JPH04223359A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enable a case to be improved in moisture resistance by a method wherein an index means which is made to serve as a reference to dispose a device itself in a certain direction is provided the surface of the case, and the index means is made to serve as a mark. CONSTITUTION:An index mark 8 is provided on the surface of a frame 1 on the primary surface side of a solid-state image sensing device. The index mark 8 is provided with a mirror-finished surface making a satin-finished surface serve as a background. The index mark 8 provided as above is formed at the same time when the frame 1 is formed. Then, as the index mark 8 provided to the frame 1 is made to serve as an index means, stripe grooves are not required to be provided to the frame 1. Therefore, the frame 1 can be miniaturized and formed thick enough to keep a solid-state image sensing chip 3 free from moisture.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a semiconductor chip, a housing made of a resin material containing the semiconductor chip, and an electrode of the semiconductor chip that is formed to protrude from the housing. The present invention relates to a semiconductor device comprising external leads to which electrical connections are made, and in which index means is provided on the surface of the casing to serve as a guide for determining the direction of the device itself.

0002

2. Description of the Related Art This type of semiconductor device, for example, a solid-state imaging device, has the following configuration.

That is, FIG. 3 is a plan view showing an example of a conventional solid-state imaging device. In the figure, there is a frame 31 made of a resin material, such as epoxy. This frame body 31 constitutes a housing together with a glass substrate 37 which will be described later.

The frame 31 has a concave portion 32 provided in the center of its main surface, and a solid-state imaging chip 33 is mounted within the concave portion 32.

[0005] Electrodes 34 are provided on the main surface of this solid-state imaging chip 33 , and each of these electrodes 34 is connected to a lead 36 via wire bonding 35 .

The lead 36 is connected to the wire bonding 35 at its base, and is connected to the frame 3.
1 and is extended to the outside of the frame body 31.

Furthermore, a glass substrate 37 that faces the main surface of the solid-state imaging chip 33 and closes the concave portion 32 of the frame 31 is provided.
is formed.

A groove 38 is provided on one side of the frame 31 so that the cross section of the groove can be recognized from the main surface side. This groove 38 functions as an index means for determining the direction of the device itself.

[0009]

[Problems to be Solved by the Invention] However, in a semiconductor device having such a structure, the groove 38 serving as the indexing means is located in the recess 32 in the frame 31 made of a resin material.
It is formed by forming the .

For this reason, it has been confirmed that moisture enters through the grooves 38.

[0011] Although resin materials are not originally completely moisture resistant, there are usually no problems with their moisture resistance as long as they have a certain thickness, and they are extremely easy to process. It is widely used for this reason.

However, in recent years, there has been a strong demand for miniaturization of devices, and accordingly there is a tendency to make the frame 31 made of resin material smaller.

Under these circumstances, it has been discovered that forming the recess 32 in the frame 31 makes it easier for moisture to enter through the recess 32.

In particular, since the moisture permeability of a resin material increases exponentially as the thickness of the resin material becomes thinner, this can be ignored even if the depth of the recessed portion 32 is shallow. It has become impossible to do so.

[0015] Therefore, the present invention has been made based on the above circumstances, and its object is to provide a semiconductor device equipped with a casing having excellent moisture resistance.

[0016]

[Means for Solving the Problems] In order to achieve the above object, the present invention basically comprises a semiconductor chip, a housing made of a resin material containing the semiconductor chip, and a housing protruding from the housing. A semiconductor device comprising an external lead formed by the semiconductor chip and electrically connected to an electrode of the semiconductor chip, wherein an index means is provided on the surface of the casing as a guide for determining the direction of the device itself. In the invention, the index means is a mark.

[0017] The above-described structure of the invention is characterized in that the surface of the casing is matte-finished, and the mark is mirror-finished on a part of the matte-finished surface. It is something.

Further, the semiconductor device is composed of a solid-state imaging device, and its casing includes a frame made of a resin material in which a recess is formed in the portion where the solid-state imaging chip is mounted, and a frame body facing the main surface of the solid-state imaging chip. and a transparent plate that closes the recessed portion.

[0019]

[Operation] Since the semiconductor device constructed in this manner uses marks as index means provided on the casing, there is no need to form grooves 38 in the casing as in the conventional case.

[0020] Therefore, the casing can be made smaller and have a thickness that ensures sufficient moisture resistance between the casing and the semiconductor chip.

[0021] The mark can be displayed extremely clearly when a border is processed on a part of the satin-finished surface.

Furthermore, when applied to a semiconductor device, especially a solid-state imaging device, it is extremely effective in terms of moisture resistance. Since solid-state imaging devices must form a projected image on the main surface of the solid-state imaging chip, a space is formed around the solid-state imaging chip. For this reason, if moisture permeates, dew condensation will occur on the surface of the glass substrate, which is part of the housing, on the side of the space. Since the glass substrate is a transparent plate that transmits a light image, the occurrence of dew condensation on this transparent plate is fatal to the device.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A shows a plan view of a solid-state imaging device which is an embodiment of a semiconductor device according to the present invention. Further, (b) shows a cross-sectional view taken along the line Ib-Ib in (a).

