CN108231708A - For the heat exchanger of two-sided cooling electronic module - Google Patents

For the heat exchanger of two-sided cooling electronic module Download PDF

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Publication number
CN108231708A
CN108231708A CN201710600887.1A CN201710600887A CN108231708A CN 108231708 A CN108231708 A CN 108231708A CN 201710600887 A CN201710600887 A CN 201710600887A CN 108231708 A CN108231708 A CN 108231708A
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CN
China
Prior art keywords
heat dissipation
heat
heat exchanger
exchanger assembly
dissipation element
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710600887.1A
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Chinese (zh)
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CN108231708B (en
Inventor
M·K·A·马彻勒
C·A·肖尔
D·L·巴特尼克
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Dana Canada Corp
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Dana Canada Corp
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Publication date
Application filed by Dana Canada Corp filed Critical Dana Canada Corp
Priority to DE102017222350.2A priority Critical patent/DE102017222350A1/en
Priority to US15/840,504 priority patent/US10600721B2/en
Publication of CN108231708A publication Critical patent/CN108231708A/en
Application granted granted Critical
Publication of CN108231708B publication Critical patent/CN108231708B/en
Active legal-status Critical Current
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids

Abstract

Heat exchanger assembly includes the first and second heat dissipation elements and clamp assembly that are with fluid course.Heat dissipation element is separated by the space that at least one heat-generating electronic elements are located therein, wherein the outer surface of each electronic unit is thermally contacted with heat dissipation element.Clamp assembly includes being arranged to the first and second spring elements contacted with the outer surface of heat dissipation element.Spring element links together to apply compressing force to heat dissipation element, and electronic unit is caused to be clamped between heat dissipation element.Each spring element is included for the discrete power applying zone to heat dissipation element applied force and for compressing and keeping multiple fastening areas of the spring element relative to the position of the outer surface of heat dissipation element.

Description

For the heat exchanger of two-sided cooling electronic module
Cross reference to related applications
This application claims the U.S. Provisional Patent Application submitted on December 14th, 2016 priority of No. 62/433,936 And equity, content in a manner of to be included in herein.
Invention field
The present invention relates to the heat exchangers with pair of radiating fan, this includes multiple fever ministrys of electronics industry to cooling fin for cooling down The opposite sides of the electron device package of part.
Background technology
Electric vehicle (" EV ") and hybrid electric vehicle (" HEV ") are using the power electronics device for generating a large amount of thermal energy Part.This thermal energy must dissipate to avoid these apparatus overheats, and overheat may result in damage or reduce performance.
Vehicle electric power electronic device generally includes one or more such as transistor, resistor, capacitor, field effect transistors Manage (FETS), isolation gate bipolar transistor (IGBT), power inverter, DC to DC converter and switcher for changing DC into AC Heat-generating electronic part.These components may be mounted on the substrate of such as printed circuit board.
Although the structure of vehicle electric power electronic device is variable, in some applications, power electronic devices setting There is cooling can be along opposite two planes of its progress.IGBT is the example for the power electronic devices that can have this structure.This The device of sample can be cooled down by one or two in opposite two planes by device with cooling fin contact.In order to make With the maximum that thermally contacts of the plane of power electronic devices, cooling fin has flat surfaces, and cooling fin is along the flat surfaces and electric power Electronic device contacts, and thin layer thermal interfacial material (TIM) can be arranged between cooling fin and the plane of power electronic devices. In order to enhance hot transmission, the cooling fluid of such as air or liquid coolant can be recycled along or through cooling fin.
The known cooling device of power electronic devices can include the first and second radiating elements being overlapping The mode of arrangement is clamped to the device of the opposite sides of power electronic devices encapsulation, to improve between electronic device and cooling fin Thermo-contact.It discloses to have in the United States Patent (USP) No.7,295,433B2 of Taylor et al. and be positioned to and electron device package The electronic building brick of first and second radiating elements of first and second sides surface thermal communication.The electronics group as disclosed in Taylor et al. Part is kept together by the fixture that a pair tightens together, and each fixture, which has, to be configured to engage or receive one of radiating element Circumference shape.
There are still the demand of the simple and effective heat exchanger to two-sided cooling heat-generating electronic part, thus in radiator Effective thermal communication is provided between the opposite sides surface of electronic unit.
Invention content
In embodiment, a kind of heat exchanger assembly is provided with, including:The first heat dissipation element and second separated by space Heat dissipation element, wherein the first heat dissipation element limits first fluid runner, the second heat dissipation element limits second fluid runner, and its In the first and second heat dissipation elements it is parallel to each other;At least one heat-generating electronic part is located in the space and is sandwiched in Between first and second heat dissipation elements, wherein there is each heat-generating electronic part the inner surface heat with the first heat dissipation element to connect The first tactile side surface and the opposite flank thermally contacted with the inner surface of the second heat dissipation element;And clamp assembly, including: (a) the first spring element is arranged to contact with the outer surface of the first heat dissipation element;(b) second spring element is arranged to It is contacted with the outer surface of the second heat dissipation element;Wherein, the first and second heat dissipation elements be sandwiched in the first and second spring elements it Between, and wherein, the first and second spring elements link together, with the first and second heat dissipation elements are applied compressing force and Thus at least one heat-generating electronic part is caused to be clamped between the first and second heat dissipation elements.
