CN114833276A - Pin cutting device for semiconductor diode production and processing - Google Patents
Pin cutting device for semiconductor diode production and processing Download PDFInfo
- Publication number
- CN114833276A CN114833276A CN202210342498.4A CN202210342498A CN114833276A CN 114833276 A CN114833276 A CN 114833276A CN 202210342498 A CN202210342498 A CN 202210342498A CN 114833276 A CN114833276 A CN 114833276A
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- support
- supporting seat
- semiconductor diode
- seat
- supporting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F11/00—Cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F23/00—Feeding wire in wire-working machines or apparatus
- B21F23/002—Feeding means specially adapted for handling various diameters of wire or rod
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F23/00—Feeding wire in wire-working machines or apparatus
- B21F23/005—Feeding discrete lengths of wire or rod
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
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Abstract
The invention discloses a pin cutting device for semiconductor diode production and processing, which comprises a fixed bottom plate, wherein support columns are arranged at the two transverse ends of the upper part of the fixed bottom plate, a rotating shaft is arranged between the support columns, a movable support seat is connected to one longitudinal side of the rotating shaft at the upper part of the fixed bottom plate in a sliding manner, a first support frame is arranged at the upper part of the movable support seat, a movable assembly is arranged at one transverse end of the movable support seat, a driving motor is arranged on the outer surface of one side of each support column, and the driving motor penetrates through the support columns and is connected with the rotating shaft. The invention has the beneficial effects that: the invention has reasonable design, simple and stable structure and strong practicability; the pin cutting machine can cut off pins of a plurality of semiconductor diodes simultaneously, can ensure the position stability of the semiconductor diodes in the processes of rotation and pin cutting, is suitable for cutting off the pins of the semiconductor diodes with different specifications and sizes, and improves the application range of the pin cutting machine.
Description
Technical Field
The invention relates to the technical field of semiconductor diode production and processing, in particular to a pin cutting device for semiconductor diode production and processing.
Background
Diodes, electronic components, a device with two electrodes, allow current to flow only in a single direction, and many applications use the rectifying function. The diodes are provided with pins, so that the diodes can be conveniently connected into a circuit, and when the diodes are produced in practice, the pins of the diodes need to be cut in the production process before leaving factories, so that the diodes can be conveniently used.
The conventional diode pin cutting device has certain defects, is simple and unstable in whole, has low cutting efficiency and inconvenient operation, has poor precision of the length of a cut pin, cannot ensure the consistency of the length, and needs to be further developed and improved.
Disclosure of Invention
The invention aims to provide a pin cutting device for producing and processing a semiconductor diode, which aims to solve the problems that the existing diode pin cutting device is simple and unstable in whole, low in cutting efficiency and inconvenient to operate, and the length precision of a cut pin is poor and the length consistency cannot be ensured.
The invention realizes the purpose through the following technical scheme: a pin cutting device for semiconductor diode production and processing comprises a fixed bottom plate, wherein support columns are arranged at the two transverse ends of the upper part of the fixed bottom plate, a rotating shaft is arranged between the support columns, the upper part of the fixed bottom plate is positioned at one longitudinal side of the rotating shaft and is connected with a movable support seat in a sliding manner, a first support frame is arranged at the upper part of the movable support seat, a movable assembly is arranged at one transverse end of the movable support seat, a driving motor is arranged on the outer surface of one side of the support columns, penetrates through the support columns to be connected with the rotating shaft, a support seat is arranged at the top of the rotating shaft, a plurality of placing grooves are arranged at equal intervals on the support seat, a limiting assembly is arranged at one longitudinal side of the support seat, a cutting assembly is longitudinally close to one side surface of the rotating shaft and is connected with a cutting assembly in a sliding manner, lifting devices are arranged at the two transverse ends of the bottom of the cutting assembly, the support column is located all be provided with rectangle fretwork spout above the supporting seat, be provided with the pin between the rectangle fretwork spout and right the board, support column one side is provided with controlling means.
Furthermore, the supporting columns are connected with the fixed bottom plate, the rotating shaft is connected with the supporting seat, and the first supporting frame is connected with the movable supporting seat in a welding mode.
Further, the driving motor and the lifting device are electrically connected with the control device.
Further, the moving assembly comprises a rotating motor and a transmission rack, the rotating motor is installed on the upper portion of the moving support seat, the rotating motor is provided with a gear, the transmission rack is installed on the upper portion of the fixed bottom plate, the transmission rack is meshed with the gear, and the rotating motor is electrically connected with the control device.
