JPH06204570A - Manufacture of luminous display - Google Patents
Manufacture of luminous displayInfo
- Publication number
- JPH06204570A JPH06204570A JP5242525A JP24252593A JPH06204570A JP H06204570 A JPH06204570 A JP H06204570A JP 5242525 A JP5242525 A JP 5242525A JP 24252593 A JP24252593 A JP 24252593A JP H06204570 A JPH06204570 A JP H06204570A
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- case
- light emitting
- tape
- cylindrical case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
- G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、発光ダイオード（ＬＥ
Ｄ）等の発光素子を使用し、筒型ケースの一端面を発光
させるようにした発光表示器において、この発光表示器
を製造する方法に関するものである。BACKGROUND OF THE INVENTION The present invention relates to a light emitting diode (LE).
The present invention relates to a method of manufacturing a light emitting display, in which a light emitting element such as D) is used and one end surface of a cylindrical case is made to emit light.
【０００２】[0002]
【従来の技術】一般に、この種の発光表示器１は、図８
及び図９に示すように、合成樹脂等の非透明体製の筒型
ケース２内に、先端に発光ダイオード（ＬＥＤ）等の発
光素子３を備えた少なくとも一対のリード端子４，５を
挿入して、これを透明な熱硬化性の合成樹脂６にて密封
することにより、この合成樹脂６の端面における発光面
６ａを発光させるように構成している。2. Description of the Related Art Generally, a light emitting display 1 of this type is shown in FIG.
As shown in FIG. 9, at least a pair of lead terminals 4 and 5 having a light emitting element 3 such as a light emitting diode (LED) at the tip thereof are inserted into a cylindrical case 2 made of a non-transparent material such as synthetic resin. By sealing this with a transparent thermosetting synthetic resin 6, the light emitting surface 6a at the end face of the synthetic resin 6 is made to emit light.
【０００３】そして、従来、この種の発光表示器は、図
１０に示すように、前記筒型ケース２を下向きにして、
その底端面に、予め感圧性接着剤を塗布したテープ７を
貼着して、当該筒型ケース２の底を塞いで仮底を形成
し、次いで、この筒型ケース２内に、発光素子３を備え
た少なくとも一対のリード端子４，５を挿入したのち、
透明な熱硬化性の合成樹脂６を液体の状態で注入して硬
化することにより製造するか、或いは、図１１に示すよ
うに、前記筒型ケース２を下向きにして、その先端面
に、予め感圧性接着剤を塗布したテープ７を貼着して、
当該筒型ケース２の底を塞いで仮底を形成し、この筒型
ケース２内に、透明な熱硬化性の合成樹脂６を液体の状
態で注入して硬化することにより底部を成形し、次い
で、図１２に示すように、前記筒型ケース２内に、発光
素子３を備えた少なくとも一対のリード端子４，５を挿
入したのち、封入用の透明な熱硬化性の合成樹脂６′を
液体の状態で注入して硬化することにより製造している
ことは、良く知られている。Conventionally, in this type of light emitting display, as shown in FIG. 10, the cylindrical case 2 is oriented downward,
A tape 7 coated with a pressure-sensitive adhesive in advance is attached to the bottom end surface thereof to close the bottom of the tubular case 2 to form a temporary bottom, and then the light emitting element 3 is placed in the tubular case 2. After inserting at least a pair of lead terminals 4 and 5 equipped with
It is manufactured by injecting a transparent thermosetting synthetic resin 6 in a liquid state and curing the resin, or as shown in FIG. Attach the tape 7 coated with pressure sensitive adhesive,
The bottom of the cylindrical case 2 is closed to form a temporary bottom, and a transparent thermosetting synthetic resin 6 is injected into the cylindrical case 2 in a liquid state to be cured to form the bottom, Next, as shown in FIG. 12, after inserting at least a pair of lead terminals 4 and 5 equipped with the light emitting element 3 into the cylindrical case 2, a transparent thermosetting synthetic resin 6'for encapsulation is inserted. It is well known that manufacturing is performed by pouring and hardening in a liquid state.
【０００４】[0004]
【発明が解決しようとする課題】そして、この種の発光
表示器において、その筒型ケース２における長さ寸法
（Ｌ）及び幅寸法（Ｗ）等の外形寸法を増大することな
く、熱硬化性の合成樹脂６の発光面６ａにおける発光面
積を増大するには、前記筒型ケース２における板厚さ
（Ｔ）は出来るだけ薄くする必要がある。In the light emitting display of this type, the thermosetting property is increased without increasing the outer dimensions such as the length dimension (L) and the width dimension (W) in the tubular case 2. In order to increase the light emitting area of the synthetic resin 6 on the light emitting surface 6a, it is necessary to make the plate thickness (T) of the cylindrical case 2 as thin as possible.
