JPH0319889A - Printing method of very fine patterns - Google Patents
Printing method of very fine patternsInfo
- Publication number
- JPH0319889A JPH0319889A JP15384289A JP15384289A JPH0319889A JP H0319889 A JPH0319889 A JP H0319889A JP 15384289 A JP15384289 A JP 15384289A JP 15384289 A JP15384289 A JP 15384289A JP H0319889 A JPH0319889 A JP H0319889A
- Authority
- JP
- Japan
- Prior art keywords
- ink
- printing
- plate
- intaglio
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007639 printing Methods 0.000 title claims abstract description 120
- 238000000034 method Methods 0.000 title claims description 71
- 239000002344 surface layer Substances 0.000 claims abstract description 45
- 230000005855 radiation Effects 0.000 claims abstract description 4
- 238000000059 patterning Methods 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 40
- 239000011521 glass Substances 0.000 claims description 29
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 238000006116 polymerization reaction Methods 0.000 claims description 23
- 239000012298 atmosphere Substances 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 21
- 239000010410 layer Substances 0.000 claims description 19
- 239000003112 inhibitor Substances 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 16
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 10
- 229920002554 vinyl polymer Polymers 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000001459 lithography Methods 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 168
- 230000008569 process Effects 0.000 description 18
- 239000000758 substrate Substances 0.000 description 17
- 239000010408 film Substances 0.000 description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 230000003993 interaction Effects 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007645 offset printing Methods 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- -1 copper Chemical class 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- BJEMXPVDXFSROA-UHFFFAOYSA-N 3-butylbenzene-1,2-diol Chemical compound CCCCC1=CC=CC(O)=C1O BJEMXPVDXFSROA-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000207199 Citrus Species 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 235000020971 citrus fruits Nutrition 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Landscapes
- Printing Methods (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は微細パターン形成を印刷手段にて行う微細パタ
ーンの印刷方法に係わり、例えば電子部品に供給する微
細回路や素子パターンなどの微細レジストパターンを高
精度で且つ量産的に形成するに好適な印刷方法に関する
。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a fine pattern printing method in which fine pattern formation is performed by printing means, and includes, for example, fine resist patterns such as fine circuits and element patterns to be supplied to electronic components. The present invention relates to a printing method suitable for forming with high precision and mass production.
従来より印刷配線やガラス、セラミンク板上の回路パタ
ーンの形rIi.或いは金属版の食刻用レジストパター
ンの形成などに際しては、スクリーン印刷法やオフセッ
ト印刷法のような印刷手段が広く採用されている,しか
し、これらの印刷手段は比較的画線中の大きい(200
μm以上)パターン形或には適していたが、画線幅がそ
れ以下の微細なパターン形成には不向きであるというの
が現状であった。しかも、印刷されるパターンはインキ
の流動性、版の圧力などの影響やインキの一部が転移し
ないで版に残留する等により変形したものとなってしま
い、印刷パターンの再現性に劣るという欠点もあった。Conventionally, printed wiring, glass, and circuit patterns on ceramic boards have been printed in the form of rIi. Alternatively, printing methods such as screen printing and offset printing are widely used to form etching resist patterns on metal plates. However, these printing methods have relatively large print lines (200
However, the current situation is that it is not suitable for forming fine patterns with a line width of less than that (μm or more). Moreover, the printed pattern is deformed due to the influence of the fluidity of the ink, the pressure of the plate, and some of the ink remains on the plate without being transferred, resulting in poor reproducibility of the printed pattern. There was also.
例えば、スクリーン印刷法はメッシュ状スクリーンにイ
ンキ遮蔽マスクを形成し、該マスクの非マスク部を所望
のパターンとし、非マスク部からインキを通過させて被
印刷体に付着させて印刷を行うものであるが、この印刷
法ではインキの厚刷り(数μm〜20μm厚)が容易な
ために耐訛性の優れたレジストパターンの印刷が可能な
ものの、実用印刷線中が最小のものでも200μm程度
が限界であるために?!!雑微細なパターンの印刷を行
うのは困難であった.
またオフセット印刷法はPS版(Presensiti
scdPlate)に親油性部と親水性部を形成し、親
水性部に水分を保持させて柚性インキを反発させ、親油
性部のみに選択的にインキを付着させ、かかるインキパ
ターンを被印刷体に印刷する方法であり、特に印刷適性
を上げるためにPS版上のインキパターンを一度、ゴム
ブランケットに転写した後に紙等の被印刷体に再転写す
るよう構或されている。For example, in the screen printing method, an ink shielding mask is formed on a mesh screen, the non-mask area of the mask is formed into a desired pattern, and ink is passed through the non-mask area and attached to the printing material to perform printing. However, with this printing method, it is easy to print thick ink (several μm to 20 μm thick), so it is possible to print a resist pattern with excellent resistance to scratches, but even the smallest practical printing line is about 200 μm To be the limit? ! ! It was difficult to print coarse and fine patterns. Also, offset printing method is PS plate (Presensitivity).
A lipophilic part and a hydrophilic part are formed on the scd plate, the hydrophilic part retains water and repels the citrus ink, the ink is selectively attached only to the lipophilic part, and the ink pattern is applied to the printing material. In order to particularly improve printability, the ink pattern on the PS plate is first transferred to a rubber blanket and then re-transferred to a printing medium such as paper.
しかし、この印刷法は比較的微細な画線が得られ易いが
、インキング方式や2回の転写操作等の関係により印刷
されるインキ膜厚が1〜2μm程度の小さいものとなる
傾向があり、そのため印刷画線にビンホールや断線が発
生し易い欠点がある。However, although this printing method can easily produce relatively fine lines, the printed ink film thickness tends to be as small as 1 to 2 μm due to the inking method and the two-time transfer operation. Therefore, there is a drawback that holes and disconnections are likely to occur in the printed lines.
また、この印刷法ではインキの塗膜厚を大きくし耐蝕性
に優れた微細パターンを形成し得る様に各種の工夫がな
されているが、膜厚を大きくすると印刷画線が太くなり
、結局のところ100〜200μm程度の線巾の印刷が
限界であった.従って、上述の印刷法では細線印刷を使
用しようとしても基本的に100〜200μm程度の線
巾の印刷が限度であって、より小さい線巾のパターンを
印刷しようとすればインキ膜厚も同時に薄くなってしま
うため、特にレジストパターンの如き耐蝕性を要す微細
パターン形戒には通用不可能であった。In addition, with this printing method, various efforts have been made to increase the thickness of the ink coating and form fine patterns with excellent corrosion resistance, but as the coating thickness increases, the printed lines become thicker, However, the limit was printing with a line width of about 100 to 200 μm. Therefore, with the above printing method, even if you try to use fine line printing, the limit is basically to print a line width of about 100 to 200 μm, and if you try to print a pattern with a smaller line width, the ink film thickness will also become thinner. Therefore, it could not be applied particularly to fine patterns such as resist patterns that require corrosion resistance.
このように印刷方法では微細パターンの形成が困賀であ
る上に、印刷されるパターンが必ずしも版パターンに忠
実のものには成り得す再現性の点でも不充分であったた
めに、特に微細パターン形或には一般にフォトリソグラ
フィーに依存せ・ざるを得なかった。ところが、このフ
ォトリソグラフィーは極めて微細なパターン形戒が可能
であるが、印刷手段に比べて工程が複雑で生産性が低く
且つコスト高となる不具合があった。In this way, with printing methods, it is difficult to form fine patterns, and the printed pattern is not always faithful to the plate pattern, so the reproducibility is also insufficient. In general, we had no choice but to rely on photolithography for the shape. However, although this photolithography is capable of forming extremely fine patterns, it has the disadvantage that the process is more complex, lowers productivity, and is higher in cost than printing methods.
