JPH04230059A - Cooling structure - Google Patents

Abstract

PURPOSE:To improve the heat conductivity of a module while a reduction in the size of the module is contrived by a method wherein are formed in a heat dissipation block, threads to mesh with these threads are formed in heat conductors and the block and the heat conductors are jointed together by screws. CONSTITUTION:Studs 8, which respectively come into contact to each LSI 2 and are superior in heat conductivity, are formed on a heat dissipation block 4 in such a way as to correspond to the mounting positions of the LSI 2. Thread cuttings 4a are processed over all of stud formation surfaces on the block 4 and screws 8c to mesh with the thread cuttings 4a are processed in the periphery of each stud 8. Slits 8d of a prescribed length are formed in each stud from the sides, which are located on the side of a cold plate 3, of these studs 8 toward the longitudinal direction and a taper thread hole 8b, in which a taper thread 9 is inserted, is perforated in the surface formed with the slits 8d of each stud. Thereby, by inserting the taper thread 9 in the studs 8 to clamp, the slits 8d are formed and the partially split studs 8 come into contact to the block 4.

Description

[Detailed description of the invention]

0001

[Field of Industrial Application] The present invention relates to a cooling structure, and more particularly, the present invention relates to a cooling structure, and in particular, a thermal conductor is brought into contact with an integrated circuit element (hereinafter referred to as LSI) mounted on a substrate, and the LSI is connected through the thermal conductor.
The present invention relates to a cooling structure for cooling I.

0002

[Prior Art] Conventionally, as shown in FIG.
A heat dissipation block 33 having excellent thermal conductivity is provided on a substrate 30 on which the heat dissipation block 33 is mounted via a flange 34. In addition, heat dissipation block 3
sealing material 3 to enhance the seal between 3 and the substrate 30.
5 is interposed. The substrate 30 of this heat dissipation block 33
On the other side, a cold plate 32 having a refrigerant passage 39 in which a refrigerant flows is brought into contact with, for example, a thermal compound. Couplers 40a and 40b for connecting pipes are formed at both ends of the refrigerant passage 39, respectively.

[0003] Studs 37 having excellent thermal conductivity are formed on the heat dissipation block 33 in correspondence with the mounting positions of the LSIs 31 and in contact with the LSIs 31 . This stud 37
A thermal compound 36 is applied to the contact surface between the LSI 31 and the LSI 31 to improve adhesion. On the other hand, a hole into which the taper screw 38 is inserted is formed on the end surface of the stud 37 on the side of the cold plate 32, and a slit (not shown) is formed around the insertion hole. Therefore, when the taper screw 38 is inserted into the stud 37 and tightened, the stud 38, which has been partially divided by forming a slit,
Since this comes into contact with the heat radiation block 33, the contact area between the heat radiation block 33 and the stud 37 is ensured at this portion.

0004

[Problems to be Solved by the Invention] However, in the past, the contact surface of the stud with the heat dissipation block was only at the part where the taper screw was inserted, so there was a limit to heat conduction. Therefore, in order to further improve heat conduction,
The only option is to increase the length of the stud and achieve indirect conduction between the stud and the heat dissipation block via gas. However, this resulted in an increase in the size of the module, and the part with the best thermal conductivity was located farthest from the LSI, and as a result, the thermal conductivity did not improve as much as the difference.

[0005] Accordingly, an object of the present invention is to reduce the size of the module while also improving its thermal conductivity.

[0006]

[Means for Solving the Problems] The above object is to provide a heat dissipation block 4 having a heat conductor 8 in contact with an integrated circuit element 2 mounted on a substrate 1, and a heat dissipation block 4 having a heat conductor 8 in contact with the heat dissipation block 4 and having a refrigerant inside the heat dissipation block 4. In a cooling structure consisting of a cold plate 3 having a flowing refrigerant passage 11, the heat radiation block 4 is formed with a thread 4a, the heat conductor 8 is formed with a thread 8c that engages with the heat radiation block 4, A cooling structure characterized in that a heat radiation block 4 and the heat conductor 8 are joined by screws,

