is contained in a holding body 2, or the adhesive 20 is applied onto the part excluding the exposed part of a conductive member 3 on both surfaces of the holding body 2. When electric circuit parts 4, 5 are connected to each other by use of the electric connecting member 1, the electric circuit parts 4, 5 are brought into contact with both the surfaces of the holding body 2 or the adhesive 20 applied layers on both the surfaces of the holding body 2, and heated to the hardening temperature of the adhesive 20. Then, the adhesive 20 is hardened and contracted, and electrodes 40, 50 forming the connecting ends of the electric circuit parts 4, 5 are pressed onto the conductive members 3, 3... by this contracting force to mutually connect the both.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical connection member used to establish an electrical connection between electrical circuit components, and a method of connecting electrical circuit components using the same.

0002

2. Description of the Related Art Known methods for establishing electrical connection between electrical circuit components include a wire bonding method, an automatic bonding method using a tape carrier system disclosed in Japanese Patent Application Laid-open No. 59-139636, etc. TAB(
There is a Tape Automated Bonding method. However, these methods have the disadvantage of not being able to deal with cases where there are many connection points at a narrow pitch, and they are also unable to obtain a connection state between many connection points at once, making the connection work difficult. Since it requires a large amount of man-hours, there is a problem in that it is difficult to reduce costs.

[0003] In order to solve these difficulties, for example, Japanese Patent Laid-Open No. 63-222437 and Japanese Patent Laid-open No. 63-222437
-228726, and Japanese Patent Application Publication No. 63-24683
In Publication No. 5, etc., a large number of conductive members are embedded in a thin plate-shaped holder made of an insulating material so as to penetrate this from the front and back,
An electrical connection member in which both ends of these members are exposed on the front and back surfaces of a holder, and a method for connecting electrical circuit components using the same, have been proposed.

FIG. 4 is a longitudinal sectional view of this electrical connection member. As shown in this figure, the electrical connection member 1 has a large number of through holes 12, 12 penetrating the holder 2 made of an insulating material from the front and back sides.
Short rod-shaped conductive members 3, 3... are embedded in each of the conductive members 3, 3..., and both ends of each are exposed on both sides of the holder 2 in a convex shape of a predetermined height. The conductive members 3, 3... are made of metal with excellent conductivity, and gold (Au) or a gold alloy is often used. In addition, the conductive member 3,
3...The mutual spacing is determined under the condition that insulation can be ensured between adjacent conductive members 3, 3.

FIG. 5 shows how electrical circuit components are connected by this electrical connection member 1. As shown in FIG. In the figure, 4 and 5 are electrical circuit components to be connected. When these are connected using the electrical connection member 1, the electrical circuit components 4 and 5 are attached to both sides of the holder 2.
After aligning the electrodes 40 and 50 that will serve as the respective connection ends in plan view, these electric circuit components 4 and 5
are pressed by an appropriate means and pressed against the exposed ends of the conductive members 3, 3, . . . on opposing surfaces to join them. Thereby, the electrodes 40, 50, that is, the electric circuit components 4, 5 are electrically connected via the conductive members 3, 3, .

In this connection, by densely arranging the conductive members 3, 3... on the surface of the holder 2, it is possible to easily cope with an increase in the number of connection points, and as shown in the figure, the electrodes 4
Since the electrical connection between 0 and 50 is made through a plurality of conductive members 3, 3... and these conductive members 3, 3... are short, the electrical resistance at the connection site is kept extremely low. , heat generation due to energization is reduced, and the small stray capacitance contributes to a reduction in delay time, etc., and the drawbacks of conventional connection methods such as wire bonding and TAB methods are solved.

[0007]

[Problems to be Solved by the Invention] Now, in the connection made by the electrical connection member 1 as described above, there is no metal bonding between the electrodes 40, 50 of the electrical circuit components 4, 5 and the conductive members 3, 3... However, since these contact surfaces are generally not clean and are covered with an oxidized or contaminated layer, the electrodes 40, 5 to the conductive members 3, 3.
When pressing 0, it is necessary to apply enough pressure to crush the oxidized and contaminated layers on both surfaces and to enable the new surfaces to come into contact with each other.

For this reason, in the past, for example, as shown in FIG. 6, a screw shaft 6 is rotatably installed on a base 60.
1 with a presser plate 62 screwed together, the base 60 and the presser plate 6
Using a vise-like crimping device 6 whose distance from the screw shaft 61 can be changed according to the rotation of the screw shaft 61, both sides of the electrical connection member 1 are clamped between the electrical circuit components 4 and 5 to be connected. A connection method is adopted in which these are inserted all at once between the base 60 and the presser plate 61, and the screw shaft 62 is rotated to apply pressure to the electric circuit components 4 and 5.