一方、印刷版において比較的細線で印刷++2 J¥も
大きくして構成することができる印刷手段に凹版印刷法
がある.この印刷法は銅板などに彫刻法や食刻法で百線
凹部を形成し、該凹部に硬めのインキを擦り込み、非画
線部のインキを拭き取った後に銅版上に印刷用紙をあて
強圧して印刷を行うものである。強圧する理由は凹部に
擦りこまれたインキが版表面より窪んだ位置にあるため
、紙のような柔軟性被印刷物に強圧着させることにより
強制的にインキ面と被印刷物面とを接触付着させてイン
キを被印刷物に転移させるためである。On the other hand, intaglio printing is a printing method that allows relatively thin lines to be printed on a printing plate with a large print size of 2 J yen. This printing method involves forming 100-line recesses on a copper plate by engraving or etching, rubbing hard ink into the recesses, wiping off the ink in the non-printing areas, and then placing printing paper on the copper plate and applying strong pressure. It is used for printing. The reason for the strong pressure is that the ink rubbed into the recesses is in a recessed position below the plate surface, so by applying strong pressure to the flexible printing material such as paper, the ink surface and the printing material surface are forcibly brought into contact and adhered. This is to transfer the ink to the printing substrate.
しかしながら、従来の凹版印刷法は上記のスクリーン印
刷法やオフセット印刷法に比し細線印刷に適しているに
も係わらず、剛性の高いプラスチンク、ガラス、セラ兆
・冫ク、金属等からなる基{反類への印刷が殆ど不可能
であるという大きな問題点がある。However, although the conventional intaglio printing method is more suitable for fine line printing than the above-mentioned screen printing method and offset printing method, {There is a major problem in that it is almost impossible to print on paper.
本発明は上記の問題点に鑑みなされたもので、従来の印
刷法よりも線幅が極細で且つインキ膜厚も適度な厚みで
あ微細パターンを印刷形戒することができ、しかも、か
かる微細パターンを各種の被印刷体に正確且つ鮮明に、
また効率的且つ安価に形成し得る微細パターンの印刷方
法を提供することを目的とする。The present invention was developed in view of the above problems, and it is possible to print fine patterns with a finer line width and an appropriate ink film thickness than conventional printing methods, and furthermore, Accurately and clearly print patterns on various printing materials,
Another object of the present invention is to provide a method for printing fine patterns that can be formed efficiently and inexpensively.
(ii題を解決するための手段〕
即ち本発明は、
(1) 印刷画線部となる微細なパターン凹部を形成
してなる印刷用凹版に硬化型インキを塗布してドクター
にて凹部以外のインキを除去して凹部のみにインキを充
填させるか、若しくは印刷画線部となる微細なパターン
版部を製版してなる印刷用平版に硬化インキを塗布して
該インキをパターン版部のみに着肉させてパターンニン
グし、次いで、熱又は放射線による硬化処理を施して凹
版又は平版上のインキを少なくとも一部表層部が不完全
硬化状態となるように硬化させた後、被印刷体に転写す
ることを特徴とする微細パターンの印刷方法。(Means for Solving Problem ii) That is, the present invention has the following features: (1) Curable ink is applied to a printing intaglio plate formed with fine pattern recesses that will become printing image areas, and the areas other than the recesses are removed using a doctor. Either remove the ink and fill only the concave portions with ink, or apply hardened ink to a printing plate made by making a fine pattern plate portion that will become the printing image portion, and apply the ink only to the pattern plate portion. The ink on the intaglio plate or lithographic plate is cured so that at least a portion of the surface layer is in an incompletely cured state by applying a curing treatment using heat or radiation, and then transferring it to the printing material. A fine pattern printing method characterized by:
(2)硬化型インキとして、アクリル基又はメタクリル
基を有してビニル重合により硬化する樹脂を主材とする
インキを用い、版上で大気と接するインキ表層部を不完
全硬化状態にする請求項1記載の転写方法。(2) A claim in which the curable ink is an ink whose main material is a resin that has an acrylic or methacrylic group and is cured by vinyl polymerization, and the surface layer of the ink in contact with the atmosphere on the plate is brought into an incompletely cured state. 1. The transfer method described in 1.
(3)凹版又は平版表面にビニル重合抑制剤を塗布した
後、硬化型インキを塗布してパターンニングする請求項
2記載の印刷方法。(3) The printing method according to claim 2, wherein after coating the surface of the intaglio or planographic plate with a vinyl polymerization inhibitor, a curable ink is applied and patterned.
(4)少なくとも一部表層部が不完全硬化状態となるよ
うに硬化させたインキをプランケノト等の中間体に一度
転写し、しかる後、被印刷体に再転写する請求項2又は
3記載の印刷方法。(4) Printing according to claim 2 or 3, wherein the ink that has been cured so that at least a portion of the surface layer is in an incompletely cured state is transferred once to an intermediate such as plankenote, and then re-transferred to the printing material. Method.
(5)硬化後のインキをプランケソト等の中間体を介し
て被印刷体に再転写する際、接着性又は粘着性層を介在
させて転写を行う請求項4記載の印刷方法。(5) The printing method according to claim 4, wherein when the cured ink is retransferred to the printing material via an intermediate such as Plankesoto, the transfer is performed with an adhesive or adhesive layer interposed.
(6)紫外線又は可視光線による硬化処理を版の裏面側
から行い、大気に接触しているインキ表層部を不完全硬
化状態にする請求項1〜5記載の印刷方法。(6) The printing method according to any one of claims 1 to 5, wherein the curing treatment using ultraviolet rays or visible light is performed from the back side of the plate to bring the ink surface layer that is in contact with the atmosphere into an incompletely cured state.
(7} 被印刷体が金属、セラミソク、ガラス又はプ
ラスチック製の剛性を有するものである請求項1〜6記
載の印刷方法.
(8)硬化後のインキを接着性又は粘着性層を介し被印
刷体に転写させた後、被印刷体上の硬化インキ層が存在
しない部分にある接着性又は粘着性層を除去する請求項
5〜7記載の印刷方法。(7) The printing method according to any one of claims 1 to 6, wherein the printing material is made of metal, ceramic, glass, or plastic and has rigidity. (8) The ink after curing is applied to the printing material through an adhesive or adhesive layer. 8. The printing method according to claim 5, wherein after the ink is transferred to the printing object, the adhesive or sticky layer on the part of the printing object where the cured ink layer does not exist is removed.
を要旨とするものである。The main points are as follows.
本発明の印刷方法は、版として凹版又は平版を使用して
硬化型インキを極細で適度の膜厚からなる微細パターン
にパターンニングすることができ、そのようにパターン
ニングした硬化型インキを少なくとも一部表層部が不完
全硬化状態となるように硬化させることにより、即ち、
インキを完全に硬化させた部分において主に非流動性に
すると共に版上でバクーンニングされた形状をそのまま
に保持させることができる上、不完全硬化状態の表層部
分において粘着性を残存させることができ、これら両作
用を利用して被印刷体に硬化後のインキを転写させるも
のである。この結果、版通りの微細パターンからなる硬
化インキ層を変形なく、しかも残存した粘着性を有する
表層部を活用してインキ転移を容易ならしめて被印刷体
に効率良く印刷形成することができる。The printing method of the present invention uses an intaglio plate or a lithographic plate as a plate to pattern curable ink into a fine pattern consisting of an extremely fine film with an appropriate thickness, and the curable ink thus patterned can be patterned into a fine pattern with an appropriate film thickness. By curing so that the surface layer part is in an incompletely hardened state, that is,
It is possible to make the ink mainly non-flowable in the completely cured area and maintain the shape baked on the plate as it is, and it is possible to maintain the adhesiveness in the incompletely cured surface layer area. Both of these effects are used to transfer the cured ink to the printing material. As a result, the cured ink layer consisting of a fine pattern according to the printing plate can be efficiently printed on the printing material without being deformed, and the remaining adhesive surface layer portion can be utilized to facilitate ink transfer.
次に、本発明を図面に基づき印刷工程順に従って説明す
る。Next, the present invention will be explained in accordance with the printing process order based on the drawings.
第1図は本発明印刷方法の各工程例を示すものである。FIG. 1 shows examples of each step of the printing method of the present invention.
