JPH04261708A - Cut arranging device for lead terminal in electronic device - Google Patents

Abstract

PURPOSE:To facilitate the change of the width dimension and the alteration of the length dimension of each lead terminal A3 in the following hybrid integrated circuit A, in the case of each lead terminal A3 at the right and left both sides of a hybrid integrated circuit A being arranged by cut in the specified length dimension. CONSTITUTION:Each lead terminal A3 at the right and left both sides are made to be cut by the respective receiving blades 15, 16 and movable type cutting blades 17, 18, at least one part of this receiving blade 15 and cutting blade 17, the receiving blade 16 and cutting blade 18, is composed so as to reciprocate to the other part, while the placing bodies 19, 20 of a hybrid integrated circuit A are provided vertically movably, at the upper part of the above both receiving blades 15, 16.

Description

[Detailed description of the invention]

0001

[Industrial Field of Application] The present invention, for example, as shown in FIG. In an electronic device having a plurality of lead terminals on both left and right sides, such as a hybrid integrated circuit A equipped with a lead terminal A3, each lead terminal A3 on each left and right side edge has a predetermined length dimension. This relates to a device for trimming into L lengths.

0002

2. Description of the Related Art Conventionally, this type of trimming device has been used to cut and align the lower side of a hybrid integrated circuit A, as shown in FIG.
After inserting the fixed receiving blade 1 configured as shown in FIG.
, 3 back and forth in unison, each lead terminal A3 on the left and right side edges of the hybrid integrated circuit A is
are configured to be trimmed to a predetermined length L.

0003

[Problems to be Solved by the Invention] By the way, in the electronic device such as the hybrid integrated circuit A, the model is as follows.
Since there are many types of electronic devices, the width W of the electronic device such as the hybrid integrated circuit A differs depending on the various models, and the length L of each lead terminal A3 also varies depending on the various models. They are different.

On the other hand, in the conventional trimming and alignment device, a fixed type receiving blade 1 is inserted under the hybrid integrated circuit A, and a pair of cutting blades arranged on the left and right sides of the receiving blade 1 are connected to the fixed receiving blade 1. Since the blades 2 and 3 are used to cut the lead terminals A3 on both the left and right sides to a predetermined length L, this conventional device has the following advantages: (1). When the width W and the length L of each lead terminal A3 change depending on the type of electronic device such as the hybrid integrated circuit A handled, the receiving blade 1 is changed to the width W1 and the height of the receiving blade 1. It is necessary to replace the receiving blade 1 one by one so that the dimension L1 is set according to the width dimension W of the hybrid integrated circuit A and the length dimension L of each lead terminal A3, and it takes a lot of effort to replace the receiving blade 1. It is extremely inefficient because it requires ■． Since it is necessary to prepare a large number of receiving blades 1 with different width dimensions W1 and height dimensions L1, the price of the device increases significantly. There was a problem. The technical object of the present invention is to provide a trimming device that eliminates these problems.

[0005]

[Means for Solving the Problems] In order to achieve this technical object, the present invention inserts a pair of left and right receiving blades into the lower side of an electronic device such as a hybrid integrated circuit, and each of the two receiving blades is attached to separately constructed support stands, at least one of the support stands is configured to reciprocate with respect to the other support stand, and each of the support stands further includes:
A movable cutting blade is provided to cut each lead terminal of the electronic device such as the hybrid integrated circuit with a receiving blade on the support base, while a movable cutting blade is provided above both receiving blades to cut the respective lead terminals of the electronic device such as the hybrid integrated circuit. The mounting body for the electronic device is configured to be movable up and down.

[0006]

[Operation] In this configuration, an electronic device such as a hybrid integrated circuit is mounted on the top surface of the mounting body with the lead terminals on both the left and right sides of the electronic device facing downward, and then By moving a movable cutting blade forward toward both receiving blades on the lower side of the electronic device, each lead terminal on both left and right sides of the electronic device is cut by the both cutting blades and both receiving blades. The length dimension of each lead terminal on both the left and right sides after this cutting is the height from the cut surface by the double cutting blade and the double receiving blade to the top surface of the mounting table on which the electronic device is placed. be equal to the dimensions. In this case, the mounting body for the electronic device is configured to be movable up and down, and by moving the mounting body up and down, the length dimension of each lead terminal on both left and right sides of the electronic device can be arbitrarily adjusted. can be increased or decreased. Further, by configuring at least one of the two support stands each having a receiving blade and a cutting blade to reciprocate with respect to the other support stand, this reciprocating movement causes the two receiving blades to Since the distance between the two receiving blades and the cutting blade can be increased or decreased, it is possible to follow the increase or decrease in the width of the electronic device.

[0007]

[Effects of the Invention] According to the present invention, when each lead terminal on both the left and right sides of an electronic device such as a hybrid integrated circuit is trimmed to a predetermined length dimension, it is possible to cut the lead terminals on both sides of an electronic device such as a hybrid integrated circuit to a predetermined length dimension. , if the width dimension and the length dimension of each lead terminal are changed, the mounting body of the electronic device may be moved up and down, or at least one of the two support stands may be reciprocated accordingly. Since there is no need to replace the catch blades one by one as in the conventional method, work efficiency can be greatly improved as the model changes. Since there is no need to prepare a large number of receiving blades with different sizes, the cost of the device can be significantly reduced.

