JPH0422353B2 - - Google Patents
Info
- Publication number
- JPH0422353B2 JPH0422353B2 JP59226065A JP22606584A JPH0422353B2 JP H0422353 B2 JPH0422353 B2 JP H0422353B2 JP 59226065 A JP59226065 A JP 59226065A JP 22606584 A JP22606584 A JP 22606584A JP H0422353 B2 JPH0422353 B2 JP H0422353B2
- Authority
- JP
- Japan
- Prior art keywords
- case
- resin
- light emitting
- lead
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 21
- 239000000057 synthetic resin Substances 0.000 claims abstract description 21
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims abstract description 7
- 239000012530 fluid Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 abstract description 27
- 239000011347 resin Substances 0.000 abstract description 27
- 230000002950 deficient Effects 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000002390 adhesive tape Substances 0.000 description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、発光ダイオード（LED）等の発光
素子を合成樹脂製の発光表示器ケース内に充填し
てその前面から光を出すようにした発光表示器の
製造方法に関するものである。[Detailed Description of the Invention] [Industrial Field of Application] The present invention is a light-emitting display case made of synthetic resin that is filled with light-emitting elements such as light-emitting diodes (LEDs) so that light is emitted from the front of the case. The present invention relates to a method of manufacturing a light emitting display.
発光ダイオード（LED）等の発光素子を使つ
た発光表示器１は、リード部２，２先端の発光素
子部を合成樹脂性等の不透明な上下端面開放状四
角等の筒状ケース３内で熱硬化性合成樹脂４にて
封入し、前記両リード部２，２の一端を外部に露
出させて成るもので、該両リード部２，２に敵宜
の電圧を掛けると、発光素子部から発する光は前
記合成樹脂４を通るが不透明な筒状ケースでは反
射され、発光表示器１前面のみから外部に出るよ
うにしている。
A light-emitting display 1 using a light-emitting element such as a light-emitting diode (LED) has lead parts 2 and the light-emitting element part at the tip of the lead part 2 heated in a cylindrical case 3 made of synthetic resin or the like and having an open top and bottom open square case. It is sealed with a curable synthetic resin 4 and one end of both the lead parts 2, 2 is exposed to the outside, and when an appropriate voltage is applied to both the lead parts 2, 2, light is emitted from the light emitting element part. Although the light passes through the synthetic resin 4, it is reflected by the opaque cylindrical case and exits only from the front surface of the light emitting display 1.
このような発光表示器１を製造する従来の方法
としては、第４図及び第５図に示すように、上面
に感圧性接着剤５を塗布した接着テープ６に、上
下端が開放された平面視四角状の筒状ケース３の
下端面を押圧接着して、いわば筒状ケース３の下
端開口部を接着テープ６にて封することにより仮
の底が出来上がるようにし、次いで、前記リード
部２，２先端部を発光素子部と共に筒状ケース３
内部に臨ませた状態に保持し、熱硬化性合成樹脂
４を流体状にて注入し、適宜時間加熱して硬化さ
せた後に前記接着テープ６を剥がすことにより完
成させるか、前記筒状ケース３の上端開口部から
適宜量の熱硬化性合成樹脂を注入して加熱硬化し
た後、前記接着テープ６を剥がすことにより前記
筒状ケース３の下端面に一旦底部を形成し、該底
部に異物や気泡のないものを選んでそれに前記リ
ード部２，２先端部を発光素子部と共に内部に臨
ませた状態に保持し、再度熱硬化性合成樹脂４を
液体状にて注入し、適宜時間加熱して硬化させる
ことにより完成させるようにしていた。 As shown in FIGS. 4 and 5, a conventional method for manufacturing such a light emitting display 1 is to use an adhesive tape 6 coated with a pressure-sensitive adhesive 5 on the top surface, and a flat surface with open upper and lower ends. A temporary bottom is completed by press-bonding the lower end surface of the tubular case 3, which is square in appearance, and sealing the lower end opening of the tubular case 3 with adhesive tape 6, and then the lead portion 2 , 2 and the cylindrical case 3 together with the light emitting element part.