In the figure, there is a frame 1 made of a resin material, such as epoxy. This frame 1 is formed, for example, by molding. This frame 1 constitutes a housing together with a glass substrate 7, which will be described later.

The frame 1 has a concave portion 2 in the center of its main surface.
is provided in this recessed part 2,
A solid-state imaging chip 3 is mounted.

A light image is formed on the main surface of the solid-state imaging chip 3 through the glass substrate 7.

The solid-state imaging chip 3 has a structure in which a plurality of photodiodes are formed in a matrix at the center of its main surface, and the charges generated in each of these photodiodes are transferred by a shift register made of, for example, a CCD element. It is designed to be output.

Electrodes 4 are provided in parallel around the main surface of this solid-state imaging chip 3, and each of these electrodes 4 is connected to a lead 6 via a wire bonding 5.

The lead 6 serves as a connection part for the wire bonding 5 at its base, and extends through the frame 1 to the outside of the frame 1.

The external leads 6A taken out to the outside of the frame 1 in this manner are formed in parallel on one side of the frame 1 and the other side opposite to this one side.

Furthermore, a glass substrate 7 is formed facing the main surface of the solid-state imaging chip 3 and closing the recess 2 of the frame 1. This glass substrate 7 is fixed to the frame 1 via an adhesive.

[0032]The entire surface of the frame 1 of the solid-state imaging device having such a structure is subjected to a so-called matte finish. This satin finish is formed at the same time as the frame body 1 is molded, and is convenient because it makes it clear when stamping, for example, a stamp indicating the characteristics of the device on the back side, etc. There is.

Furthermore, an index mark 8 is formed on the surface of the frame 1 on the main surface side of the solid-state imaging device (the matte-finished surface). The index mark 8 has a mirror-finished surface with a satin-finished surface as the background.

Such index marks 8 are formed, for example, at the same time as the frame 1 is molded.

As is clear from the embodiments described above,
Since the mark 8 is used as the indexing means provided on the frame 1, the frame 1 has no grooves 3 like the conventional one.
There is no need to form 8 at all.

Therefore, the frame 1 can be made compact and have a thickness that ensures sufficient moisture resistance between the frame 1 and the solid-state imaging chip 3.

Since the mark 8 is formed as a border-processed part of the satin-finished surface, it can be displayed very clearly without being mistaken.

The solid-state imaging device described above has a space formed around the solid-state imaging chip 3 because it is necessary to form a projected image on the main surface of the solid-state imaging chip 3. ing. Therefore, when moisture permeates, dew condensation occurs on the surface of the glass substrate 7, which is a part of the housing, on the space side. In such a case, even if the amount of dew condensation is small, it will be fatal to the device because the glass substrate is a transparent plate that transmits light images. However, by enhancing the moisture resistance as described above, such adverse effects are eliminated.

Although the above-described embodiments have been described with respect to solid-state imaging devices, the present invention is not necessarily limited to solid-state imaging devices. It can be applied to all semiconductor devices.

FIG. 2 is a plan view showing an embodiment of a semiconductor device according to the present invention, and shows a semiconductor device incorporating a so-called IC element.

In the figure, the same reference numerals as in FIG. 1 indicate the same materials. In the case of FIG. 2, the configuration different from FIG. 1 is
There are no voids around the semiconductor chip (not shown),
The reason is that the resin material, which is the material of the frame body 1, is filled in a state in which it is in contact with the semiconductor chip.

In this embodiment, the index mark 8 is formed of a mirror-finished surface with a satin-finished surface as the background, but it goes without saying that this relationship may be reversed. Furthermore, the same effect can be obtained even if the material is formed by attaching a colored paint or the like instead of such a material.

[0043]

[Effect of the invention] As is clear from the above explanation,
According to the semiconductor device according to the present invention, it is possible to obtain a semiconductor device including a housing having excellent moisture resistance.

[Brief explanation of the drawing]

FIG. 1A shows a plan view of a solid-state imaging device which is an embodiment of a semiconductor device according to the present invention. Further, (b) shows a cross-sectional view taken along the line Ib-Ib in (a).

FIG. 2 is a plan view of another embodiment of the semiconductor device according to the present invention.

FIG. 3 is a plan view showing an example of a conventional solid-state imaging device.

[Explanation of symbols]

1 Frame 2 Recessed part 3. Solid-state imaging chip 5 Bonding wire 6A External lead 7 Glass substrate 8 Index mark

Claims (3)

[Claims] 1. A semiconductor device comprising a semiconductor chip, a resin housing housing the semiconductor chip, and external leads protruding from the housing and electrically connected to electrodes of the semiconductor chip. A semiconductor device, wherein index means for determining the direction of the device itself is provided on the surface of the casing, wherein the index means is a mark. [Claim 2] The invention according to claim 1, wherein the surface of the casing has a matte finish, and the mark is formed by mirror finishing a part of the matte finish. semiconductor devices. 3. In the invention as set forth in claim 2, the semiconductor device comprises a solid-state imaging device, and its casing includes a frame made of a resin material in which a recess is formed in a portion where the solid-state imaging chip is mounted; 1. A semiconductor device comprising: a transparent plate facing the main surface of a solid-state imaging chip and closing the recessed portion.