In embodiment, each spring element includes one or more discrete force regions, for heat dissipation member One of part applied force and multiple fastening areas, for keeping appearance of the spring element relative to the heat dissipation element being in contact with it The position in face.In embodiment, it is at least one force region of each setting at least one heat generating components.In embodiment In, by the compressing force each applied in spring element maximum value is at least one force region.
In embodiment, heat exchanger assembly includes the multiple fever ministrys of electronics industry being aligned along the longitudinal axis of heat dissipation element Part, and each include multiple force regions wherein in spring element.
In embodiment, the zone location that exerts a force is at least some of the region that exert a force substantially centrally positioned at heating electric Above or below the side surface of one of subassembly.
In embodiment, exert a force region at least some spring elements transverse to longitudinal axis width dimensions substantially Positioned at the centre of one of spring element.
In embodiment, axis is spaced apart center to center between adjacent heat-generating electronic part along longitudinal direction in force region Distance.
In embodiment, fastening area is located at the outer edge of each spring element, and be positioned to be more than outward The perimeter edge of heat dissipation element.
In embodiment, the fastening area in respective springs element is arranged to be mutually perpendicular to be aligned.
In embodiment, fastening area is provided with the clamp device for receiving fastener, and spring element passes through fastener It links together.In embodiment, clamp device is slot or hole, and wherein fastener includes bar, screw or bolt.
In embodiment, each in spring element includes multiple X-form cross members, and each in X-form cross member includes a pair Relative to the intersection leg member arranged of longitudinal axis diagonal ground of heat dissipation element.In embodiment, leg member has phase To both ends, fastening area is located at the ends and the adjacent X-form cross member of spring element is at the ends It links together.
In embodiment, each leg member that at least some of force region is located in X-form cross member is intersected with each other Point at.
In embodiment, each in spring element is nonplanar under its uncompressed state, wherein force region leads to Be frequently located in one of multiple planes of plane spaced-apart being generally disposed therein with fastening area, and leg member usually with It extends between force region and fastening area and is tilted.
In embodiment, each bending section by being formed in spring element in force region limits.In embodiment, Each longitudinal axis is parallel in bending section.In embodiment, each bending section is towards identical direction, so as in spring element In the case of uncompressed state, make spring element that there is the overall convex shape on lateral dimension perpendicularly to the longitudinal axis Shape, and wherein, spring element is installed on the heat-radiating element in the case where convex shape is towards heat dissipation element.
In embodiment, each include in spring element:
Multiple interior force regions, along longitudinal direction axis alignment;
Multiple outer force regions, being each located near one of fastening area in outer force region;And
Multiple intermediate force regions, each in the force region of centre are located in interior force region along one of leg member One of between outer force one of region.
In embodiment, heat exchanger assembly further includes the heat sink of the outer surface fixed to the first and second heat dissipation elements, Each leg member including spring element wherein in heat sink is received in groove therein.
In embodiment, each in spring element is integrally formed by spring steel plate or steel spring plate, and entire thick Degree is uniform.
In embodiment, heat dissipation element in a manner of arrangement of contacting with the entrance opening that is arranged in the first heat dissipation element and The exit opening connection being arranged in the second heat dissipation element, wherein entrance opening and exit opening are arranged side by side in heat exchanger assembly First end, and wherein entrance opening and exit opening is provided with and is arranged side by side and accessory prominent in the same direction.In reality It applies in example, the first and second heat dissipation elements are each formed with projection portion, and it is convex that corresponding entrance opening and exit opening are located at this It rises in part;Wherein each projection portion is from the longitudinal axis of substantially heat dissipation element laterally across the one of corresponding heat dissipation element Part extends to the outer perimeter edge being longitudinally extended of heat dissipation element.
Description of the drawings
It now will only by way of example with reference to the accompanying drawings to describe the present invention, in attached drawing:
Fig. 1 is the top perspective view of heat exchanger according to the embodiment;
Fig. 2 is the plan view from above of the heat exchanger of Fig. 1;
Fig. 3 is the face upwarding view of the heat exchanger of Fig. 1;
Fig. 4 is the side view of the heat exchanger of Fig. 1;
Fig. 5 is the sectional view along the line 5-5 ' of Fig. 4;
Fig. 6 is the top perspective view of the latch plate for the heat exchanger for showing Fig. 1;
Fig. 7 is the plan view from above of the latch plate of Fig. 6;
Fig. 8 is the side view of the latch plate of Fig. 6;
Fig. 9 is the front view of the latch plate of Fig. 6;
Figure 10 is the front view of the latch plate with alternate configuration;
Figure 11 is the sectional view similar to Fig. 5 for showing the latch plate before clamping force is applied;And
Figure 12 is the sectional view similar to Fig. 5 for showing the latch plate after clamping force is applied.
Specific embodiment
Referring to the heat exchanger assembly 10 of the descriptions of Fig. 1 to 5 accoding to exemplary embodiment.
