JPH0425042A - Supply of semiconductor device - Google Patents
Supply of semiconductor deviceInfo
- Publication number
- JPH0425042A JPH0425042A JP12620790A JP12620790A JPH0425042A JP H0425042 A JPH0425042 A JP H0425042A JP 12620790 A JP12620790 A JP 12620790A JP 12620790 A JP12620790 A JP 12620790A JP H0425042 A JPH0425042 A JP H0425042A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- adhesive tape
- tray
- tape
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 239000002390 adhesive tape Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000002950 deficient Effects 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 238000007689 inspection Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の供給方法に関し、特に半導体装置
の自動実装用供給方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for supplying semiconductor devices, and more particularly to a method for supplying semiconductor devices for automatic mounting.
従来、この種の半導体装置の供給方法は、第６図、第７
図に示すように、中央部に穴を設けな長尺の紙テープ９
の裏側に粘着テープ１を貼り、前記穴から露出した粘着
テープに半導体装置２を貼り付ける方法、または、第８
図、第９図に示すように、半導体装置の形状に合わせた
凹形状の溝を有する樹脂テープ１１の前記溝の中に半導
体装置２を挿入し、表面にカバーテープ１０を貼り付け
る方法等があり、前記テープを中央にテープ幅の芯を有
し、その両端にガイド板を設けた第１１゜図に示すリー
ルに巻いて供給するものがある。第１２図はリールの部
分断面図である。Conventionally, the method for supplying this type of semiconductor device has been as shown in FIGS. 6 and 7.
As shown in the figure, a long paper tape 9 with a hole in the center.
A method of pasting an adhesive tape 1 on the back side of the hole, and pasting a semiconductor device 2 on the adhesive tape exposed through the hole, or an eighth method.
As shown in FIG. 9, there is a method of inserting the semiconductor device 2 into the groove of the resin tape 11, which has a concave groove matching the shape of the semiconductor device, and pasting the cover tape 10 on the surface. In some cases, the tape is wound onto a reel shown in FIG. 11, which has a tape-width core in the center and guide plates at both ends. FIG. 12 is a partial sectional view of the reel.
また、複数の凹形状の溝を有する第１０図に示すトレー
に半導体装置を挿入して供給する方法等がある。Further, there is a method of inserting and supplying a semiconductor device into a tray shown in FIG. 10 having a plurality of concave grooves.
上述した従来の半導体装置の供給方法は、半導体装置を
貼り付けたテープ、または、凹形状の溝に半導体装置を
挿入したテープをリールに巻いて供給する為、実装密度
が低く大きなスペースを要する。又、半導体装置の外観
等を検査する場合及び不良品等を交換する場合に、巻い
ているデープをほどかなければならない。さらに、半導
体装置が貼り付は又は挿入されたテープを巻くことによ
り、半導体装置に外力が加わり半導体装置の端子が曲っ
てしまう欠点がある。The conventional semiconductor device supply method described above has a low packaging density and requires a large space because a tape with a semiconductor device attached thereto or a tape with a semiconductor device inserted into a concave groove is wound around a reel and supplied. Furthermore, when inspecting the appearance of a semiconductor device or replacing a defective product, the tape must be unwound. Furthermore, when the semiconductor device is pasted or inserted and the tape is wound, an external force is applied to the semiconductor device, causing the terminals of the semiconductor device to bend.
又、複数の凹形状の溝を有する１ヘレーに半導体装置を
挿入する方法は凹形状の溝のピッチを小さくすることか
できない為、実装密度が低く大きなスペースを要する。Furthermore, in the method of inserting a semiconductor device into a single helay having a plurality of concave grooves, the pitch of the concave grooves cannot be reduced, so the packaging density is low and a large space is required.
さらに、半導体装置が極小さい場合、テープ及びトレー
に凹形状の溝を作ることが困難となる等の欠点がある。Furthermore, when the semiconductor device is extremely small, there are drawbacks such as difficulty in forming concave grooves in the tape and tray.
本発明の目的は、第１に小さなスペースにて多くの半導
体装置を供給することができ、第２に半導体装置の数量
確認、外観検査及び不良品の差換えか容易にできる。ま
た、第３に半導体装置の大きさに関係なく共用でき、第
４にトレーの再利用が容易にでき、第５に輸送や保管に
要するスペースを小さくすることができ、第６に半導体
装置に外力の加わることなく信頼性を硲保できる半導体
装置の供給方法を提供することにある。The objects of the present invention are, firstly, that a large number of semiconductor devices can be supplied in a small space, and secondly, that it is possible to easily confirm the quantity of semiconductor devices, perform visual inspection, and replace defective products. Third, it can be shared regardless of the size of the semiconductor device, fourth, the tray can be easily reused, fifth, the space required for transportation and storage can be reduced, and sixth, the semiconductor device An object of the present invention is to provide a method for supplying semiconductor devices that can ensure reliability without applying external force.
