JPH04240007A - Polycrystal diamond cutting tool and manufacture thereof - Google Patents
Polycrystal diamond cutting tool and manufacture thereofInfo
- Publication number
- JPH04240007A JPH04240007A JP3003151A JP315191A JPH04240007A JP H04240007 A JPH04240007 A JP H04240007A JP 3003151 A JP3003151 A JP 3003151A JP 315191 A JP315191 A JP 315191A JP H04240007 A JPH04240007 A JP H04240007A
- Authority
- JP
- Japan
- Prior art keywords
- polycrystalline diamond
- tool
- cutting tool
- cutting edge
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 88
- 239000010432 diamond Substances 0.000 title claims abstract description 88
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 86
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000463 material Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 25
- 239000012808 vapor phase Substances 0.000 claims abstract description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 8
- 239000010439 graphite Substances 0.000 claims description 8
- 239000012071 phase Substances 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 230000001376 precipitating effect Effects 0.000 claims 1
- 238000000227 grinding Methods 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 238000003754 machining Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 239000011247 coating layer Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 101100008049 Caenorhabditis elegans cut-5 gene Proteins 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- UBAZGMLMVVQSCD-UHFFFAOYSA-N carbon dioxide;molecular oxygen Chemical compound O=O.O=C=O UBAZGMLMVVQSCD-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- -1 methanol and ethanol Chemical compound 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001868 water Inorganic materials 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、特に非鉄金属や貴金属
の仕上げ加工に最適で、耐欠損性の高い多結晶ダイヤモ
ンド切削工具およびその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polycrystalline diamond cutting tool that is particularly suitable for finishing nonferrous metals and precious metals and has high fracture resistance, and a method for manufacturing the same.
【０００２】0002
【従来の技術】ダイヤモンドは硬度と熱伝導率が高いた
め、切削工具や耐磨工具として使用されている。しかし
、多結晶ダイヤモンドは劈開するという欠点があり、こ
の欠点を抑制するために、たとえば特公昭５２−１２１
２６号公報に記載されているように超高圧焼結技術を用
いてダイヤモンド同士を焼結したダイヤモンド焼結体が
開発されている。2. Description of the Related Art Diamond has high hardness and high thermal conductivity, and is therefore used as cutting tools and wear-resistant tools. However, polycrystalline diamond has the disadvantage of cleavage, and in order to suppress this disadvantage, for example,
As described in Japanese Patent No. 26, a diamond sintered body in which diamonds are sintered together using ultra-high pressure sintering technology has been developed.
【０００３】しかしながら、これらのダイヤモンド焼結
体は、５％〜１０％の結合材を含有するため、構成する
粒子単位でチッピングが生じるという問題点を有してい
た。However, since these diamond sintered bodies contain 5% to 10% of binder, they have had the problem that chipping occurs in the constituent particles.
【０００４】そこで、ダイヤモンド焼結体の代わりに結
合材を含有していない多結晶ダイヤモンド、すなわち低
圧気相法により構成された多結晶ダイヤモンドを工具素
材とした切削工具が発明者らによって考案された。この
ような多結晶ダイヤモンドを素材とした切削工具の例が
、特開平１−２１２７６７号公報に示されている。図７
は、このような多結晶ダイヤモンド切削工具の一例を示
す刃先部分の断面構造図である。この多結晶ダイヤモン
ド切削工具は、工具支持体４の表面上にろう付部５を介
して多結晶ダイヤモンドチップ３が固定されている。
チップ３はシリコン（Ｓｉ）などの基材１の表面上に低
圧気相法を用いて合成された多結晶ダイヤモンド層を用
いている。多結晶ダイヤモンド層は素材の多結晶体が結
合材を含有していないので、優れた耐磨耗性を有してい
る。[0004] Therefore, the inventors devised a cutting tool that uses polycrystalline diamond that does not contain a binder, that is, polycrystalline diamond that is constructed using a low-pressure gas phase method, as a tool material instead of a diamond sintered body. . An example of a cutting tool made of such polycrystalline diamond is shown in Japanese Patent Laid-Open No. 1-212767. Figure 7
1 is a cross-sectional structure diagram of a cutting edge portion showing an example of such a polycrystalline diamond cutting tool. In this polycrystalline diamond cutting tool, a polycrystalline diamond tip 3 is fixed onto the surface of a tool support 4 via a brazed portion 5. The chip 3 uses a polycrystalline diamond layer synthesized using a low pressure vapor phase method on the surface of a base material 1 such as silicon (Si). The polycrystalline diamond layer has excellent wear resistance because the polycrystalline material does not contain a binder.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、多結晶
ダイヤモンド切削工具の刃先部９をシャープエッジで構
成すると、初期欠損が生じるという問題点を有していた
。However, when the cutting edge portion 9 of a polycrystalline diamond cutting tool is configured with a sharp edge, there is a problem in that initial chipping occurs.
