JPH0246074Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to the structure of a hybrid IC (integrated circuit) used in high frequency circuits of radio equipment, etc.

In recent years, digital frequency synthesizers with built-in voltage-controlled oscillators (hereinafter abbreviated as VCOs) have been widely used in mobile radio equipment in the direction of multi-channel technology. Considering the usage conditions of mobile radio equipment, this VCO needs to have excellent vibration resistance and shielding characteristics. For this purpose, the current VCO
is a hybrid IC that is tightly shielded with an almost metal case. Furthermore, portable mobile radio devices are becoming more and more compact, and in this case, the built-in high-frequency circuits of the transmitter and receiver are also built using hybrid ICs similar to those described above for the purpose of miniaturization and prevention of mutual interference. Often used.

Shielding characteristics are very important to these hybrid ICs for high-frequency circuits, and in addition to a solid metal shield case, feed-through relay terminals (including those with capacitor characteristics and filter characteristics) are used for power supply and signal input/output. , will become indispensable. And this hybrid IC
The number of man-hours required to manufacture the device is influenced by the connection means used to mount the device on a device such as a radio and connect it to other circuits within the device, which in turn affects the price of the device.
For this reason, a hybrid IC that has easy connection means with other circuits in the device is required.

An example of the structure of a conventional hybrid IC of this type is shown in FIG. 1 is a metal case for shielding, and 2 is a through-type relay terminal (including those having capacitor characteristics and filter characteristics) for power supply or signal input/output, which is attached to penetrate through the case 1. Figure 2 shows the hybrid IC shown in Figure 1.
10 is a diagram illustrating an example of a case where the device 10 is mounted on a device such as a radio and connected to other circuits in the device. Generally, the hybrid IC 10 is fixed to the housing of the device or the printed board 4 of another circuit by screwing, soldering, or the like. Since the through-type relay terminal 2 is attached to the metal case 1, for connection to other circuits 5 in the device, it is not possible to directly insert the input/output terminal 2 into a printed board like a hybrid IC for low frequency circuits. First, it is necessary to connect the wires with a conductor wire 3 or the like.
In order to improve reliability, this connection is performed by using loose wiring on the relay terminal 2 side, and by soldering to the circuit pattern on the printed circuit board 4 on the circuit 5 side, but both are special post-assembly wiring work. will arise. This is a factor that increases the price and is also a major drawback when considering mass production.

The present invention was made to eliminate these conventional drawbacks, and its purpose is to provide a hybrid IC that does not require special post-work such as assembly and wiring.

The present invention will be explained below with reference to the figures.

FIG. 3 is a perspective view showing an embodiment of the present invention,
The hybrid IC 20 has a tongue piece 6 on the mounting surface of the relay terminal 2 in the hybrid IC 10 shown in FIG.
is provided with a protrusion. Here, the tongue piece 6 is of a convex shape, for example as shown in FIG. 4 showing the cross section of FIG. 3 a-a', and its dimension L is larger than L> 1, and when the length m is the thickness of the printed board on which it is mounted, m>n may be considered. This hybrid IC20
FIG. 5 shows an example of implementation when connecting the circuit to other circuits in the device. Reference numeral 4 denotes a printed board that includes another circuit 5 to be connected, and the circuit 5 is provided with a through hole of a diameter suitable for inserting the lead of the through-type relay terminal 2. Moreover, on the printed board 4,
A square hole 7 suitable for inserting the tongue piece 6 of the IC 20 is provided, and a ground air pattern 8 is provided around the square hole 7. By using such external connection parts, the hybrid IC 20 of the present invention can be used as a hybrid IC for low frequency circuits that does not include through-type relay terminals.
It can be mounted in the same way as an IC, that is, it can be inserted and connected to a printed board for other connection circuit parts.

FIG. 6 is a view of the IC 20 inserted into the printed circuit board 4 in FIG. 5, viewed from direction b. When the hybrid IC 20 is mounted as shown in FIG. 6, the conductor wire 3 for connection shown in FIG. 2 is no longer necessary, and special post-work during production such as tie wiring can be eliminated. Further, it can be attached together with other armature parts on the printed board 4 by flow soldering.

By using the hybrid IC according to the present invention described in detail above, it is possible to obtain wireless devices and the like that have good work efficiency, are inexpensive, and are excellent in mass production. This will bring great profits to manufacturers of radio equipment and the like.

[Brief explanation of the drawing]

Figure 1 is a perspective view showing the structure of a conventional hybrid IC, and Figure 2 is the hybrid IC shown in Figure 1.
Needle view when mounted on a device and connected to other circuits,
3 and 4 are perspective views and side sectional views, respectively, showing the structure of the hybrid IC of the present invention, and FIGS. 5 and 6 show the structure of the hybrid IC of the present invention shown in FIGS. They are an exploded perspective view and a side view, respectively, when mounted and connected to other circuits. In the figure, 10... conventional hybrid IC,
20... Hybrid IC of the present invention, 1... Metal case, 2... Through-type relay terminal, 3... Conductor wire, 4... Printed board, 5... Conductor pattern on printed board, 6... Tongue piece, 7... Square hole on top of the printed board, 8... Pattern on the bottom of the printed board.

Claims (1)

[Scope of utility model registration request] A hybrid IC that is housed in a metal case and has a through-type relay terminal for connection to an external circuit.
The metal case has a convex tongue piece for attaching the metal case to a housing or the like, and the tongue piece is attached to the through-type relay terminal of the metal case so that the through-type relay terminal and the external circuit can be directly connected. What is claimed is: 1. A hybrid IC characterized in that the tongue piece is provided so as to protrude from the side on which the tongue piece is provided, and the narrow part of the tongue piece is further inserted into and fixed to the housing or the like.