Further, spacing subassembly includes second support frame and arc limiting plate, the second support frame is installed the vertical side surface of supporting seat, the arc limiting plate is located the standing groove is inboard, the second support frame with be provided with the connecting plate between the supporting seat, the connecting plate is close to a supporting seat side surface equidistance is provided with a plurality of connecting rods, connecting rod one end is passed the supporting seat with the arc limiting plate is connected, the second support frame is kept away from supporting seat one side is provided with first cylinder, first cylinder passes the second support frame with the connecting plate is connected, first cylinder with controlling means electric connection, arc limiting plate surface with the standing groove internal surface all is provided with the protective layer that the rubber material was made.
Further, decide the subassembly including go up and down to decide brace table and third support frame, go up and down to decide brace table with first support frame sliding connection, third support frame bottom both ends with go up and down to decide brace table top and be connected, third support frame top is provided with the second cylinder, the second cylinder passes the third support frame is installed and is cut the sword, go up and down to decide the horizontal both ends in brace table bottom with elevating gear is connected.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention has reasonable design, simple and stable structure and strong practicability; the pins of the semiconductor diodes can be cut off and processed at the same time, the semiconductor is convenient to take and place, and the cutting efficiency of the pins of the semiconductor diodes is greatly improved;
2. the arranged limiting assembly is matched with the placing groove, so that the position stability of the semiconductor diode in the processes of rotation and pin cutting can be ensured, the displacement generated in the processes of rotation and pin cutting of the semiconductor diode is avoided, the length precision of the cut pin is ensured, and the length consistency of the pin is further ensured;
3. the arranged limiting assembly is matched with the placing groove, so that the semiconductor diodes with different specifications and sizes can be fixedly limited, the semiconductor diodes with different specifications and sizes can be suitable for cutting off pins, and the application range of the semiconductor diodes is improved;
4. Through the removal subassembly that sets up, remove supporting seat, first support frame, decide subassembly and elevating gear and can be convenient for cut off the semiconductor diode pin of different thicknesses and different length dimensions according to the demand, further improve the scope of use and the convenience of operation.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic perspective view of another embodiment of the present invention;
FIG. 3 is an enlarged view of portion A of FIG. 1;
FIG. 4 is an enlarged view of portion B of FIG. 1;
fig. 5 is an enlarged view of a portion C in fig. 2.
In the figure: 1-a fixed bottom plate, 2-supporting columns, 3-a rotating shaft, 4-a movable supporting seat, 5-a first supporting frame, 6-a movable assembly, 7-a driving motor, 8-a supporting seat, 9-a placing groove, 10-a limiting assembly, 11-a cutting assembly, 12-a lifting device, 13-a rectangular hollow chute, 14-a pin aligning plate and 15-a control device;
601-rotating motor, 602-transmission rack, 603-gear;
101-a second support frame, 102-an arc limiting plate, 103-a connecting plate, 104-a connecting rod and 105-a first cylinder;
111-lifting cutting support platform, 112-third support frame, 113-second cylinder and 114-cutting knife.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Referring to FIGS. 1 to 5, a pin cutting device for semiconductor diode production and processing comprises a fixed base plate 1, wherein support columns 2 are arranged at both transverse ends of the upper portion of the fixed base plate 1, a rotating shaft 3 is arranged between the support columns 2, a movable support seat 4 is slidably connected to one longitudinal side of the rotating shaft 3 at the upper portion of the fixed base plate 1, a first support frame 5 is arranged at the upper portion of the movable support seat 4, a moving assembly 6 is arranged at one transverse end of the movable support seat 4, a driving motor 7 is arranged on the outer surface of one side of each support column 2, the driving motor 7 penetrates through the support columns 2 to be connected with the rotating shaft 3, a support seat 8 is arranged at the top of the rotating shaft 3, a plurality of placing grooves 9 are equidistantly arranged on the support seat 8, a limiting assembly 10 is arranged at one longitudinal side of the support seat 8, a cutting assembly 11 is slidably connected to the surface of one longitudinal side close to the rotating shaft 3, lifting devices 12 are arranged at both transverse ends of the bottom of the cutting assembly 11, the support column 2 is located and all is provided with rectangle fretwork spout 13 above the supporting seat 8, is provided with pin aligning plate 14 between the rectangle fretwork spout 3, and support column 2 one side is provided with controlling means 15.
The supporting columns 2 and the fixed bottom plate 1, the rotating shaft 3 and the supporting seat 8 and the first supporting frame 5 and the movable supporting seat 4 are connected in a welding mode, so that the firmness of integral connection is improved, and the stability of the integral structure is ensured; drive motor 7 and elevating gear 12 all with controlling means 15 electric connection, be convenient for control drive motor 7 and elevating gear 12's operating condition, wherein the preferred servo motor of drive motor 7, elevating gear 12 can select for use arbitrary one in pneumatic cylinder, electric telescopic handle or the servo electric jar according to actual conditions.