As another connection method, both sides of the electrical connection member 1 are sandwiched between the electrical circuit components 4 and 5 to be connected, and these are heated under pressure to connect the former conductive member 3.
, 3... and the latter electrodes 40, 50 by diffusion bonding.

However, in the former case, a dedicated crimping device 6 is required, and the electrical circuit components 4,
5, and the connection work requires a large amount of man-hours. On the other hand, in the latter method, the required pressure is small, so the electrical circuit components 4,
5. There is no risk of damage and the connection work is facilitated, but in order to obtain a good diffusion bonding condition, the temperature should be 200 to 350℃.
It requires heating to a high temperature range that can reach up to 100%, and there is a risk that the electrical circuit components 4 and 5 may be damaged due to this heating, so it cannot be used for connecting electrical circuit components that are inferior in heat resistance, such as liquid crystal boards. Furthermore, since thermal stress remains in the conductive members 3, 3... after connection, cracks may occur in the conductive members 3, 3... or their holder 2, resulting in increased electrical resistance, poor continuity, etc. There was a risk that this would cause inconvenience.

The present invention has been made in view of the above circumstances, and provides an electrical bonding device that can connect electrical circuit components without requiring pressure using a dedicated crimping device or heating to a high temperature range. An object of the present invention is to provide a connecting member and a connecting method using the same.

0012

[Means for Solving the Problems] An electrical connection member according to a first aspect of the present invention includes a holder made of an insulating material and a plurality of conductive members embedded through the holder on the front and back sides, In the electrical connection member used to establish a connection between electrical circuit components that are pressed against both ends of the conductive member from both sides of the holder, the holder contains a thermosetting adhesive. A second invention of the present invention, which is a connection method using this electrical connection member, is characterized in that after the electrical circuit components to be connected are brought into contact with both surfaces of the holder, the temperature reaches a predetermined temperature. The conductive member and the electric circuit component are bonded by heating the holding body to a temperature of 10.degree. C. and pressing the electric circuit component against the conductive member by curing and shrinking of the adhesive contained in the holder. Further, the electrical connection member according to a third aspect of the present invention is characterized in that a thermosetting adhesive is applied to the front and back surfaces of the holder excluding the ends of the electrically conductive member, and A fourth aspect of the present invention, which is a connection method using a physical connection member, is a method of connecting electrical circuit components to be connected to the adhesive coating layers on both sides of the holder, and then reaching a predetermined temperature. The method is characterized in that the conductive member and the electric circuit component are bonded by heating to a temperature of 10.degree.

[0013]

[Function] In the present invention, the holder that holds the conductive member contains a thermosetting adhesive or has a coating layer of a thermosetting adhesive on both surfaces, When electrical connection members such as The electrical circuit components on both sides of the body are pressed against the conductive member, and a good connection is obtained between the two. The pressure required at this time may be just to maintain contact between the electrical circuit component and the electrical connection member, and the heating required is the temperature at which the adhesive hardens (usually 100 to 2
00°C).

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to drawings showing embodiments thereof. FIG. 1 is a schematic diagram showing the manufacturing process of an electrical connection member according to the first invention of the present invention, and FIG. 2 is a schematic diagram showing the manufacturing process of the electrical connection member according to the third invention of the invention.

When manufacturing the electrical connection member according to the first invention, first, as shown in FIG. 1(a), a metal plate (for example, a copper plate) 10 serving as a base is prepared. A negative type photosensitive polyimide resin 11 containing an adhesive 20 in the form of a large number of capsule-like lumps is applied. As will be described later, this polyimide resin 11 constitutes the holder 2 in the electrical connection member 1, and the coating thickness of the polyimide resin 11 is designed to prevent decreases due to solvent scattering, shrinkage in the subsequent curing process, etc. Taking this into account, the thickness is set to be thicker than the thickness of the holder 2 to be obtained. The adhesive 20 to be contained in the polyimide resin 11 may be any adhesive as long as it has thermosetting properties, such as epoxy, polyester, polyurethane, phenol, resorcinol, urea, etc.
An adhesive resin such as melamine may be used.

Next, the surface of the coating layer of polyimide resin 11 is covered with a photomask (not shown) on which a predetermined pattern is formed, and light is irradiated (exposed) through the photomask, and further development is performed. . As a result, the unexposed parts are removed, and as shown in FIG.
12... are formed.

Thereafter, etching is performed from the surface side of the polyimide resin 11, and the metal plate 10 located below the through holes 12, 12... is etched to form recesses 13, 13 as shown in FIG. 1(c). ... to form. Note that this etching process is performed until the diameter of the recesses 13, 13... becomes slightly larger than the diameter of the through holes 12, 12....