Heat exchanger assembly 10 includes the first heat dissipation element 12 (top in figure) and the second heat dissipation element 14 (under in figure Portion).Two heat dissipation elements 12,14 are separated by space 16, and at least one heat-generating electronic part 18 is located in the space 16, wherein, At least one heat-generating electronic part 18 is clipped between the first heat dissipation element 12 and the second heat dissipation element 14.In the present embodiment, it is empty Between 16 accommodate multiple heat-generating electronic parts 18.Electronic unit 18 can include IGBT, and although not shown in the drawings, the but ministry of electronics industry Part 18 may be mounted on circuit board.
First heat dissipation element 12 of heat exchanger assembly 10 has the hollow inside for limiting first fluid runner 20.In this implementation In example, the first heat dissipation element 12 is included in be sealed at its perimeter edge one to 26 including the first plate to 26, first plates To plate 28,30.First plate 28 is flat and plane, and the second plate 30 is configured to what is had flat flat plate bottom and protrude Circumferential flange 32 with perimeter seal surface 34, peripherally sealing surfaces 34 are sealingly joined to the first plate 28, example to the second plate 30 Such as by being brazed or welding.
Second heat dissipation element 14 of heat exchanger assembly 10 similarly has the hollow inside for limiting second fluid runner 36. In the present embodiment, the second heat dissipation element 14 is included at its perimeter edge 42, second plates including the second plate to 42 is sealed in one A pair of of the plate 44,46 risen.First plate 44 is flat and plane, and the second plate 46 be configured to have flat flat plate bottom and The prominent circumferential flange 48 with perimeter seal surface 50, peripherally sealing surfaces 34 are sealingly joined to the first plate to the second plate 46 44, such as by being brazed or welding.
First heat dissipation element 12 and the second heat dissipation element 14 and corresponding first flow 20 and second flow channel 36 can phases It is mutually parallel.In addition, there is heat exchanger assembly 10 central longitudinal axis A (Fig. 2 and Fig. 3), central longitudinal axis A to be parallel to heat dissipation member The long size of part 12,14, and it is parallel to the fluid flow direction by first flow 20 and second flow channel 36.Heat dissipation element 12nd, 14 be elongated, and runner 20,36 extends to its other end from one end of heat dissipation element 12,14.Although the present invention is come It says and is not necessary, but heat exchanger plate 28,30,44,46 can be made of aluminum or aluminum alloy.
First plate 28,44 of each heat dissipation element 12,14 is flat and plane, and forms heat sink.Heat sink 28, Each thickness with the thickness for being significantly greater than the second plate 30,46 in 44.It should be appreciated that heat exchanger assembly 10 can be alternatively It is configured to by plate pair and independent heat sink, for the plate to being made of relatively thin plate, the independent heat sink is solid by being brazed or welding Surely the outer surface of one of the plate of each plate pair is arrived.
Heat-generating electronic part 18 is clipped between heat dissipation element 12,14.Heat-generating electronic part 18 usually can be rectangular prism The shape of body, it is each that there is a pair of opposite major side surface, i.e. the first side surface 22 and the second side surface 24.First side surface 22 Be flat with the second side surface 24, plane and be parallel to heat dissipation element 12,14.First side of each heat-generating electronic part 18 Surface 22 is thermally contacted with the first plate 28 of the first heat dissipation element 12, wherein, 22 heat of the first side surface with heat-generating electronic part 18 The surface of first plate 28 of the first heat dissipation element 12 of contact is herein referred to as the inner surface of the first heat dissipation element 12, And it is represented in figures 4 and 5 with reference numeral 27.The apparent surface of first heat dissipation element 12 is herein referred to as The outer surface of one heat dissipation element 12, and represented in figures 4 and 5 with reference numeral 29.
Second side surface 24 of each heat-generating electronic part 18 is thermally contacted with the first plate 44 of the second heat dissipation element 14, In, the surface of the first plate 44 thermally contacted with the second side surface 24 of heat-generating electronic part 18 is herein referred to as second The inner surface of heat dissipation element 14, and represented in figures 4 and 5 with reference numeral 45.The apparent surface of second heat dissipation element 14 The herein referred to as outer surface of the second heat dissipation element 14, and represented in figures 4 and 5 with reference numeral 47.
It is generally square that first and second side surfaces 22,24 of heat-generating electronic part 18, which are shown in the drawings, is had The width dimensions roughly the same with the width of the heat dissipation element 12,14 transverse to longitudinal axis A.
Heat exchanger assembly 10 includes three heat-generating electronic parts 18, and axis A is in line and to each other along longitudinal direction for they It separates.It is transmitted to by the heat that electronic unit 18 is sent out by the first plate 28,44 of corresponding heat dissipation element 12,14 in first flow 20 With the cooling agent recycled in second flow channel 36.It should be appreciated that heat exchanger assembly 10 may include more or less than the fever of three Electronic unit 18, and can be arranged to it is multiple rows of, and the heat dissipation element 12 with the length that increases or reduces and/or width, 14 can be set according to the quantity, size and arrangement of heat-generating electronic part 18.
