JPH0422922Y2 - - Google Patents
Info
- Publication number
- JPH0422922Y2 JPH0422922Y2 JP1985191696U JP19169685U JPH0422922Y2 JP H0422922 Y2 JPH0422922 Y2 JP H0422922Y2 JP 1985191696 U JP1985191696 U JP 1985191696U JP 19169685 U JP19169685 U JP 19169685U JP H0422922 Y2 JPH0422922 Y2 JP H0422922Y2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- thin plate
- eccentric shaft
- lap
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985191696U JPH0422922Y2 (en, 2012) | 1985-12-13 | 1985-12-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985191696U JPH0422922Y2 (en, 2012) | 1985-12-13 | 1985-12-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62100848U JPS62100848U (en, 2012) | 1987-06-26 |
JPH0422922Y2 true JPH0422922Y2 (en, 2012) | 1992-05-27 |
Family
ID=31146077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985191696U Expired JPH0422922Y2 (en, 2012) | 1985-12-13 | 1985-12-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0422922Y2 (en, 2012) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52151995A (en) * | 1976-06-14 | 1977-12-16 | Hitachi Ltd | Wafer grinder |
JPS6090668A (ja) * | 1983-10-19 | 1985-05-21 | Seiko Epson Corp | 鏡面研磨方法 |
-
1985
- 1985-12-13 JP JP1985191696U patent/JPH0422922Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS62100848U (en, 2012) | 1987-06-26 |
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