JPH04268205A - Production of thin-film magnetic head - Google Patents
Production of thin-film magnetic headInfo
- Publication number
- JPH04268205A JPH04268205A JP2989391A JP2989391A JPH04268205A JP H04268205 A JPH04268205 A JP H04268205A JP 2989391 A JP2989391 A JP 2989391A JP 2989391 A JP2989391 A JP 2989391A JP H04268205 A JPH04268205 A JP H04268205A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic layer
- film
- thin
- magnetic head
- upper magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000010408 film Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000007747 plating Methods 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 14
- 239000000956 alloy Substances 0.000 claims abstract description 14
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 12
- 238000003486 chemical etching Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000001312 dry etching Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 238000000992 sputter etching Methods 0.000 abstract description 21
- 238000001035 drying Methods 0.000 abstract description 5
- 230000007423 decrease Effects 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 59
- 239000000463 material Substances 0.000 description 13
- 238000000151 deposition Methods 0.000 description 12
- 238000004544 sputter deposition Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000005347 demagnetization Effects 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 235000019395 ammonium persulphate Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は薄膜磁気ヘッドの製造方
法に関し、特に磁路を形成している磁性層を歩留りよく
形成できる薄膜磁気ヘッドの製造方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thin film magnetic head, and more particularly to a method for manufacturing a thin film magnetic head in which a magnetic layer forming a magnetic path can be formed with a high yield.
【０００２】0002
【従来の技術】従来、薄膜磁気ヘッドは、磁束を伝達す
る磁気コアの厚みが数μ程度のＦｅ−Ｎｉ合金の磁性層
で構成されており、バルクタイプに比べ低インダクタン
スにできることが特徴の一つであるが、磁性層の形状や
軟磁気特性が、ヘッドの電磁変換特性に大きな影響を与
えるという欠点があった。磁性層の被着方法として、蒸
着法、電解メッキ法、スパッタ法等があるが、磁性層の
膜組成を容易に制御でき、ばらつきを少なく出来ること
や膜の結晶性が良いことから主にスパッタ法が用いられ
ている。[Prior Art] Conventionally, a thin-film magnetic head has a magnetic core that transmits magnetic flux and is composed of a magnetic layer made of an Fe-Ni alloy with a thickness of about several micrometers, and one of its characteristics is that it can have a lower inductance than a bulk type. However, it has the drawback that the shape and soft magnetic properties of the magnetic layer have a large effect on the electromagnetic conversion characteristics of the head. There are vapor deposition methods, electrolytic plating methods, sputtering methods, etc. as methods for depositing the magnetic layer, but sputtering is mainly used because the film composition of the magnetic layer can be easily controlled, variations can be reduced, and the film has good crystallinity. law is used.
【０００３】スパッタ法で成膜したＦｅ−Ｎｉ合金磁性
層をイオンミリング装置によりエッチングを行うと、エ
ッチングされた被エッチング物がＦｅ−Ｎｉ合金磁性層
が形成しようとしているパターンの側壁に付着すること
が多い（以後再付着と称する）。When a Fe-Ni alloy magnetic layer formed by sputtering is etched using an ion milling device, the etched object may adhere to the sidewall of the pattern that the Fe-Ni alloy magnetic layer is trying to form. (hereinafter referred to as reattachment).
【０００４】以下、従来の薄膜磁気ヘッドについて説明
する。図５は上部磁性層被着形成後の従来の薄膜磁気ヘ
ッドの断面図であり、図６は製造過程で露光、現像した
後の従来の薄膜磁気ヘッドの断面図であり、図７は従来
の薄膜磁気ヘッドの磁気記録媒体対向面側からみた正面
図である。A conventional thin film magnetic head will be explained below. FIG. 5 is a cross-sectional view of a conventional thin-film magnetic head after the upper magnetic layer has been deposited, FIG. 6 is a cross-sectional view of a conventional thin-film magnetic head after exposure and development in the manufacturing process, and FIG. FIG. 2 is a front view of the thin-film magnetic head seen from the side facing the magnetic recording medium.
【０００５】１は基板、２は下部磁性層、３はギャップ
層、４は絶縁層、５はコイル、６は第１上部磁性層、７
は第２上部磁性層、８はマスク用のレジスト、１０は保
護層、１４は再付着物である。1 is a substrate, 2 is a lower magnetic layer, 3 is a gap layer, 4 is an insulating layer, 5 is a coil, 6 is a first upper magnetic layer, 7
8 is a second upper magnetic layer, 8 is a resist for a mask, 10 is a protective layer, and 14 is a redeposited substance.