Next, by electroplating using the metal plate 10 as a common electrode, the through holes 12, 12... and the recesses 13,
13... is filled with gold 14. This filling is performed by filling through holes on the surface of the polyimide resin 11, as shown in FIG. 1(d).
Gold 14 is heaped up on the open ends of the holes 12, 12, . . . to a thickness corresponding to the recesses 13, 13, . Note that this electroplating filling is performed using gold (Au).
However, metals such as Ag, Cu, Be, Mo, and Ni, or alloys thereof may also be used.

Finally, the metal plate 10 used as a base is removed by metal etching. As a result, a large number of conductive members 3, 3, etc. made of gold 14 are embedded in a state of insulation from each other in a holding body 2 made of polyimide resin 11, which is an insulating material, and containing an adhesive 20, and both ends of these members are insulated from each other. The electrical connection member 1 according to the first aspect of the present invention, which is exposed on the front and back surfaces of the holder 2, is configured as shown in FIG. 1(e).

On the other hand, the electrical connection member according to the third aspect of the present invention is manufactured as follows. First, as shown in FIG. 2(a), a negative photosensitive polyimide resin 11 is applied onto a metal plate 10 serving as a base. The coating thickness at this time is set to be thicker than the thickness of the holder 2 to be obtained, as described above.

Next, the surface of the coating layer of polyimide resin 11 is exposed to light through a photomask on which a predetermined pattern is formed, and further development is performed to form a large number of through holes 12 that penetrate the coating layer from the front and back. 12... is formed. Thereafter, these are heated to harden the coating layer of the polyimide resin 11 by imidization, and the metal plate 10 located below the through holes 12, 12 is etched from the surface side of this coating layer.
are etched to form recesses 13, 13..., and further electroplated using the metal plate 10 as a common electrode to form through holes 12.
, 12... and the recesses 13, 13... are filled with gold 14. The process from the state shown in FIG. 2(a) to this point is shown in FIGS. 1(b) to 1(b) in manufacturing the electrical connection member 1 according to the first invention.
This is the same as the process d), and illustration thereof is omitted.

Next, the metal plate 10 used as a base is removed by metal etching. As a result, a large number of conductive members 3, 3, etc. made of gold 14 are embedded in the holding body 2 made of polyimide resin 11, which is an insulating material, while being insulated from each other.
The raw product 1', whose both ends are exposed on the front and back surfaces of the holder 2, is constructed as shown in FIG. 2(b). It goes without saying that this raw product 1' corresponds to the conventional electrical connection member 1 shown in FIG.

Next, as shown in FIG. 2(c), a resist layer 15 of an appropriate thickness is formed only on the exposed portions of each conductive member 3 on the front and back surfaces of the holder 2 of this raw product 1'. The formation of such a resist layer 15 is performed using the same procedure as in the case of forming the through holes 12, that is, first, a photosensitive resist agent is applied to the entire surface of the holder 2, and then the surface of this applied layer is coated in a predetermined manner. This is performed by covering with a patterned photomask, exposing through the photomask, developing, and removing the unexposed portions, and the remaining portions become the resist layer 15.

After that, as shown in FIG. 2(d), the holder 2
Adhesive 20 is applied to portions of the front and back surfaces not covered with resist layer 15, and finally resist layer 15 is peeled off. As a result, the holding body 2 holding the conductive members 3, 3...
An electrical connection member 1 according to the third aspect of the present invention is obtained by applying adhesive 20 to a predetermined thickness on the front and back surfaces of the substrate, as shown in FIG. 2(e).

The adhesive 20 applied to the surface of the holder 2 may be any thermosetting adhesive, such as epoxy, polyester, polyurethane, phenol, resorcinol, etc., as described above. Adhesive resins such as urea-based and melamine-based may be used. Also, adhesive 2
0 may be applied to the entire surface of the holder 2, and when the resist layer 15 is peeled off after the application, the adhesive applied to the region where the layer 15 is formed may be removed at the same time.

FIG. 3 is a schematic diagram showing how electrical circuit components are connected by the electrical connection member according to the present invention obtained as described above, and FIG. 3(a) shows the electrical connection member according to the first invention. FIG. 3(b) shows the case where the electrical connection member 1 according to the third invention is used.

Reference numerals 4 and 5 in the figure are electrical circuit components to be connected, and first, as in the conventional case, these electrical circuit components 4 are connected.
. And the first
When using the electrical connection member 1 according to the invention, FIG. 3(a)
As shown in FIG. 3(b), after the electrical circuit components 4 and 5 are brought into contact with both surfaces of the holding body 2, and when using the electrical connection member 1 according to the third invention, the holding body 2 is held as shown in FIG. 3(b). Electric circuit parts 4 are applied to the surface of the adhesive 20, 20 on both sides of the body
5 are brought into contact with each other, and then heated as a whole.