同図(A)は本発明に使用する製版された印刷用版lを
示す。この版1としては図示の如き凹版か或いは特に図
示しないが平版が使用される。また版lは図示の如きゴ
ムローラ20等に巻き付けて円筒状に構成したものもの
に限定されず、第2図に例示の如き平板状のものであっ
ても良い.版1が凹版の場合、凹版1には印刷画線とな
るパターン凹部2が形成されており、また版1が平版の
場合、平版には上記四部2に相当するパターン版部が製
版されている.この凹部2の形戒方法は特に限定される
ものではなく、例えば、平滑に研磨された金属製版材(
一般に銅、銅合金、鉄、鉄合金等、その他の金属〉を微
細切削法にて切削形成したり、或いは該基材にフォトフ
アプリケーションを利用して光学的にレジストマスクを
設けた後、エッチングして形成することができる.凹部
2はその線幅が5〜50μm程度、深さ(版深)が1〜
10μm程度の微細なものとして構戒することができる
.また版材はガラス、セラミック等の硬質の材質からな
るものを使用してもよい。FIG. 1A shows a printing plate 1 used in the present invention. As the plate 1, an intaglio plate as shown in the figure or a planographic plate (not particularly shown) is used. Further, the plate 1 is not limited to a cylindrical shape wrapped around a rubber roller 20 as shown, but may be a flat plate as shown in FIG. 2. When the plate 1 is an intaglio plate, a pattern depression 2 that becomes a printing image line is formed on the intaglio plate 1, and when the plate 1 is a planographic plate, a pattern plate portion corresponding to the above-mentioned four parts 2 is made on the planar plate. .. The shape of the recess 2 is not particularly limited, and for example, a metal plate material polished smooth (
Generally, other metals such as copper, copper alloys, iron, iron alloys, etc. are formed by cutting using a micro-cutting method, or a resist mask is optically provided on the base material using a photo application, and then etching is performed. It can be formed by The recess 2 has a line width of about 5 to 50 μm and a depth (plate depth) of 1 to 50 μm.
It can be considered as a microscopic object of about 10 μm. Further, the plate material may be made of a hard material such as glass or ceramic.
更に、凹版1表面の硬度を増すために製版面にニンケル
、クロム等の硬質金属をメッキしてもよく、これにより
ドクターによるインキ掻き落とし時の耐久性を付与する
ことができる.平版のパターン版部の形成に当たっては
平版印刷で採用されている公知の製版方法を適用できる
.
次いで、上記の印刷用版(凹版)■面に硬化型インキ3
を塗布する(第1図(B))。インキの塗布はインキ溜
めに版を浸漬させて行ったり、版面にインキをかけ流し
して行う等により容易になし得る。この際、版lが凹版
の場合には同図に示すように凹版1面の不要なインキ3
aを薄い金属ブレード等からなるドクター4でかき取っ
て除去し、印刷画線となる凹部2のみにインキ3を残留
充填させる.一方、版1が平版であれば塗布された硬化
型インキ3は、版とインキとの表面工不ルギーの相互作
用により自然にパターン版部のみに着肉する。いずれの
版においても、この段階でインキ3のパターンニングが
なされる,
次いで、第1図(C)に示すように版l上の凹部2やパ
ターン版部においてパターンニングされたインキ3に対
して熱又は放射線による硬化処理5を施し、該インキ3
を少なくとも一部インキ表層部が不完全硬化状態となる
ように硬化させる。Furthermore, in order to increase the hardness of the surface of the intaglio plate 1, the plate-making surface may be plated with a hard metal such as nickel or chromium, thereby providing durability when ink is scraped off by a doctor. In forming the pattern plate portion of the lithographic plate, known plate-making methods used in lithographic printing can be applied. Next, curable ink 3 is applied to the above printing plate (intaglio) side
(Fig. 1 (B)). Ink can be easily applied by dipping the plate in an ink reservoir or by pouring ink onto the plate surface. At this time, if the plate 1 is an intaglio plate, unnecessary ink 3 on one side of the intaglio plate is removed as shown in the figure.
a is removed by scraping it off with a doctor 4 made of a thin metal blade, etc., and the remaining ink 3 is filled only in the recesses 2 that will become the printing lines. On the other hand, if the plate 1 is a planar plate, the applied curable ink 3 will naturally ink only on the pattern plate part due to the interaction of the surface roughness between the plate and the ink. In either plate, the ink 3 is patterned at this stage.Next, as shown in Fig. 1(C), the ink 3 patterned in the recesses 2 on the plate 1 and the patterned plate portion is The ink 3 is subjected to a curing treatment 5 using heat or radiation.
The ink is cured so that at least a portion of the surface layer of the ink becomes incompletely cured.
これにより硬化型インキ3は、図示の如く不完全硬化表
層部3bと完全硬化部3cから構威される硬化インキ6
となる.硬化処理によりインキ3は反応活性化し、凹版
凹部2内又は平版版部において増帖又は硬化反応が発生
し、インキの流動性が消滅する。但し、不完全硬化表層
部では完全硬化部に比べて硬化度合いが少なく、粘着性
等の物性が残存する。一部インキ表層部を不完全硬化状
態とさせる手段は特に限定されず、例えば、硬化型イン
キの硬化特性を利用したり、硬化抑制剤等により硬化速
度を調整したり、硬化処理の処理方向や度合いを調整し
たりして行われる。As a result, the curable ink 3 is made up of a cured ink 6 composed of an incompletely cured surface layer portion 3b and a fully cured portion 3c as shown in the figure.
becomes. The ink 3 is reactively activated by the curing treatment, and a thickening or curing reaction occurs within the intaglio recesses 2 or the planographic plate portion, and the fluidity of the ink disappears. However, in the incompletely cured surface layer portion, the degree of curing is lower than that in the fully cured portion, and physical properties such as stickiness remain. There are no particular limitations on the means for partially curing the surface layer of the ink, such as using the curing characteristics of the curable ink, adjusting the curing speed with a curing inhibitor, changing the direction of the curing process, etc. This is done by adjusting the degree.
本発明に使用される硬化型インキ3は熱硬化タイプ、電
離放射線硬化タイプ等のものであり、これらは無溶剤系
のもので且つ比較的低粘度のものが好ましい.具体的に
は一般に市販されている紫外線硬化型インキ、電子線硬
化型インキ、赤外線(又は熱)硬化型インキ等を利用す
ることができ、本発明は上記のような公知のインキを適
用できることも非常に有利な点である.インキ3の基本
組威は、紫外線硬化型インキを挙げて説明すると、溶剤
を用いずに感光性のプレポリマー又はモノマーと光重合
開妬剤を結合剤とし、着色用顔料と適当な増感剤や夕冫
ク調整剤等のインキ助剤類から構威されている。また通
常の紫外線硬化型インキに代えて、半導体加工やフォト
エッチング等に使用されているフォトレジスト材料から
適宜選択してものを使用してもよい。更に平版用インキ
としては従来の平版印刷法の如く高粘度のインキを使用
する必要はなく、若干低粘度のものを使用できる。この
インキの粘度調整は結合剤である光重合開始剤を含むプ
レポリマー又はモノマーのうらで低粘度のものを選択使
用すればよい。The curable ink 3 used in the present invention is a thermosetting type, an ionizing radiation curable type, etc., and these are preferably solvent-free and relatively low viscosity. Specifically, commercially available ultraviolet curable inks, electron beam curable inks, infrared ray (or heat) curable inks, etc. can be used, and the present invention can also apply known inks such as those mentioned above. This is a very advantageous point. The basic composition of Ink 3 is explained by referring to an ultraviolet curable ink.A photosensitive prepolymer or monomer and a photopolymerization agent are used as a binder without using a solvent, and a coloring pigment and a suitable sensitizer are used as a binder. It is made up of ink auxiliary agents such as color and color control agents. Further, instead of the usual ultraviolet curable ink, a photoresist material that is appropriately selected from those used in semiconductor processing, photoetching, etc. may be used. Furthermore, as for the lithographic ink, it is not necessary to use a high viscosity ink as in the conventional lithographic printing method, and it is possible to use an ink with a slightly lower viscosity. The viscosity of this ink can be adjusted by selecting a prepolymer containing a photopolymerization initiator or a monomer having a low viscosity as a binder.