The first flow 20 and second flow channel 36 of heat exchanger assembly 10 are connected in series with so that cooling agent first flows through runner 20th, one in 36 and another in runner 20,36 is then flowed through.In the shown embodiment, cooling agent flows through first-class Body runner 20 and second fluid runner 36 is then flowed through to cool down the opposite sides surface 22,24 of heat-generating electronic part 18.Cause This, entrance opening 52 and associated inlet fitting 54 are provided with including the first plate to 26 the first heat dissipation element 12, and including Second plate is provided with exit opening 56 and associated outlet accessory 58 to 42 the second heat dissipation element 14.Although heat exchanger assembly 10 are shown as with series flow configuration, but it is to be understood that heat, which is changed, hands over component 10 to can be configured to that cooling agent is made to flow through parallel First heat dissipation element 1 and the second heat dissipation element 14.For example, similar to above-mentioned United States Patent (USP) No.7, the cloth shown in 295,433 It puts, each heat dissipation element 12,14 can be provided with the entrance opening of their own and exit opening and inlet fitting and outlet are matched Part, they are all connected to coolant circulating system.Alternatively, heat dissipation element 12,14 can be connected by inlet manifold and outlet manifold It is connected together so that an entrance opening and one outlet is only needed to be open.
It the position of opening 52,56 and accessory 54,58 will be different and different with application.In the present embodiment, entrance opening 52 and exit opening 56 be disposed side by side on the same end of heat exchanger assembly 10, wherein, corresponding inlet fitting 54 and outlet accessory 58 Extend along the same direction vertical with the plane where heat dissipation element 12,14.Therefore, entrance opening 52 and inlet fitting 54 are set In the second plate 30 of the first heat dissipation element 12, and exit opening 56 and outlet accessory 58 are arranged on the of the second heat dissipation element 14 In one plate 44.In arranged in series is substituted, single coaxial inlet/outlet accessory can be provided, such as by Abels's Disclosed in US2014/0224452A1.
For the ease of entrance opening 52 and exit opening 56 and its associated accessory 54,58 is allowed to be arranged side by side, accordingly Plate 28,30,44,46 and heat dissipation element 12,14 are formed with projection portion 60,62, wherein entrance opening 52 and inlet fitting 54 In entrance projection portion 60, and exit opening 56 and outlet accessory 58 are located in outlet boss point 62.Projection portion 60,62 A part for corresponding heat dissipation element 12,14 is extended laterally across respectively, i.e., is extended to from substantially intermediate (close central axis A) scattered The outer perimeter edge being longitudinally extended of thermal element 12 or 14 and the longitudinal edge that heat dissipation element 12,14 will not be extended outwardly beyond Edge.It will be appreciated, however, that projection portion 60,62 and the fluid course 20,36 of entire width are in fluid communication.
With opening 52,56, accessory 54,58 and projection portion 60,62 it is opposite to the end of heat exchanger assembly 10 set It is equipped with and turns to channel 64, cooling agent leaves first fluid runner 20 by the steering channel 64 and enters second fluid stream road 36. As shown in Figure 2 and Figure 4, channel 64 is turned to by being limited with side wall and the spacer element of hollow inside 66, and spacer element 66 is with setting It puts the connection opening 68 in the first plate 28 of the first heat dissipation element 12 and is arranged in the second plate 30 of the second heat dissipation element 14 Connection opening 70 hermetically be in fluid communication and extend in-between.
As that can find out from the side view of Fig. 4, turn to channel 64 and spacer 66 is located at the end of heat dissipation element 12,14 Near portion so that heat-generating electronic part 18, which is located at, turns to channel 64 with being provided with the convex of entrance opening 52 and exit opening 56 Rise part 60,62 between.Therefore, the cooling agent edge fever of heat exchanger assembly 10 is entered by entrance opening 52 and inlet fitting 54 First fluid runner 20 is flowed through in first side surface 22 of component 18, then flows through and turns to channel 64 into second fluid runner 36. Cooling agent then flows through second fluid runner 36 along the second side surface 24 of heat generating components 18, and passes through exit opening 56 and outlet Accessory 58 is discharged from heat exchanger assembly 10.In this way, realize cooling along two side surfaces 22,24 of each heat generating components 18.
Although being not shown in the accompanying drawings, first flow 20 and second flow channel 36 can be provided with turbulence excess insertion Part can each include fin or turbulator in insertion piece.As it is used herein, term " fin " and " turbulator " are intended to Represent the corrugated turbulence excess insertion piece with multiple axially extending spines connected by side wall or top, wherein spine It is mellow and full or flat.As defined herein, " fin " have continuous spine, and " turbulator " have be interrupted along its length Spine so that by the axial flowing of turbulator be tortuous.Turbulator is sometimes referred to as the strip fin for biasing or cutting, And the example of this turbulator is in No. 6,273,183 (So etc. of U.S. Patent No. No. Re.35,890 (So) and U.S. Patent No. People) described in.The full content of the patent of So and So et al. in a manner of to be included in herein.
Thermally contacting between heat dissipation element 12,14 and heat generating components 18 can be by the inner surface in the first heat dissipation element 12 Interface setting a thin layer hot boundary of 27 (the first plates to 26 the first plate 28) between the first side surface 22 of heat generating components 18 Plane materiel material (TIM) and pass through the inner surface 45 (the second plate to 42 the first plate 44) and heat generating components in the second heat dissipation element 14 Interface between 18 second side 24 sets thin layer TIM to enhance.TIM can include thermally conductive grease, wax or metal material.