【０００６】以上のように構成された従来の薄膜磁気ヘ
ッドについて、以下そのドライプロセスによる上部磁性
層の形成方法を説明する。In the conventional thin film magnetic head constructed as described above, a method of forming the upper magnetic layer by a dry process will be described below.
【０００７】図６において、第１上部磁性層６を常法で
形成した後、第２上部磁性層７を３〜４μ被着する。次
いで、マスク用レジスト８を塗付、露光、現像を行って
エッチング用マスクを形成する。この時平坦な段差上の
厚みｔ９と、フロントギャップ層近傍の斜面部の厚みｔ
７、ｔ８とは同一の厚みとはならずｔ９の方がｔ７、ｔ
８よりも厚くなる。その後イオンミリング装置を用いて
入射角θ９にてエッチングを行う。θは通常０°〜３０
°の範囲である。次にマスク用レジスト８を除去する。
しかし、ｔ９がｔ７、ｔ８よりも厚いため、磁気媒体対
向面側の第２磁性層７の厚みｔ５の方が、フロントギャ
ップ層近傍の斜面部の第２磁性層７の厚みｔ６よりも厚
くなる傾向がある。またマスク用レジスト８とＦｅ−Ｎ
ｉ合金よりなる第２上部磁性層７とはエッチングレート
が違うため再付着現象が発生すると、図７に示すように
トラック上部方向に角状の再付着物が形成されていた。In FIG. 6, after a first upper magnetic layer 6 is formed by a conventional method, a second upper magnetic layer 7 is deposited to a thickness of 3 to 4 μm. Next, a mask resist 8 is applied, exposed, and developed to form an etching mask. At this time, the thickness t9 on the flat step and the thickness t on the slope near the front gap layer
7, t8 are not the same thickness, and t9 is thicker than t7, t.
It becomes thicker than 8. Thereafter, etching is performed using an ion milling device at an incident angle θ9. θ is usually 0°~30
It is in the range of °. Next, the mask resist 8 is removed. However, since t9 is thicker than t7 and t8, the thickness t5 of the second magnetic layer 7 on the side facing the magnetic medium is thicker than the thickness t6 of the second magnetic layer 7 on the slope near the front gap layer. Tend. Also, mask resist 8 and Fe-N
Since the etching rate was different from that of the second upper magnetic layer 7 made of i alloy, when the re-deposition phenomenon occurred, angular re-deposition was formed in the upper direction of the track as shown in FIG.
【０００８】次に、再付着の機構を図面を参照しながら
説明する。図８はイオンミリング法における再付着現象
を説明するための模式図である。Next, the reattachment mechanism will be explained with reference to the drawings. FIG. 8 is a schematic diagram for explaining the redeposition phenomenon in the ion milling method.
【０００９】１１は被エッチング物、１２はマスク材、
１３はＡｒ＋の入射方向、１４は再付着物、１５は被エ
ッチング物の再付着方向である。11 is an object to be etched, 12 is a mask material,
13 is the direction of incidence of Ar+, 14 is the redeposited substance, and 15 is the redeposited direction of the etched substance.
【００１０】図８（ａ）に示すように被エッチング物１
１の上にマスク材１２を形成し、１３の矢印のような角
度でイオンミリングを行う。そうするとマスク材１２の
側面付近でエッチングされた被エッチング物は、図８（
ｂ）に示すようにマスク材１２の側面に付着し、エッチ
ング終了時には図８（ｃ）に示すようにマスク材１２の
側面に再付着物１４が形成され、マスク材１２を除去す
ると図８（ｄ）に示すように被エッチング物の上に角状
の再付着物１４が残存していた。As shown in FIG. 8(a), the object to be etched 1
A mask material 12 is formed on 1, and ion milling is performed at an angle as indicated by an arrow 13. Then, the object to be etched near the side surface of the mask material 12 will be removed as shown in FIG.
As shown in FIG. 8(b), the deposits 14 adhere to the side surfaces of the mask material 12, and when etching is completed, redeposit 14 is formed on the side surfaces of the mask material 12 as shown in FIG. 8(c), and when the mask material 12 is removed, As shown in d), angular redeposit 14 remained on the object to be etched.