また上記硬化型インキとして、本発明ではアクリル基又
はメタクリル基を有し、ビニル重合により硬化する樹脂
材質を主材とするインキが使用される.この種のインキ
は、重合過程において大気に触れている部分では酸素の
影響により重合反応の阻害を受ける性質があり、この性
質を利用することにより不完全硬化状態のインキ表層部
の形成が容易に行え得る。例えば、第1図(C)に示さ
れているように硬化処理5が施された場合、凹部2の内
側にあり大気と接していない部分は完全なる硬化が起こ
り完全硬化部3cとなり、一方、大気に接している部分
では重合反応が阻害されて硬化が遅延されて不完全硬化
表層部3bとなる。In the present invention, as the above-mentioned curable ink, an ink whose main material is a resin material having an acrylic group or a methacrylic group and which is cured by vinyl polymerization is used. This type of ink has the property that the polymerization reaction is inhibited by the influence of oxygen in the parts exposed to the atmosphere during the polymerization process, and by taking advantage of this property, it is easy to form an incompletely cured ink surface layer. It can be done. For example, when the hardening process 5 is performed as shown in FIG. 1(C), the part inside the recess 2 that is not in contact with the atmosphere is completely hardened and becomes a completely hardened part 3c; In the portion that is in contact with the atmosphere, the polymerization reaction is inhibited and curing is delayed, resulting in an incompletely cured surface layer portion 3b.
このように変則的にインキを硬化させた後、第1図(D
)に示すように版1と被印刷体7を重ね合わせて両者を
密着させ、続いて両者を離すことにより版1の凹部2内
の硬化インキ6が被印刷体7上に転写され、以て本発明
印刷方法による印刷がなされる。ここで、不完全硬化表
層部3bに残存している粘着性により硬化インキ6の被
印刷体7への転移が確実になされる。また平版の場合で
も版上の大気と接する部分が不完全硬化表層部となり、
該表層部分の粘着性により硬化インキの被印刷体への転
移が確実になされ、同様に転写が完了する。After curing the ink irregularly in this way, as shown in Figure 1 (D
), by overlapping the plate 1 and the printing material 7 and bringing them into close contact with each other, and then separating them, the cured ink 6 in the recesses 2 of the printing plate 1 is transferred onto the printing material 7. Printing is performed by the printing method of the present invention. Here, the adhesiveness remaining in the incompletely cured surface layer portion 3b ensures the transfer of the cured ink 6 to the printing material 7. In addition, even in the case of planographic printing, the part of the plate that comes into contact with the atmosphere becomes an incompletely hardened surface layer.
The adhesiveness of the surface layer portion ensures the transfer of the cured ink to the printing medium, and the transfer is also completed.
また、本発明は第2図(A)に示すように予め版1表面
にビニル重合抑制剤8を塗布しておき、しかる後に硬化
型インキ3の塗布をしパターンニングし(同図(B))
、硬化処理5を施す(同図(C))。この結果、硬化型
インキ3は前述の如く大気と接する部分で不完全硬化状
態となると共に、重合仰制剤8と接している部分も該抑
制剤の作用により重合硬化が遅延され不完全硬化状態と
なり、結局インキ周囲が全面的に不完全硬化表層部3b
となって変則的な硬化がなされることになる。ビニル重
合抑制剤としては従来公知のものを使用することができ
、なかでもペンヅキノン、プチルカテコール等が好まし
い。Further, in the present invention, as shown in FIG. 2(A), a vinyl polymerization inhibitor 8 is applied to the surface of the plate 1 in advance, and then a curable ink 3 is applied and patterned (FIG. 2(B)). )
, hardening treatment 5 is performed ((C) in the same figure). As a result, as described above, the curable ink 3 becomes incompletely cured in the portions in contact with the atmosphere, and the polymerization and curing in the portions in contact with the polymerization suppressor 8 are delayed due to the action of the inhibitor, resulting in an incompletely cured state. As a result, the area around the ink is completely incompletely cured surface layer 3b.
This results in irregular hardening. As the vinyl polymerization inhibitor, conventionally known ones can be used, and among them, penduquinone, butylcatechol, etc. are preferable.
本発明では硬化インキ6を被印刷体7に転写させる他の
態様として、第2図、第3図に示すように版1から一旦
ブランケット等の中間体9に硬化インキ6を転写してお
き、しかる後、インキ6を被印刷体7に再転写させて印
刷を行うこともできる。In the present invention, as another embodiment of transferring the cured ink 6 to the printing material 7, as shown in FIGS. 2 and 3, the cured ink 6 is first transferred from the plate 1 to an intermediate body 9 such as a blanket, After that, printing can be performed by retransferring the ink 6 onto the printing medium 7.
第2図に例示した態様の場合、版I上の大気に接した側
の不完全硬化表層部3bの粘着性により硬化インキ6は
ブランケントに確実に転移し、また重合抑制剤8に接し
た側の不完全硬化表層部の粘着性によりブランケットか
ら被印刷体への硬化インキ6の転移が蹟実に行われる(
同図(D)〜(E)参照)。In the case of the embodiment illustrated in FIG. 2, the cured ink 6 was reliably transferred to the blank due to the adhesiveness of the incompletely cured surface layer 3b on the side of the plate I that was in contact with the atmosphere, and the cured ink 6 was also transferred to the blank, and was also in contact with the polymerization inhibitor 8. Due to the adhesiveness of the incompletely cured surface layer on the side, the transfer of the cured ink 6 from the blanket to the printing material takes place (
(See Figures (D) to (E)).
硬化インキ6をプランケント等の中間体9を介して被印
刷体7に再転写する場合、硬化インキの被印刷体への転
移をより確実ならしめるため、第3図(C)に示すよう
に接着性又は粘着性層10を介在させて硬化インキ6の
転写を行う。接着性又は粘着性NIOは通常、被印刷体
7側に予め形成しておく。上記層IOを形成する接着剤
又は粘着剤は塗布適性に優れ且つ版1表面に対して接着
又は粘着性が弱いものを市販品から選択して使用すれば
よい。例えば、所望する工程によってその接着・粘着過
程が溶剤賦活型、熱賦活型、圧力賦活型、化学反応型等
のうちから適宜選択して使用することができ、なかでも
圧力賦活型である感圧接着剤(粘着剤)や熱賦活型であ
るホノトメルト型接着剤等が好ましい.
接着性又は粘着性層10を介して印刷を行った場合、第
3図(C)に示すように被印刷体7面には転写された硬
化インキ層6が存在しない非画線部にも層10aが存在
するが、必要に応して該層10aを適宜手段にて除去す
る(第4図)。この除去処理により非画線部に相当する
被印刷体7表面を露出させることができる。この除去手
段としてはインキ層3bがエノチングレジスト印刷であ
る場合、プラズマ等のドライエッチングl去や適当なエ
ソチング液によるウエットエンチング法等がある。他の
除去手段としてはオゾン酸化、放射エネルギー分解、或
いは溶剤や薬品による溶解除去法等が採用できる。When retransferring the cured ink 6 to the printing medium 7 via an intermediate 9 such as a Planckent, in order to ensure the transfer of the cured ink to the printing medium, as shown in FIG. 3(C), Transfer of the cured ink 6 is performed with an adhesive or adhesive layer 10 interposed. Adhesive or adhesive NIO is usually formed in advance on the printing medium 7 side. The adhesive or pressure-sensitive adhesive forming the layer IO may be selected from commercially available products that have excellent coating suitability and have weak adhesion or tackiness to the surface of the plate 1. For example, depending on the desired process, the adhesion/adhesive process can be appropriately selected from solvent activation type, heat activation type, pressure activation type, chemical reaction type, etc. Among them, pressure activation type is pressure sensitive. Adhesives (adhesives) and heat-activated photomelt adhesives are preferred. When printing is carried out through the adhesive or adhesive layer 10, as shown in FIG. Although the layer 10a is present, the layer 10a is removed by appropriate means if necessary (FIG. 4). Through this removal process, the surface of the printing medium 7 corresponding to the non-image area can be exposed. When the ink layer 3b is etched resist printed, the removing means includes dry etching using plasma or the like, wet etching using an appropriate etching solution, and the like. Other removal methods that can be used include ozone oxidation, radiant energy decomposition, and dissolution and removal methods using solvents and chemicals.
