JPH0425199A - Case structure of radio device - Google Patents
Case structure of radio deviceInfo
- Publication number
- JPH0425199A JPH0425199A JP12982790A JP12982790A JPH0425199A JP H0425199 A JPH0425199 A JP H0425199A JP 12982790 A JP12982790 A JP 12982790A JP 12982790 A JP12982790 A JP 12982790A JP H0425199 A JPH0425199 A JP H0425199A
- Authority
- JP
- Japan
- Prior art keywords
- case
- printed board
- housing
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 13
- 238000005476 soldering Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は無線装置の筺体構造に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a housing structure of a wireless device.
従来の無線装置の筺体構造について、第3図を参照して
説明する。The housing structure of a conventional wireless device will be explained with reference to FIG.
送信フィルタと受信フィルタとに分離された送受分波器
(図示せず)の受信フィルタ入力端子2aと送信フィル
タ出力端子]bをマイクロストリップライン3にて接続
し、アンテナ端子4とする。このとき、送信フィルタで
は、入力端子1aからマイクロストリップライン3へ送
信周波数の2倍、3倍等の周波数の電磁波が飛び込み、
送信スプリアス特性を悪化させることがある。また、受
信フィルタでは、マイクロストリップライン3より出力
端子2bへ送信波が飛び込み送信時感度特性を劣化させ
ることがある。A receiving filter input terminal 2a and a transmitting filter output terminal ]b of a transmitting/receiving duplexer (not shown) separated into a transmitting filter and a receiving filter are connected by a microstrip line 3 to form an antenna terminal 4. At this time, in the transmission filter, electromagnetic waves with a frequency twice or three times the transmission frequency jump from the input terminal 1a to the microstrip line 3.
This may worsen transmission spurious characteristics. Further, in the receiving filter, a transmission wave may enter the output terminal 2b from the microstrip line 3 and deteriorate the sensitivity characteristics during transmission.
そのため、従来、プリン1へ基板]5−Fに印刷形成さ
れたマイクロス1〜リツプライン3と送受フィルタ各々
の入出力端子とを電磁的に遮断し電磁シール1〜するこ
とを目的として、プリント基板15上に設けられたアー
スパターンにシールドケース9を半田付けし、このプリ
ン1へ基板15を筺体16に備えられたねし穴にねして
締つけてプリント基板15を固定していた。Therefore, in the past, printed circuit boards were used for the purpose of electromagnetically shielding and electromagnetic sealing between the micros 1 to 3 printed on the printed circuit board 5-F and the input/output terminals of the transmitting and receiving filters. A shield case 9 is soldered to the earth pattern provided on the casing 15, and the printed circuit board 15 is fixed to the printer 1 by screwing the board 15 into a screw hole provided in a housing 16 and tightening it.
上述した従来の無線装置の筺体構造は、マイクロス1〜
リツプライン等を電磁的にシールドするシール1〜ケー
スをはんだ付けにてプリン)・基板に取り付ける構造の
ため、はんだ付けする箇所が少いと、その数や位置によ
りシールドケースのシールド特性が変化してしまう。そ
のため、受信機での送信時感度特性や送信機での送信ス
プリアス特性にほらつきが生しる。また、これら特性改
善のためにはんだ付は箇所を多くし、広く均一にはんだ
付けしようとすれば、取付作業時間か多くなり高価にな
るという欠点がある。The housing structure of the conventional wireless device described above is Micros 1 to
Seal 1 for electromagnetically shielding lip lines, etc. (by soldering the case) - Due to the structure of attaching it to the board, if there are few soldering points, the shielding characteristics of the shield case will change depending on the number and position. . As a result, fluctuations occur in the sensitivity characteristics during transmission at the receiver and the transmission spurious characteristics at the transmitter. Furthermore, if soldering is performed in a large number of locations to improve these characteristics, and if it is attempted to solder widely and uniformly, there is a drawback that the installation time becomes longer and the cost becomes higher.