【０００５】しかし、筒型ケース２における板厚さ
（Ｔ）を薄くすると、当該筒型ケース２の先端面に、こ
れを塞ぐためのテープ７を貼着したときにおける接着面
の幅寸法が狭くなり、筒型ケース２に対するテープの接
着が不完全になり易く、この筒型ケース２内に熱硬化性
の合成樹脂６を液体の状態で注入した場合において、こ
の合成樹脂６が、前記筒型ケース２とテープ７との接着
面から外側に漏れ出ることになるから、不良品の発生率
が高くなるのであった。However, if the plate thickness (T) of the tubular case 2 is reduced, the width of the adhesive surface when the tape 7 for closing the tubular case 2 is attached to the tip surface of the tubular case 2 becomes narrow. When the thermosetting synthetic resin 6 is poured into the tubular case 2 in a liquid state, the synthetic resin 6 is not completely bonded to the tubular case 2. Since it leaks to the outside from the adhesive surface between the case 2 and the tape 7, the defective product rate increases.
【０００６】また、前記液体合成樹脂６の外側への漏れ
出しを防止するために、筒型ケース２の先端面に対して
テープ７を強く押圧すると、該テープ７のうち筒型ケー
ス２内における部分が湾曲状に変形することになるか
ら、合成樹脂６における発光面６ａが平面にならず、こ
れまた、不良品が発生するのであった。本発明は、これ
らの問題を解消した製造方法を提供することを技術的課
題とするものである。In order to prevent the liquid synthetic resin 6 from leaking to the outside, when the tape 7 is strongly pressed against the tip end surface of the tubular case 2, the tape 7 in the tubular case 2 is pressed. Since the portion is deformed into a curved shape, the light emitting surface 6a of the synthetic resin 6 does not become a flat surface, which also causes defective products. The present invention aims to provide a manufacturing method that solves these problems.
【０００７】[0007]
【課題を解決するための手段】この技術的課題を達成す
るため本発明は、筒型ケースの先端面にテープを貼着
し、次いで、前記筒型ケース内に、発光素子部を挿入し
たのち合成樹脂を液体で注入して硬化するか、或いは、
前記筒型ケース内に、合成樹脂を液体で注入して硬化し
たのち発光素子部を挿入した状態で合成樹脂を液体で注
入して硬化するようにした発光表示器の製造方法におい
て、前記筒型ケースにおける先端部の外周面に、前記テ
ープに対して貼着するようにしたフランジ部を、全周に
わたって一体的に造形し、このフランジ部を、前記合成
樹脂の硬化後において除去することにした。In order to achieve this technical object, according to the present invention, a tape is attached to the front end surface of a tubular case, and then a light emitting element portion is inserted into the tubular case. Inject synthetic resin with liquid and cure, or
A method for manufacturing a light-emitting display, wherein a synthetic resin is injected into a tubular case by a liquid and cured, and then a synthetic resin is injected into the tube and cured in a state where a light emitting element part is inserted, On the outer peripheral surface of the tip portion of the case, a flange portion that is attached to the tape is integrally formed over the entire circumference, and the flange portion is to be removed after the synthetic resin is cured. .
【０００８】[0008]
【作 用】このように、筒型ケースの先端部における
外周面に、テープに対して貼着するようにしたフランジ
部を、全周にわたって一体的に造形することにより、こ
の先端面に、テープを貼着した場合における接着面の幅
寸法を、当該筒型ケースにおける板厚さ寸法に、前記フ
ランジ部の幅寸法を加えた値に広くすることができるか
ら、筒型ケースの先端面に対してテープを強く押圧しな
くても、この筒型ケース内に液体の状態で充填した合成
樹脂が、前記接着面より筒型ケースの外側に漏れ出るこ
とを確実に防止できる。[Operation] In this way, the flange part, which is adapted to be adhered to the tape, is integrally formed on the outer peripheral surface of the tip of the cylindrical case over the entire circumference, so that the tape is attached to the end surface of the tape. Since the width dimension of the adhesive surface in the case of sticking can be widened to a value obtained by adding the width dimension of the flange portion to the plate thickness dimension in the tubular case, It is possible to reliably prevent the synthetic resin filled in the tubular case in a liquid state from leaking from the adhesive surface to the outside of the tubular case without strongly pressing the tape with the tape.
