JPH04228260A - Soldering apparatus - Google Patents

Abstract

PURPOSE:To ensure efficiency of soldering work in a soldering apparatus. CONSTITUTION:The soldering apparatus for carrying a print substrate 5 at the height that a soldering joining face 4 comes into contact with the top part 3 of molten solder jet 2 in a soldering vessel 1 and executing the soldering to parts 6 laid on the print substrate 5 is constituted by arranging an orifice plate 8 able to advance/retreat, advancing into the molten solder jet 2 corresponding to non-solder supplying range in the above print substrate 5 to make the height of the top part 3 of molten solder jet 2 low, near jetting hole 7 of the molten solder jet 2.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering device.

[0002] When soldering a printed circuit board unit for a computer, molten solder is jetted, and the printed circuit board is conveyed thereon by a conveying means such as a conveyor.
The entire bottom surface of the printed circuit board is soldered all at once, but during this soldering work, care must be taken to avoid soldering in areas where parts that are not suitable for cleaning in the post-process are mounted. and furthermore,
Measures are taken to prevent the solder from blowing out onto the mounting surface from the large holes and notches for mounting equipment.

0003

[Prior Art] Conventionally, in order to form an area on the solder joint surface where no solder is supplied or to prevent solder from blowing up toward the mounting surface, the solder surface of a printed circuit board is partially masked with masking tape. Methods such as screen printing or spray printing of a resist with poor solder wettability have been proposed.

0004

[Problems to be Solved by the Invention] However, in any of the above-mentioned conventional examples, the work of pasting tape etc. is troublesome, and the tape or resist must be manually peeled off after soldering is completed. First, it has the drawbacks of poor workability, resulting in a long lead time, an increase in in-process inventory, and an increase in the number of work steps.

The present invention has been made to solve the above-mentioned drawbacks, and an object of the present invention is to provide a soldering device that can improve the efficiency of soldering work.

[0006]

[Means for Solving the Problems] According to the present invention, the above object is achieved by providing a solder joint surface 4 at the top 3 of the molten solder jet 2 in the solder bath 1, as shown in FIGS. 1 and 2 corresponding to the embodiment. In a soldering device that transports a printed circuit board 5 at a height at which it contacts the printed circuit board 5 and solders the components 6 mounted on the printed circuit board 5, the By providing a soldering device in which an orifice plate 8 is movably provided so as to enter the molten solder jet 2 corresponding to a non-solder supply area of the substrate 5 and lower the height of the top 3 of the molten solder jet 2. achieved.

[0007]

[Function] Based on the above configuration, the soldering device is configured to provide molten solder jets 2 corresponding to non-solder supply areas of the printed circuit board 5.
It has an orifice plate 8 that enters the molten solder jet 2 and lowers the height of the top 3 of the molten solder jet 2, and by moving the orifice plate 8 back and forth, solder is prevented from being supplied to the non-solder supply area of the printed circuit board 5. , masks, etc. will no longer be necessary.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

FIG. 1 shows an embodiment of the present invention, in which reference numeral 9 denotes a conveyor chain driven by a drive motor 10 at a constant speed in the direction of the arrow. The side edge portions are held by holding claws 11 fixed to the solder tank 9 and conveyed to the solder bath 1 at a predetermined speed.

In order to detect the feed amount of the conveyor chain 9, an encoder 13 is provided on the shaft portion 12 of the conveyor chain 9, and an encoder 13 is provided on the shaft portion 12 of the conveyor chain 9. The current position information of the printed circuit board 5 is obtained by calculating the timing and the feed amount signal output from the encoder 13 in the control section 15.

On the other hand, the solder bath 1, as shown in FIG.
The molten solder is stirred by the jet motor 16 to form the guide wall 1.
7 and an outer wall 18 to eject molten solder from a spout 7 formed by
Molten solder jet 2 whose height is controlled to be constant
By conveying the printed circuit board 5 above and bringing the solder joint surface 4 into contact with the top 3 of the molten solder jet 2, solder is supplied to the back surface of the printed circuit board 5 and the through holes, and soldering is performed.