本発明の無線装置の筺体構造は、組込んだ部品又は一方
の面に設けた回路導体のうち少くとも一方を有するプリ
ン1〜基板を金属製の筺体に取付けてなる無線装置の筺
体構造において、一方の端面か前記筺体の内側の底面に
接触してこの底面を部分的に囲み他方の端面が前記プリ
ン1へ基板の前記一方の面に接触する金属性のしきりを
含んでいる。A housing structure of a wireless device according to the present invention is a housing structure of a wireless device in which a printed circuit board 1 to a board having at least one of an assembled component or a circuit conductor provided on one surface are attached to a metal housing. One end surface contacts the inner bottom surface of the housing and partially surrounds this bottom surface, and the other end surface includes a metal barrier that contacts the one surface of the substrate to the printer 1.
又、本発明の無線装置の筺体構造は、前記プリント基板
の前記一方の面に前記しきりの前記一方の端面と接触す
る接地導体を設けて構成されていてもよい。Moreover, the housing structure of the wireless device of the present invention may be configured by providing a ground conductor on the one surface of the printed circuit board that comes into contact with the one end surface of the partition.
更に、本発明の無線装置の筺体構造は、前記しきりを前
記筺体と一体に成形して構成されていてもよい。Furthermore, the housing structure of the wireless device of the present invention may be configured such that the partition is integrally molded with the housing.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例の要部分解斜視図、第2図は
同しく要部の上面図である。FIG. 1 is an exploded perspective view of a main part of an embodiment of the present invention, and FIG. 2 is a top view of the main part.
第1図、第2図において、1は送信フィルタ、2は受信
フィルタ、3はマイクロス1〜リツプライン、4はアン
テナ端子、5はプリン1〜基板、6は金属性の筺体、7
は筺体6の底面から垂直方向に一体成形されたシール1
〜壁である。In FIGS. 1 and 2, 1 is a transmission filter, 2 is a reception filter, 3 is a micros 1 to a lip line, 4 is an antenna terminal, 5 is a print 1 to a board, 6 is a metal housing, 7
is a seal 1 integrally molded vertically from the bottom of the housing 6.
~It's a wall.
送信フィルター及び受信フィルタ2はプリント基板5の
」二面に実装されている。マイクロストリップライン3
は、プリント基板5の下面に印刷形成されており、送信
フィルターの出力端子1bと受信フィルタ2の出力端子
2aとを接続している。アンテナ端子4は、プリント基
板5の上面に設Gプられ、マイクロス1−リップライン
3と接続されている。The transmit filter and the receive filter 2 are mounted on two sides of the printed circuit board 5. Microstrip line 3
is printed and formed on the lower surface of the printed circuit board 5, and connects the output terminal 1b of the transmitting filter and the output terminal 2a of the receiving filter 2. The antenna terminal 4 is provided on the upper surface of the printed circuit board 5 and is connected to the micro loop 1 and the lip line 3.
マイクロス1ヘリツブライン3の周囲に、プリン1〜基
板5に印刷形成されたアースパターン8が設けである。An earth pattern 8 is provided around the micros 1 helical line 3, which is printed on the print 1 to the substrate 5.
このアースパターン8と筺体6に備えられなシールド壁
7とは、プリント基板5を貫通ずるねしてプリン1〜基
板5と筺体6とを占めつけることにより電気的に接続さ
れる。この電気的接続により、マイクロス1〜リツプラ
イン3を送信フィルタ1の入力端子1a、受信フィルタ
2の出力端子2bその他から確実に電気シールドするこ
とかできる。This earth pattern 8 and a shield wall 7 provided in the housing 6 are electrically connected by passing through the printed circuit board 5 and occupying the printed circuit board 1 to the circuit board 5 and the housing 6. With this electrical connection, the micros 1 to the lipline 3 can be reliably electrically shielded from the input terminal 1a of the transmission filter 1, the output terminal 2b of the reception filter 2, and others.
以上説明した実施例は、シールド壁7を筺体6と一定成
形しているので、大量生産に適している。The embodiment described above is suitable for mass production because the shield wall 7 is formed in the same shape as the housing 6.