The cylindrical case 3 can be completed by holding it in a state facing the inside, injecting the thermosetting synthetic resin 4 in a fluid state, heating it for an appropriate period of time to cure it, and then peeling off the adhesive tape 6. After injecting an appropriate amount of thermosetting synthetic resin from the upper end opening and curing it by heating, a bottom is temporarily formed on the lower end surface of the cylindrical case 3 by peeling off the adhesive tape 6, and the bottom is free from foreign matter and Select one without air bubbles, hold the tips of the lead parts 2 and 2 facing inside together with the light emitting element part, inject the thermosetting synthetic resin 4 in liquid form again, and heat it for an appropriate time. It was completed by curing the material.
ところが、前記筒状ケース３の下端面の面積は
大きくなく、また、筒状ケース３の下端面にバリ
が突出している等のために接着テープ６における
感圧性接着剤５との接着が不完全になり易く、こ
の接着不完全部分から前記流動状樹脂４が漏れ出
すと硬化後の樹脂量が不足し、しかも隣接する筒
体に漏れ出た樹脂が付着する場合には、その部品
も不良品になり、不良の発生率が高い。他方、筒
体３の下端面の面積を大きくすべく筒体の肉厚を
厚くすると、発光表示器１の形状が大きくなり、
大型化する。
However, the area of the lower end surface of the cylindrical case 3 is not large, and there are burrs protruding from the lower end surface of the cylindrical case 3, so that the adhesion with the pressure sensitive adhesive 5 in the adhesive tape 6 is incomplete. If the fluid resin 4 leaks from this incompletely bonded part, the amount of resin after curing will be insufficient, and if the leaked resin adheres to the adjacent cylinder, that part may also be defective. , and the incidence of defects is high. On the other hand, if the wall thickness of the cylinder 3 is increased in order to increase the area of the lower end surface of the cylinder 3, the shape of the light emitting display 1 becomes larger.
Become larger.
この接着を完全にするため接着テープ６を裏か
ら指等で強く押すと、筒体３の下端開口部分に接
着テープ６が上凸湾曲状に変形し、合成樹脂４の
硬化後にはその下端面が凹湾曲面になり、これも
不良の原因となる。しかも、この接着テープ６は
使い捨てであり、製造コストが高く付く問題があ
つた。 When the adhesive tape 6 is strongly pressed with a finger or the like from the back side to ensure complete adhesion, the adhesive tape 6 is deformed into an upwardly convex curved shape at the lower end opening of the cylinder 3, and after the synthetic resin 4 has hardened, the lower end surface becomes a concave curved surface, which also causes defects. Moreover, this adhesive tape 6 is disposable, which poses a problem of high manufacturing costs.
そこで、本発明では、リード部下端の発光素子
部を、発光表示器のケースとなる合成樹脂製の上
面開放型の底部付き箱状ケース内に挿入し、次い
で流動状の熱硬化性合成樹脂を前記箱状ケース内
に注入後に加熱硬化し、さらに、前記箱状ケース
の底部を前記合成樹脂が露出するように切除する
方法であつて、これにより、箱状ケースの側板の
厚さがいかに薄くても、注入した樹脂は硬化する
までの間に箱状ケースから外に漏れ出ないように
できる。
Therefore, in the present invention, the light emitting element section at the lower end of the lead is inserted into a box-shaped case made of synthetic resin with an open top and bottom, which serves as the case of the light emitting display, and then a fluid thermosetting synthetic resin is inserted into the case. This is a method in which the synthetic resin is injected into the box-shaped case and cured by heating, and then the bottom of the box-shaped case is cut off to expose the synthetic resin. However, the injected resin can be prevented from leaking out of the box-like case until it hardens.
また、樹脂が硬化するまでの間に、当該樹脂内
に混入したごみ等の不純物が箱状ケースの底部に
沈澱しているから、樹脂の硬化後にこの樹脂を箱
状ケースの底部と共に切り取りれば、これらと一
緒に前記不純物も取り除くことができるのであ
る。 In addition, since impurities such as dust mixed into the resin settle at the bottom of the box-like case until the resin hardens, it is necessary to cut out this resin together with the bottom of the box-like case after the resin hardens. , the above-mentioned impurities can be removed together with these.
しかも、前記切断により発光表示器のケースの
前面を平面状にすることも簡単で均一にできる。 Moreover, by the cutting, the front surface of the case of the light emitting display can be easily and uniformly made into a flat surface.
