JPH04241493A - Heat sink with harness guide groove - Google Patents

Abstract

PURPOSE:To simplify routing of a harness 7 by developing a heat sink 3 which can stably hold the harness 7 without using a harness supporting bracket and eliminate obstacle of air cooling of a semiconductor element 5 due to a conventionally used harness supporting bracket. CONSTITUTION:A heat sink 3 of this invention for discharging heat of a semiconductor element is formed with a guide groove 31 for holding a harness on a side, wherein a harness 7 is inserted into the guide groove 31 to hold the harness 3.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink for dissipating heat from a power semiconductor device, which has a harness guide groove and is capable of holding a harness.

0002

2. Description of the Related Art Power semiconductor devices such as power transistors are generally used by being fixed on a heat sink made of an aluminum alloy block or the like for heat dissipation. On the other hand, for example, full-wave rectifier bridge devices and inverter devices for vehicle running control have many semiconductor devices including several power semiconductor devices, and these semiconductor devices are connected to a harness, that is, a bundle of insulated wires. Often wired.

FIG. 6 shows an example of a diode, a heat sink, and a harness connected thereto used in a full-wave rectifier bridge device for vehicle running control. A heat sink 30 made of an aluminum block is fixed with screws 40 on an aluminum base 10 serving as a heat sink with an electrically insulating resin sheet 20 in between, and a diode 50 is mounted on the heat sink 30. Fixed. Base 1 close to heat sink 30
An aluminum bracket 60 is erected on the heat sink 30, and a harness 70 is held by a clamp 80 on the side of the bracket 60 facing away from the heat sink 30. A branch wire 71 coming out of the harness 70 is connected to one electrode of the diode 50.

The bracket 60 shown in FIG. 6 not only prevents the movement of the harness 70 due to vehicle vibrations, but also thermally and electrically isolates the harness 70 from the high-temperature diode 50. .

[0005]

[Problems to be Solved by the Invention] However, the frequent use of such brackets 60 becomes an obstacle when circuit elements are integrated at a high density in a limited space or when harnesses are laid, and also increases the number of man-hours. cause an increase. Further, erecting the bracket 60 in close proximity to the diode 50 impedes air cooling of the diode 50.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a heat sink with a harness guide groove that can stably hold a harness without using a bracket. This is an issue.

[0007]

[Means for Solving the Problems] The heat sink with a harness guide groove of the present invention is characterized in that a guide groove for holding a harness is recessed in the side surface.

[0008]

[Operation and Effects of the Invention] The heat sink with a harness guide groove of the present invention has a guide groove for holding the harness recessed in the side surface, so the harness can be inserted into the guide groove and the harness can be held. - If you maintain the frame, you can omit the bracket and still have a
It is possible to stably hold and position the nest, which is economical.

Furthermore, since the harness is accommodated within the heat sink, the effective space is increased and the degree of freedom in routing the harness is improved. Furthermore, it is possible to eliminate the obstruction of the air cooling of the power semiconductor element by the bracket, and the heat dissipation area of the heat sink is increased by the guide groove, thereby improving its heat dissipation performance.

0010

[Embodiment] An embodiment of the present invention will be explained based on FIG. This heat sink 3 is made of an aluminum block, and an insulating sheet made of polytetrafluoroethylene (PTFE) resin film is placed on an aluminum base 1 as a heat sink.
It is fixed with screws 4 with the tip 2 in between.

A power diode 5 constituting a part of a full-wave rectifier used in a vehicle running control device is fixed on the heat sink 3, and one electrode of the power diode 5 is connected to a hard wire. It is fastened to a branch wire 71 of the nest 7 with a screw 9. A guide groove 31 for holding a harness is recessed in one side of the heat sink 3 parallel to the upper and lower surfaces of the heat sink 3, and the harness 7 is inserted into the guide groove 31.

A cap holding groove 32 is formed in the upper and lower inner surfaces of the guide groove 31 as shown in the sectional view of FIG. 2, and a resin cap 8 is inserted into this cap holding groove 32 as shown in FIG. This prevents the harness 7 from coming off the guide groove 31. The heat sink 3 of this embodiment has a guide groove 31 on one side of a rectangular parallelepiped aluminum block, so it has the advantage of being extremely easy to manufacture. That is, an aluminum bar having the cross section shown in Fig. 2 is formed by drawing, and this aluminum bar is cut to the required length.
The heat sink 3 can be manufactured by providing necessary screw holes.

[0013] Below, some examples of modifications of the present invention will be explained. As shown in FIG. 3, grooves 31 are provided on both sides of the heat sink 3, and the harness 7 is inserted into the guide grooves 31.
At the same time, the aluminum plate 8a is attached to the heat sink 3.
or the guide groove 3 (not shown).
The harness may be prevented from coming off by fitting a resin into the opening of the harness. Further, guide grooves 31 may be further provided on other side surfaces of the heat sink 3. Adopting such a configuration is advantageous in that the degree of freedom in routing the harness is further improved and the heat radiation area of the heat sink is further increased.

Alternatively, as shown in FIG. 4, it is also possible to provide a plurality of guide grooves in parallel to one another on one side of the heat sink 3. These guide grooves 31 are advantageous for accommodating one or more independent electric wires instead of the harness 7. In the example shown in FIG. 5, a guide groove 35 is provided obliquely to two mutually perpendicular side surfaces 33 and 34 of the heat sink 3, and the harness 7 is housed obliquely to the two side surfaces 33 and 34. ing. The harness 7 is prevented from coming off from the guide groove 35 by two screws 37 that are fastened near the corner 36 of the heat sink 3 across the guide groove 35 .

In the embodiments described so far, the harness 7 is prevented from coming off by the cap 8, the aluminum plate 8a, the screw 37, etc., but the guide groove 31 of the heat sink 3,
By utilizing the elasticity of the jaw portion 39 that constitutes the guide groove 3
By pushing the harness 7 into 1 and 35, the harness 7
It may be configured to hold. In this case, the cap 8, aluminum plate 8a, etc. can be omitted. Note that by forming the inner depths of the guide grooves 31 and 35 wider than the vicinity of the openings, the harness 7 can be held more reliably and damage to the harness 7 can also be prevented.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of a heat sink with a harness guide groove of the present invention;

[Fig. 2] Cross-sectional view of the heat sink in Fig. 1,

[Fig. 3] Side view showing the deformed form,

[Fig. 4] Side view showing the deformed form,

FIG. 5 is a partial plan view showing a deformed mode;

[Fig. 6] A perspective view showing an example of a conventional heat sink with harness guide grooves.

[Explanation of symbols]

1 is the base 2 is an insulating sheet 3 is heat sink 5 is a power diode 7 is a harness 8 is the cap 31 is the guide groove

Claims (1)

[Claims] 1. A heat sink with a harness guide groove for heat dissipation of a semiconductor device, the side surface of which is provided with a guide groove for holding a harness.