JPH0423320Y2 - - Google Patents
Info
- Publication number
- JPH0423320Y2 JPH0423320Y2 JP17313786U JP17313786U JPH0423320Y2 JP H0423320 Y2 JPH0423320 Y2 JP H0423320Y2 JP 17313786 U JP17313786 U JP 17313786U JP 17313786 U JP17313786 U JP 17313786U JP H0423320 Y2 JPH0423320 Y2 JP H0423320Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- ejector pin
- cavity
- sealing device
- molds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 51
- 229920005989 resin Polymers 0.000 claims description 51
- 239000000463 material Substances 0.000 claims description 21
- 238000007789 sealing Methods 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 17
- 230000000694 effects Effects 0.000 description 8
- 238000000465 moulding Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005580 one pot reaction Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17313786U JPH0423320Y2 (enrdf_load_html_response) | 1986-11-10 | 1986-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17313786U JPH0423320Y2 (enrdf_load_html_response) | 1986-11-10 | 1986-11-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6377340U JPS6377340U (enrdf_load_html_response) | 1988-05-23 |
| JPH0423320Y2 true JPH0423320Y2 (enrdf_load_html_response) | 1992-05-29 |
Family
ID=31110316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17313786U Expired JPH0423320Y2 (enrdf_load_html_response) | 1986-11-10 | 1986-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423320Y2 (enrdf_load_html_response) |
-
1986
- 1986-11-10 JP JP17313786U patent/JPH0423320Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6377340U (enrdf_load_html_response) | 1988-05-23 |
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