次ぎに本発明の実施例を説明すると、第１図に
示すように、金属板材を打ち抜いて、発光ダイオ
ードを構成する一対のカソードリード１１及びア
ノードリード１２とを適宜間隔で連設して成るリ
ードフレーム１３を構成し、前記各カソードリー
ド１１の先端部に半導体チツプをマウントし、対
をなすカソードリード１１とアノードリード１２
にワイヤーボンデイングを施すことにより、発光
素子部１４を構成する。
Next, an embodiment of the present invention will be described. As shown in FIG. 1, a lead is formed by punching out a metal plate and connecting a pair of cathode leads 11 and anode leads 12 constituting a light emitting diode at appropriate intervals. A frame 13 is constructed, a semiconductor chip is mounted on the tip of each cathode lead 11, and the cathode lead 11 and anode lead 12 form a pair.
The light emitting element section 14 is constructed by applying wire bonding to the light emitting element section 14.
１５は底部１６と四側部とを一体的に成形され
た平面視四角状等の不透明な合成樹脂製の箱状ケ
ースを示し、該各箱状ケース１５の上面開口部か
ら前記各一対のカソードリード１１及びアノード
リード１２の下端部と発光素子部１４とを、箱状
ケース１５内に挿入し、該発光素子部１４が箱体
の底部１６と適宜上下間隔があるようにして位置
保持する。 Reference numeral 15 denotes a box-like case made of opaque synthetic resin and having a rectangular shape in plan view, whose bottom part 16 and four side parts are integrally molded. The lower ends of the lead 11 and the anode lead 12 and the light emitting element section 14 are inserted into a box-like case 15, and the light emitting element section 14 is held in position with an appropriate vertical distance from the bottom section 16 of the box.
次いで、流動状の熱硬化性合成樹脂１７を注入
器１８にて前記各箱体箱状ケース１５内に一杯に
なるまで注入し、この状態のまま適宜時間加熱す
ることにより、前記樹脂１７を硬化させる。これ
により、前記発光素子部１４が箱状ケース１５内
に封入され、両リード１１，１２の一端は外部に
突出した状態にて保持される。 Next, fluid thermosetting synthetic resin 17 is injected into each of the box-like cases 15 until it is filled with a syringe 18, and the resin 17 is cured by heating in this state for an appropriate period of time. let As a result, the light emitting element portion 14 is enclosed within the box-like case 15, and one ends of both leads 11 and 12 are held in a state of protruding to the outside.
次ぎに、第２図の一点鎖線１９で示すような位
置で箱状ケース１５の底部１６と樹脂１７の下端
部とを適宜切削手段にて切り取ると、その面が発
光表示器１の前面２０となる。 Next, when the bottom part 16 of the box-like case 15 and the lower end part of the resin 17 are cut out using appropriate cutting means at the position shown by the dashed line 19 in FIG. Become.
その後、前記前面２０を研磨する一方、前記リ
ードフレーム１３を切り離してカソードリード１
１及びアノードリード１２が分離するようにすれ
ば、第３図に示すような発光表示器１が出来上が
る。 Thereafter, while polishing the front surface 20, the lead frame 13 is separated and the cathode lead 1 is removed.
1 and anode lead 12 are separated, a light emitting display 1 as shown in FIG. 3 is completed.
このように、本発明では、底部が一体的に成形
された上面開放の箱状ケース内に発光素子部を封
入すべく、熱硬化性合成樹脂を箱体内に注入後、
加熱硬化させるのであつて、箱状ケースの底部が
一体成形であるため、各箱状ケース内に流動状樹
脂を入れた状態で加熱装置等へ移送する際にも、
注入された樹脂は底部から漏れ出ることがない。
従つて、注入樹脂量を一定にできる一方、そのロ
スがなく、また、箱状ケース内の樹脂量が不足し
たまま硬化させることもないから、不良品の発生
もない。
As described above, in the present invention, in order to encapsulate the light emitting element part in a box-like case with an open top and an integrally molded bottom, after injecting a thermosetting synthetic resin into the box,
The resin is cured by heating, and the bottom of the box-shaped cases is integrally molded, so even when the fluid resin is placed inside each box-shaped case and transferred to a heating device, etc.