[0008]

[Example] The following is an example of the present invention in the drawings (Figs. 1 to 8).
I will explain about it. In this figure, reference numeral 10 indicates a machine base, and a first support base 11 is fixed to the upper surface of the machine base 10, and a second support base 12 is attached to the first support base 11. The second support stand 12 is mounted so as to be reciprocally movable, and the second support stand 12 has a screw shaft 13 pivotally supported on the upper surface of the machine stand 10, for example.
It is configured to reciprocate by turning the handle 14. On the upper surfaces of both the support stands 11 and 12,
Receptacle blades 15 and 16 are respectively fixed to the portions of the support stands 11 and 12 adjacent to each other, and these receptacle blades 15
, 16, movable cutting blades 17, 18 are provided in a reciprocating manner. (not shown), it is configured to reciprocate with respect to each of the receiving blades 15 and 16.

Reference numerals 19 and 20 denote the double receiving blades 15,
The hybrid integrated circuit A is mounted on the upper surface of both the mounting bodies 19 and 20, and each lead terminal A3 on the left and right sides thereof is shown.
Place it so that it is facing downwards. Then, one of the mounting bodies 19 and 20 is placed on the second mounting body 20.
A pair of upper and lower bearing bodies 21
It is fixed and supported at the tip of a support rod 22 which is supported vertically movably through the support rod 22. Further, a support rod 23 is protruded downward from the lower surface of the other one of the two mounting bodies 19 and 20, and the support rod 23 is supported by a screw that is pivotally supported on the side surface of the first support base 11. The other mounting body 19 is supported by being fixed to a nut body 25 screwed onto the shaft 24, and the threaded shaft 24 is provided on a shaft 27 that interlocks therewith via a pair of bevel gears 26. By turning the handle 28, the other mounting body 19 is configured to move up and down. At this time, an interlocking rod 29 that protrudes horizontally and laterally from the nut body 25 is attached to a pair of rollers 30 and 3 that protrudes from the side surface of the support rod 22 for the one mounting body 20.
1, by inserting the interlocking rod 29 so as to be freely movable in the longitudinal direction, the one mounting body 20 can be moved between the two supporting bases 12, no matter what reciprocating position the second support base 12 is in. It is configured to move up and down simultaneously with the mounting body 19.

[0010] In this configuration, the second support stand 12 is
By moving back and forth with respect to the first support stand 11, the interval between the receiving blades 15 and 16 is adjusted to the width dimension W of the hybrid integrated circuit A, and then both the mounting bodies 19,
After placing the hybrid integrated circuit A on the upper surface of the hybrid integrated circuit A with the lead terminals A3 on both the left and right sides thereof facing downward, the cutting blades 17 and 18 of the support stands 11 and 12 are cut into As shown in FIG. 3, by moving forward toward the receiving blades 15 and 16, the lead terminals A3 on both the left and right sides of the hybrid integrated circuit A can be cut simultaneously. The length dimension L of A3 is measured from the upper surface of both the mounting bodies 19, 20 to the receiving blades 15, 16 and the cutting blade 17,
It can be trimmed to a size equal to the height dimension H up to the cut surface with 18.

Then, by rotating the handle 28, the mounting bodies 19, 20 are moved downward as shown in FIG. 16 and the cutting surfaces of the cutting blades 17 and 18 are as low as H1, each lead terminal A3 on both the left and right sides can be trimmed to a short length dimension. 19, 20, handle 2
8, as shown in FIG. 6, the height dimension from the upper surface of both the mounting bodies 19, 20 to the cutting surface of the receiving blades 15, 16 and the cutting blades 17, 18 is increased. is as high as H2, so each lead terminal A3 on both the left and right sides can be trimmed to a long length by vertically moving the mounting bodies 19 and 20. The dimension L can be freely increased or decreased.

On the other hand, when the hybrid integrated circuit A to be handled is changed to one with a narrow width dimension W, the second support stand 12 is rotated by rotating the handle 14, as shown in FIG.
As shown in FIG. As shown in FIG. 8, by retracting from the first support stand 11 by operation, it is possible to accommodate a hybrid integrated circuit A having a wide width dimension W.

[0013] In the above embodiment, the second support stand 12 is configured to reciprocate, but the first reciprocating stand 11 may be configured to reciprocate, or both Support stand 1
Both of the mounting bodies 19 and 20 may be configured to reciprocate, and by making one of the mounting bodies 19 and 20 wide, the other mounting body may be configured to move back and forth. The mounting body can be abolished.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a hybrid integrated circuit.

FIG. 2 is a partially cutaway front view of the embodiment device of the present invention.

FIG. 3 is a plan view of FIG. 2;

FIG. 4 is a diagram showing a state in which the lead terminal is cut.

FIG. 5 is a diagram showing the lead terminals being trimmed into short lengths.

FIG. 6 is a diagram showing a state in which lead terminals are trimmed to a long length.

FIG. 7 is a diagram showing a state where the present invention is applied to a hybrid integrated circuit with a narrow width dimension.

FIG. 8 is a diagram showing a state where the present invention is applied to a hybrid integrated circuit having a wide width.

FIG. 9 is a diagram showing a conventional device.

FIG. 10 is a perspective view of a receiving blade in a conventional device.

[Explanation of symbols]

A Hybrid integrated circuit A3
Lead terminal 10
Machine bases 11, 12 Support base 13 Screw shaft 14 Handle 15, 16 Receiving blade 17, 18 Movable cutting blade 19, 20 Mounting body 22, 23 Support rod 24 Screw shaft 28 Handle 29 Interlocking rod

Claims (1)

[Claims] Claim 1: A pair of left and right receiving blades is inserted into the lower side of an electronic device such as a hybrid integrated circuit, and each of the receiving blades is attached to a support stand constructed separately, and one of the support stands is provided with a pair of left and right receiving blades. At least one of the support stands is configured to reciprocate with respect to the other support stand; A movable cutting blade for cutting the lead terminal is provided, and a mounting body for the electronic device such as the hybrid integrated circuit is disposed above the receiving blades so as to be movable up and down. A device for trimming and aligning lead terminals in electronic devices.