Alternatively, a cold radiator block 4 having a heat conductor 13 in contact with an integrated circuit element 2 mounted on a substrate 1, and a refrigerant passage 11 in contact with the heat radiator block 4 and in which a refrigerant flows. A cooling structure consisting of a plate 3, a thermal conductor 13 having a hole 14c passing through it in the longitudinal direction, and a plurality of tapered pipes 1 inserted into each of the tapered ends of the thermal conductor 13.
4a, 14b, and a bolt 13a that is inserted into the hole 14c, connects the plurality of tapered pipes 14a, 14b, and has fastening means 13b on at least one of the bolts 13a,

Alternatively, a cold radiator block 4 having a heat conductor 16 in contact with the integrated circuit element 2 mounted on the substrate 1, and a refrigerant passage 11 in contact with the heat radiator block 4 and through which a refrigerant flows. A cooling structure comprising a plate 3, characterized in that a spline shape 16a is formed in a portion of the heat conductor 16 that contacts the heat radiation block 4,

[0009] Alternatively, a cold radiator block 4 having a heat conductor 19 in contact with an integrated circuit element 2 mounted on a substrate 1, and a refrigerant passage 11 in contact with the heat radiator block 4 and through which a refrigerant flows. In the cooling structure consisting of a plate 3, a heat sink 17 having a protrusion shape with excellent thermal conductivity is formed on the integrated circuit element 2, and a heat sink 17 is formed on the heat dissipation block 4 corresponding to the mounting position of the integrated circuit element 2. and a cylindrical sleeve 19 that contacts the heat sink 17 and the protrusion 4e, respectively, and has an R curved surface at the contact portion,

0010

[Operation] That is, in any case, in the present invention, first, the contact area is ensured by actively making contact between the heat conductor and the heat dissipation block near the LSI, and then the contact area is ensured. By providing other contact parts in addition to the contact parts, it becomes possible to perform contact at other points.

[0011]

[Embodiment] A preferred embodiment of the present invention will be described below with reference to FIG.
This will be explained in detail using FIGS. 12 to 12.

FIG. 1 is a diagram showing a first embodiment of the present invention, FIG. 2 is a perspective view of a stud, and FIG. 3 is a diagram showing a second embodiment of the present invention.
FIG. 4 is a perspective view of a stud, FIG. 5 is a diagram showing a heat conduction state, FIG. 6 is a diagram showing a third embodiment of the present invention, and FIG. 7 is a diagram showing a third embodiment of the present invention. FIG. 8 is a perspective view of a stud, FIG. 8 is a diagram showing a fourth embodiment of the present invention, and FIG. 9 is a diagram showing a fourth embodiment of the present invention.
is a perspective view of the sleeve, FIG. 10 is a diagram showing a heat conduction state, FIG. 11 is a diagram showing a fifth embodiment of the present invention, and FIG. 12 is a perspective view of the sleeve and LSI.

1 to 12, 1 is a substrate, 2 is an LSI, 3 is a cold plate, 4 is a heat dissipation block, 4
a is threaded, 4b is a hole, 4c is a recess, 4d is a recess, 4e is a notch, 4f is a recess, 5 is a flange, 6 is a sealing material, 7
are thermal compound, 8, 13 and 16 are studs, 8a is a locking hole, 8b is a tapered screw hole, 8c is a screw, 8d is a slit, 9 is a tapered screw, 10 is a bolt, 1
1 is a refrigerant passage, 12a and 12b are couplers, 13a is a bolt, 13b is a nut, 13c is a slit, 14a and 14b are tapered pipes, 14c is a hole, 15 is a spring, 16a is a spline, 16c is a spline hole, 17 is a heat sink, 18 is bocchi, 18a is bocchi, 18b
19 is a recess, 19 is a sleeve, 19a and 19b are slits, 19c is a sleeve, and 19d and 19e are slits.

It should be noted that the same reference numerals throughout FIGS. 1 to 12 indicate the same objects.

First, a first embodiment will be explained in detail using FIGS. 1 and 2. As shown in FIG. 1, a heat dissipation block 4 having excellent thermal conductivity is provided on a substrate 1 on which an LSI 2 is mounted via a flange 5. In addition, the heat dissipation block 4 and the board 1
A sealing material 6 is interposed to enhance the seal between the two. On the side of this heat dissipation block 4 that is different from the substrate 1 side,
A cold plate 3 having a refrigerant passage 11 in which a refrigerant flows is brought into contact with, for example, a thermal compound. Couplers 12a and 12b for connecting pipes are formed at both ends of the refrigerant passage 11, respectively.