The injected resin will not leak out from the bottom.
Therefore, while the amount of injected resin can be kept constant, there is no loss of resin, and since the resin is not cured with an insufficient amount of resin in the box-like case, there is no occurrence of defective products.
箱状ケースの底部及び側板部の肉厚を極端に薄
くすることができるから、発光表示器ケースの形
状を小型化することができる。 Since the bottom and side panels of the box-like case can be made extremely thin, the shape of the light-emitting display case can be reduced in size.
樹脂の硬化後に箱状ケースの底部を切削するこ
とにより、樹脂を露出させるようにするので、発
光表示器ケースの前面となる箇所を平面状にする
ことが簡単である。樹脂注入時に混入する異物、
不純物が箱状ケースの底部に溜まり易いが、これ
らを前記切削時に同時に切り取ることができ、こ
の面からも不良品をなくすことができると云う効
果を奏する。 Since the resin is exposed by cutting the bottom of the box-like case after the resin has hardened, it is easy to make the front surface of the light emitting display case flat. Foreign matter mixed in during resin injection,
Impurities tend to accumulate at the bottom of the box-like case, but these can be removed at the same time as the cutting, and this also has the effect of eliminating defective products.
第１図は箱状ケース内へのリード部の挿入と流
動樹脂の注入状態を示す側断面図、第２図は箱状
ケースの底部の切削を示す側断面図、第３図は完
成品の斜視図、第４図は従来例を示す斜視図、第
５図は第４図のＶ−Ｖ線視断面図である。
１……発光表示器、２，２……リード部、３…
…筒状ケース、４……熱硬化性樹脂、５……感圧
性接着剤、６……接着テープ、１１……カソード
リード、１２……アノードリード、１３……リー
ドフレーム、１４……発光素子部、１５……箱状
ケース、１６……底部、１７……熱硬化性樹脂、
２０……前面。
Figure 1 is a side sectional view showing the insertion of the lead part into the box-shaped case and injection of fluid resin, Figure 2 is a side sectional view showing the cutting of the bottom of the box-shaped case, and Figure 3 is the finished product. FIG. 4 is a perspective view showing a conventional example, and FIG. 5 is a sectional view taken along the line V-V in FIG. 4. 1... Light emitting indicator, 2, 2... Lead section, 3...
... Cylindrical case, 4 ... Thermosetting resin, 5 ... Pressure sensitive adhesive, 6 ... Adhesive tape, 11 ... Cathode lead, 12 ... Anode lead, 13 ... Lead frame, 14 ... Light emitting element Part, 15... Box-shaped case, 16... Bottom, 17... Thermosetting resin,
20...Front.
Claims (1)
光素子部を、発光表示器のケースとなる合成樹脂
製の上面開放型の底部付き箱状ケース内に挿入
し、次いで流動状の熱硬化性合成樹脂を前記箱状
ケース内に注入後に加熱硬化し、さらに、前記箱
状ケースにおける底部を前記合成樹脂が露出する
ように切除することを特徴とする発光表示器の製
造方法。1. Insert the light-emitting element part at the tip of the lead part of a light-emitting diode, etc. into a box-shaped case made of synthetic resin with an open top and bottom, which will serve as the case of the light-emitting display, and then insert the fluid thermosetting synthetic resin into the 1. A method of manufacturing a light emitting display, which comprises injecting the synthetic resin into a box-like case, heating and curing it, and further cutting off the bottom of the box-like case so that the synthetic resin is exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59226065A JPS61102785A (en) | 1984-10-26 | 1984-10-26 | Manufacture of light emitting display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59226065A JPS61102785A (en) | 1984-10-26 | 1984-10-26 | Manufacture of light emitting display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61102785A JPS61102785A (en) | 1986-05-21 |
| JPH0422353B2 true JPH0422353B2 (en) | 1992-04-16 |
Family
ID=16839252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59226065A Granted JPS61102785A (en) | 1984-10-26 | 1984-10-26 | Manufacture of light emitting display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61102785A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2573080B2 (en) * | 1990-04-26 | 1997-01-16 | 三洋電機株式会社 | Method for manufacturing solid-state imaging device |
-
1984
- 1984-10-26 JP JP59226065A patent/JPS61102785A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61102785A (en) | 1986-05-21 |
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