【０００６】したがって、この発明は上記のような問題
点を解消するためになされたもので、初期欠損の発生を
抑制し得る多結晶ダイヤモンド切削工具およびその製造
方法を提供することを目的とする。[0006] Therefore, the present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a polycrystalline diamond cutting tool and a method for manufacturing the same that can suppress the occurrence of initial defects.
【０００７】[0007]
【課題を解決するための手段】この発明による多結晶ダ
イヤモンド切削工具は、低圧気相法により構成された多
結晶ダイヤモンドを工具素材として用いている。多結晶
ダイヤモンドにはすくい面と逃げ面とが構成され、この
すくい面と逃げ面との交線に沿って構成される刃先部が
ホーニング加工された曲面を有している。[Means for Solving the Problems] A polycrystalline diamond cutting tool according to the present invention uses polycrystalline diamond constructed by a low-pressure vapor phase method as a tool material. The polycrystalline diamond has a rake face and a flank face, and the cutting edge part constructed along the intersection line of the rake face and the flank face has a curved surface that has been honed.
【０００８】また、この発明による多結晶ダイヤモンド
切削工具は、以下のように製造される。まず、基材の表
面上に低圧気相法により多結晶ダイヤモンドを析出させ
る。次に、基材上の多結晶ダイヤモンドを所定のチップ
形状に切断した後、基材を多結晶ダイヤモンドのチップ
から除去する。そして、多結晶ダイヤモンドのチップ表
面のうち基材と接していた側の表面を工具すくい面とし
、このすくい面と所定の角度をなすように逃げ面を形成
することにとより刃先部を形成する。そして、刃先部を
ホーニング加工して曲面を形成する。Further, the polycrystalline diamond cutting tool according to the present invention is manufactured as follows. First, polycrystalline diamond is deposited on the surface of a base material by a low pressure vapor phase method. Next, after cutting the polycrystalline diamond on the base material into a predetermined chip shape, the base material is removed from the polycrystalline diamond chip. Then, the surface of the polycrystalline diamond chip that was in contact with the base material is used as the rake face of the tool, and a flank is formed at a predetermined angle with the rake face to form the cutting edge. . Then, the cutting edge is honed to form a curved surface.
【０００９】[0009]
【作用】この発明による多結晶ダイヤモンド切削工具の
刃先部はレーザ加工を用いたホーニング処理が施される
。レーザ加工を用いることにより刃先部のチッピングを
微小に抑制した状態で刃先部のホーニング加工が施され
る。またホーニング加工が施された刃先部は、シャープ
エッジを有する刃先部に比べて切削初期の欠損が抑制さ
れる。[Operation] The cutting edge of the polycrystalline diamond cutting tool according to the present invention is honed using laser processing. By using laser machining, the cutting edge portion is honed with minimal chipping at the cutting edge portion. In addition, the honed cutting edge portion is less prone to chipping at the initial stage of cutting than the cutting edge portion having a sharp edge.
【００１０】0010
【実施例】以下、この発明の実施例を図を用いて説明す
る。[Embodiments] Hereinafter, embodiments of the present invention will be explained with reference to the drawings.