Studs 8 having excellent thermal conductivity are formed in the heat dissipation block 4 in correspondence with the mounting positions of the LSI 2 and in contact with the LSI 2. In this embodiment, first, threads 4a are machined on the heat dissipation block 4 over the entire stud forming surface, and as shown in FIG. 2, screws 8c are machined around the stud 8 to engage with the threads 4a. A slit 8d of a predetermined length is formed in the stud 8 from the cold plate side toward the longitudinal direction. Further, a tapered screw hole 8b into which a taper screw 9 is inserted is bored in the surface where the slit 8d is formed. Therefore, by inserting the taper screw 9 into the stud 8 and tightening it, the slit 8d is formed and the partially divided stud 8 comes into contact with the heat radiation block 4.

In the above configuration, heat conduction when cooling the LSI 2 is first conducted to the stud 8 via the thermal compound 7 for increasing the adhesion between the LSI 2 and the stud 8, and then to the heat dissipation block 4 via each screw. The heat is exchanged with the refrigerant in the cold plate 3. The mounting height of the LSI 2 mounted on the substrate 1 is adjusted by adjusting the insertion length between the heat dissipation block 4 and the stud 8.

In this embodiment, the heat dissipation block 4
Since the contact between the stud 8 and the stud 8 is made mechanically, there is no possibility that the stud 8 will move due to external force and the contact resistance will increase.

Next, a second embodiment will be explained in detail using FIGS. 3 to 5. As shown in FIG. 3, a heat dissipation block 4 having excellent thermal conductivity is provided on a substrate 1 on which an LSI 2 is mounted via a flange 5. In addition, the heat dissipation block 4 and the board 1
A sealing material 6 is interposed to enhance the seal between the two. On the side of this heat dissipation block 4 that is different from the substrate 1 side,
A cold plate 3 having a refrigerant passage 11 in which a refrigerant flows is brought into contact with, for example, a thermal compound. Couplers 12a and 12b for connecting pipes are formed at both ends of the refrigerant passage 11, respectively.

A hole 4b is bored in the heat dissipation block 4 corresponding to the mounting position of the LSI 2, and the LSI 2 is inserted into the hole 4b.
A stud 13 with excellent thermal conductivity is formed in contact with. As shown in FIG. 4, the stud 13 of this embodiment has a hole 14c that extends through the stud 13 in the longitudinal direction and has a tapered portion at a predetermined angle on both end surfaces. Further, slits 13c of a predetermined length are formed alternately in the longitudinal direction from both end faces. On the other hand, a bolt 13a having a thread 13b cut at one end thereof and a nut 13b that fits into the thread is inserted into the hole 14c of the stud 13. Tapered pipes 14a and 14b having angles slightly larger than the predetermined angle are inserted into the tapered portions. Therefore, when the stud 13 is brought into contact with the heat radiation block 4, the stud 1
3, and with the taper pipes 14a and 14b attached to the bolt 13a, tighten the nut 13b.
When tightened, the stud 13 with the slit 13c formed
The portion contacts the heat dissipation block 4 in a divided form.

In the above configuration, heat conduction when cooling the LSI 2 is first conducted to the stud 13 via the thermal compound for increasing the adhesion between the LSI 2 and the stud 13, as shown in FIG.
, 14b, the heat is transferred to the heat radiation block 4 (
In a to d) in the figure, heat exchange is performed with the refrigerant in the cold plate 3.

Next, regarding the third embodiment, FIGS. 6 and 7
This will be explained in detail using . As shown in FIG.
A heat dissipation block 4 having excellent thermal conductivity is provided on a substrate 1 on which a heat dissipation block 4 is mounted via a flange 5. Note that a sealing material 6 is interposed to improve the seal between the heat dissipation block 4 and the substrate 1. A cold plate 3 having a refrigerant passage 11 through which a refrigerant flows therein is brought into contact with, for example, a thermal compound, on the side of the heat dissipation block 4 that is different from the substrate 1 side. Couplers 12a and 12b for connecting pipes are formed at both ends of the refrigerant passage 11, respectively.