本発明の半導体装置の供給方法は、半導体装置を貼り付
ける粘着テープと粘着テープの外周部に粘着テープを固
定する為の平面部と前記平面部の外周の垂直方向に壁を
設け、さらに、壁の内側下方に凸形状の足を設けた凹形
状のトレーの中央に固定された粘着テープを有し、その
粘着テープ上に半導体装置を貼り付けることを特徴とし
て構成される。A method for supplying a semiconductor device according to the present invention includes: an adhesive tape for pasting a semiconductor device; a flat part for fixing the adhesive tape on the outer periphery of the adhesive tape; and a wall in a direction perpendicular to the outer periphery of the flat part; It is characterized by having an adhesive tape fixed to the center of a concave tray with convex legs provided on the lower inside of the tray, and a semiconductor device is pasted onto the adhesive tape.
次に、本発明について図面を参照して説明する。第１図
は本発明の一実施例の縦断面図である。粘着テープ１の
外周と１ヘレー４の平面部６は粘着剤３で固定され、粘
着テープ１の上方に半導体装置２を貼り付ける。又、ト
レー４の外周には平面部６と垂直方向に壁７と、壁７よ
り内側下方に足５を設け、半導体装置２の下方には穴８
を設けている。Next, the present invention will be explained with reference to the drawings. FIG. 1 is a longitudinal sectional view of an embodiment of the present invention. The outer periphery of the adhesive tape 1 and the flat part 6 of the first helay 4 are fixed with an adhesive 3, and the semiconductor device 2 is pasted above the adhesive tape 1. Further, a wall 7 is provided on the outer periphery of the tray 4 in a direction perpendicular to the plane portion 6, a foot 5 is provided inside and below the wall 7, and a hole 8 is provided below the semiconductor device 2.
has been established.
第２図は本発明の一実施例の平面図であるが、粘着テー
プ１に半導体装置２を最小のすき間で貼り付けることが
できる。FIG. 2 is a plan view of an embodiment of the present invention, and the semiconductor device 2 can be attached to the adhesive tape 1 with a minimum gap.
第３図は本発明の一実施例を積重ねた場合の縦断面図で
あり、壁７の内側に足５が入り、横にずれることなく安
定に、しかも、半導体装置２に外力等を加えることなく
積重ねが可能である。FIG. 3 is a longitudinal cross-sectional view of one embodiment of the present invention stacked together, in which the legs 5 enter inside the wall 7, stably do not shift laterally, and furthermore, it is possible to apply external force etc. to the semiconductor device 2. It is possible to stack them without any problem.
第４図は本発明の他の実施例の縦断面図、第５図は第４
図の第２の実施例の平面図である。この実施例ではトレ
ー４が四角形である為、実施例１の丸形のトレー４に対
し、外形寸法が同じであっても、より多くの半導体装置
を供給することができる利点がある。FIG. 4 is a longitudinal sectional view of another embodiment of the present invention, and FIG.
FIG. 3 is a plan view of the second embodiment of the figure; In this embodiment, since the tray 4 is square, there is an advantage that more semiconductor devices can be supplied even if the external dimensions are the same compared to the round tray 4 of the first embodiment.
以上説明したように本発明は、半導体装置を貼り付ける
粘着テープと粘着テープの外周部に粘着テープを固定す
る平面部及び前記平面部の外周の垂直方向に壁を設け、
更に壁の内側下方に足を設け／２凹形状のトレー中夫に
粘着テープを固定し、前記粘着テープ上に半導体装置を
貼り付ける事が出来る。これにより半導体装置は、任意
の数量を任意の間隔で貼り付ける事が出来るが、本例に
よれは半導体装置外形寸法より０．２ｍｍ離せは整列可
能であり、小さなスペースにて多くの半導体装置を供給
する事が出来る。As explained above, the present invention provides an adhesive tape for pasting a semiconductor device, a flat part for fixing the adhesive tape to the outer periphery of the adhesive tape, and a wall in the vertical direction of the outer periphery of the flat part.
Further, legs are provided on the inner lower side of the wall/adhesive tape is fixed to the middle part of the concave tray, and the semiconductor device can be pasted on the adhesive tape. As a result, any number of semiconductor devices can be pasted at any interval, but in this example, it is possible to align the semiconductor devices at a distance of 0.2 mm from the external dimensions, and a large number of semiconductor devices can be attached in a small space. We can supply it.
又、トレーの上方か開放されている為に半導体装置の数
量確認や外観検査及び不良品の差換えが容易に出来る。In addition, since the upper part of the tray is open, it is easy to confirm the quantity of semiconductor devices, inspect the appearance, and replace defective products.