【００１１】図１は、この発明の一実施例による多結晶
ダイヤモンド切削工具の断面構造図および刃先部の拡大
図である。多結晶ダイヤモンドのチップ３は超硬合金や
鋼などからなる工具支持体４にろう付部５を介在して強
固に取付けられている。多結晶ダイヤモンドのチップ３
の上面は工具すくい面６を構成し、このすくい面６と所
定の角度をなして逃げ面７が構成されている。すくい面
６と逃げ面７との交線に沿う部分に刃先部９が形成され
ている。刃先部９はホーニング加工された所定の曲率を
有する曲面上に形成されている。そして、その表面には
ホーニング加工時に生成された黒鉛被覆層８が形成され
ている。ここで、「特許請求の範囲」に使用したホーニ
ング加工量を定義する。すなわち、図１の刃先拡大図に
おいて、ホーニング加工量Ｌは、工具すくい面６の延長
線と逃げ面７の延長線との交点からすくい面６の端部あ
るいは逃げ面７の端部にいたる長さＬで示されるものと
する。このホーニング加工量Ｌは５〜２０μｍの範囲が
好ましい。ホーニング加工量Ｌが５μｍ以下の場合には
初期欠損性の向上が得られず、また２０μｍ以上におい
ては刃先のエッジが損なわれて仕上げ面の粗度が低下す
る。FIG. 1 is a sectional structural view and an enlarged view of the cutting edge of a polycrystalline diamond cutting tool according to an embodiment of the present invention. A polycrystalline diamond tip 3 is firmly attached to a tool support 4 made of cemented carbide, steel, etc. with a brazed portion 5 interposed therebetween. Polycrystalline diamond chip 3
The upper surface of the tool constitutes a tool rake face 6, and a flank face 7 forms a predetermined angle with this rake face 6. A cutting edge portion 9 is formed along the intersection line between the rake face 6 and the flank face 7. The cutting edge portion 9 is formed on a honed curved surface having a predetermined curvature. A graphite coating layer 8 generated during the honing process is formed on the surface. Here, the honing amount used in the "claims" will be defined. That is, in the enlarged view of the cutting edge in FIG. 1, the honing amount L is the length from the intersection of the extension line of the tool rake face 6 and the extension line of the flank face 7 to the end of the rake face 6 or the end of the flank face 7. Let it be denoted by L. The honing amount L is preferably in the range of 5 to 20 μm. If the honing amount L is less than 5 μm, no improvement in initial chipping property will be obtained, and if it is more than 20 μm, the edge of the cutting edge will be damaged and the roughness of the finished surface will be reduced.
【００１２】次に、図１に示された多結晶ダイヤモンド
切削工具の製造工程について説明する。図１ないし図６
はその製造工程図である。まず、図２を参照して、金属
あるいは合金からなる基材１表面上に、低圧気相法を用
いて多結晶ダイヤモンド２を形成する。基材１の表面は
、その表面粗さが最大高さ表示Ｒｍａｘ で０．１μｍ
以下の鏡面に仕上げ加工されている。この表面上に多結
晶ダイヤモンドを析出させる方法としては次のような低
圧気相法が用いられる。すなわち、熱電子放射やプラズ
マ放電を利用して原料ガスの分解・冷却を生じさせる方
法、あるいは燃焼炎を用いた成膜方法が有効である。原
料ガスとしては、たとえばメタン、エタン、プロパンな
どの炭化水素類、メタノール、エタノールなどのアルコ
ール類、エステル類などの有機炭素化合物と水素とを主
成分とする混合ガスが一般的に用いられる。これ以外に
はアルゴンなどの不活性ガスや酸素、二酸化炭素、水な
どもダイヤモンドの合成反応やその特性を阻害しない範
囲内で原料中に含有されても構わない。このような低圧
気相法により基板１表面上に多結晶ダイヤモンドの平均
結晶粒径が０．５〜１５μｍとなるように合成される。
この多結晶ダイヤモンドの粒径が規定されるのは、切削
工具として使用された場合、結晶粒径が０．５μｍより
も微粒になると耐磨耗性が低下し、また１５μｍよりも
粗粒になると欠損しやすくなるからである。また、基材
１としては多結晶ダイヤモンドの内部押力を低減させる
ために、その熱膨張率がダイヤモンドの熱膨張率に近い
ものが好ましく、たとえばモリブデン（Ｍｏ）、タング
ステン（Ｗ）、シリコン（Ｓｉ）などが挙げられる。Next, the manufacturing process of the polycrystalline diamond cutting tool shown in FIG. 1 will be explained. Figures 1 to 6
is a diagram of its manufacturing process. First, referring to FIG. 2, polycrystalline diamond 2 is formed on the surface of base material 1 made of metal or alloy using a low pressure vapor phase method. The surface of the base material 1 has a surface roughness of 0.1 μm at the maximum height Rmax.