A recess 4c is formed in the heat dissipation block 4 in correspondence with the mounting position of the LSI 2, and a stud 16 having a spline 16a formed on its outer periphery is formed in the recess 4c as shown in FIG. . A spline hole 16c is formed in this stud 16 and the LS shown in FIG.
A spring 15 for adjusting the mounting height of I2 is provided inside. Note that the surface 16b that contacts the LSI 2 is a curved surface.

In the above configuration, heat conduction when cooling the LSI 2 is first conducted from the LSI 2 to the stud 13, and then through the spline 16a formed on the outer periphery of the stud 13.
The heat is transmitted to the heat radiation block 4 via the stud 16 and the spring 15 elastically attached to the heat radiation block 4, and heat is exchanged with the refrigerant in the cold plate 3.

Next, regarding the fourth embodiment, FIGS. 8 to 10
This will be explained in detail using . As shown in FIG.
A heat dissipation block 4 having excellent thermal conductivity is provided on a substrate 1 on which a heat dissipation block 4 is mounted via a flange 5. Note that a sealing material 6 is interposed to improve the seal between the heat dissipation block 4 and the substrate 1. A cold plate 3 having a refrigerant passage 11 through which a refrigerant flows therein is brought into contact with, for example, a thermal compound, on the side of the heat dissipation block 4 that is different from the substrate 1 side. Couplers 12a and 12b for connecting pipes are formed at both ends of the refrigerant passage 11, respectively.

The heat dissipation block 4 is formed with a notch 4e corresponding to the mounting position of the LSI 2.
A convex heat sink 17 is bonded onto the heat sink 2 via a thermal compound (not shown). As shown in FIG. 9, a sleeve 19 having a cylindrical shape and having slits 19a and 19b alternately formed in the longitudinal direction with a predetermined length from both end faces is attached to the notch 4e formed on the heat dissipation block 4 and the heat sink 17. Provided to cover the convex part. Note that an R curved surface is formed on the inside of the sleeve 19 in order to improve the bondability with the notch 4e formed on the heat radiation block 4 and the convex portion of the heat sink 17.

In the above configuration, heat conduction when cooling the LSI 2 is first conducted from the LSI 2 to the heat sink 17 as shown in FIG. sleeve 1
9, the sleeve 19 and the heat dissipation block 4 are connected to each other.
The heat is transmitted to the heat radiation block 4 via g and h, which are the contact points of e, and heat exchange is performed with the refrigerant in the cold plate 3.

Finally, the fifth embodiment will be explained in detail using FIGS. 11 and 12. As shown in Figure 11, L
A heat dissipation block 4 having excellent thermal conductivity is provided on a substrate 1 on which an SI 2 is mounted via a flange 5. In addition, heat dissipation block 4
A sealing material 6 is interposed to enhance the seal between the substrate 1 and the substrate 1 . A cold plate 3 having a refrigerant passage 11 through which a refrigerant flows therein is brought into contact with, for example, a thermal compound, on the side of the heat dissipation block 4 that is different from the substrate 1 side. Couplers 12a and 12b for connecting pipes are formed at both ends of the refrigerant passage 11, respectively.

A recess 4f is formed in the heat dissipation block 4 corresponding to the mounting position of the LSI 2.
A convex heat sink 17 is bonded to the top via a thermal compound (not shown). Specifically, Figure 1
As shown in FIG. 2, even if the notch 18a is convex in side view, the inside of the notch 18a is a concave portion 18b. On the other hand, as shown in FIG. 12, outwardly projecting R is provided on both end surfaces that fit into the recess 4f of the heat dissipation block 4 and the recess 18b of the heat sink 17, respectively.
The slits 19 have a shape (19f, 19g in FIG. 12) and are formed alternately with a predetermined length in the longitudinal direction.
A sleeve 19c having sleeves d and 19e is provided. Therefore,
The sleeve 19c comes into contact with the recess 4f of the heat radiation block 4 and the recess 18b of the heat sink 17 from the inside.