【００１１】[0011]
【発明が解決しようとする課題】しかしながら上記従来
のドライプロセスによる上部磁性層の形成による薄膜磁
気ヘッドの製造方法では、図５に示すように、媒体対向
面側の第２上部磁性層７の厚みｔ５が、フロントギャッ
プ層近傍の７の上部磁性層の厚みｔ６よりも厚くなるた
め、記録動作を行う際、厚みの薄い部分で過飽和を起こ
し、記録減磁を引起し、高周波領域での出力の低下やオ
ーバーライトの低下を招きやすいという問題点があった
。また、図７に示すように媒体対向面側から見ると再付
着現象のため角状の再付着物が生じるという問題点があ
った。However, in the method of manufacturing a thin film magnetic head by forming the upper magnetic layer by the conventional dry process described above, as shown in FIG. Since t5 is thicker than the thickness t6 of the upper magnetic layer 7 near the front gap layer, during recording operation, supersaturation occurs in the thin part, causing recording demagnetization, and reducing the output in the high frequency region. There has been a problem in that it tends to cause a decrease in overwriting and a decrease in overwriting. Further, as shown in FIG. 7, when viewed from the medium facing surface side, there is a problem in that angular redeposited matter is generated due to the redeposition phenomenon.
【００１２】本発明は上記従来の問題点を解決するもの
で、ドライプロセスで薄膜磁気ヘッドの磁性層を形成す
る場合において、磁性層の厚みのバラツキを小さくし高
い歩留りを得られる薄膜磁気ヘッドの製造方法を提供す
ることを目的とする。The present invention solves the above-mentioned conventional problems, and provides a thin-film magnetic head that can reduce variations in the thickness of the magnetic layer and obtain a high yield when forming the magnetic layer of the thin-film magnetic head using a dry process. The purpose is to provide a manufacturing method.
【００１３】[0013]
【課題を解決するための手段】本発明は、Ｆｅ−Ｎｉ合
金からなる第２上部磁性層の形成方法をイオンミリング
でエッチングする際のマスク用レジストに換えて、Ｆｅ
−Ｎｉ合金を銅薄膜を電極として、メッキ膜を形成し、
これをマスクにして第２上部磁性層をイオンミリングに
てエッチングし、その後ケミカルエッチングにて前記銅
薄膜を除去するようにした構成を有している。[Means for Solving the Problems] The present invention provides a method for forming a second upper magnetic layer made of an Fe-Ni alloy by using a Fe-Ni alloy instead of a resist for a mask when etching by ion milling.
- Forming a plating film using a Ni alloy with a copper thin film as an electrode,
Using this as a mask, the second upper magnetic layer is etched by ion milling, and then the copper thin film is removed by chemical etching.
【００１４】[0014]
【作用】この構成により、Ｆｅ−Ｎｉ合金メッキ膜をＦ
ｅ−Ｎｉ合金で形成されている上部磁性層のエッチング
マスクとして使用することによりマスクの厚みが、段差
上でも斜面上でもほぼ均一な厚みとして得られるため、
イオンミリングによるエッチング時に第２上部磁性層の
厚みは、平坦部でも斜面部でも略均一となる。またエッ
チングマスク（前記メッキ膜）と被エッチング物（前記
第２上部磁性層）の材質は略同じであるため、エッチン
グレートが同程度でよく、再付着が起こってもマスクと
ともにエッチングされていくため角状の再付着物の生成
を防止できる。[Operation] With this configuration, the Fe-Ni alloy plating film is
By using it as an etching mask for the upper magnetic layer made of e-Ni alloy, the thickness of the mask can be almost uniform even on steps and slopes.
During etching by ion milling, the thickness of the second upper magnetic layer becomes substantially uniform on both the flat portion and the sloped portion. Furthermore, since the materials of the etching mask (the plated film) and the object to be etched (the second upper magnetic layer) are approximately the same, the etching rate may be the same, and even if re-deposition occurs, the material will be etched together with the mask. The formation of angular re-deposition can be prevented.