Finished to the mirror surface shown below. As a method for depositing polycrystalline diamond on this surface, the following low pressure vapor phase method is used. That is, a method in which the source gas is decomposed and cooled using thermionic radiation or plasma discharge, or a film forming method using a combustion flame is effective. As the raw material gas, a mixed gas whose main components are hydrogen and hydrocarbons such as methane, ethane, and propane, alcohols such as methanol and ethanol, and organic carbon compounds such as esters is generally used. In addition to this, inert gases such as argon, oxygen, carbon dioxide, water, etc. may also be contained in the raw material within a range that does not inhibit the diamond synthesis reaction or its properties. By such a low pressure vapor phase method, polycrystalline diamond is synthesized on the surface of the substrate 1 so that the average crystal grain size is 0.5 to 15 μm. The grain size of this polycrystalline diamond is regulated because when used as a cutting tool, wear resistance decreases when the crystal grain size becomes finer than 0.5 μm, and when it becomes coarser than 15 μm. This is because it becomes easy to lose. In addition, in order to reduce the internal pushing force of polycrystalline diamond, the base material 1 is preferably one whose coefficient of thermal expansion is close to that of diamond, such as molybdenum (Mo), tungsten (W), silicon (Si), etc. ), etc.
【００１３】次に、図３を参照して、レーザ光１０によ
り基材１上に形成された多結晶ダイヤモンド層２に所定
の工具素材形状に沿って切断線を形成する。Next, referring to FIG. 3, cutting lines are formed in polycrystalline diamond layer 2 formed on base material 1 by laser beam 10 along a predetermined tool material shape.
【００１４】さらに図４を参照して、塩酸、硫酸、硝酸
、沸酸あるいはこれらの混合液により化学処理を施して
基材１を溶解し、多結晶ダイヤモンドから除去する。
これらによって形成された多結晶ダイヤモンド工具素材
３ａは、その積層方向の厚みが１ｍｍ以上であれば、そ
のまま刃先形成加工を行ない、ホルダにクランプして工
具として使用することができる。また、厚さが０．０５
〜１ｍｍであれば、超硬合金や鋼などからなる工具支持
体に接合した構造の切削工具として使用してもよい。こ
のような工具支持体に接合される構造の切削工具の場合
、多結晶ダイヤモンド工具素材３ａの厚みが０．０５ｍ
ｍよりも薄い場合には、工具素材としての強度が低下し
て欠損しやすくなる。また、このような接合型の切削工
具においては、一般的な使用に対しては工具素材の厚み
が１ｍｍ程度あれば十分である。なおこれらの構造は、
図５に示されるように、工具支持体４に対して、基材と
接合していた面がすくい面６となるように多結晶ダイヤ
モンド工具素材３と工具支持体４とがろう付された後接
合されることが必須である。Further, referring to FIG. 4, the base material 1 is dissolved and removed from the polycrystalline diamond by chemical treatment using hydrochloric acid, sulfuric acid, nitric acid, boiling acid, or a mixture thereof. If the polycrystalline diamond tool material 3a thus formed has a thickness of 1 mm or more in the stacking direction, it can be directly processed to form a cutting edge, clamped in a holder, and used as a tool. Also, the thickness is 0.05
~1 mm, it may be used as a cutting tool with a structure joined to a tool support made of cemented carbide, steel, or the like. In the case of a cutting tool having such a structure to be joined to a tool support, the thickness of the polycrystalline diamond tool material 3a is 0.05 m.
If it is thinner than m, the strength as a tool material decreases and it becomes easy to break. Further, in such a joint type cutting tool, it is sufficient for the thickness of the tool material to be about 1 mm for general use. Note that these structures are
As shown in FIG. 5, after the polycrystalline diamond tool material 3 and the tool support 4 are brazed to the tool support 4 so that the surface that was joined to the base material becomes the rake face 6. It is essential to be joined.