Thermo-contact to heat exchanger component 10 by applying compressing force so that heat dissipation element 12,14 and 18 close thermal of heat generating components It contacts to enhance.This applies compressing force to realize by using clamp assembly 72 to radiator element 12,14.
Clamp assembly 72 includes a pair of of spring element 74, and in the present embodiment, this is to spring element 74 by single-leaf spring steel Plate is for example integrally formed by punching press and bending.The first spring element in spring element 74 is arranged to and the first heat dissipation element 12 Outer surface 29 directly or indirectly thermally contact, and the second spring element in spring element 74 is arranged to and the second heat dissipation element 14 Outer surface 47 directly or indirectly thermally contact.In the present embodiment, the first and second spring elements 74 are mutually the same, but this is not It is necessary.
Each spring element 74 includes one or more be used for the discrete of the application compressing force of radiator element 12, one of 14 Force region 76 and multiple for keeping fastening area 78 of the spring element 74 relative to the position of heat dissipation element 12,14.
The spring element 74 of the present embodiment respectively includes multiple force regions 76, wherein for each setting in heat generating components 18 It is equipped at least one such region 76.As shown in the figure, it is attached to heat exchanger assembly 10 in spring element 74 and is attached to each other In the case of, the first heat dissipation element 12 and the second heat dissipation element 14 be sandwiched in the first spring element 74 and second spring element 74 it Between, and compressing force is applied to heat dissipation element 12,14 by spring element 74.Compressing force is in the region 76 that exerts a force in maximum Value, to provide the enhancing of heat-generating electronic part 18 cooling, as described further below.
The position in the force region 76 in spring element 74 is chosen to be focused on by the compressing force that spring element 74 applies Or concentrate on heat-generating electronic part 18 heat be intended to concentrate region in, thus the cooling of enhancing is provided.For example, it is applied in multiple Power region 76A is substantially centrally located above or below the side surface 22,24 of one of heat generating components 18.Interior force region 76A The compressing force being positioned in the centre of the side surface that heat is allow to concentrate on heat generating components 18 therein 22,24 is maximum.At this In embodiment, on the lateral dimension shown in the end-view in Fig. 9, interior force region 76A is located substantially at the centre of spring element 74, And it is substantially aligned along the longitudinal axis A of heat exchanger assembly 10.On longitudinal size, interior force region 76A is spaced apart adjacent The distance of center to center between heat generating components 18.
It can each include excessive force region 76 in spring element 74.For example, in the exemplary embodiment, spring element Each include a pair of intermediate external force region 76C of the region 76B and one that exerts a force in part 74.It is every in the force region 76B of centre One intermediate interval around between the centre of spring element 74 and its outer edge is opened, to be located at side to heat generating components 18 Region between the centre on surface 22,24 and its outer edge applies compressing force.Each in outer force region 76C is close to spring The outer edge of element 74 is spaced apart to apply the region near the outer edge of its side surface 22,24 of heat generating components 18 Compressive forces.
Fastening area 78 is located at the outer edge of the spring element 74 close to outer force region 76C so that fastening area 78 Extend outwardly beyond the perimeter edge of heat dissipation element 12,14.As can be seen in Figure 4, it is changed when spring element 74 is mounted on When in hot device assembly 10, the fastening area 78 in corresponding spring element 74 is arranged to be aligned vertically.In addition, fastening area 78 are provided with the device that the first and second spring elements 74 is allowed to link together, to be dissipated to the first heat dissipation element 12 and second Thermal element 12 applies compressing force, and heat-generating electronic part 18 is thus caused to be clamped in the first heat dissipation element 12 and the second heat dissipation element 14 Between.In the present embodiment, it is in beginning slit (open- for linking the attachment device of the first and second spring elements 74 Ended) 80 form.
Each spring element 74 in the present embodiment is configured to multiple X-form cross members 82, wherein, in each spring element 74 There are three such components for setting.Each X-form cross member 82 includes the leg member 84 of a pair of cross, each leg member relative to Arrange to longitudinal axis A diagonal.The ends of leg member 84 is used as the position of fastening area 78 and/or as same The tie point of adjacent X-form cross member 82 in one spring element 74.It can be seen from the figure that interior force region 76A is located at X-form cross member The intersection of leg member 84 in each in 82.Centre force region 76B is located at crosspoint and its along leg member 84 Between opposite end.Outer force region 76C is located on or near the end of leg member 84.
Spring element 74 is individually configured to so that the compressing force for being applied to heat dissipation element 12,14 and heat generating components 18 is exerting a force Region 76 is everywhere in maximum value.In the present embodiment, as described above, each in spring element 74 is by spring steel plate or spring steel Plate is integrally formed, and whole thickness is uniform.In order to maximize the compressing force at force region 76, spring element 74 by On-plane surface is bent under uncompressed state to be formed, as shown in Figure 7 to 9.More specifically, spring element 74 is formed so that and applies Power region 76 is usually located in one or more planes, and fastening area 78 is usually located in another plane, fastening area 78 One or more plane spaced-aparts of plane and fastening area 76, and leg member 84 is usually as it prolongs from force region 76 It reaches fastening area 78 and tilts.