更に、平面のテープに貼り付けるだけである為、半導体
装置の大きさに関係なく共用でき、しかも粘着テープを
交換すればトレーの再利用が容易にてきる利点がある。Furthermore, since it is simply pasted onto a flat tape, it can be used regardless of the size of the semiconductor device, and it has the advantage that the tray can be easily reused by replacing the adhesive tape.
本トレーは積み重ねる事が可能であり、輸送や保管に要
するスペースも少なくて済み、かつ半導体装置に外力が
加わる事も無い為に信頼性の高い半導体装置を供給でき
る効果かある。This tray can be stacked, requires less space for transportation and storage, and since no external force is applied to the semiconductor device, it is effective in supplying highly reliable semiconductor devices.
尚、微小半導体装置における外形寸法が２ｍｍＸ２ｍｍ
以下の場合においては、従来方式である供給テープを作
成する事が困難になるが、本発明によれは容易に可能と
なる効果がある。In addition, the external dimensions of the micro semiconductor device are 2 mm x 2 mm.
In the following cases, it is difficult to create a supply tape using the conventional method, but the present invention has the effect of easily making it possible.
第１図は本発明の一実施例の縦断面図、第２図は第１図
の平面図、第３図は第１の実施例を積み重ねた場合の縦
断面図、第４図は第２の実施例の縦断面図、第５図は第
４図の平面図、第６図は従来の半導体供給方法であり、
半導体装置をテープに貼り付けた状態を示す平面図、第
７図は第６図の縦断面図、第８図は従来の半導体供給方
法てあり、半導体装置を凹形状の講に挿入した状態を示
す平面図、第９図は第８図の縦断面図、第１０図は従来
の半導体供給方法であるトレーを用いる方法の縦断面図
、第１−１図は、従来の半導体供給方法である第６図、
第７図を巻いておくリールの縦断面図、第１２図はリー
ルの部分断面図である。
１−・・・粘着テープ、２・・・半導体装置、３・・・
粘着剤、４・・・１〜レー、５・・・足、６・・・平面
部、７・・・穴、９・・・紙テープ、１０・・・カバー
テープ、１１・・・樹脂テープ、１２・・・リール。FIG. 1 is a longitudinal sectional view of one embodiment of the present invention, FIG. 2 is a plan view of FIG. 1, FIG. 3 is a longitudinal sectional view of the first embodiment stacked up, and FIG. FIG. 5 is a plan view of FIG. 4, and FIG. 6 is a conventional semiconductor supply method.
FIG. 7 is a plan view showing a semiconductor device attached to a tape, FIG. 7 is a vertical sectional view of FIG. 6, and FIG. 9 is a vertical sectional view of FIG. 8, FIG. 10 is a vertical sectional view of a conventional semiconductor supply method using a tray, and FIG. 1-1 is a conventional semiconductor supply method. Figure 6,
FIG. 7 is a longitudinal sectional view of the reel for winding, and FIG. 12 is a partial sectional view of the reel. 1-... Adhesive tape, 2... Semiconductor device, 3...
Adhesive, 4... 1-ray, 5... Feet, 6... Flat part, 7... Hole, 9... Paper tape, 10... Cover tape, 11... Resin tape, 12...Reel.
Claims (1)
する平面部と、前記平面部の外周の垂直方向に壁を設け
、又、壁の内側下方に凸形状の足を設けた凹形状のトレ
ーの中央に粘着テープを固定し前記粘着テープ上に半導
体装置を貼り付けることを特徴とする半導体装置の供給
方法。An adhesive tape, a flat part for fixing the adhesive tape to the outer periphery of the adhesive tape, a wall in the vertical direction of the outer periphery of the flat part, and a concave tray with convex feet on the inner lower side of the wall. A method for supplying a semiconductor device, comprising fixing an adhesive tape in the center and pasting the semiconductor device on the adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12620790A JPH0425042A (en) | 1990-05-16 | 1990-05-16 | Supply of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12620790A JPH0425042A (en) | 1990-05-16 | 1990-05-16 | Supply of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0425042A true JPH0425042A (en) | 1992-01-28 |
Family
ID=14929368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12620790A Pending JPH0425042A (en) | 1990-05-16 | 1990-05-16 | Supply of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0425042A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04291768A (en) * | 1991-03-20 | 1992-10-15 | Fuji Electric Co Ltd | Mos device and manufacture thereof |
| US9192317B2 (en) | 2011-01-14 | 2015-11-24 | Cardiac Pacemakers, Inc. | Implantable active fixation lead with biodegradable helical tip |
-
1990
- 1990-05-16 JP JP12620790A patent/JPH0425042A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04291768A (en) * | 1991-03-20 | 1992-10-15 | Fuji Electric Co Ltd | Mos device and manufacture thereof |
| US9192317B2 (en) | 2011-01-14 | 2015-11-24 | Cardiac Pacemakers, Inc. | Implantable active fixation lead with biodegradable helical tip |
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