Remove subassembly 6 and include rotating electrical machines 601 and driving rack 602, rotating electrical machines 601 is installed on 4 upper portions of movable support seat, rotating electrical machines 601 is provided with gear 603, driving rack 602 is installed on 1 upper portion of PMKD, driving rack 602 meshes with gear 603 mutually, rotating electrical machines 601 and controlling means 15 electric connection, be convenient for control movable support seat 4 is along the vertical reciprocating motion of PMKD 1, and then realize that the control goes up and down to decide the vertical position of platform 111, the different length of semiconductor diode pin is decided in the adjustment.
The limiting component 10 comprises a second supporting frame 101 and an arc limiting plate 102, the second supporting frame 101 is installed on one side surface of the supporting seat 8 in the longitudinal direction, the arc limiting plate 102 is located on the inner side of the placing groove 9, a connecting plate 103 is arranged between the second supporting frame 101 and the supporting seat 8, a plurality of connecting rods 104 are equidistantly arranged on one side surface of the connecting plate 103 close to the supporting seat 8, one ends of the connecting rods 104 penetrate through the supporting seat 8 to be connected with the arc limiting plate 102, a first air cylinder 105 is arranged on one side of the second supporting frame 101 far away from the supporting seat 8, the first air cylinder 105 penetrates through the second supporting frame 101 to be connected with the connecting plate 103, the first air cylinder 105 is electrically connected with the control device 15, protective layers made of rubber materials are arranged on the outer surface of the arc limiting plate 102 and the inner surface of the placing groove 9 and used for fixing the semiconductor diode placed in the placing groove 9 and ensuring the position stability of the semiconductor diode when the semiconductor diode rotates and cuts pins, meanwhile, the semiconductor diode is placed in the placing groove 9, and the bottom of the semiconductor diode is in contact with the bottom of the placing groove 9, so that the pins of the semiconductor diode are cut to be consistent in size.
The cutting component 11 comprises a lifting cutting support platform 111 and a third support frame 112, the lifting cutting support platform 11 is connected with the first support frame 5 in a sliding way, two ends of the bottom of the third support frame 112 are connected with the top of the lifting cutting support platform 111, a second air cylinder 113 is arranged at the top of the third support frame 112, a cutting knife 114 is arranged on the second air cylinder 113 through the third support frame 112, the transverse two ends of the bottom of the lifting cutting support platform 111 are connected with a lifting device 12, so that different heights of the lifting cutting support platform 111 can be adjusted, the lifting cutting support platform 111 is in contact with the pins of the semiconductor diode after rotation, support semiconductor diode pin, then drive through second cylinder 113 and cut sword 114 and to semiconductor diode pin, can decide a plurality of semiconductor diode's pin simultaneously, further guarantee that semiconductor diode pin decides the uniformity of size, improve work efficiency simultaneously.
The working principle is as follows: when the cutting support is used, the support seat is adjusted to be right above the rotating shaft, the first cylinder drives the arc limiting plate to return, then the semiconductor diode to be cut and processed can be placed in the placing groove, the semiconductor diode is placed in a mode that the pins face upwards, then the pin aligning plate is moved, all the semiconductor diode pins are located on the same surface, then the first cylinder is controlled to drive the arc limiting plate to move forwards, the semiconductor diode is fixed and limited, then the pin aligning plate is pulled out, the driving motor is controlled to rotate, the support seat drives the semiconductor diode to rotate 90 degrees towards the direction of the cutting assembly, then the movable support seat is moved to a specified position towards the direction of the semiconductor diode under the matching of the movable assembly (the movable position is determined according to the length of the pins to be cut), then the lifting cutting support platform is driven by the lifting device to ascend, and the top of the lifting cutting support platform is in contact with the pins of the semiconductor diode, then, the pins of the semiconductor diode can be cut off by the cutting knife under the driving of the second cylinder.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. The utility model provides a pin cutting device is used in semiconductor diode production and processing, includes PMKD (1), its characterized in that: PMKD (1) upper portion horizontal both ends all are provided with support column (2), be provided with rotation axis (3) between support column (2), PMKD (1) upper portion is located vertical one side sliding connection of rotation axis (3) has movable support seat (4), movable support seat (4) upper portion is provided with first support frame (5), the horizontal one end of movable support seat (4) is provided with removal subassembly (6), support column (2) one side surface is provided with driving motor (7), driving motor (7) pass support column (2) with rotation axis (3) are connected, rotation axis (3) top is provided with supporting seat (8), supporting seat (8) equidistance is provided with a plurality of standing grooves (9), vertical one side of supporting seat (8) is provided with spacing subassembly (10), vertically be close to first support frame (5) rotation axis (3) one side surface sliding connection has decides group's of deciding Piece (11), decide horizontal both ends in subassembly (11) bottom and all be provided with elevating gear (12), support column (2) are located supporting seat (8) top all is provided with rectangle fretwork spout (13), be provided with pin aligning board (14) between rectangle fretwork spout (3), support column (2) one side is provided with controlling means (15).