【０００９】一方、前記フランジ部は、筒型ケース内に
充填した合成樹脂が硬化した後において切除するもので
あるから、筒型ケースの外形寸法が、前記フランジ部の
ために増大することを防止できるのである。On the other hand, since the flange portion is cut off after the synthetic resin filled in the cylindrical case is hardened, the outer dimension of the cylindrical case is prevented from increasing due to the flange portion. You can do it.
【００１０】[0010]
【発明の効果】従って、本発明によると、前記従来のよ
うに、筒型ケース内に充填した合成樹脂が筒型ケースと
テーブとの接着面から外側に漏れ出ることによる不良品
の発生、及び、筒型ケースに対してテープを強く押圧す
ることで筒型ケース内に充填した合成樹脂における発光
面が平面状にならないと云う不良品の発生を、筒型ケー
スの外形寸法の増大、延いては、発光表示器の大型、及
び発光面積の縮小を招来することなく、確実に低減でき
る効果を有する。Therefore, according to the present invention, as in the prior art, the defective synthetic resin filled in the tubular case leaks to the outside from the bonding surface between the tubular case and the tape, and The occurrence of defective products in which the light emitting surface of the synthetic resin filled in the tubular case does not become flat by strongly pressing the tape against the tubular case is caused by an increase in the external dimensions of the tubular case. Has the effect of reliably reducing the size of the light emitting display and reducing the light emitting area.
【００１１】[0011]
【実施例】以下、本発明の実施例を、図１〜図７の図面
について説明する。この図において符号２は、発光表示
器１における合成樹脂等の非透明体製製の筒型ケースを
示し、該筒型ケース２における先端部の外周には、幅寸
法（Ｓ）で厚さ（ｔ）のフランジ部８を、全周にわたっ
て一体的に造形し、このフランジ部８の筒型ケース２に
対する付け根部には、Ｖ型ノッチ溝９を、筒型ケース２
の外周面に沿って延びるように設けることにより、該フ
ランジ部８を、筒型ケース２より切除可能に、換言する
と、筒型ケース２から容易に切除できるように構成す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to the drawings of FIGS. In this figure, reference numeral 2 indicates a tubular case made of a non-transparent material such as synthetic resin in the light emitting display 1, and the outer circumference of the tip of the tubular case 2 has a width (S) and a thickness (S). The flange portion 8 of t) is integrally formed over the entire circumference, and a V-shaped notch groove 9 is formed in the base portion of the flange portion 8 with respect to the cylindrical case 2.
By providing the flange portion 8 so as to extend along the outer peripheral surface thereof, the flange portion 8 can be cut off from the tubular case 2, in other words, can be easily cut off from the tubular case 2.
【００１２】そして、前記筒型ケース２を、図３に示す
ように、下向きにして、その先端面を予め感圧接着剤を
塗布したテープ７に対して押圧することにより、当該先
端部の外側に全周にわたって造形した前記フランジ部８
において接着する。このテープ７に対する接着により、
その接着面における幅寸法は、筒型ケース２における板
厚さ（Ｔ）に前記フランジ部８の幅寸法（Ｓ）を加えた
値に広くなる。Then, as shown in FIG. 3, the cylindrical case 2 is directed downward, and its tip end surface is pressed against the tape 7 to which a pressure-sensitive adhesive has been applied in advance. The flange portion 8 formed over the entire circumference
Glue at. By adhesion to this tape 7,
The width dimension of the adhesive surface is widened to a value obtained by adding the plate thickness (T) of the tubular case 2 to the width dimension (S) of the flange portion 8.
【００１３】従って、筒型ケース２の先端面に対してテ
ープ７を強く押圧しなくても、この筒型ケース２内に、
図４に示すように、液体の状態で充填した透明な熱硬化
性の合成樹脂６は、前記接着面より筒型ケース２の外側
に漏れ出ることはないのである。そして、前記筒型ケー
ス２内に充填した合成樹脂６が硬化すると、テープ７を
剥離したのち、前記フランジ部８を、図５に矢印Ａ，Ｂ
で示すように、折り曲げることを繰り返すことにより、
当該フランジ部８を筒型ケース２から切除できるのであ
る。Therefore, even if the tape 7 is not strongly pressed against the tip end surface of the cylindrical case 2, the inside of the cylindrical case 2 is
As shown in FIG. 4, the transparent thermosetting synthetic resin 6 filled in the liquid state does not leak to the outside of the cylindrical case 2 from the adhesive surface. Then, when the synthetic resin 6 filled in the cylindrical case 2 is cured, the tape 7 is peeled off, and then the flange portion 8 is moved to the direction indicated by arrows A and B in FIG.