This heating is carried out until the temperature of the adhesive 20 contained in the holder 2 or the adhesive 20 coated on the surface of the holder 2 reaches the curing temperature, whereby the electric circuit components 4 and 5 are heated.
is adhered to the holder 2 or the coating layer of the adhesive 20 on the surface of the holder 2, and at this time, due to curing shrinkage of the adhesive 20 caused by the heating, the electrical connection member 1 according to the first invention As a result of shrinkage of the holder 2 itself and the coating layer of the adhesive 20 in the electrical connection member 1 according to the third invention, the electrodes 40 and 50 of the electrical circuit components 4 and 5 are brought into alignment with each other. The electrodes 40, 50 are pressed against the end surfaces of certain conductive members 3, 3..., and a good metal bonding state is obtained between the two by this pressing.
That is, the electric circuit components 4 and 5 are electrically connected via the conductive members 3, 3, . . . .

In the connection method according to the present invention carried out in this manner, the electric circuit components 4 and 5 are pressurized to maintain contact between them and the holder 2, and the adhesive 20 is hardened. Since the curing temperature of the thermosetting adhesive is usually about 100 to 200°C, this heating and the pressurization cause the electric circuit components 4 and 5 and the holder 2 to be heated. Since there is little risk of damage to the conductive members 3, 3, . . . and the thermal stress generated in the conductive members 3, 3, .

[0030] Also, the electrical circuit components 4 and 5 after connection
and the electrical connection member 1 include not only the bonding force between the electrodes 40, 50 and the conductive members 3, 3... but also the electrical circuit components 4,
The adhesive force between the entire body 5 and the holder 2 also provides the additional advantage of a very high connection strength.

[0031]

Effects of the Invention As detailed above, in the electrical connection member according to the present invention, the holder for embedding and holding the conductive member contains a thermosetting adhesive or has a coating layer of a thermosetting adhesive. The method for connecting electrical circuit components according to the present invention using these electrical connection members includes stacking the electrical circuit components to be connected on both sides of the holder and heating them; In this method, the electrical circuit component is pressed against the conductive member by contraction of the holder itself or the coating layer as the adhesive hardens, and at this time, a slight pressure is applied to maintain the contact, and the adhesive is Since only heating is required to achieve the curing temperature, there is no need for special equipment, and there is little risk that the pressurization and heating will damage the electrical circuit components and electrical connection members, and the In addition to realizing a good connection state, the thermal stress generated in the conductive member is also reduced, which effectively prevents the occurrence of poor continuity and increase in electrical resistance after connection, and also improves the heat resistance of liquid crystal substrates, etc. The present invention has excellent effects such as easy connection of inferior electric circuit components.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing a manufacturing process of an electrical connection member according to a first aspect of the present invention.

FIG. 2 is a schematic diagram showing a manufacturing process of an electrical connection member according to a third aspect of the present invention.

FIG. 3 is an explanatory diagram of a method for connecting electrical circuit components using an electrical connection member according to the present invention.

FIG. 4 is a longitudinal cross-sectional view of a conventional electrical connection member.

FIG. 5 is a schematic diagram showing how electrical circuit components are connected by a conventional electrical connection member.

FIG. 6 is an explanatory diagram of a method for connecting electrical circuit components using a conventional electrical connection member.

[Explanation of symbols]

1 Electrical connection member 2 Holding body 3 Conductive member 4 Electric circuit parts 5 Electric circuit parts 20 Adhesive 40 Electrode 50 Electrode

Claims (4)

[Claims] 1. An electric circuit comprising a holder made of an insulating material and a plurality of electrically conductive members embedded through the holder on the front and back sides, the electrical circuit being press-contacted to both ends of the electrically conductive members from both the front and back sides of the holder, respectively. An electrical connection member used to establish a connection between parts, wherein the holder contains a thermosetting adhesive. 2. A method for connecting electrical circuit components using the electrical connection member according to claim 1, wherein the electrical circuit components to be connected are brought into contact with both surfaces of the holder and then brought to a predetermined temperature. connection of electrical circuit components, characterized in that the electrical circuit component is heated to 100°C and the electrical circuit component is pressed against the conductive member by curing and shrinking of the adhesive contained in the holder, thereby joining the conductive member and the electrical circuit component. Method. 3. An electric circuit comprising a holder made of an insulating material and a plurality of electrically conductive members embedded through the holder on the front and back sides, the electrical circuit being brought into contact with both ends of the electrically conductive members from both the front and back surfaces of the holder. An electrical connection member used to establish a connection between parts, characterized in that a thermosetting adhesive is applied to the front and back surfaces of the holder excluding the ends of the conductive member. Element. 4. A method for connecting electrical circuit components using an electrical connection member according to claim 3, wherein the electrical circuit components to be connected are brought into contact with the coating layers of the adhesive on both surfaces of the holder, respectively. After that, heat it to a specified temperature,
A method for connecting electrical circuit components, characterized in that the electrical circuit component is pressed against the electrically conductive member by curing and shrinking of the coating layer, thereby joining the electrical circuit component to the electrically conductive member.