【００１５】さらに、図６を参照して、微粒のダイヤモ
ンド砥石などを用いてすくい面６と所定の角度をなす逃
げ面７を形成する。その後、レーザ光線を用いて刃先部
のホーニング加工を行なう。このレーザ加工は熱化学的
反応を伴なった加工であるため、機械的除去法である研
削加工に比べて刃先部の損傷が少ない。また、このレー
ザ加工により刃先部９には黒鉛被覆層８が形成される。
この黒鉛被覆層８の厚さは０．５〜１０μｍが好ましい
。かりに黒鉛被覆層８の厚さは、現状の技術では０．５
μｍとすることは困難であり、また１０μｍ以上では刃
先部に与えるダメージが大きくなり耐欠損性が低下する
。具体的実施例マイクロ波プラズマＣＶＤ法により、そ
の表面がＲｍａｘで０．０５μｍの鏡面状態であるＳｉ
基板上に多結晶ダイヤモンドを１０時間合成した。合成
は以下の条件で行なった。Further, referring to FIG. 6, a flank surface 7 forming a predetermined angle with the rake surface 6 is formed using a fine diamond grindstone or the like. Thereafter, the cutting edge is honed using a laser beam. Since this laser processing involves a thermochemical reaction, there is less damage to the cutting edge compared to grinding, which is a mechanical removal method. Furthermore, a graphite coating layer 8 is formed on the cutting edge portion 9 by this laser processing. The thickness of this graphite coating layer 8 is preferably 0.5 to 10 μm. However, the thickness of the graphite coating layer 8 is 0.5 with the current technology.
It is difficult to set the thickness to 10 μm or more, and damage to the cutting edge becomes large and fracture resistance decreases. Concrete Example A Si film whose surface has a mirror-like state with an Rmax of 0.05 μm was produced by microwave plasma CVD.
Polycrystalline diamond was synthesized on the substrate for 10 hours. The synthesis was performed under the following conditions.
【００１６】
合成後、弗硝酸に浸漬してＳｉ基板のみを溶解除去
することにより、平均結晶粒径が５μｍで厚さ０．２ｍ
ｍの多結晶ダイヤモンドを回収することができた。また
、多結晶ダイヤモンドの基板側の面はその粗さがＲｍａ
ｘで０．０５μｍであった。この多結晶ダイヤモンドを
、その成長面側を接合面として超硬合金製のシャンクと
ろう付接合を行なった。次に、この接合体を＃１５００
のダイヤモンド砥石による研削加工によりスローアウェ
イチップ（型番：ＳＰＧＮ１２０３０４）を作製した。
なお、得られたスローアウェイチップ（Ａ）は、刃先の
チッピングが１０μｍであった。[0016] After synthesis, by dipping in fluoronitric acid and dissolving and removing only the Si substrate, the resulting product had an average crystal grain size of 5 μm and a thickness of 0.2 m.
We were able to recover m polycrystalline diamonds. In addition, the roughness of the surface of polycrystalline diamond on the substrate side is Rma
x was 0.05 μm. This polycrystalline diamond was joined by brazing to a cemented carbide shank with its growth surface as the joint surface. Next, this zygote was #1500
An indexable tip (model number: SPGN120304) was prepared by grinding using a diamond grindstone. Note that the obtained indexable tip (A) had a chipping of 10 μm at the cutting edge.
【００１７】上記と同じ方法で作製したスローアウェイ
チップの刃先をＹＡＧレーザによって加工量Ｌが１０μ
ｍのホーニング処理を施した。得られたスローアウェイ
チップ（Ｂ）は、ホーニング部にレーザ加工に伴なって
厚さ３μｍの黒鉛被覆層が生成し、またその刃先のチッ
ピングの大きさは２μｍと良好であった。[0017] The cutting edge of the indexable insert manufactured by the same method as above was machined with a YAG laser so that the processing amount L was 10μ.
Honing treatment of m was performed. In the obtained indexable tip (B), a graphite coating layer with a thickness of 3 μm was formed on the honed portion due to laser processing, and the size of chipping at the cutting edge was as good as 2 μm.
【００１８】これらのスローアウェイチップを各々１０
個ずつ作製し、性能評価を以下の条件で行なった。10 each of these throwaway chips
They were manufactured one by one and performance evaluation was performed under the following conditions.