By repeating bending, as shown in
The flange portion 8 can be cut off from the cylindrical case 2.
【００１４】なお、このフランジ部８の切除は、前記図
１１及び図１２に示す従来の場合と同様に、筒型ケース
２内に発光素子３を備えた少なくとも一対のリード端子
４，５を挿入したのち、封入用の透明な熱硬化性の合成
樹脂６′を液体の状態で注入し、この合成樹脂６′の硬
化後において、テープ７を剥離してから行うようにして
も良く、また、前記フランジ部８の切除に際しては、図
６に示すように、フランジ部８付き筒型ケース２をダイ
ス型１０内に嵌め、該ダイス型１０と、当該ダイス型１
０に嵌まるポンチ型１１とによる打抜きによって、フラ
ンジ部８を切除するようにしても良いのである。Incidentally, the flange portion 8 is cut off by inserting at least a pair of lead terminals 4 and 5 provided with the light emitting element 3 in the cylindrical case 2 as in the conventional case shown in FIGS. 11 and 12. After that, a transparent thermosetting synthetic resin 6'for encapsulation may be injected in a liquid state, and after the synthetic resin 6'is cured, the tape 7 may be peeled off. When the flange portion 8 is cut off, as shown in FIG. 6, the tubular case 2 with the flange portion 8 is fitted into the die die 10 to form the die die 10 and the die die 1.
Alternatively, the flange portion 8 may be cut out by punching with the punch die 11 that fits into zero.
【００１５】また、前記実施例は、筒型ケース２の外周
面に一体的に造形した厚さ（ｔ）のフランジ部８を、そ
の付け根部にＶ型ノッチ溝９を設けることにより、筒型
ケース２に対して切除可能に構成した場合を示したが、
本発明は、これに限らず、筒型ケース２の外周面に、図
７に示すように、厚さ（ｔ）を薄くしたフランジ部８ａ
を一体的に造形することによって、当該フランジ部８ａ
を筒型ケース２に対して切除可能に構成しても良いので
ある（この場合におけるフランジ部８ａの切除は、図６
に示すように、ダイス型１０と、ポンチ型１１とによる
打抜きを適用するのが好ましい）。Further, in the above-described embodiment, the flange portion 8 having a thickness (t) integrally formed on the outer peripheral surface of the cylindrical case 2 is provided, and the V-shaped notch groove 9 is provided at the base portion thereof to form the cylindrical shape. The case where it can be cut off is shown for Case 2,
The present invention is not limited to this, and the flange portion 8a having a reduced thickness (t) is formed on the outer peripheral surface of the cylindrical case 2 as shown in FIG.
By integrally molding the flange portion 8a
May be configured to be cuttable with respect to the cylindrical case 2 (cutting of the flange portion 8a in this case is as shown in FIG.
It is preferable to apply punching with a die 10 and a punch 11 as shown in FIG.
【００１６】更にまた、本発明は、前記実施例のよう
に、筒型ケース２内に合成樹脂を二回に分けて充填する
場合に限らず、前記図１０に示す従来の場合と同様に、
筒型ケース２内に、発光素子３を備えた少なくとも一対
のリード端子４，５を挿入したのち、透明な熱硬化性の
合成樹脂６を液体の状態で一度に注入する場合にも適用
できることは言うまでもない。Furthermore, the present invention is not limited to the case in which the cylindrical case 2 is filled with the synthetic resin twice as in the above-described embodiment, but the same as in the conventional case shown in FIG.
After inserting at least a pair of lead terminals 4 and 5 equipped with the light emitting element 3 into the cylindrical case 2, the transparent thermosetting synthetic resin 6 can be applied at one time in a liquid state. Needless to say.
【図１】本発明における第１の実施例に使用する筒型ケ
ースの斜視図である。FIG. 1 is a perspective view of a cylindrical case used in a first embodiment of the present invention.
【図２】図１のII−II視断面図である。FIG. 2 is a sectional view taken along line II-II of FIG.
【図３】前記筒型ケースにテープを貼着した状態の断面
図である。FIG. 3 is a cross-sectional view of a state in which a tape is attached to the cylindrical case.
【図４】前記筒型ケース内に合成樹脂を充填したときの
断面図である。FIG. 4 is a cross-sectional view when a synthetic resin is filled in the cylindrical case.