更に本発明方法において第3図(A)に図示の如く紫外
線又は可視光線による硬化処理5を版lの裏面側から施
すこともできる。この場合、版は紫外線又は可視光線が
透過可能な版材にて構或する必要がある。このような硬
化処理によりインキの光透過率により、インキの版深部
と表層部にて硬化度合いを変えられる等の利点がある。Furthermore, in the method of the present invention, as shown in FIG. 3(A), a curing treatment 5 using ultraviolet rays or visible light can be applied from the back side of the plate 1. In this case, the plate must be made of a plate material that allows ultraviolet or visible light to pass through. Such a curing process has the advantage that the degree of curing of the ink can be changed between the deep part of the plate and the surface part, depending on the light transmittance of the ink.
本発明における被印刷体7としては紙や薄いフィルムな
どの柔軟性を有するもの、金属、セラミック、ガラス、
プラスチック等のような剛性を有するもの等の各種のも
のが適用できる.特に本発明では不完全硬化表層部3が
生じるようにインキ3を変則的に硬化させ、該表層部3
の粘着性を利用して硬化インキ6の被印イ11体等への
転移を確実かつ効率的に行えるため、剛性を有する被印
刷体に対しても印刷が容易に行える。In the present invention, the printing material 7 may be a flexible material such as paper or a thin film, metal, ceramic, glass, etc.
Various materials can be used, including materials with rigidity such as plastic. In particular, in the present invention, the ink 3 is hardened irregularly so that an incompletely hardened surface layer 3 is formed, and
Since the cured ink 6 can be reliably and efficiently transferred to the printing object 11 etc. using the adhesiveness of the material, printing can be easily performed even on rigid printing objects.
本発明では必要に応して転写した硬化インキ層をより確
実に硬化完了せしめるために硬化処理を施してもよい.
上記の如き構或からなる本発明の印刷方法は微細パター
ン形成を要す用途に広く利用することができる.例えば
、本発明は被印刷体に接着性又は粘着性層を介して微細
パターンを印刷し、次いで非画線部の上記層を除去した
後、更に必要に応じて露出した被印刷体の非′?i線部
をドライ又はウエットエンチングにて食刻し、食刻後に
硬化インキ層を(上記層も共々)除去するような用途に
も極めて有効である。In the present invention, if necessary, a curing treatment may be applied to the transferred cured ink layer in order to more reliably complete curing. The printing method of the present invention having the above structure can be widely used in applications requiring fine pattern formation. For example, the present invention prints a fine pattern on a printing material through an adhesive or adhesive layer, then removes the layer in the non-image area, and then, if necessary, prints a fine pattern on the exposed printing material. ? It is also extremely effective for applications where the i-line portion is etched by dry or wet etching and the cured ink layer (along with the above layers) is removed after etching.
以下、実施例を挙げて本発明を更に詳細に説明する.
丈施炎上
版として微細パターン凹部をエッチングした銅製凹版(
版深2μm)を用い、これをゴムローラに巻きつけて版
胴ローラとし、この凹版面にアクリルーウレタン系紫外
線硬化型インキに熱垂合開始剤を添加したものを塗布し
た後、グラビア印刷用ドクターブレードを用いて版の凹
部以外のインキを掻き落として除去した.
次いで、凹版面に向けて遠赤外線を照射して凹部に充填
されているインキを硬化させた。この硬化処理によりイ
ンキの大気と接する表層部分には粘着性が残った.
次に、この版胴ローラをガラス板上に載置してゆっくり
と転がし、上記粘着性を利用して硬化したインキをガラ
ス板上に転写させた。この結果、版凹部内の硬化インキ
は残存することなく完全にガラス板側に転移され、線巾
が30μm,膜厚が2μmの画線パターンが梢度良く再
現できた。上記重合開始剤としてはペンゾイルパーオキ
サイドを用いたが、他の過酸化物でも、またアゾイソブ
チロニトリル等も使用可能である.
夫施拠1
版として版深2μmの水無し平版(東レ製)を用い、こ
れをゴムローラに巻き付けて版胴ローラとし、この版胴
ローラの版面にアクリルーエボキシ系紫外線硬化性イン
キを塗布した.版とインキの表面エネルギーの相互作用
によりインキが所定のパターン形状になった後、紫外線
を版胴ローラ表面に照射してインキを硬化せしめた.こ
の硬化処理によりインキの大気と接する表層部分には粘
着性が残った。Hereinafter, the present invention will be explained in more detail with reference to Examples. Copper intaglio plate with finely patterned recesses etched as a long flame plate (
Using a plate depth of 2 μm), wrap this around a rubber roller to form a plate cylinder roller, and apply an acrylic-urethane ultraviolet curable ink containing a thermal initiator to the intaglio surface, then apply a gravure printing doctor. A blade was used to scrape and remove ink from areas other than the concave portions of the plate. Next, the ink filled in the recesses was cured by irradiating far infrared rays toward the intaglio surface. Due to this curing process, the surface layer of the ink that came into contact with the atmosphere remained sticky. Next, this plate cylinder roller was placed on a glass plate and slowly rolled, and the hardened ink was transferred onto the glass plate using the above-mentioned adhesiveness. As a result, the cured ink in the plate recesses was completely transferred to the glass plate side without remaining, and a line pattern with a line width of 30 μm and a film thickness of 2 μm could be reproduced with good accuracy. Although penzoyl peroxide was used as the polymerization initiator, other peroxides, such as azoisobutyronitrile, can also be used. Construction 1 A waterless lithographic plate (manufactured by Toray Industries, Ltd.) with a plate depth of 2 μm was used as the plate, which was wrapped around a rubber roller to form a plate cylinder roller, and an acrylic-epoxy ultraviolet curable ink was applied to the plate surface of this plate cylinder roller. After the ink formed into a predetermined pattern due to the interaction between the surface energy of the plate and the ink, the ink was cured by irradiating the surface of the plate cylinder roller with ultraviolet rays. As a result of this curing treatment, tackiness remained on the surface layer of the ink that came into contact with the atmosphere.
次いで、この粘着性を利用して硬化インキを版胴ローラ
からガラス基板上に転写した.以上の工程により、ガラ
ス基板上に線中30μm,膜厚2μmの画線からなる微
細パターンが精度良く印刷再現された.
災胤銖1
版として版深2μmのPS板を用い、これをゴムローラ
に巻き付けて版胴ローラとし、この版胴ローラに湿し水
を水付けローラにて与えた後、実施例lと同様の熱重合
開始剤を添加したインキを塗布した.版と水とインキの
表面エネルギーの相互作用によりインキが所定パターン
形状になった後、ローラ表面に遠赤外線を照射してイン
キを硬化せしめた.この硬化処理によりインキの大気と
接する表層部分には粘着性が残った.
次いで、この版胴ローラをガラス基板上に転がして硬化
インキをガラス基板に転写した.以上のにより、ガラス
基板上に線巾30μm,膜厚2μmの画線からなる微細
パターンが精度良く印刷された.
夫嵐奥土
版としてガラス板に微細パターン凹部をエッチングした
凹版(版深2μm〉を用い、これを千台の版定盤上に固
定した.この凹版上にビニル重合仰止剤としてヒドロキ
ノンのメタノール溶液を塗布した後、その上にアクリル
ーエボキシ系紫外線硬化性インキを塗布し、ドクターに
て凹部以外にある不要なインキを掻き落として除去した
。Next, using this adhesive property, the cured ink was transferred from the plate cylinder roller onto the glass substrate. Through the above steps, a fine pattern consisting of lines of 30 μm in diameter and 2 μm in film thickness was printed and reproduced with high accuracy on the glass substrate. A PS plate with a plate depth of 2 μm was used as a plate, and this was wound around a rubber roller to form a plate cylinder roller. After applying dampening water to the plate cylinder roller using a dampening roller, the same process as in Example 1 was carried out. An ink containing a thermal polymerization initiator was applied. After the ink formed into a predetermined pattern due to the interaction of the surface energy of the plate, water, and ink, the roller surface was irradiated with far-infrared rays to harden the ink. Due to this curing process, the surface layer of the ink that came into contact with the atmosphere remained sticky. Next, this plate cylinder roller was rolled onto a glass substrate to transfer the cured ink onto the glass substrate. Through the above process, a fine pattern consisting of lines with a line width of 30 μm and a film thickness of 2 μm was printed with high accuracy on the glass substrate. An intaglio plate (plate depth 2 μm) with a fine pattern of recesses etched into a glass plate was used as the Fuarashi Okudo version, and this was fixed on a 1,000 plate plate. On this intaglio plate, methanol of hydroquinone was added as a vinyl polymerization inhibitor. After applying the solution, an acrylic-epoxy ultraviolet curable ink was applied thereon, and unnecessary ink outside the recesses was scraped off with a doctor.