【００１９】
（切削条件）
被削材 ：Ａ３９０−Ｔ６
（Ａ１−１７％Ｓｉ）
丸棒の軸方向に４本のＶ字状の溝が形成
されたもの 切削速度 ：５００
ｍ／ｍｉｎ 切込み量 ：０．２
ｍｍ 送り速度 ：０．１ｍｍ／
ｒｅｖ． 冷却液 ：水溶性
油剤その結果、チップ（Ａ）は５個が切削後５分で、ま
た３個が切削後８分で、さらに残りの２個が切削後２０
分で欠損が生じた。これに対して、本発明によるチップ
（Ｂ）は、いずれのチップも６０分間切削しても刃先に
欠損を生じることがなく、また良好な被削面が得られた
。この結果より、この発明によるチップは高靭性を有す
る切削工具であることが明らかとなった。(Cutting conditions) Work material: A390-T6
(A1-17%Si)
A round bar with four V-shaped grooves formed in the axial direction Cutting speed: 500
m/min depth of cut: 0.2
mm Feed speed: 0.1mm/
rev. Coolant: Water-soluble oil As a result, 5 chips (A) were cut 5 minutes after cutting, 3 chips were cut 8 minutes after cutting, and the remaining 2 chips were cut 20 minutes after cutting.
The loss occurred in minutes. On the other hand, with the tips (B) according to the present invention, no chipping occurred on the cutting edge even after cutting for 60 minutes, and a good cut surface was obtained. These results revealed that the tip according to the present invention is a cutting tool with high toughness.
【００２０】[0020]
【発明の効果】このように、多結晶ダイヤモンド工具の
刃先部をレーザ加工によりホーニング処理することによ
り、耐欠損性に優れた高靭性を有する多結晶ダイヤモン
ド切削工具を得ることができる。As described above, by honing the cutting edge of a polycrystalline diamond tool by laser processing, a polycrystalline diamond cutting tool having high toughness and excellent fracture resistance can be obtained.
【図１】この発明による多結晶ダイヤモンド切削工具の
刃先部断面構造図である。FIG. 1 is a cross-sectional structural view of the cutting edge of a polycrystalline diamond cutting tool according to the present invention.
【図２】この発明による多結晶ダイヤモンド切削工具の
製造工程の第１工程図である。FIG. 2 is a first process diagram of the manufacturing process of a polycrystalline diamond cutting tool according to the present invention.
【図３】この発明による多結晶ダイヤモンド切削工具の
製造工程の第２工程図である。FIG. 3 is a second process diagram of the manufacturing process of a polycrystalline diamond cutting tool according to the present invention.
【図４】この発明の多結晶ダイヤモンド切削工具の製造
工程の第３工程図である。FIG. 4 is a third process diagram of the manufacturing process of the polycrystalline diamond cutting tool of the present invention.
【図５】この発明の多結晶ダイヤモンド切削工具の製造
工程の第４工程図である。FIG. 5 is a fourth process diagram of the manufacturing process of the polycrystalline diamond cutting tool of the present invention.
【図６】この発明の多結晶ダイヤモンド切削工具の製造
工程の第５工程図である。FIG. 6 is a fifth process diagram of the manufacturing process of the polycrystalline diamond cutting tool of the present invention.
【図７】従来の多結晶ダイヤモンド切削工具の刃先部断
面構造図である。FIG. 7 is a cross-sectional structural view of the cutting edge of a conventional polycrystalline diamond cutting tool.
１ 基材 ２ 多結晶ダイヤモンド層 ３ ダイヤモンドチップ ４ 工具支持体 ５ ろう付部 ６ すくい面 ７ 逃げ面 ８ 黒鉛被覆層 ９ 刃先部 １０ レーザ光 1 Base material 2 Polycrystalline diamond layer 3 Diamond tip 4 Tool support 5 Brazing part 6 Rake face 7 Relief surface 8 Graphite coating layer 9 Blade tip 10 Laser light
Claims (11)
イヤモンドを用いた多結晶ダイヤモンド切削工具であっ
て、工具のすくい面と逃げ面との交線に沿って構成され
る刃先部がホーニング加工された曲面を有している、多
結晶ダイヤモンド切削工具。Claim 1: A polycrystalline diamond cutting tool using polycrystalline diamond synthesized by a low-pressure gas phase method, wherein the cutting edge portion formed along the intersection line of the rake face and flank face of the tool is honed. A polycrystalline diamond cutting tool with a curved surface.
ｍ以上２０μｍ以下である、請求項１記載の多結晶ダイ
ヤモンド切削工具。[Claim 2] The honing amount of the cutting edge portion is 5μ.
