JPH0426550U - - Google Patents
Info
- Publication number
- JPH0426550U JPH0426550U JP6751390U JP6751390U JPH0426550U JP H0426550 U JPH0426550 U JP H0426550U JP 6751390 U JP6751390 U JP 6751390U JP 6751390 U JP6751390 U JP 6751390U JP H0426550 U JPH0426550 U JP H0426550U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- wiring board
- printed wiring
- heat
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 4
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6751390U JPH0426550U (pt) | 1990-06-26 | 1990-06-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6751390U JPH0426550U (pt) | 1990-06-26 | 1990-06-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0426550U true JPH0426550U (pt) | 1992-03-03 |
Family
ID=31601148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6751390U Pending JPH0426550U (pt) | 1990-06-26 | 1990-06-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0426550U (pt) |
-
1990
- 1990-06-26 JP JP6751390U patent/JPH0426550U/ja active Pending