次いで、凹版表面に紫外線を照射してインキを硬化せし
めた。インキは大気と接する表層部分と重合抑制剤に接
する表層部分とに粘着性が残った.硬化処理後、大気と
接する表層部分の粘着性を利用して凹版内のインキをブ
ランケット上に転写した。続いて、重合抑制剤に接する
表層部分の粘着性を利用してブランケット上のインキを
再度ガラス基板上に再転写した。Next, the intaglio surface was irradiated with ultraviolet rays to cure the ink. The ink remained sticky on the surface layer that was in contact with the atmosphere and on the surface layer that was in contact with the polymerization inhibitor. After the curing process, the ink in the intaglio was transferred onto the blanket using the adhesiveness of the surface layer in contact with the atmosphere. Subsequently, the ink on the blanket was retransferred onto the glass substrate using the adhesiveness of the surface layer in contact with the polymerization inhibitor.
以上によりガラス基板上に線巾30μm、膜厚2μmの
画線パターンを精度よく再現できた.夫嵐真亙
版として実施例4と同様の凹版を用い、千台の版定盤上
に固定し、この凹版上に実施例4と同様にビニル重合抑
制剤を塗布した後、実施例1と同様の熱重合開始剤を添
加したインキを塗布し、ドクターにて不要なインキを除
去した。As described above, a line pattern with a line width of 30 μm and a film thickness of 2 μm could be accurately reproduced on the glass substrate. An intaglio plate similar to that used in Example 4 was used as the Fuarashi Makoto plate, and it was fixed on a 1,000 plate plate. After coating the vinyl polymerization inhibitor on this intaglio plate in the same manner as in Example 4, the same plate as in Example 1 was used. Ink containing the same thermal polymerization initiator was applied, and unnecessary ink was removed with a doctor.
この後、遠赤外線を照射してインキを変則的に硬化させ
、それ以後は実施例4と同様にブランケットを介してガ
ラス基板上に転写を行い、同様の画線パターンを精度良
く印刷再現した.夫益孤立
版として実施例2と同様の水無し平版を用い、これを平
台の版定盤上に固定し、実施例4と同様に重合抑制剤を
塗布した後、同様のインキを塗布し、版とインキの表面
エネルギーの相互作用にてインキが所定通りパターンニ
ングされた。After this, the ink was irradiated with far infrared rays to harden it irregularly, and thereafter, it was transferred onto a glass substrate via a blanket in the same manner as in Example 4, and the same image pattern was reproduced with high accuracy by printing. A waterless lithographic plate similar to that in Example 2 was used as the Fuyoshi isolated plate, and this was fixed on a flat plate plate, and after applying a polymerization inhibitor in the same manner as in Example 4, the same ink was applied. The ink was patterned as specified by the interaction between the surface energy of the plate and the ink.
次に、紫外線を平版表面に照射して版上のインキを硬化
せしめた.インキは大気と接する表層部分と重合抑制剤
に接する表層部分とに粘着性が残った.硬化処理後、大
気と接する表層部分の粘着性を利用して凹版内のインキ
をブランケット」二に転写し、続いて重合抑制剤に接す
る表層部分の粘着性を利用してブランケット上のインキ
を再度ガラス基板上に再転写した.
以上によりガラス基板上に線巾30μm,膜厚2μmの
画線パターンを精度よく再現できた。Next, the ink on the plate was cured by irradiating the surface of the plate with ultraviolet light. The ink remained sticky on the surface layer that was in contact with the atmosphere and on the surface layer that was in contact with the polymerization inhibitor. After the curing process, the ink in the intaglio is transferred onto the blanket using the tackiness of the surface layer in contact with the atmosphere, and then the ink on the blanket is transferred again using the tackiness of the surface layer in contact with the polymerization inhibitor. It was retransferred onto a glass substrate. As described above, a line pattern with a line width of 30 μm and a film thickness of 2 μm could be accurately reproduced on the glass substrate.
尖施囲1
版として実施例3と同様のPS板を用い、これを平台の
版定盤上に固定し、実施例4と同様に重合抑制剤を塗布
した後、実施例3と同様の熱重合開始剤を添加したイン
キを塗布した。Sharpening 1 A PS plate similar to that in Example 3 was used as a plate, and this was fixed on a flat plate surface plate, and after coating with a polymerization inhibitor in the same manner as in Example 4, it was heated in the same manner as in Example 3. An ink containing a polymerization initiator was applied.
版上でのインキのバクーンニング終了後、遠赤外線を照
射してインキを硬化せしめた。硬化処理後、大気と接す
るインキ表層部分の粘着性を利用して凹版内のインキを
ブランケット上に転写し、続いて重合抑制剤に接するイ
ンキ表層部分の粘着性を利用してブランケット上のイン
キを再度ガラス基板上に再転写した。After the ink was baked on the plate, it was irradiated with far infrared rays to harden the ink. After curing, the ink inside the intaglio is transferred onto the blanket using the tackiness of the ink surface layer that comes into contact with the atmosphere, and then the ink on the blanket is transferred using the tackiness of the ink surface layer that comes into contact with the polymerization inhibitor. It was transferred again onto a glass substrate.
以上によりガラス基板上に線中30pm,膜厚2μmの
画線パターンを精度よく再現できた.z益班エ
版として版深2μmの水無し平版(東レ製)を用い、こ
れを平台の版定盤上に固定した.この平版上にアクリル
ーエボキシ系紫外線硬化性インキを塗布した.版とイン
キの表面エネルギーの相互作用にてインキが所定パター
ン形状になった後、紫外線を閉版表面より照射して版上
のインキを硬化させた.
次いで、大気と接するインキ表層部分の粘着性を利用し
て凹版内のインキをブランケント上に転写し、続いてア
クリル樹脂系粘着剤をltIm厚で全面に塗布したガラ
ス基板上に粘着剤層を介してインキを再転写した.
次に、このガラス板を酸素プラズマ雰囲気中にlO分間
暴露してプラズマエッチングを行った。As described above, it was possible to accurately reproduce a line pattern with a line width of 30 pm and a film thickness of 2 μm on a glass substrate. A waterless lithographic plate (manufactured by Toray Industries, Ltd.) with a plate depth of 2 μm was used as the printing plate, and this was fixed on a flat plate plate. Acrylic-epoxy ultraviolet curable ink was applied onto this lithographic plate. After the ink formed a predetermined pattern due to the interaction between the surface energy of the plate and the ink, ultraviolet rays were irradiated from the closed plate surface to harden the ink on the plate. Next, the ink in the intaglio is transferred onto the blank using the adhesiveness of the ink surface layer that comes into contact with the atmosphere, and then an adhesive layer is applied to the glass substrate, which has been coated with an acrylic resin adhesive to a thickness of ltIm. The ink was retransferred through the paper. Next, this glass plate was exposed to an oxygen plasma atmosphere for 10 minutes to perform plasma etching.
これにより、硬化インキ層部分はエボキシ成分によるベ
ンゼン環の存在により酸素プラズマに侵され難く、一方
のアクリル樹脂からなる粘着剤層部分は酸素プラズマに
より侵され易いため、結果的に粘着剤層のみが露出して
いる非画線部の粘着剤層部分が除去された.
以上により、ガラス基板上に線巾30μm,膜厚3μm
(インキ層2μm十粘着N1μm)の画線パターンが精
度よく再現できた。As a result, the cured ink layer part is difficult to be attacked by oxygen plasma due to the presence of benzene rings due to the epoxy component, while the adhesive layer part made of acrylic resin is easily attacked by oxygen plasma, so as a result, only the adhesive layer is The exposed adhesive layer in the non-print area was removed. By the above, a line width of 30 μm and a film thickness of 3 μm were formed on a glass substrate.