2. The pin cutting device for the production and processing of the semiconductor diode as claimed in claim 1, wherein the supporting column (2) and the fixed base plate (1), the rotating shaft (3) and the supporting seat (8), and the first supporting frame (5) and the movable supporting seat (4) are connected by welding.
3. The pin cutting device for the production and processing of the semiconductor diode as claimed in claim 1, wherein the driving motor (7) and the lifting device (12) are electrically connected with the control device (15).
4. The pin cutting device for the production and processing of the semiconductor diode according to claim 1, wherein the moving assembly (6) comprises a rotating motor (601) and a transmission rack (602), the rotating motor (601) is installed on the upper portion of the moving support seat (4), the rotating motor (601) is provided with a gear (603), the transmission rack (602) is installed on the upper portion of the fixed bottom plate (1), the transmission rack (602) is meshed with the gear (603), and the rotating motor (601) is electrically connected with the control device (15).
5. The pin cutting device for the production and processing of the semiconductor diode according to claim 1, wherein the limiting component (10) comprises a second supporting frame (101) and an arc-shaped limiting plate (102), the second supporting frame (101) is installed on one longitudinal side surface of the supporting seat (8), the arc-shaped limiting plate (102) is located on the inner side of the placing groove (9), a connecting plate (103) is arranged between the second supporting frame (101) and the supporting seat (8), a plurality of connecting rods (104) are equidistantly arranged on one side surface of the connecting plate (103) close to the supporting seat (8), one end of each connecting rod (104) penetrates through the supporting seat (8) to be connected with the arc-shaped limiting plate (102), a first air cylinder (105) is arranged on one side of the second supporting frame (101) far away from the supporting seat (8), and the first air cylinder (105) penetrates through the second supporting frame (101) to be connected with the connecting plate (103), the first air cylinder (105) is electrically connected with the control device (15), and protective layers made of rubber materials are arranged on the outer surface of the arc-shaped limiting plate (102) and the inner surface of the placing groove (9).
6. The pin cutting device for the production and processing of the semiconductor diode according to claim 1, wherein the cutting component (11) comprises a lifting cutting support table (111) and a third support frame (112), the lifting cutting support table (11) is in sliding connection with the first support frame (5), two ends of the bottom of the third support frame (112) are connected with the top of the lifting cutting support table (111), a second cylinder (113) is arranged at the top of the third support frame (112), the second cylinder (113) penetrates through the third support frame (112) to be provided with a cutting knife (114), and two transverse ends of the bottom of the lifting cutting support table (111) are connected with the lifting device (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210342498.4A CN114833276A (en) | 2022-04-02 | 2022-04-02 | Pin cutting device for semiconductor diode production and processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210342498.4A CN114833276A (en) | 2022-04-02 | 2022-04-02 | Pin cutting device for semiconductor diode production and processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114833276A true CN114833276A (en) | 2022-08-02 |
Family
ID=82563715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210342498.4A Withdrawn CN114833276A (en) | 2022-04-02 | 2022-04-02 | Pin cutting device for semiconductor diode production and processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114833276A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116532581A (en) * | 2023-05-16 | 2023-08-04 | 江苏晟驰微电子有限公司 | Quick recovery diode processingequipment with soft recovery characteristic |
| CN116786721A (en) * | 2023-08-18 | 2023-09-22 | 苏州弘磊光电有限公司 | LED production equipment |
-
2022
- 2022-04-02 CN CN202210342498.4A patent/CN114833276A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116532581A (en) * | 2023-05-16 | 2023-08-04 | 江苏晟驰微电子有限公司 | Quick recovery diode processingequipment with soft recovery characteristic |
| CN116532581B (en) * | 2023-05-16 | 2023-11-07 | 江苏晟驰微电子有限公司 | Quick recovery diode processingequipment with soft recovery characteristic |
| CN116786721A (en) * | 2023-08-18 | 2023-09-22 | 苏州弘磊光电有限公司 | LED production equipment |
| CN116786721B (en) * | 2023-08-18 | 2023-11-14 | 苏州弘磊光电有限公司 | LED production equipment |
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| PB01 | Publication | ||
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20220802 |
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| WW01 | Invention patent application withdrawn after publication |