The polycrystalline diamond cutting tool according to claim 1, wherein the polycrystalline diamond cutting tool has a diameter of not less than m and not more than 20 μm.
が厚さ０．５μｍ以上１０μｍ以下の黒鉛層で被覆され
ている、請求項１または２記載の多結晶ダイヤモンド工
具。3. The polycrystalline diamond tool according to claim 1, wherein the honed cutting edge portion is coated with a graphite layer having a thickness of 0.5 μm or more and 10 μm or less.
０．５μｍ以上１０μｍ以下である、請求項１ないし請
求項３のいずれかに記載の多結晶ダイヤモンド切削工具
。4. The polycrystalline diamond cutting tool according to claim 1, wherein the polycrystalline diamond has an average grain size of 0.5 μm or more and 10 μm or less.
イヤモンドを工具素材とし、この工具素材を工具支持体
に接合して構成された多結晶ダイヤモンド切削工具であ
って、工具のすくい面と逃げ面との交線に沿って構成さ
れる刃先部がホーニング加工された曲面を有している、
多結晶ダイヤモンド切削工具。5. A polycrystalline diamond cutting tool constructed by using polycrystalline diamond synthesized by a low-pressure gas phase method as a tool material and bonding this tool material to a tool support, the tool having a rake face and a clearance. The cutting edge section configured along the line of intersection with the surface has a curved surface that has been honed.
Polycrystalline diamond cutting tools.
μｍ以上２０μｍ以下である、請求項５記載の多結晶ダ
イヤモンド切削工具。6. The honing amount of the cutting edge portion is 5.
The polycrystalline diamond cutting tool according to claim 5, which has a diameter of not less than μm and not more than 20 μm.
が、厚さ０．５μｍ以上１０μｍ以下の黒鉛層で被覆さ
れている、請求項５または請求項６に記載の多結晶ダイ
ヤモンド切削工具。7. The polycrystalline diamond cutting tool according to claim 5, wherein the honed cutting edge portion is coated with a graphite layer having a thickness of 0.5 μm or more and 10 μm or less.
、０．５μｍ以上１５μｍ以下である、請求項５ないし
請求項７のいずれかに記載の多結晶ダイヤモンド切削工
具。8. The polycrystalline diamond cutting tool according to claim 5, wherein the polycrystalline diamond has an average grain size of 0.5 μm or more and 15 μm or less.
面にほぼ直交する方向の厚みが０．０５ｍｍ以上１ｍｍ
以下である、請求項５ないし請求項８のいずれかに記載
の多結晶ダイヤモンド切削工具。9. The polycrystalline diamond has a thickness of 0.05 mm or more and 1 mm in a direction substantially perpendicular to the rake face.
The polycrystalline diamond cutting tool according to any one of claims 5 to 8, which is as follows.
結晶ダイヤモンドを析出させる工程と、前記基材上の前
記多結晶ダイヤモンドを所定のチップ形状に切断した後
、前記基材を前記多結晶ダイヤモンドのチップから除去
する工程と、前記多結晶ダイヤモンドのチップ表面のう
ち、前記基材と接していた側の表面を工具すくい面とし
、このすくい面と所定の角度をなすように逃げ面を形成
することにより刃先部を形成する工程と、前記刃先部を
ホーニング加工して曲面を形成する工程とを備えた、多
結晶ダイヤモンド切削工具の製造方法。10. Precipitating polycrystalline diamond on the surface of a base material by a low-pressure vapor phase method, and cutting the polycrystalline diamond on the base material into a predetermined chip shape, and then depositing the polycrystalline diamond on the surface of the base material. A step of removing the crystalline diamond from the chip; and a step of removing the polycrystalline diamond from the chip, using the surface of the polycrystalline diamond chip that was in contact with the base material as the tool rake face, and forming a flank face at a predetermined angle with the rake face. A method for manufacturing a polycrystalline diamond cutting tool, comprising: forming a cutting edge by forming a cutting edge; and honing the cutting edge to form a curved surface.