Reference numeral 8 denotes an orifice plate 8 which has a rectangular shape in plan view and is provided to partially lower the height of the top portion 3 of the molten solder jet 2. The orifice plate 8 is moved forward and backward toward the molten solder jet 2. In order to hold the actuator 19, a holding plate 21 is installed between the side plates 20 of the main body of the apparatus. In addition, the installation height of the orifice plate 8 and the dimension of its entry into the molten solder jet 2 are set so low that at least the top 3 of the molten solder jet 2 does not come into contact with the back surface of the printed circuit board 5, as shown in FIG. It is set up so that it is possible.

Next, control of the forward and backward movement of the orifice plate 8 will be explained. As shown in FIG. 4, information regarding the non-solder supply area of the printed circuit board 5 to be soldered is previously input to the control section 15 from the operating panel 22, and the printed circuit board 5 is mounted on the main body of the apparatus and the solder tank 1 When it is transported to the vicinity, the output signal SS from the cue sensor 14 rises, and the output signal SE from the encoder 13 rises.
The position is monitored by calculating between

In this state, the printed circuit board 5 is transported to the top of the molten solder jet 2, and the solder joint surface 4 is
contacts the top 3 of the molten solder jet 2 and soldering is performed, but when the non-solder supply area set on the printed circuit board 5 reaches the top of the molten solder jet 2, just before that, the control unit 15 activates the actuator. Drive signal SD to driver 23
A is output, and the actuator 19 is driven. As a result, the orifice plate 8 advances toward the molten solder jet 2 and lowers the height of its top 3 so as not to contact the solder joint surface 4 of the printed circuit board 5, thereby preventing solder from being supplied to the area. .

Note that in FIG. 4, 24 is the drive motor 10.
The control unit 15 outputs a drive signal SD to the motor driver 24 to control the rotation speed of the drive motor 10, and controls the conveyor so that an appropriate amount of solder is supplied to the printed circuit board 5. Adjust or set the conveyance speed of the chain 9. Further, in the embodiment shown in FIG. 1, as shown in FIG. 5(a), a plurality of orifice plates 8 are fixed on a retaining plate 21, but
As shown in FIG. 5(b), a small number of orifice plates 8 are arranged on a retaining plate 21, and an actuator 19 for driving the orifice plates 8 is configured to be driven by a motor 25 in the longitudinal direction of the retaining plate 21. You can also do that.

[0016]

[Effects of the Invention] As is clear from the above explanation, according to the soldering apparatus according to the present invention, a non-solder supply area can be formed on a printed circuit board without using a mask or the like, so that the soldering work can be performed easily. It can be made more efficient.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing an embodiment of the present invention.

FIG. 2 is a diagram showing a solder bath.

[Fig. 3] Diagrams showing the action of the orifice plate, (a) is a view of the molten solder jet seen from the insertion direction of the orifice plate, (b)
) is its side view.

FIG. 4 is a diagram showing a control section.

FIG. 5 is a diagram showing the arrangement of orifice plates.

[Explanation of symbols]

1 Solder bath 2 Molten solder jet 3 Top 4 Solder joint surface 5 Printed circuit board 6 Parts 7 Spout 8 Orifice plate

Claims (1)

[Claims] [Claim 1] Molten solder jet (
2), and transport the printed circuit board (5) at a height where the solder joint surface (4) contacts the top (3) of the printed circuit board (5).
In the soldering device for soldering the component (6) listed above, the area near the spout (7) of the molten solder jet (2) corresponds to the non-solder supply area of the printed circuit board (5). and enters the molten solder jet (2),
A soldering device comprising an orifice plate (8) that can be moved forward and backward to lower the height of the top (3) of the molten solder jet (2).