In an illustrated embodiment, each force region 76 is limited by the bending section being formed in spring element 74, is bent Each longitudinal axis A is parallel in portion.As shown in the end-view of Fig. 9, in different force regions 76, bending degree can be with It is identical or different.In the present embodiment, it is applied than force region 76A in limiting with centre the bending section for limiting outer force region 76C The relatively shallower bending section of power region 76B is more sharp.The angle of each bending section can be on the order of magnitude less than about 10 degree, example Such as from about 5 degree.
As shown in figure 9, bending section both faces towards same direction, to be in uncompressed state as depicted in spring element 74 In the case of lower, make elastic element 74 that there is the overall convex shape on lateral dimension perpendicularly to the longitudinal axis.Work as spring Element 74 be mounted on heat dissipation element 12, one of 14 it is upper when, convex shape is towards heat dissipation element 12,14, and spring element 74 Concave surface is backwards to heat dissipation element 12,14.
In alternative embodiments, the nonplanar structure of spring element 74 can be at least partially through making in force region 76 At least some other regions relative to spring element 74 thicken to realize.For example, Figure 10 is shown according to alternate embodiment Spring element 74', in addition to each at least partly by the spring element 74' in force plus region 76 in force region 76 Part thicken limit it is outer, it is all identical with spring element 74.In addition, at least some of force region 76 can be by needle such as above Bending section described in spring element 74 is limited.For example, the thickening center of at least spring element 74' exerts a force, region 76A is also by curved Pars convoluta limits, as discussed above concerning described in spring element 74.
Clamp assembly 72 further includes multiple tightening members 86.In the present embodiment, it is each including tool in tightening member 86 There is the bar of axostylus axostyle 88, and axostylus axostyle 88 has expansion head 90 in each end set.Axostylus axostyle 88 has so as to slip into out Hold the diameter of one of slit 80.Clamp assembly 72 is assembled into this way on heat exchanger assembly 10, that is, uses pressing by spring element 74 are pressed in plate on 26 and 42, and then by 86 insertion groove 80 of tightening member, and then release pressing.
Tightening member 86 can not be the axostylus axostyle 88 with expansion head 90, but can include screw rod, bolt or screw, And slit 80 can be replaced with the hole around its edge closure.
As described above, the first and second spring elements 74 are arranged to the outer surface with the first and second heat dissipation elements 12,14 29th, 47 directly or indirectly contact.In Fig. 1 to embodiment shown in fig. 5, heat exchanger assembly 10 includes being affixed directly to radiator The outer surface 29,47 of element 12,14 and the outer heat sink 92 thermally contacted with it.These outer heat sinks 92 can be arranged to for example with The additional heat-generating electronic part (not shown) arranged along the outer surface 29,47 of heat dissipation element 12,14 thermally contacts.In Figure 11 and Figure 12 In shown embodiment, heat exchanger assembly 10 does not include outer heat sink 92, and the heat dissipation member of spring element 74 and first and second The outer surface 29,47 of part 12,14 is in direct contact.
Outer heat sink 92 include for receive spring element 74 leg member 84 groove 94 (Fig. 5) so that each bullet It the upper surface of spring component 74 can be substantially coplanar with the outer surface of one of outer heat sink 92 or slightly concave relative to its.These are recessed Slot 94 extends through a part for the thickness of outer heat sink 92.This can find out in figures 4 and 5.This arrangement ensures outer heat dissipation The outer surface of plate 92 can be thermally contacted with the additional heat generating components arranged along the outer surface 29,47 of heat dissipation element 12,14.
The structure of outer heat sink 92 can also contribute to spring element 74 and position and keep relative to heat dissipation element 12,14, This is because the pin components 84 of spring element 74 are received in the groove 94 of outer heat sink 92.
It should be appreciated that outer heat sink 92 is not the necessary parts of heat exchanger assembly 10, and spring element 74 can be with dissipating The outer surface 29,47 of thermal element 12,14 is in direct contact.
Figure 11 and 12 contacts it for showing that spring element 74 is compressed at it with the first and second heat dissipation elements 12,14 It is preceding and later relative to the positioning of other components of heat exchanger assembly 10.
In the case where the spring element 74 as shown in Fig. 4,5 and 12 is mounted on heat exchanger assembly 10, spring element 74 There can be the planar appearance of general planar as shown in Figure 4 and Figure 5 so that the portion of the spring element 74 to exert a force outside region 76 outside Divide to show and be contacted with the outer surface 29,47 of the first and second heat dissipation elements 12,14.It will be appreciated, however, that clamp assembly The heat that 72 the advantages of is not rely between the part of heat dissipation element 12,14 and the spring element 74 outside force region 76 connects It touches, and therefore spring element 74 can be slightly offset from plane configuration when on heat exchanger assembly 10.In addition, even if bullet Spring element 74 has the appearance of the general plane in such as Fig. 4 and Fig. 5, it should also be understood that compressing force will focus on force region 76 Place.It should be appreciated that it will be provided with the selectivity of the compressing force of the region vertical alignment of the heat-generating electronic part application for needing to cool down Thermally contacting between more effective heat dissipation element 12,14 and heat-generating electronic part 18 is clamped than traditional circumference, in conventional manner, Clamping force can be located at except the region of heat-generating electronic part 18.Hair is applied to by heat dissipation element 12,14 by spring element 74 Compressing force on thermoelectricity subassembly 18 is indicated by an arrow in fig. 12.As can be seen that the compressing force quilt applied by spring element 74 It is applied at multiple points between the edge of heat-generating electronic part 18, and the whole table of heat-generating electronic part 18 can be distributed in On the region of face.
