JPH0426536U - - Google Patents

Info

Publication number
JPH0426536U
JPH0426536U JP6735190U JP6735190U JPH0426536U JP H0426536 U JPH0426536 U JP H0426536U JP 6735190 U JP6735190 U JP 6735190U JP 6735190 U JP6735190 U JP 6735190U JP H0426536 U JPH0426536 U JP H0426536U
Authority
JP
Japan
Prior art keywords
light emitting
lead frame
emitting diode
support shaft
robot arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6735190U
Other languages
English (en)
Japanese (ja)
Other versions
JP2530948Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990067351U priority Critical patent/JP2530948Y2/ja
Publication of JPH0426536U publication Critical patent/JPH0426536U/ja
Application granted granted Critical
Publication of JP2530948Y2 publication Critical patent/JP2530948Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1990067351U 1990-06-26 1990-06-26 樹脂封止用半導体製造装置 Expired - Lifetime JP2530948Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990067351U JP2530948Y2 (ja) 1990-06-26 1990-06-26 樹脂封止用半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990067351U JP2530948Y2 (ja) 1990-06-26 1990-06-26 樹脂封止用半導体製造装置

Publications (2)

Publication Number Publication Date
JPH0426536U true JPH0426536U (enExample) 1992-03-03
JP2530948Y2 JP2530948Y2 (ja) 1997-04-02

Family

ID=31600848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990067351U Expired - Lifetime JP2530948Y2 (ja) 1990-06-26 1990-06-26 樹脂封止用半導体製造装置

Country Status (1)

Country Link
JP (1) JP2530948Y2 (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6437041U (enExample) * 1987-08-31 1989-03-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6437041U (enExample) * 1987-08-31 1989-03-06

Also Published As

Publication number Publication date
JP2530948Y2 (ja) 1997-04-02

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