JPH04256348A - Cooling module structure - Google Patents

Abstract

PURPOSE:To simplify the structure of a ceramic board and to enhance its relibility when an electronic component is cooled via the ceramic board by a method wherein a specific cold plate provided with a flow passage coming into contact with the back of the ceramic board is installed on the back of the ceramic board. CONSTITUTION:Electronic components 4 mounted on a ceramic board 1 are cooled from the side of the ceramic board 1 by conducting their heat. At such a cooling module structure, a cold plate 2 which is provided with flow passages 8 coming into contact with the back 1a of the ceramic board 1, which holds the ceramic board 1 so as to surround it and which is provided with nipples 7 used to supply and discharge a coolant is installed on the back 1a of the ceramic board 1. For example, grooves are formed in a gold plate 2 on a face coming into contact with the back 1a of a ceramic board 1, and flow passages 8 as passages of a coolant when they come into contact with the ceramic board 1 are formed. It is desirable that the flow passages 8 are formed so as to correspond to mounting rows of LSI's 4 mounted on the ceramic board 1.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling module structure, and more particularly to a cooling module structure in which electronic components are cooled by heat conduction from the back side of a board on which electronic components are mounted.

0002

[Prior Art] When electronic components (hereinafter referred to as LSI) mounted on a ceramic substrate are cooled, cooling is performed by placing a cooling element in contact with the surface of the LSI, and cooling is performed via the ceramic substrate. There are cases.

Conventionally, as shown in FIG. 2, a nipple 24 to which a refrigerant is supplied or discharged is attached to the ceramic substrate 20 itself, and a flow path 23 through which the refrigerant flows is formed inside the ceramic substrate 20. ing.

Further, bonding pads 22 are provided at the edges of the ceramic substrate 20. In the above configuration, L
SI is SiC, which is the material of the ceramic substrate 30, by the coolant flow path 23 provided inside the ceramic substrate 20.
, BeO, AlN, or the like.

[0005]

[Problems to be Solved by the Invention] However, conventionally, the inside of a ceramic substrate has a structure in which a flow path is provided in addition to a normal wiring pattern, resulting in a complicated shape and
There is a problem that cracks are likely to occur in the flow path portion.

Furthermore, since the nipple is directly attached to the ceramic substrate, the reliability of the attachment is not high.

[0007] Accordingly, an object of the present invention is to simplify the structure and improve the reliability of a ceramic substrate when electronic components are cooled through the ceramic substrate.

[0008]

[Means for Solving the Problems] The above object is to provide a cooling module structure in which electronic components mounted on a ceramic substrate are cooled by heat conduction from the ceramic substrate side.
A cold plate is provided on the back surface of the ceramic substrate, the cold plate having a flow path in contact with the back surface of the ceramic substrate, and a nipple that surrounds and holds the ceramic substrate and supplies and discharges a coolant. This can be achieved by featuring a cooling module structure.

[0009]

[Operation] That is, according to the present invention, a refrigerant flow path is provided from the back surface of a ceramic substrate on which electronic components are mounted, and is in contact with the back surface, and a portion that surrounds and holds the ceramic substrate and a portion thereof It is in contact with a cold plate having nipples to which refrigerant is supplied or discharged.

[0010] Therefore, since the refrigerant flow path is separate from the ceramic substrate and the nipple is also attached to the cold plate rather than the ceramic substrate, the structure of the ceramic substrate itself is simplified and reliability is improved.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described in detail below with reference to FIG.

FIG. 1 is a diagram showing an embodiment of the present invention. As shown in FIG. 1, a cold plate 2 is attached to a back surface 1a of a ceramic substrate 1, which has an LSI 4 mounted on its mounting surface and has bonding pads 5 for connecting external terminals at its edges.

The cold plate 2 surrounds and holds the end of the ceramic substrate 1 with a frame 2a, and furthermore, the cold plate 2 and the ceramic substrate 1 are fixed using a substrate holder 3 and fastened with bolts 6.

On the other hand, a nipple 7 is attached to the cold plate 2 and serves as a connection point for supplying refrigerant to or discharging refrigerant to a flow path 8, which will be described later.

A groove is formed in the cold plate 2 on the surface that contacts the back surface 1a of the ceramic substrate 1, and a channel 8 is formed in contact with the ceramic substrate 1 to serve as a passage for the coolant.

It is desirable that the flow path 8 be formed corresponding to the mounting row of the LSI 4 mounted on the ceramic substrate 1.

A seal 9 is provided around the entire edge where the cold plate 2 and the ceramic substrate 1 are in contact.

Cooling module 2 configured as described above
When the refrigerant is supplied from the destination nipple 7, the refrigerant passes through the flow path 8. Here, the heat emitted from the LSI 4 is exchanged with the coolant in the flow path 8 via the ceramic substrate 1, and the LSI 4 is cooled. Thereafter, the warmed refrigerant is discharged to the discharge destination nipple 7.

[0019]

[Effects of the Invention] As described above, in the present invention, since the edge of the ceramic substrate is surrounded and held by the cold plate, reliability in terms of strength of the ceramic substrate is improved, and there is no wiring inside the ceramic substrate. Since only a pattern is provided, the thickness of the board is constant and there is no need to worry about cracks, resulting in simplification and improved reliability of the ceramic board. Furthermore, as a matter of course, pattern density is also improved.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing an embodiment of the present invention.

FIG. 2 is a diagram showing a conventional example.

[Explanation of symbols]

1 Ceramic substrate 2 Cold plate 4 Electronic components (LSI) 7 Nipple 8 Flow path

Claims (1)

[Claims] 1. A cooling module structure in which an electronic component (4) mounted on a ceramic substrate (1) is cooled from the ceramic substrate (1) side by heat conduction. Flow path (8) in contact with 1a)
A cold plate (2) having a nipple (7) that surrounds and holds the ceramic substrate (1) and supplies and discharges a coolant is attached to the back surface (1a) of the ceramic substrate (1). ) A cooling module structure characterized by being provided with.