It should be appreciated that the compressing force provided by clamp assembly 72 can improve on the whole surface region of heat generating components 18 Thermo-contact between heat dissipation element 12,14, and compressing force can be sufficiently high, it is certain from heat dissipation element 12,14 to squeeze The TIM of interface zone between heat-generating electronic part 18 so that TIM can still eliminate heat dissipation element 12,14 and the fever ministry of electronics industry Any gap between part 18, at the same it is sufficiently thin in other regions, to minimize the heat-blocking action of TIM.
Although the present invention is described accoding to exemplary embodiment, it is not limited to this.Relatively, the present invention includes All embodiments that can be within the scope of the following claims.

Claims (25)

1. a kind of heat exchanger assembly, including:
The first heat dissipation element and the second heat dissipation element separated by space, wherein first heat dissipation element limits first fluid Runner, and second heat dissipation element limits second fluid runner, and wherein, first and second heat dissipation element is put down each other Row;
At least one heat-generating electronic part is located in the space and is sandwiched between the first and second heat dissipation elements, In each heat-generating electronic part have the first side surface for being thermally contacted with the inner surface of first heat dissipation element and with The opposite flank of the inner surface thermo-contact of second heat dissipation element;And
Clamp assembly, including:
(a) the first spring element is arranged to contact with the outer surface of first heat dissipation element;With
(b) second spring element is arranged to contact with the outer surface of second heat dissipation element;
Wherein, first and second heat dissipation element is sandwiched between first and second spring element, and wherein, described First and second spring elements link together, to apply compressing force to first and second heat dissipation element and thus cause At least one heat-generating electronic part is clamped between first and second heat dissipation element.
2. heat exchanger assembly as described in claim 1, which is characterized in that each spring element include it is one or more from Scattered force region, for one of heat dissipation element applied force and multiple fastening areas, for keeping the spring element Part is relative to the position of the outer surface of the heat dissipation element being in contact with it.
3. heat exchanger assembly as claimed in claim 2, which is characterized in that for each setting at least one heat generating components Put at least one force region.
4. heat exchanger assembly as claimed in claim 2, which is characterized in that by the compression each applied in the spring element Power is in maximum value at least one force region.
5. heat exchanger assembly as claimed in claim 2, which is characterized in that the heat exchanger assembly is included along the heat dissipation element Longitudinal axis alignment multiple heat-generating electronic elements, and each including in wherein described spring element is multiple described Exert a force region.
6. heat exchanger assembly as claimed in claim 2, which is characterized in that the force zone location is into causing the force area At least some of domain is substantially centrally located above or below the side surface of one of the heat-generating electronic part.
7. heat exchanger assembly as claimed in claim 6, which is characterized in that at least some transverse to institute of region that exert a force The width direction for stating the spring element of longitudinal axis is located substantially at the centre of one of the spring element.
8. heat exchanger assembly as claimed in claim 6, which is characterized in that the force region is spaced apart along the longitudinal axis The distance of center to center between adjacent heat-generating electronic part.
9. heat exchanger assembly as claimed in claim 2, which is characterized in that the fastening area is located at each spring element Outer edge, and be positioned to outward be more than the heat dissipation element perimeter edge.
10. heat exchanger assembly as claimed in claim 9, which is characterized in that the fastening area cloth in respective springs element It is set to and is mutually perpendicular to be aligned.
11. heat exchanger assembly as claimed in claim 9, which is characterized in that the fastening area is provided with to receive fastening The clamp device of part, the spring element are linked together by the fastener.
12. heat exchanger assembly as claimed in claim 11, which is characterized in that the clamp device is slot or hole, and wherein The fastener includes bar, screw or bolt.
13. heat exchanger assembly as claimed in claim 2, which is characterized in that each including multiple X in the spring element Shape component, each in the X-form cross member arrange with including a pair of longitudinal axis diagonal relative to the radiator element Intersection leg member.
14. heat exchanger assembly as claimed in claim 13, which is characterized in that the leg member has ends, institute State that fastening area is located at the ends and the adjacent X-form cross member of the spring element is at the ends It links together.
15. heat exchanger assembly as claimed in claim 13, which is characterized in that at least some of described force region is located at institute It states at each leg member in X-form cross member point intersected with each other.
16. heat exchanger assembly as claimed in claim 15, which is characterized in that each uncompressed at its in the spring element Be under state it is nonplanar, wherein it is described force region be usually located at the interplanar that the fastening area is generally disposed therein every In one of multiple planes opened, and the leg member is usually as it is between the force region and the fastening area Extend and tilt.