【００１５】[0015]
【実施例】以下本発明の一実施例について、図面を参照
しながら説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【００１６】図１は本発明の一実施例における薄膜磁気
ヘッドの断面図であり、図２は本発明の第２上部磁性層
が形成された薄膜磁気ヘッドの断面図であり、図３は図
２の薄膜磁気ヘッドの磁気媒体対向面側からの正面図で
あり、図４はイオンミリングによる銅薄膜が露出した状
態を示す薄膜磁気ヘッドの断面図である。FIG. 1 is a cross-sectional view of a thin-film magnetic head according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a thin-film magnetic head on which a second upper magnetic layer of the present invention is formed, and FIG. FIG. 4 is a front view of the thin film magnetic head No. 2 from the side facing the magnetic medium, and FIG. 4 is a cross-sectional view of the thin film magnetic head showing a state in which a thin copper film formed by ion milling is exposed.
【００１７】１は基板、２は下部磁性層、３はギャップ
層、４は絶縁層、５はコイル、６は第１上部磁性層、７
は第２上部磁性層、９はイオンミリング時のＡｒ＋の入
射方向であり、これらは従来例と同様のものであるので
同一番号を付し説明を省略する。１６は銅薄膜、１７は
マスクとなるメッキ膜である。図１は第２上部磁性層７
の面に銅薄膜１６を形成し、次いで、銅薄膜１６上にマ
スクとなるメッキ膜９を選択的にメッキしたところを示
している。1 is a substrate, 2 is a lower magnetic layer, 3 is a gap layer, 4 is an insulating layer, 5 is a coil, 6 is a first upper magnetic layer, 7
9 is the second upper magnetic layer, and 9 is the incident direction of Ar+ during ion milling. Since these are the same as in the conventional example, they are given the same numbers and their explanation will be omitted. 16 is a copper thin film, and 17 is a plating film serving as a mask. FIG. 1 shows the second upper magnetic layer 7.
A copper thin film 16 is formed on the surface of the copper thin film 16, and then a plating film 9 serving as a mask is selectively plated on the copper thin film 16.
【００１８】図２は図１よりメッキ膜１７をマスクにイ
オンミリングにて第２上部磁性層７をエッチングした後
、銅薄膜１６をケミカルエッチャントで取り去り、メッ
キ膜１７の残りをリフトオフし第２上部磁性層７が形成
されたところを示している。FIG. 2 shows, as shown in FIG. 1, the second upper magnetic layer 7 is etched by ion milling using the plating film 17 as a mask, the copper thin film 16 is removed with a chemical etchant, and the remaining plating film 17 is lifted off to form the second upper magnetic layer 7. It shows the state where the magnetic layer 7 has been formed.
【００１９】図４は図２の断面図よりメッキ膜１７をマ
スクにして第２上部磁性層７をイオンミリングしてフロ
ントギャップ近傍の斜面に電極である銅薄膜１６が露出
したところを示している。FIG. 4 shows a cross-sectional view of FIG. 2 in which the second upper magnetic layer 7 is ion-milled using the plating film 17 as a mask, and the copper thin film 16 serving as an electrode is exposed on the slope near the front gap. .
【００２０】次に本発明の薄膜磁気ヘッドの製造方法に
ついて詳細に説明する。図１に示すように第１上部磁性
層６をスパッタ法で被着しレジストマスクで所望のパタ
ーンを形成した後、第２上部磁性層７をスパッタ法で３
〜４μｍ被着する。次いで、その上に銅薄膜１６をスパ
ッタ法にて０．５〜１μｍ被着する。それからレジスト
を塗付し、露光、現像して上部磁性層のパターンを形成
した後、メッキ法にて３〜４μｍ膜厚のＦｅ−Ｎｉ合金
を被着する。そしてイオンミリング装置で、前記メッキ
膜をマスクにして第２上部磁性層７をエッチングする。
この時、メッキ膜１７の厚みを上部磁性層７のスパッタ
時の厚みと同じくらいか、やや厚めに設定しておけばミ
リング時には、第２上部磁性層７がない箇所のＦｅ−Ｎ
ｉ合金スパッタ膜がマスク材であるメッキ膜１７より先
に除去される。そして図４に示すようにイオンミリング
時に上部磁性層７上の銅薄膜１６が表面に露出した時点
でミリングをストップして、（ＮＨ４）２Ｓ２Ｏ８＋Ｎ
ａＣｌ＋ＮａＯＨ溶液等でＦｅ−Ｎｉ合金をエッチング
しないエッチャントでケミカルエッチングするとメッキ
膜１７はリフトオフされる。銅薄膜１６はイオンミリン
グ時のエンドポイント検出とメッキ膜１７のリフトオフ
のために必要である。そして前記メッキ膜１７と被エッ
チング物となる第２上部磁性層７は同質のものであるた
め、エッチングレートはほぼ同じであるから、マスク材
の側面に再付着してもマスク材とともにエッチングされ
ていくので再付着現象が起きて角状の再付着物を生じた
りすることはなく図３に示すような正常な磁気媒体対向
面形状となる。このようにして、イオンミリング後に銅
薄膜１６をケミカルエッチングして取り去ったときの第
２上部磁性層７の磁気媒体対向面側の厚みｔ１とフロン
トギャップ近傍の斜面部の厚みｔ２とはほぼ同じ厚みと
なり、安定した磁気特性が得られる。Next, the method for manufacturing the thin film magnetic head of the present invention will be explained in detail. As shown in FIG. 1, after depositing the first upper magnetic layer 6 by sputtering and forming a desired pattern using a resist mask, the second upper magnetic layer 7 is deposited by sputtering.