【図５】前記筒型ケースにおけるフランジ部を切除して
いる状態を示す断面図である。FIG. 5 is a cross-sectional view showing a state in which a flange portion of the cylindrical case is cut off.
【図６】図５の変形例を示す断面図である。6 is a cross-sectional view showing a modified example of FIG.
【図７】本発明における第２の実施例に使用する筒型ケ
ースの断面図である。FIG. 7 is a cross-sectional view of a cylindrical case used in the second embodiment of the present invention.
【図８】発光表示器の斜視図である。FIG. 8 is a perspective view of a light emitting display.
【図９】図８のIX−IX視断面図である。9 is a sectional view taken along line IX-IX in FIG.
【図１０】従来における方法を示す断面図である。FIG. 10 is a cross-sectional view showing a conventional method.
【図１１】従来における別の方法を示す断面図である。FIG. 11 is a cross-sectional view showing another conventional method.
【図１２】図１１の次の段階を示す断面図である。FIG. 12 is a cross-sectional view showing the next step of FIG. 11.
１ 発光表示器 ２ 筒型ケース ３ 発光素子 ４，５ リード端子 ６，６′ 合成樹脂 ７ テープ ８，８ａ フランジ部 1 Light emitting display 2 Cylindrical case 3 Light emitting element 4,5 Lead terminal 6,6 'Synthetic resin 7 Tape 8,8a Flange part
Claims (1)
いで、前記筒型ケース内に、発光素子部を挿入したのち
合成樹脂を液体で注入して硬化するか、或いは、前記筒
型ケース内に、合成樹脂を液体で注入して硬化したのち
発光素子部を挿入した状態で合成樹脂を液体で注入して
硬化するようにした発光表示器の製造方法において、前
記筒型ケースにおける先端部の外周面に、前記テープに
対して貼着するようにしたフランジ部を、全周にわたっ
て一体的に造形し、このフランジ部を、前記合成樹脂の
硬化後において除去することを特徴とする発光表示器の
製造方法。1. A tape is attached to the front end surface of a tubular case, and then a light emitting element portion is inserted into the tubular case, and then a synthetic resin is injected as a liquid and cured, or the tubular case is used. In a method of manufacturing a light emitting display, wherein a synthetic resin is injected into a mold case by a liquid and cured, and then a synthetic resin is injected into the mold and cured in a state where a light emitting element portion is inserted, A flange portion adapted to be attached to the tape is integrally formed on the outer peripheral surface of the tip portion over the entire circumference, and the flange portion is removed after the synthetic resin is cured. Manufacturing method of light emitting display.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5242525A JPH0831622B2 (en) | 1993-09-29 | 1993-09-29 | Manufacturing method of light emitting display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5242525A JPH0831622B2 (en) | 1993-09-29 | 1993-09-29 | Manufacturing method of light emitting display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06204570A true JPH06204570A (en) | 1994-07-22 |
| JPH0831622B2 JPH0831622B2 (en) | 1996-03-27 |
Family
ID=17090414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5242525A Expired - Lifetime JPH0831622B2 (en) | 1993-09-29 | 1993-09-29 | Manufacturing method of light emitting display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0831622B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7005311B2 (en) | 1993-09-30 | 2006-02-28 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
| US7102215B2 (en) | 1997-07-29 | 2006-09-05 | Osram Gmbh | Surface-mountable light-emitting diode structural element |
| US9196800B2 (en) | 1996-06-26 | 2015-11-24 | Osram Gmbh | Light-radiating semiconductor component with a luminescence conversion element |
-
1993
- 1993-09-29 JP JP5242525A patent/JPH0831622B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7005311B2 (en) | 1993-09-30 | 2006-02-28 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
| US7102212B2 (en) | 1993-09-30 | 2006-09-05 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
| US7288831B2 (en) | 1993-09-30 | 2007-10-30 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
| US9196800B2 (en) | 1996-06-26 | 2015-11-24 | Osram Gmbh | Light-radiating semiconductor component with a luminescence conversion element |
| US7102215B2 (en) | 1997-07-29 | 2006-09-05 | Osram Gmbh | Surface-mountable light-emitting diode structural element |
| US7183632B2 (en) | 1997-07-29 | 2007-02-27 | Osram Gmbh | Surface-mountable light-emitting diode structural element |
| US7508002B2 (en) | 1997-07-29 | 2009-03-24 | Osram Gmbh | Surface-mountable light-emitting diode structural element |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0831622B2 (en) | 1996-03-27 |
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