17. heat exchanger assembly as claimed in claim 13, which is characterized in that each by being formed in the force region The bending section stated in spring element limits.
18. heat exchanger assembly as claimed in claim 17, which is characterized in that being each parallel in the bending section is described vertical To axis.
19. heat exchanger assembly as claimed in claim 17, which is characterized in that in the case where the spring element is in uncompressed state In the case of, the bending section both faces towards same direction so that the elastic element has in the horizontal stroke perpendicular to the longitudinal axis Overall convex shape in size, and wherein, in the case where the convex shape is towards the heat dissipation element, the bullet Spring element is mounted on the heat dissipation element.
20. heat exchanger assembly as claimed in claim 13, which is characterized in that each by the force in the force region The part of the spring element in region thickeies to limit, and optionally, wherein one or more in the force region A bending section by being formed in the spring element limits.
21. heat exchanger assembly as claimed in claim 13, which is characterized in that each include in the spring element:
Multiple interior force regions are aligned along the longitudinal axis;
Multiple outer force regions, being each located near one of described fastening area in the outer force region;And
Multiple intermediate force regions, each in the intermediate force region are located in along one of described leg member in described It exerts a force between one of one of region and the outer force region.
22. heat exchanger assembly as claimed in claim 13, which is characterized in that further include heat sink, be fixed to described first With the outer surface of the second heat dissipation element, wherein, in the heat sink each include groove, the spring element it is described Leg member is received in the groove.
23. heat exchanger assembly as described in claim 1, which is characterized in that each by spring steel in the spring element Piece or steel spring plate are integrally formed, and whole thickness is uniform.
24. heat exchanger assembly as described in claim 1, which is characterized in that the heat dissipation element in a manner of arrangement of contacting with The entrance opening being arranged in first heat dissipation element is connected with the exit opening being arranged in second heat dissipation element, Described in entrance opening and the exit opening be arranged side by side in the first end of the heat exchanger assembly, and wherein described entrance Opening and the exit opening are provided with the accessory for being arranged side by side and protruding in the same direction.
25. heat exchanger assembly as claimed in claim 24, which is characterized in that each self-forming of the first and second heat dissipation elements There is projection portion, corresponding entrance opening and exit opening are located in the projection portion;Wherein each projection portion from The longitudinal axis of substantially described heat dissipation element extends to the vertical of the heat dissipation element laterally across a part for corresponding heat dissipation element To the outer perimeter edge of extension.
CN201710600887.1A 2016-12-14 2017-07-21 Heat exchanger for double-sided cooling of electronic modules Active CN108231708B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102017222350.2A DE102017222350A1 (en) 2016-12-14 2017-12-11 HEAT EXCHANGER FOR DOUBLE-SIDED COOLING OF ELECTRONIC MODULES
US15/840,504 US10600721B2 (en) 2016-12-14 2017-12-13 Heat exchanger for dual-sided cooling of electronic modules

Applications Claiming Priority (2)

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US201662433936P 2016-12-14 2016-12-14
US62/433,936 2016-12-14

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207602552U (en) * 2016-12-14 2018-07-10 达纳加拿大公司 For the heat exchanger assembly of at least one heat-generating electronic part of two-sided cooling
CN111076595B (en) * 2020-01-10 2020-12-08 山东华昱压力容器股份有限公司 Plate-tube type fused salt heat storage component and heat storage tank thereof

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CN205069616U (en) * 2015-09-29 2016-03-02 比亚迪股份有限公司 Power module and vehicle that has it
CN205488102U (en) * 2015-12-30 2016-08-17 北京新创椿树整流器件有限公司 High -power plate thyristor heat pipe cooling ware for device
CN207602552U (en) * 2016-12-14 2018-07-10 达纳加拿大公司 For the heat exchanger assembly of at least one heat-generating electronic part of two-sided cooling

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5306065A (en) * 1993-03-16 1994-04-26 Ades Bruce A Supplemental visor assembly
US5926369A (en) * 1998-01-22 1999-07-20 International Business Machines Corporation Vertically integrated multi-chip circuit package with heat-sink support
WO2001008460A1 (en) * 1999-07-21 2001-02-01 Allman Richard K Thermally-coupled heat dissipation apparatus for electronic devices
US20040150956A1 (en) * 2003-01-24 2004-08-05 Robert Conte Pin fin heat sink for power electronic applications
CN1893807A (en) * 2005-06-30 2007-01-10 株式会社东芝 Cooling device and electronic apparatus
CN104617085A (en) * 2013-11-04 2015-05-13 江苏宏微科技股份有限公司 Stack-up assembled power module
CN205069616U (en) * 2015-09-29 2016-03-02 比亚迪股份有限公司 Power module and vehicle that has it
CN205488102U (en) * 2015-12-30 2016-08-17 北京新创椿树整流器件有限公司 High -power plate thyristor heat pipe cooling ware for device
CN207602552U (en) * 2016-12-14 2018-07-10 达纳加拿大公司 For the heat exchanger assembly of at least one heat-generating electronic part of two-sided cooling

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