(Ink layer: 2 μm, adhesion N: 1 μm) The line pattern could be accurately reproduced.
l動4生
版としてガラス板に微細パターン凹部をエッチングした
凹版(版深2μm)を用い、これを平台の版定盤上に固
定した.この凹版上にアクリルーエボキシ系紫外線硬化
性インキを塗布し、ドクタ一にて凹部以外にある不要な
インキを掻き落として除去した.
次いで、凹版の裏面側から紫外線を照射してインキを硬
化せしめた.この裏面側からの硬化処理によりインキは
表面側即ち大気と接する表層部分において良好な粘着性
が残った.
この粘着性を利用して凹版内のインキをブランケット上
に転写し、続いてアクリル樹脂系粘着剤をlμm厚で全
面に塗布したガラス基板上に粘着剤層を介してインキを
再転写した.
次に、このガラス板を酸素プラズマ雰囲気中に10分間
暴露してプラズマエッチングを行った.これにより、硬
化インキ層部分はエボキシ威分によるベンゼン環の存在
により酸素プラズマに侵され難く、一方のアクリル樹脂
からなる粘着剤層部分は酸素プラズマにより侵され易い
ため、結果的に粘着剤層のみが露出している非画線部の
粘着剤層部分が除去された.
以上により、ガラス基板上に線中30μm1膜厚3μm
(インキ層2μm+粘着層1μm)の画線パターンが桔
度よく再現できた.
〔発明の効果〕
以上説明したように、本発明の印刷方法によれば凹版又
は平版を使用し、極細で所定膜厚の微細パターンからな
る印刷画線部を凹版にはパターン凹部として平版にはパ
ターン版部として製版し、版の凹部又はパターン版部で
パターンニングされた硬化型インキを凹部内若しくは版
上で硬化せしめた後、その硬化したインキを被印刷体に
転写させるものであるため、従来の印刷技術では最小線
中が100〜200μmのものしか印刷再現させること
ができなかったものが、所定の膜厚を以て100IIm
未満の極めて極細な線画印刷を容易に行うことができる
.
特に本発明では少なくとも一部表層部が不完全硬化状態
となるようにインキを硬化させるという変則的な硬化を
行うため、インキの完全硬化部分において版上でパター
ンニングされた形状に忠実な形状を保持したままで微細
パターンが鮮明に印刷再現され得ると同時に、不完全硬
化状態のインキ表層部における粘着性を利用して被印刷
体等への硬化インキの転移を容易且つ確実ならしめるこ
とができ、再現性良好な印刷を効率良く行うことができ
る.
また本発明方法は上記のような印刷手段を採用している
ため、従来高価で非能率的なフォトレジストによらなけ
ればならなかった微細画線の形戒を能率的に且つ安価に
行うことが可能となった.更に本発明方法は接着性又は
粘着性層を介して印刷を行うことにより、硬化インキを
より安定的にに転写せしめることができる.
従って、本発明印刷方法は微細パターン形戒の用途に広
く適用でき、例えば、ガラスフォトマスクや微細なプリ
ント回路板、その他の微細バタンー形成を要す製品を高
精度で安価に加工提供することができ、実益大である.l Motion 4 An intaglio plate (plate depth 2 μm) with finely patterned recesses etched into a glass plate was used as a raw plate, and this was fixed on a flat plate plate. Acrylic-epoxy ultraviolet curable ink was applied onto this intaglio plate, and unnecessary ink outside the concave areas was scraped off using a doctor. Next, the ink was cured by irradiating ultraviolet light from the back side of the intaglio. This curing treatment from the back side left the ink with good adhesion on the front side, that is, the surface layer in contact with the atmosphere. Utilizing this adhesive property, the ink in the intaglio was transferred onto the blanket, and then the ink was retransferred via the adhesive layer onto a glass substrate whose entire surface was coated with an acrylic resin adhesive to a thickness of 1 μm. Next, this glass plate was exposed to an oxygen plasma atmosphere for 10 minutes to perform plasma etching. As a result, the cured ink layer part is difficult to be attacked by oxygen plasma due to the presence of benzene rings caused by epoxy resin, while the adhesive layer part made of acrylic resin is easily attacked by oxygen plasma, so as a result, only the adhesive layer is affected. The adhesive layer in the non-print area where is exposed has been removed. As a result of the above, 30 μm in line and 3 μm in film thickness were formed on the glass substrate.
The line pattern (ink layer 2 μm + adhesive layer 1 μm) could be reproduced with good accuracy. [Effects of the Invention] As explained above, according to the printing method of the present invention, an intaglio plate or a lithographic plate is used, and the printed line portion consisting of an extremely fine pattern with a predetermined film thickness is printed as a pattern recess on the intaglio plate and as a pattern concave portion on the lithographic plate. The process involves making a plate as a pattern plate, curing the curable ink patterned in the recesses of the plate or on the pattern plate, and then transferring the cured ink to the printing material. With conventional printing technology, it was only possible to reproduce prints with a minimum line diameter of 100 to 200 μm, but with a predetermined film thickness, it is possible to reproduce prints with a minimum line thickness of 100 II m.
It is possible to easily print extremely fine line drawings of less than In particular, in the present invention, the ink is cured in an irregular manner so that at least a portion of the surface layer is in an incompletely cured state. Fine patterns can be clearly reproduced in print while the ink is being held, and at the same time, the adhesiveness of the surface layer of the incompletely cured ink can be used to easily and reliably transfer the cured ink to the printing medium, etc. , it is possible to efficiently perform printing with good reproducibility. Furthermore, since the method of the present invention employs the above-described printing means, it is possible to efficiently and inexpensively form fine lines, which conventionally had to be done using expensive and inefficient photoresist. It has become possible. Furthermore, the method of the present invention allows for more stable transfer of cured ink by printing through an adhesive or adhesive layer. Therefore, the printing method of the present invention can be widely applied to the use of fine pattern formation, and can, for example, process and provide glass photomasks, fine printed circuit boards, and other products that require the formation of fine patterns with high precision and at low cost. It is possible and very profitable.
第1図(A)〜(D)は本発明印刷方法の各印刷工程の
一実施例を示す断面略図、第2図(A)〜(E)、第3
図(A)〜(C)及び第4図は本発明方法の印刷工程の
他のL!i様例をそれぞれ示す断面略図である
l・・・印刷用版 2・・・パターン四部3・・
・硬化型インキ
3b・・・不完全硬化表層部 4・・・ドクター5・・
・硬化処理 6・・・硬化インキ7・・・被印刷
体 8・・・ビニル重合抑制剤9・・・中間体
lO・・・接着性又は粘着性層第
1
図
9
中間体
第
2
図FIGS. 1(A) to (D) are schematic cross-sectional views showing one embodiment of each printing process of the printing method of the present invention, FIGS. 2(A) to (E), and 3.
Figures (A) to (C) and Figure 4 show the other L of the printing process of the method of the present invention. A schematic cross-sectional view showing each example of i...Printing plate 2...Four pattern parts 3...
- Curing ink 3b... incompletely cured surface layer part 4... doctor 5...
・Curing treatment 6... Cured ink 7... Printed material 8... Vinyl polymerization inhibitor 9... Intermediate
lO...Adhesive or sticky layer 1 Figure 9 Intermediate Figure 2
Claims (8)
なる印刷用凹版に硬化型インキを塗布してドクターにて
凹部以外のインキを除去して凹部のみにインキを充填さ
せるか、若しくは印刷画線部となる微細なパターン版部
を製版してなる印刷用平版に硬化インキを塗布して該イ
ンキをパターン版部のみに着肉させてパターンニングし
、次いで、熱又は放射線による硬化処理を施して凹版又
は平版上のインキを少なくとも一部表層部が不完全硬化
状態となるように硬化させた後、被印刷体に転写するこ
とを特徴とする微細パターンの印刷方法。(1) Apply curable ink to a printing intaglio plate formed with minute pattern depressions that will become printing image areas, remove ink from areas other than the depressions with a doctor, and fill only the depressions with ink, or A hardening ink is applied to a printing plate made by plate-making a fine pattern plate part that will become a printing image part, and the ink is applied only to the pattern plate part for patterning, and then hardening treatment with heat or radiation. A method for printing fine patterns, which comprises curing the ink on an intaglio or planographic plate so that at least a portion of the surface layer thereof is in an incompletely cured state, and then transferring the ink to a printing medium.
