JPH0423263Y2 - - Google Patents

Description

[Detailed description of the invention] A. Industrial application field The present invention is an electrode connection structure in which a signal electrode is provided in the side direction of a plurality of wirings arranged in parallel on a substrate, and this electrode is connected to the above wiring. Regarding.

B. Prior Art In a liquid crystal display device, when electrically connecting a driving semiconductor chip provided on a glass substrate to a plurality of wiring lines arranged in parallel on the glass substrate and forming input lines, conventional techniques have been used. For example, wire bonding was used as shown in Japanese Patent Publication No. 59-17977. That is, as shown in the top view of FIG. 3, the wiring 2 provided on the glass substrate 1,
2... and desired bonding pads 4, 4, . . . on the semiconductor chip 3 were bonded with wires 5, 5, . Here, 6, 6, . . . are output lines from the semiconductor chip 3.

C. Problems to be Solved by the Invention However, with such a connection structure, the bonding distance becomes long, and as shown in the cross-sectional view of FIG. 4, there is a risk that the wire 5 will hang down and come into contact with other wiring 2. For this reason, as shown in FIG. 5, it is necessary to lift the wire 5 and correct it so that it does not come into contact with other wiring 2, which poses a problem in that the bonding process becomes complicated.

D. Means for Solving the Problems The present invention has been made in view of the above points, and includes a wire in a direction intersecting with the wire on the side of a plurality of wires provided in parallel on the glass substrate serving as the first substrate. A plurality of electrodes are formed in parallel, and electrical connections between each wiring and the electrodes are made using a second substrate on which a conductive pattern is formed and an anisotropic conductive film that holds the second substrate. It's on.

E. Effect A plurality of electrodes are provided on the sides of a plurality of wirings arranged in parallel, and these electrodes and each wiring are electrically connected by a conductive pattern and an anisotropic conductive film on the second substrate. Therefore, the electrode can be safely taken out from the wiring, and this electrode extraction structure can be used to make an electrical connection between the wiring on the glass substrate of the liquid crystal display and the driving semiconductor chip.

F Example Fig. 1 is a top view of the main part on a glass substrate using the electrode extraction structure of the present invention, and Fig. 2 is a sectional view of the main part thereof. A code is attached. In these figures, a large number of electrodes 7, 7, . . . are formed on a glass substrate 1 between a chip 3 and a plurality of wirings 2, 2, . . ., which are input lines arranged in parallel. Reference numeral 8 denotes a flexible printed circuit board (hereinafter referred to as FPC) serving as a second board, on which the wirings 2, 2... and electrodes 7, 7 are connected.
It is provided so as to cover at least a part of...
Reference numerals 9, 9, . . . indicate anisotropic conductive films interposed between the wirings 2, 2, . . . and the FPC 8, which have vertical conductivity. Reference numeral 10 denotes an anisotropic conductive film interposed between the electrodes 7, 7... and the FPC 8, which exhibits conductivity in the vertical direction and exhibits insulation in the direction in which the electrodes 7, 7... are arranged. It's summery. Moreover, these anisotropic conductive films 9, 9...10 are connected to the glass substrate 1,
It also serves as a spacer to maintain the distance between it and the FPC8. 11, 11... are conductive patterns provided on the surface of the FPC 8, and the wirings 2,
The positions of the anisotropic conductive films 9, 9, . . . on the electrodes 7, 7, . Further, the electrodes 7, 7, . . . and the bonding pads 4, 4, . . . on the semiconductor chip 3 are bonded with wires 5, 5, .

Therefore, in such a configuration, when a signal is applied to the wirings 2, 2... serving as input lines, the anisotropic conductive films 9, 9..., the conductive patterns 11,
11..., the anisotropic conductive film 10, the electrodes 7, 7..., and the wires 5, 5... to the bonding pads 4, 4... of the semiconductor chip 3. At this time, as mentioned above, the anisotropic conductive film 10 between the electrodes 7, 7... and the FPC 8 has insulating properties in the arrangement direction of the electrodes 7, 7..., so no shortening occurs at this location. .

The anisotropic conductive films 9, 9...10 are, for example, Ansolm AC-1052 (trade name, Hitachi Chemical Co., Ltd.).
), CP-1000, CP-2000 (trade name, manufactured by Sony Chemical Co., Ltd.), etc. are used. Further, these anisotropic conductive films 9, 9...10 are provided attached to the FPC 8, and when the FPC 8 is attached to the glass substrate 1, these anisotropic conductive films 9, 9...10 are attached to the wirings 2, 2. . . . and the electrodes 7, 7 . . . by thermocompression bonding.

G. Effects of the invention As stated above, the electrode connection structure of the invention
A plurality of electrodes are provided on the sides of multiple wirings arranged in parallel on a second substrate, and these electrodes and each wiring are electrically connected by a conductive pattern and an anisotropic conductive film on a second substrate. This makes it possible to safely extract signals from the wiring, and this electrode connection structure can be used to make electrical connections between the wiring on the glass substrate of a liquid crystal display and the semiconductor chip for driving the display. , a highly reliable device is provided.

[Brief explanation of drawings]

Fig. 1 is a schematic top view showing the main parts of the electrode connection structure of the present invention, Fig. 2 is a schematic sectional view of the main parts of the invention, Fig. 3 is a schematic top view showing the connection state of a conventional wiring semiconductor chip, and Fig. FIG. 5 is a schematic cross-sectional view showing a conventional connection state between wiring and a semiconductor chip. 1... Glass substrate, 2, 2... Wiring, 3... Semiconductor chip, 4, 4... Bonding pad,
5, 5...wire, 7,7...electrode, 8...
FPC, 9,9...10...Anisotropic conductive film, 11,
11... Conductive pattern.

Claims (1)

[Scope of utility model registration request] a plurality of wirings formed in parallel on a first substrate; a plurality of electrodes formed in parallel in a direction intersecting the wirings on the first substrate on the side of the wiring;
a second substrate that covers at least directly above the electrode and a part of the wiring; and a second substrate that is provided on the wiring and the electrode and serves as a spacer between the first substrate and the second substrate; An electrode connection structure comprising an anisotropic conductive film having conductivity and a conductive pattern formed on the surface of the second substrate and connecting a conductive film position on the wiring to a conductive film position on the electrode.