JPH0425721B2 - - Google Patents
Info
- Publication number
- JPH0425721B2 JPH0425721B2 JP57221146A JP22114682A JPH0425721B2 JP H0425721 B2 JPH0425721 B2 JP H0425721B2 JP 57221146 A JP57221146 A JP 57221146A JP 22114682 A JP22114682 A JP 22114682A JP H0425721 B2 JPH0425721 B2 JP H0425721B2
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- integrated circuit
- circuit boards
- metal carrier
- millimeter wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 230000005540 biological transmission Effects 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
Landscapes
- Structure Of Printed Boards (AREA)
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22114682A JPS59111401A (ja) | 1982-12-17 | 1982-12-17 | マイクロ波ミリ波集積回路の構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22114682A JPS59111401A (ja) | 1982-12-17 | 1982-12-17 | マイクロ波ミリ波集積回路の構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59111401A JPS59111401A (ja) | 1984-06-27 |
JPH0425721B2 true JPH0425721B2 (de) | 1992-05-01 |
Family
ID=16762182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22114682A Granted JPS59111401A (ja) | 1982-12-17 | 1982-12-17 | マイクロ波ミリ波集積回路の構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59111401A (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69107082T2 (de) * | 1991-11-16 | 1995-05-24 | Hewlett Packard Gmbh | Eine Verbinderanordnung zur lösbaren Verbindung zwischen zwei Leiterstreifen. |
EP1180918B1 (de) * | 2000-08-16 | 2010-01-27 | Ericsson AB | Verfahren zur Abgabe eines Klebstoffs auf einem Leiterplattenträgerelement und so hergestellte Leiterplatte |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6110321Y2 (de) * | 1980-11-17 | 1986-04-03 |
-
1982
- 1982-12-17 JP JP22114682A patent/JPS59111401A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59111401A (ja) | 1984-06-27 |
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