JPH0426780A - Masking method for curved surface etching - Google Patents

Abstract

PURPOSE:To transfer a sharp image to a work piece and to facilitate curved surface etching by applying a resist to a work piece having curved surface and ruggedness, applying printing to the above surface, and using the above as a masking. CONSTITUTION:An ultraviolet-setting negative-positive process photoresist 2 is applied to a work piece 1 having curved surface and ruggedness by means of a centrifugal separator and is then dried by means of a drier. Subsequently, the desired printing 3, such as figure, picture, and pattern, is printed on the resist 2 with black ink by using a printing press. After the above surface is irradiated with ultraviolet rays, this work piece 1 is immersed into a resist developing solution and the printed part and the resist 2 unexposed to ultraviolet rays are peeled, and etching is applied to the work piece 1 having curved surface and rugged surface. Further, etching is exerted after printing and resist peeling, and plating can be applied to the resulting etched pits by performing etching treatment in the above state, by which the variety of ornaments can be provided.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to masking in etching of a curved or uneven portion of a workpiece having a curved surface or uneven surface.

[Summary of the invention]

The present invention applies a resist to a workpiece with a curved or uneven surface and prints on it as masking, thereby transferring a sharp image onto the workpiece. Curved surface etching, which was considered difficult with conventional techniques, is possible. This made processing easier.

[Conventional technology]

As is well known, the conventional masking method in etching processing involves applying UV-curable negative and positive resists to the surface of the workpiece, drying them, and then applying a developed film with the desired characters, pictures, etc. as a masking layer. In this method, the resist is developed by installing it and irradiating it with ultraviolet rays. .

In conventional methods, if the work surface is flat, images such as letters and pictures drawn on the film can be transferred to the resist without being disturbed during the ultraviolet irradiation step.

[Problem to be solved by the invention]

However, if the workpiece has a curved or uneven surface and a conventional film mask is used, steps will be created on the workpiece surface and the image drawn on the film during ultraviolet irradiation will be distorted, making it difficult to obtain the desired text or picture. I couldn't. Therefore, it has not been easy to perform sowing on curved or uneven surfaces.

[Means to solve the problem]

In order to solve the above problem, we decided to use printing as a means to replace the conventional film mask. UV-curable negative and positive resists are applied to curved and uneven surfaces in the same way as before, and after drying, the necessary letters and pictures are printed by applying printing ink on top of the resist, and this printing blocks UV irradiation. This method prevents the resist from hardening, and then uses conventional resist development to mask the etching process.

[Effect]

By using the masking method configured as described above, it is possible to transfer arbitrary numbers or pictures onto the workpiece even if the surface is curved or uneven, and it is possible to perform sharp etching processing without blurring.

〔Example〕

Embodiments of the present invention will be described below based on the drawings.

1, 2, and 3 do not show cross-sectional views of the present invention. 1st
In the figure, a UV-curable negative and positive resist 2 is applied to a workpiece with a curved surface and uneven surfaces using a centrifugal separator and then dried using a dryer. Next, a printing machine is used to print desired numbers, pictures, patterns, etc. on the resist 2. The ink used for printing is black, which is effective in preventing the resist from curing when exposed to ultraviolet light. In FIG. 2, the workpiece shown in FIG. 1 is irradiated with ultraviolet rays and then soaked in a predetermined resist developer for a predetermined period of time. In this state, the printed portion and the resist that has not been exposed to ultraviolet light are peeled off. As a result, it is possible to perform etching on a workpiece having a curved surface and an uneven surface as shown in FIG. Furthermore, by etching after printing and removing the resist as shown in Figure 2, and plating in this state, plating can be applied to the etched recesses, and it can be used as a variety of decorative items. .

〔Effect of the invention〕

As explained above, the present invention makes it possible to perform etching on curved and uneven surfaces, which was considered difficult with the prior art, by masking resist and printing on a workpiece that has a curved or uneven surface.

[Brief explanation of drawings]

1, 2 and 3 show cross-sectional views of the invention. 1...Work 2...Resist 3...Print that's all Applicant: Seiko Electronics Industries Co., Ltd. Agent: Patent Attorney Takayoshi Hayashi

Claims (1)

[Claims] The process consists of a process of applying resist to a workpiece with a curved or uneven surface, a process of masking by printing numbers, pictures, patterns, etc. on the resist, and a process of peeling off the resist in the masked area. A characteristic masking method for curved surface etching processing.