ーザを用いて行なわれる、請求項１０に記載の多結晶ダ
イヤモンド切削工具。11. The polycrystalline diamond cutting tool according to claim 10, wherein the honing of the cutting edge portion is performed using a laser.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3003151A JP3013448B2 (en) | 1991-01-16 | 1991-01-16 | Polycrystalline diamond cutting tool and its manufacturing method |
| US07/772,268 US5178645A (en) | 1990-10-08 | 1991-10-07 | Cutting tool of polycrystalline diamond and method of manufacturing the same |
| EP91117198A EP0480394B1 (en) | 1990-10-08 | 1991-10-08 | Cutting tool of polycrystalline diamond and method of manufacturing the same |
| DE69107766T DE69107766T2 (en) | 1990-10-08 | 1991-10-08 | Polycrystalline diamond cutting tool and process for its manufacture. |
| KR1019910017576A KR950004663B1 (en) | 1990-10-08 | 1991-10-08 | Cutting tool of polycrystalline diamond and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3003151A JP3013448B2 (en) | 1991-01-16 | 1991-01-16 | Polycrystalline diamond cutting tool and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04240007A true JPH04240007A (en) | 1992-08-27 |
| JP3013448B2 JP3013448B2 (en) | 2000-02-28 |
Family
ID=11549353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3003151A Expired - Fee Related JP3013448B2 (en) | 1990-10-08 | 1991-01-16 | Polycrystalline diamond cutting tool and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3013448B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06190610A (en) * | 1992-12-25 | 1994-07-12 | Osaka Diamond Ind Co Ltd | Diamond tool |
| JP2011000667A (en) * | 2009-06-17 | 2011-01-06 | Fukuoka Institute Of Technology | Machining apparatus and machining method for high hardness material |
| JP2012176471A (en) * | 2011-02-28 | 2012-09-13 | Mitsubishi Materials Corp | Diamond coated cutting tool |
| DE102011076584A1 (en) * | 2011-05-27 | 2012-11-29 | Karnasch Professional Tools GmbH | Cutting tool, useful for machining workpieces, comprises a base body that comprises cutting edges in a region of its free end, where the cutting edges extend radially outward starting from the center of the base body |
| JP2014091168A (en) * | 2012-10-31 | 2014-05-19 | Mitsubishi Materials Corp | End mill and manufacturing method for the same |
| JPWO2016035490A1 (en) * | 2014-09-05 | 2017-06-22 | 住友電工ハードメタル株式会社 | Throwaway tip |
| JP2020001156A (en) * | 2018-06-29 | 2020-01-09 | ヘラミエンタス プレジス，エセ．エレ． | Cutting insert applicable to machining tool and machining tool bearing it |
| JP2021516631A (en) * | 2018-11-27 | 2021-07-08 | トゥエンティファーストティーエイチ センチュリー カンパニー リミテッド21Th Century Co., Ltd | Ultra-precision blade edge processing method using femtosecond laser |
-
1991
- 1991-01-16 JP JP3003151A patent/JP3013448B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06190610A (en) * | 1992-12-25 | 1994-07-12 | Osaka Diamond Ind Co Ltd | Diamond tool |
| JP2011000667A (en) * | 2009-06-17 | 2011-01-06 | Fukuoka Institute Of Technology | Machining apparatus and machining method for high hardness material |
| JP2012176471A (en) * | 2011-02-28 | 2012-09-13 | Mitsubishi Materials Corp | Diamond coated cutting tool |
| DE102011076584A1 (en) * | 2011-05-27 | 2012-11-29 | Karnasch Professional Tools GmbH | Cutting tool, useful for machining workpieces, comprises a base body that comprises cutting edges in a region of its free end, where the cutting edges extend radially outward starting from the center of the base body |
| JP2014091168A (en) * | 2012-10-31 | 2014-05-19 | Mitsubishi Materials Corp | End mill and manufacturing method for the same |
| JPWO2016035490A1 (en) * | 2014-09-05 | 2017-06-22 | 住友電工ハードメタル株式会社 | Throwaway tip |
| JP2020001156A (en) * | 2018-06-29 | 2020-01-09 | ヘラミエンタス プレジス，エセ．エレ． | Cutting insert applicable to machining tool and machining tool bearing it |
| JP2021516631A (en) * | 2018-11-27 | 2021-07-08 | トゥエンティファーストティーエイチ センチュリー カンパニー リミテッド21Th Century Co., Ltd | Ultra-precision blade edge processing method using femtosecond laser |
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|---|---|
| JP3013448B2 (en) | 2000-02-28 |
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