In the above configuration, heat conduction when cooling the LSI 2 is first conducted from the LSI 2 to the heat sink 17, then the heat is transferred to the sleeve 19c via the contact point between the heat sink 17 and the sleeve 19c, and then
The heat is transmitted to the heat radiation block 4 through the contact point of the notch 4e of the heat radiation block 4, and heat exchange is performed between the refrigerant in the cold plate 3.

[0031]

[Effects of the Invention] As explained above, according to the present invention, first, contact is made between the heat conductor and the heat dissipation block in the vicinity of the LSI to secure the contact area, and further,
By providing other contact portions in addition to the contact portions described above, it becomes possible to perform contact at other points, and the module can be made smaller, which has the effect of reducing weight and improving cooling efficiency.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a perspective view of the stud.

FIG. 3 is a diagram showing a second embodiment of the invention.

FIG. 4 is a perspective view of the stud.

FIG. 5 is a diagram showing a state of heat conduction.

FIG. 6 is a diagram showing a third embodiment of the present invention.

FIG. 7 is a perspective view of the stud.

FIG. 8 is a diagram showing a fourth embodiment of the present invention.

FIG. 9 is a perspective view of the sleeper.

FIG. 10 is a diagram showing a state of heat conduction.

FIG. 11 is a diagram showing a fifth embodiment of the present invention.

FIG. 12 is a perspective view of the sleeve and LSI.

FIG. 13 is a diagram showing a conventional example.

[Explanation of symbols]

1: Substrate
2: LSI (integrated circuit element) 3: Cold plate
4: Heat dissipation block 8, 13, 16: Stud (thermal conductor) 9: Tapered screw 11: Refrigerant passage
13a: Bolts 14a, 14b: Taper pipe 1
4c: Hole 16a: Spline
17: Heat sink 18: Bocchi (protrusion)
19, 19c: Sleeve

Claims (4)

[Claims] 1. A heat dissipation block (4) having a heat conductor (8) in contact with an integrated circuit element (2) mounted on a substrate (1), and a heat dissipation block (4) having a heat conductor (8) in contact with and inside the heat dissipation block (4). In a cooling structure consisting of a cold plate (3) having a refrigerant passage (11) through which a refrigerant flows, a screw thread (4a) is formed on the heat dissipation block (4), and the heat conductor (
8), there is a screw thread (8) that engages with the heat dissipation block (4).
c), and the heat dissipation block (4) and the heat conductor (8) are formed.
) and are connected by screws. 2. A heat dissipation block (4) having a heat conductor (13) in contact with an integrated circuit element (2) mounted on a substrate (1), and a heat dissipation block (4) having a heat conductor (13) in contact with and inside the heat dissipation block (4). A cooling structure consisting of a cold plate (3) having a refrigerant passage (11) through which a refrigerant flows, a thermal conductor (13) having a hole (14c) penetrating in the longitudinal direction thereof, and the thermal conductor (13). A plurality of tapered pipes (14a, 14b) each inserted into the tapered ends of the
), a bolt (13a) inserted into the hole (14c), connecting the plurality of tapered pipes (14a, 14b), and having fastening means (13b) on at least one of the bolts (13a);
A cooling structure characterized by consisting of. 3. A heat dissipation block (4) having a heat conductor (16) in contact with an integrated circuit element (2) mounted on a substrate (1), and a heat dissipation block (4) having a heat conductor (16) in contact with and inside the heat dissipation block (4). In a cooling structure consisting of a cold plate (3) having a refrigerant passage (11) through which a refrigerant flows, a spline shape (16a) is formed in a portion of the heat conductor (16) that contacts the heat radiation block (4). A cooling structure characterized by: 4. A heat dissipation block (4) having a heat conductor (19) in contact with an integrated circuit element (2) mounted on a substrate (1); A cooling structure comprising a cold plate (3) having a refrigerant passage (11) through which a refrigerant flows, a protrusion-shaped heat sink (17) with excellent thermal conductivity formed on the integrated circuit element (2); A protrusion (4e) formed on the heat dissipation block (4) corresponding to the mounting position of the integrated circuit element (2), and a protrusion (4e) formed on the heat sink (17) and the protrusion (
4e) and a cylindrical sleeve (19) having an R curved surface at the contact portion.