なお、シールド壁7だけでかなりのシールド効果が得ら
れるので、プリント基板5にアースパターン8を設けな
くてもほぼ同様の効果が得られる。Incidentally, since a considerable shielding effect can be obtained only by the shield wall 7, substantially the same effect can be obtained even without providing the ground pattern 8 on the printed circuit board 5.
以上説明したように本発明は、プリント基板の所要部分
を筺体のシールド壁にて電磁的にシールドすることによ
り、プリン1〜基板にシールドケースをはんだ付けする
ことなく所要部分をシールドでき、組立作業効率にすぐ
れ、安価に製造できる効果がある。As explained above, the present invention electromagnetically shields the required portions of the printed circuit board with the shield wall of the casing, thereby making it possible to shield the required portions without soldering the shield case to the printed circuit board. It is highly efficient and can be manufactured at low cost.
第1図は本発明の一実施例の要部分解斜視図、第2図は
同しく要部の上面図、第3図は従来の無線装置の筺体構
造の要部分解斜視図である。
1・送信フィルタ、2・受信フィルタ、3・・・マイク
ロス1ヘリツブライン、4・・アンテナ端子、5・プリ
ン1〜基板、6・・・筺体、7・・シールド壁、8・・
アースパターン、1a・・・送信フィルタ入力端子、]
1)・・送信フィルタ出力端子、2a・・・受信フィル
タ入力端子、21〕・・受信フィルタ出力端子。FIG. 1 is an exploded perspective view of the main parts of an embodiment of the present invention, FIG. 2 is a top view of the main parts, and FIG. 3 is an exploded perspective view of the main parts of the housing structure of a conventional wireless device. 1. Transmission filter, 2. Reception filter, 3.. Micros 1 helical tube line, 4.. Antenna terminal, 5. Print 1 to board, 6.. Housing, 7.. Shield wall, 8..
Earth pattern, 1a...transmission filter input terminal, ]
1)...Transmission filter output terminal, 2a...Reception filter input terminal, 21]...Reception filter output terminal.
Claims (3)
少くとも一方を有するプリント基板を金属製の筺体に取
付けてなる無線装置の筺体構造において、一方の端面が
前記筺体の内側の底面に接触してこの底面を部分的に囲
み他方の端面が前記プリント基板の前記一方の面に接触
する金属性のしきりを含むことを特徴とする無線装置の
筺体構造。1. In a wireless device housing structure in which a printed circuit board having at least one of the assembled components or a circuit conductor provided on one surface is attached to a metal housing, one end surface contacts the inner bottom surface of the housing. What is claimed is: 1. A housing structure for a wireless device, comprising: a metal barrier that partially surrounds the bottom surface and has the other end surface in contact with the one surface of the printed circuit board.
記一方の端面と接触する接地導体を設けたことを特徴と
する請求項1記載の無線装置の筺体構造。2. 2. The housing structure of a wireless device according to claim 1, further comprising a ground conductor provided on the one surface of the printed circuit board and in contact with the one end surface of the partition.
とする請求項1記載の無線装置の筺体構造。3. 2. The wireless device housing structure according to claim 1, wherein the partition is integrally formed with the housing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12982790A JPH0425199A (en) | 1990-05-18 | 1990-05-18 | Case structure of radio device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12982790A JPH0425199A (en) | 1990-05-18 | 1990-05-18 | Case structure of radio device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0425199A true JPH0425199A (en) | 1992-01-28 |
Family
ID=15019207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12982790A Pending JPH0425199A (en) | 1990-05-18 | 1990-05-18 | Case structure of radio device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0425199A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010272873A (en) * | 2010-05-31 | 2010-12-02 | Hitachi High-Technologies Corp | Plasma processing apparatus and plasma processing method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59149100A (en) * | 1983-02-16 | 1984-08-25 | 富士通テン株式会社 | Shield case |
-
1990
- 1990-05-18 JP JP12982790A patent/JPH0425199A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59149100A (en) * | 1983-02-16 | 1984-08-25 | 富士通テン株式会社 | Shield case |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010272873A (en) * | 2010-05-31 | 2010-12-02 | Hitachi High-Technologies Corp | Plasma processing apparatus and plasma processing method |
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