JPH0422024B2 - - Google Patents

Info

Publication number
JPH0422024B2
JPH0422024B2 JP58243955A JP24395583A JPH0422024B2 JP H0422024 B2 JPH0422024 B2 JP H0422024B2 JP 58243955 A JP58243955 A JP 58243955A JP 24395583 A JP24395583 A JP 24395583A JP H0422024 B2 JPH0422024 B2 JP H0422024B2
Authority
JP
Japan
Prior art keywords
chip
liquid
electronic components
cooling device
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58243955A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60136350A (ja
Inventor
Shigeki Hirasawa
Takahiro Ooguro
Tadakatsu Nakajima
Noryuki Ashiwake
Hisashi Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58243955A priority Critical patent/JPS60136350A/ja
Publication of JPS60136350A publication Critical patent/JPS60136350A/ja
Publication of JPH0422024B2 publication Critical patent/JPH0422024B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58243955A 1983-12-26 1983-12-26 電子部品の冷却装置 Granted JPS60136350A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58243955A JPS60136350A (ja) 1983-12-26 1983-12-26 電子部品の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58243955A JPS60136350A (ja) 1983-12-26 1983-12-26 電子部品の冷却装置

Publications (2)

Publication Number Publication Date
JPS60136350A JPS60136350A (ja) 1985-07-19
JPH0422024B2 true JPH0422024B2 (show.php) 1992-04-15

Family

ID=17111520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58243955A Granted JPS60136350A (ja) 1983-12-26 1983-12-26 電子部品の冷却装置

Country Status (1)

Country Link
JP (1) JPS60136350A (show.php)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201303643D0 (en) * 2013-03-01 2013-04-17 Iceotope Ltd Cooling system with redundancy

Also Published As

Publication number Publication date
JPS60136350A (ja) 1985-07-19

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