~4μm deposits. Next, a thin copper film 16 of 0.5 to 1 μm is deposited thereon by sputtering. Then, a resist is applied, exposed and developed to form a pattern for the upper magnetic layer, and then a Fe--Ni alloy with a thickness of 3 to 4 μm is deposited by plating. Then, the second upper magnetic layer 7 is etched using an ion milling device using the plating film as a mask. At this time, if the thickness of the plating film 17 is set to be the same as the thickness of the upper magnetic layer 7 during sputtering, or slightly thicker, then during milling, the Fe-N
The i-alloy sputtered film is removed before the plating film 17, which is a mask material, is removed. As shown in FIG. 4, when the copper thin film 16 on the upper magnetic layer 7 is exposed to the surface during ion milling, milling is stopped and (NH4)2S2O8+N
When chemical etching is performed using an etchant that does not etch the Fe-Ni alloy, such as aCl+NaOH solution, the plating film 17 is lifted off. The copper thin film 16 is necessary for end point detection and lift-off of the plating film 17 during ion milling. Since the plating film 17 and the second upper magnetic layer 7, which is the object to be etched, are of the same quality, the etching rate is almost the same, so even if the plated film 17 is reattached to the side surface of the mask material, it will not be etched together with the mask material. As a result, the re-deposition phenomenon does not occur and angular re-deposition occurs, and the surface facing the magnetic medium has a normal shape as shown in FIG. 3. In this way, when the copper thin film 16 is removed by chemical etching after ion milling, the thickness t1 of the second upper magnetic layer 7 on the surface facing the magnetic medium is approximately the same as the thickness t2 of the sloped portion near the front gap. Therefore, stable magnetic properties can be obtained.
【００２１】[0021]
【発明の効果】以上のように本発明は、ドライプロセス
での上部磁性層の形成方法を用いることにより、角状の
再付着物が生成しない安定した形状をもつ上部磁性層を
形成でき、また、高周波領域における出力の低下やヘッ
ドの飽和に起因する記録減磁によるオーバーライトの不
良のない歩留りを向上させた優れた薄膜磁気ヘッドの製
造方法を実現できるものである。As described above, the present invention makes it possible to form an upper magnetic layer with a stable shape in which no angular redeposit is generated by using a dry process method for forming the upper magnetic layer. Accordingly, it is possible to realize an excellent method of manufacturing a thin film magnetic head that improves the yield without overwriting defects due to recording demagnetization caused by a decrease in output in a high frequency region or saturation of the head.
【図１】本発明の一実施例における薄膜磁気ヘッドの断
面図FIG. 1 is a cross-sectional view of a thin film magnetic head in an embodiment of the present invention.
【図２】本発明の第２上部磁性層が形成された薄膜磁気
ヘッドの断面図FIG. 2 is a cross-sectional view of a thin film magnetic head in which a second upper magnetic layer of the present invention is formed.
【図３】薄膜磁気ヘッドの磁気媒体対向面側からの正面
図[Figure 3] Front view of the thin-film magnetic head from the side facing the magnetic medium
【図４】イオンミリングによる銅薄膜が露出した状態を
示す薄膜磁気ヘッドの断面図[Figure 4] A cross-sectional view of a thin-film magnetic head showing a copper thin film exposed by ion milling.