基を有してビニル重合により硬化する樹脂を主材とする
インキを用い、版上で大気と接するインキ表層部を不完
全硬化状態にする請求項1記載の転写方法。(2) A claim in which the curable ink is an ink whose main material is a resin that has an acrylic or methacrylic group and is cured by vinyl polymerization, and the surface layer of the ink in contact with the atmosphere on the plate is brought into an incompletely cured state. 1. The transfer method described in 1.
後、硬化型インキを塗布してパターンニングする請求項
2記載の印刷方法。(3) The printing method according to claim 2, wherein after coating the surface of the intaglio or planographic plate with a vinyl polymerization inhibitor, a curable ink is applied and patterned.
うに硬化させたインキをブランケット等の中間体に一度
転写し、しかる後、被印刷体に再転写する請求項2又は
3記載の印刷方法。(4) Printing according to claim 2 or 3, wherein the ink that has been cured so that at least a portion of the surface layer is in an incompletely cured state is transferred once to an intermediate such as a blanket, and then transferred again to the printing material. Method.
て被印刷体に再転写する際、接着性又は粘着性層を介在
させて転写を行う請求項4記載の印刷方法。(5) The printing method according to claim 4, wherein when the cured ink is retransferred to the printing object via an intermediate such as a blanket, the transfer is performed with an adhesive or adhesive layer interposed.
から行い、大気に接触しているインキ表層部を不完全硬
化状態にする請求項1〜5記載の印刷方法。(6) The printing method according to any one of claims 1 to 5, wherein the curing treatment using ultraviolet rays or visible light is performed from the back side of the plate to bring the ink surface layer that is in contact with the atmosphere into an incompletely cured state.
チック製の剛性を有するものである請求項1〜6記載の
印刷方法。(7) The printing method according to any one of claims 1 to 6, wherein the printing material is made of metal, ceramic, glass, or plastic and has rigidity.
刷体に転写させた後、被印刷体上の硬化インキ層が存在
しない部分にある接着性又は粘着性層を除去する請求項
5〜7記載の印刷方法。(8) A claim in which after the cured ink is transferred to the printing material through the adhesive or sticky layer, the adhesive or sticky layer on the printing material in the area where the cured ink layer does not exist is removed. 7. The printing method described in 5 to 7.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15384289A JP2935852B2 (en) | 1989-06-16 | 1989-06-16 | Fine pattern printing method |
KR1019900008703A KR0153260B1 (en) | 1989-06-16 | 1990-06-14 | Method of printing fine patterns |
CA002019046A CA2019046C (en) | 1989-06-16 | 1990-06-14 | Method of printing fine patterns |
DE69016841T DE69016841T2 (en) | 1989-06-16 | 1990-06-15 | Process for printing fine patterns. |
EP90111352A EP0402942B1 (en) | 1989-06-16 | 1990-06-15 | Method of printing fine patterns |
US07/539,333 US5127330A (en) | 1989-06-16 | 1990-06-18 | Method including treatment of ink on a plate to cause hardening at other than the ink outer surface before printing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15384289A JP2935852B2 (en) | 1989-06-16 | 1989-06-16 | Fine pattern printing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0319889A true JPH0319889A (en) | 1991-01-29 |
JP2935852B2 JP2935852B2 (en) | 1999-08-16 |
Family
ID=15571294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15384289A Expired - Fee Related JP2935852B2 (en) | 1989-06-16 | 1989-06-16 | Fine pattern printing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2935852B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03159781A (en) * | 1989-11-17 | 1991-07-09 | Matsushita Electric Ind Co Ltd | Printing method and printer |
JPH03221484A (en) * | 1990-01-29 | 1991-09-30 | Matsushita Electric Ind Co Ltd | Printing method and printing device |
JPH09318804A (en) * | 1996-05-24 | 1997-12-12 | Sumitomo Rubber Ind Ltd | Production of liquid crystal color filter |
JP2006512744A (en) * | 2002-12-20 | 2006-04-13 | ザ、トラスティーズ オブ プリンストン ユニバーシティ | Device manufacturing method by low pressure cold welding |
US7569153B2 (en) | 2002-05-23 | 2009-08-04 | Lg Display Co., Ltd. | Fabrication method of liquid crystal display device |
CN102700247A (en) * | 2011-03-28 | 2012-10-03 | 海德堡印刷机械股份公司 | Method for generating layer on substrate |
JP2017136719A (en) * | 2016-02-02 | 2017-08-10 | 凸版印刷株式会社 | Printing plate, manufacturing method therefor, manufacturing method of printed article using the same |
-
1989
- 1989-06-16 JP JP15384289A patent/JP2935852B2/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03159781A (en) * | 1989-11-17 | 1991-07-09 | Matsushita Electric Ind Co Ltd | Printing method and printer |
JPH03221484A (en) * | 1990-01-29 | 1991-09-30 | Matsushita Electric Ind Co Ltd | Printing method and printing device |
JPH09318804A (en) * | 1996-05-24 | 1997-12-12 | Sumitomo Rubber Ind Ltd | Production of liquid crystal color filter |
US7569153B2 (en) | 2002-05-23 | 2009-08-04 | Lg Display Co., Ltd. | Fabrication method of liquid crystal display device |
JP2006512744A (en) * | 2002-12-20 | 2006-04-13 | ザ、トラスティーズ オブ プリンストン ユニバーシティ | Device manufacturing method by low pressure cold welding |
CN102700247A (en) * | 2011-03-28 | 2012-10-03 | 海德堡印刷机械股份公司 | Method for generating layer on substrate |
JP2017136719A (en) * | 2016-02-02 | 2017-08-10 | 凸版印刷株式会社 | Printing plate, manufacturing method therefor, manufacturing method of printed article using the same |
Also Published As
Publication number | Publication date |
---|---|
JP2935852B2 (en) | 1999-08-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5127330A (en) | Method including treatment of ink on a plate to cause hardening at other than the ink outer surface before printing | |
CN106030416B (en) | Method for generating surface texture on flexographic printing elements | |
JPH04249189A (en) | Method for forming fine regist pattern | |
JPH0319889A (en) | Printing method of very fine patterns | |
JPH0647895A (en) | Precise printing method and precise printer | |
JPH0648677B2 (en) | Method of forming resist pattern | |
JPH11327124A (en) | Intaglio board with cushioning characteristic and manufacture thereof | |
JPH04202677A (en) | Formation of resist pattern | |
JP2935851B2 (en) | Fine pattern printing method | |
JP2003043672A (en) | Flexographic printing plate with improved printing quality | |
JP3475498B2 (en) | Letterpress and printing method using the same | |
JP3923655B2 (en) | Intaglio with cushioning properties | |
JPH07329441A (en) | Intaglio and printing method using the same | |
JP2966031B2 (en) | Method of forming fine pattern | |
JPH06340053A (en) | Printing plate and printing method | |
JP3376618B2 (en) | Intaglio production method | |
JP3898836B2 (en) | Gravure printing plate | |
JP3321952B2 (en) | Offset printing method | |
JP2648315B2 (en) | Intaglio for forming printed circuit pattern, method of manufacturing the same, and method of forming printed circuit pattern | |
JP4454709B2 (en) | Method for producing a gravure plate having cushioning properties | |
JPH0834156A (en) | Printing plate and printing method | |
JPH05147360A (en) | Forming method for fine pattern | |
JPH11314471A (en) | Intaglio plate material having cushioning property and intaglio plate | |
US20040094055A1 (en) | Gravure sleeve | |
JPH04267151A (en) | Preparation of planographic printing plate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080604 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090604 Year of fee payment: 10 |
|
LAPS | Cancellation because of no payment of annual fees |