JPH0423389A - Plated lead connection structure of circuit board - Google Patents

Abstract

PURPOSE:To lessen the number of external plated leads and to prevent the generation of the static breakdown of a circuit board by a method wherein the connection structure between shorting patterns, which are positioned on the same coordinates of a pluralily of layers, is formed into a plated lead connection structure, in which the shorting patterns are made to have continuity to each other through a through hole. CONSTITUTION:A shorting pattern 1 is made to have continuity with a shorting pattern 3 through a through hole 5. The pattern 1 is connected to a shorting pattern 2 via a circuit pattern 13 and plated leads 6 on the same surface. Accordingly, the patterns on a circuit board 10 result in all being made to have continuity with one another. Then, when a external plated lead 8 is led out from one arbitrary place of the circuit pattern 13, it becomes possible to perform an electrolytic plating to all the circuit pattern on the board 10. Then, when the external shape of the board is punched, an intrusion of static electricity from the cut surface of the external plated lead, which is exposed to the section of the external shape of the board, can be prevent because the cut surface is one place.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a plated lead connection structure between shorting patterns located close to each other in a plan view of each layer in a circuit board having circuit patterns in a plurality of layers. .

[Summary of the Invention] The present invention provides electrical conductivity between shorting patterns located in close planar positions in each layer in a circuit board having circuit patterns on multiple layers by using through holes to connect externally plated lead out lines. This prevents static electricity from being generated from the externally cut surface of the externally plated lead wire.

[Prior art 1] As shown in FIG. 4, the conventional structure utilizes a through hole (12) in a circuit board to draw out a mesh node (6) and connect a shift node (6) located on the same coordinates of multiple layers. The connecting patterns (11) were connected.

In addition, as shown in Fig. 5, a shorting pattern (
Since there is a limit to the number of plated leads (6) that can be connected to 11), external plated lead lead wires (8) are provided at several locations when there is not enough space.

[Problems to be Solved by the Invention] In the conventional plated lead connection structure, shorting patterns (11
) is connected through a through hole (12) in the circuit pattern as shown in Fig. 4, the plated lead (6) connected to the shorting pattern (11) is required for this purpose. It will become. Here, there is a processing and quality condition that requires a certain distance or more between adjacent plated lead cut surfaces on the cut surfaces of the plated lead cut holes (7). 7) must be increased or increased.

Furthermore, as shown in FIG. 5, when the external plated leads (8) are pulled out from each shorting pattern (11), there are multiple plated lead cut surfaces in the cross section of the board outline.
There was a problem in that the number of paths for static electricity to enter increased, making it easier to cause static electricity damage.

Therefore, in order to solve these conventional problems, this invention reduces the number of external plated leads.
The purpose is to prevent static electricity damage.

[Means for Solving the Problems] In order to solve the above problems, the present invention provides a plated lead connection structure in which shorting patterns located on the same coordinates of a plurality of layers are electrically connected through through holes. The structure allows only a small number of externally plated lead wires to be drawn out.

[Function] In the circuit board configured as described above, conduction is established between the patterns of each layer through the through holes in the shorting patterns of each layer, so the external plating is performed at a predetermined level. This can be done by connecting only the lead out line.

After completing the coating process, the shorting pattern portion is cut to complete the circuit board.

Embodiment] Embodiments of the present invention will be described below based on the drawings. In FIG. 1, shorting pattern 1 and shorting pattern 3 are electrically connected through a through hole 5. In FIG. Furthermore, the shorting patterns 1 and 2 are connected on the same surface via a circuit pattern 13 and a plating lead 6. Therefore, all the patterns on the circuit board 10 are electrically connected. Next, if the external plated lead 8 is pulled out from any one place on the circuit pattern 13, the circuit board 10
It becomes possible to apply electrolytic plating to all of the above circuit patterns.

Next, when the board is cut out, only one cut surface of the externally plated lead is exposed in the cross section of the board, as shown in FIG. 2, so it is possible to prevent static electricity from penetrating the cut surface. Here, a resist 9 can also be applied to the pattern.

Further, here, circular shorting patterns A to 4 are shown as examples, but the shape is not particularly limited, and therefore, a land of a rectangular shorting pattern may be used.

[Effects of the Invention] As explained above, by establishing conduction between shorting patterns located close to each other in a plane of multiple layers using through holes, there are fewer cut surfaces of externally plated leads exposed on the cross section of the board outline. This has the advantage that static electricity can be prevented from entering from the cut surface, and defects and breakdowns due to static electricity breakdown can be prevented.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of the present invention, (a) is a back pattern diagram, (b) is a front pattern diagram, and FIG.
b) is a side view of part A, FIG. 3 is a perspective view of a plated lead cut portion, FIG. 4 is a conventional plated lead connection diagram, and FIG. 5 is a conventional plated lead extraction diagram. 1 , 2, 3, 4 5 ・ ・ ・ Shorting pattern/Through hole (between shorting patterns) ・ Plated lead ・ Plated lead cut hole ・ External plated lead lead wire ・ Resist ・ Circuit board ・ Shorting pattern ・ Through hole ( Between circuit patterns) ・Circuit patterns and above Applicant Seiko Electronic Industries Co., Ltd. Agent Patent attorney Keisuke Hayashi Figure

Claims (3)

[Claims] (1) A plated lead connection for a circuit board having circuit patterns in a plurality of layers, characterized in that conduction between the shorting patterns in each layer is established by providing through holes in the shorting patterns in each layer. structure. (2) The plating lead connection structure for a circuit board according to claim 1, wherein the shorting pattern is circular. (3) The plating lead connection structure for a circuit board according to claim 1, wherein the shorting pattern is formed into a rectangular round shape.