【図５】従来の上部磁性層被着形成後の薄膜磁気ヘッド
の断面図[Fig. 5] Cross-sectional view of a conventional thin film magnetic head after deposition of the upper magnetic layer
【図６】従来の製造過程における露光・現像後の薄膜磁
気ヘッドの断面図[Figure 6] Cross-sectional view of a thin film magnetic head after exposure and development in the conventional manufacturing process
【図７】従来の薄膜磁気ヘッドの磁気記録媒体対向面側
からみた正面図[Fig. 7] Front view of a conventional thin-film magnetic head seen from the side facing the magnetic recording medium.
【図８】（ａ）はイオンミリング法における再付着現象
を説明するための模式図
（ｂ）はイオンミリング法における再付着現象を説明す
るための模式図
（ｃ）はイオンミリング法における再付着現象を説明す
るための模式図
（ｄ）はイオンミリング法における再付着現象を説明す
るための模式図[Figure 8] (a) is a schematic diagram for explaining the re-deposition phenomenon in the ion milling method. (b) is a schematic diagram for explaining the re-deposition phenomenon in the ion milling method. (c) is a schematic diagram for explaining the re-deposition phenomenon in the ion milling method. Schematic diagram (d) to explain the phenomenon is a schematic diagram to explain the redeposition phenomenon in the ion milling method.
１ 基板
２ 下部磁性層
３ ギャップ層
４ 絶縁層
５ コイル
６ 第１上部磁性層
７ 第２上部磁性層
８ マスク用レジスト
９ イオンミリング時のＡｒ＋の入射方向１０ 保
護層
１１ 被エッチング物
１２ マスク材
１３ Ａｒ＋の入射方向
１４ 再付着物
１５ 被エッチング物の再付着方向1 Substrate 2 Lower magnetic layer 3 Gap layer 4 Insulating layer 5 Coil 6 First upper magnetic layer 7 Second upper magnetic layer 8 Mask resist 9 Incident direction of Ar+ during ion milling 10 Protective layer 11 Etched object 12 Mask material 13 Ar+ incident direction 14 Redeposited matter 15 Redeposited direction of etched material
Claims (1)
層、ギャップ層、コイル、絶縁層、Ｆｅ−Ｎｉ合金から
なる第１上部磁性層、Ｆｅ−Ｎｉ合金からなる第２上部
磁性層、保護膜が形成されてなる薄膜磁気ヘッドの製造
方法であって、第２上部磁性層上に銅薄膜を電極にして
Ｆｅ−Ｎｉ合金メッキ膜を形成し、前記メッキ膜をマス
クとしてドライエッチングを行い、次いで、前記銅薄膜
をケミカルエッチングによりエッチングして前記メッキ
膜を除去して第２上部磁性層を形成することを特徴とす
る薄膜磁気ヘッドの製造方法。1. A lower magnetic layer made of an Fe-Ni alloy, a gap layer, a coil, an insulating layer, a first upper magnetic layer made of an Fe-Ni alloy, a second upper magnetic layer made of an Fe-Ni alloy on a substrate, A method for manufacturing a thin-film magnetic head on which a protective film is formed, the method comprising forming an Fe-Ni alloy plating film on a second upper magnetic layer using a copper thin film as an electrode, and performing dry etching using the plating film as a mask. A method for manufacturing a thin film magnetic head, comprising: then etching the copper thin film by chemical etching to remove the plating film to form a second upper magnetic layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2989391A JPH04268205A (en) | 1991-02-25 | 1991-02-25 | Production of thin-film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2989391A JPH04268205A (en) | 1991-02-25 | 1991-02-25 | Production of thin-film magnetic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04268205A true JPH04268205A (en) | 1992-09-24 |
Family
ID=12288654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2989391A Pending JPH04268205A (en) | 1991-02-25 | 1991-02-25 | Production of thin-film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04268205A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7554764B2 (en) | 2006-04-07 | 2009-06-30 | Hitachi Global Storage Technologies Netherlands B.V. | Lift-off method for forming write pole of a magnetic write head and write pole formed thereby |
-
1991
- 1991-02-25 JP JP2989391A patent/JPH04268205A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7554764B2 (en) | 2006-04-07 | 2009-06-30 | Hitachi Global Storage Technologies Netherlands B.V. | Lift-off method for forming write pole of a magnetic write head and write pole formed thereby |
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