JPH04219996A - Housing structure for circuit board into case - Google Patents
Housing structure for circuit board into caseInfo
- Publication number
- JPH04219996A JPH04219996A JP40452990A JP40452990A JPH04219996A JP H04219996 A JPH04219996 A JP H04219996A JP 40452990 A JP40452990 A JP 40452990A JP 40452990 A JP40452990 A JP 40452990A JP H04219996 A JPH04219996 A JP H04219996A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- case
- insulating sheet
- inner peripheral
- peripheral surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract description 25
- 229920003002 synthetic resin Polymers 0.000 claims description 9
- 239000000057 synthetic resin Substances 0.000 claims description 9
- 125000006850 spacer group Chemical group 0.000 abstract description 11
- 230000035939 shock Effects 0.000 abstract 1
- 238000005452 bending Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、電子部品を実装した回
路基板を、回路基板とケースの内周面との間に絶縁シー
トを介装した形でケース内に納装する回路基板のケース
への収納構造に関するものである。[Industrial Application Field] The present invention relates to a circuit board case in which a circuit board on which electronic components are mounted is housed within the case with an insulating sheet interposed between the circuit board and the inner peripheral surface of the case. This relates to the storage structure for the.
【０００２】0002
【従来の技術】従来より、図８に示すように、電子部品
３を実装したプリント基板よりなる回路基板２を金属製
のケース１に納装する際には、回路基板２の導電部とケ
ース１とが直接接触することを防止するために、ケース
１の内周面と回路基板２との間に合成樹脂よりなる絶縁
シート４を介在させるのが一般的である。また、回路基
板２の導電部とケース１との間の電気的絶縁性能を確保
するには、回路基板２とケース１とを離間させて配置す
るためのスペーサが必要になる。2. Description of the Related Art Conventionally, as shown in FIG. 8, when a circuit board 2 consisting of a printed circuit board on which electronic components 3 are mounted is packaged in a metal case 1, the conductive parts of the circuit board 2 and the case are In order to prevent direct contact between the case 1 and the circuit board 2, an insulating sheet 4 made of synthetic resin is generally interposed between the inner peripheral surface of the case 1 and the circuit board 2. Furthermore, in order to ensure electrical insulation performance between the conductive portion of the circuit board 2 and the case 1, a spacer is required to space the circuit board 2 and the case 1 apart.
【０００３】スペーサとしては、ロッキングサポートと
称する合成樹脂製の固定具１１を採用することが多い。
この固定具１１は、軸部１１ａの両端部に、それぞれ拡
縮自在な傘状の外側保持部１１ｂと外側保持部１１ｂに
対向する内側保持部１１ｃとを一体に形成したものであ
る。したがって、対象物に形成された透孔に外側保持部
１１ｂを挿通すると、外側保持部１１ｂと内側保持部１
１ｃとの間で対象物が挟持されるのである。ケース１と
回路基板２との間のスペーサとして用いるには、ケース
１と回路基板２とにそれぞれ透孔を形成して、軸部１１
ａの両端にそれぞれ設けた外側保持部１１ａと内側保持
部１１ｂとの間に、ケース１と回路基板２とをそれぞれ
挟持すれば、軸部１１ａの長さ分だけケース１と回路基
板２とを離間させることができるのである。[0003] As the spacer, a synthetic resin fixture 11 called a locking support is often used. This fixture 11 has an umbrella-shaped outer holding part 11b that can be expanded and contracted, and an inner holding part 11c that faces the outer holding part 11b, which are integrally formed at both ends of a shaft part 11a. Therefore, when the outer holding part 11b is inserted into the through hole formed in the object, the outer holding part 11b and the inner holding part 1
The object is held between the two parts 1c and 1c. In order to use it as a spacer between the case 1 and the circuit board 2, a through hole is formed in the case 1 and the circuit board 2, respectively, and the shaft part 11
If the case 1 and the circuit board 2 are held between the outer holding part 11a and the inner holding part 11b provided at both ends of the shaft part 11a, the case 1 and the circuit board 2 can be held by the length of the shaft part 11a. It is possible to separate them.
【０００４】他のスペーサとしては、図９に示すように
、ゴム等の弾性材料により形成された支持台１２もある
。この支持台１２は、回路基板２の要所に固着され、ケ
ース１の底面上に載置されることにより、ケース１と回
路基板２との間の距離を保つようになっている。ケース
１の内周面の要所には切り起こして形成された押さえ片
１３が突設され、回路基板２において支持台１２とは反
対側の面の周部に押さえ片１３を当接させることにより
、回路基板２がケース１の底面から浮き上がらないよう
にしてある。Another spacer, as shown in FIG. 9, is a support base 12 made of an elastic material such as rubber. This support stand 12 is fixed to important points of the circuit board 2 and placed on the bottom surface of the case 1 to maintain a distance between the case 1 and the circuit board 2. Holding pieces 13 formed by cutting and raising are protrudingly provided at important points on the inner peripheral surface of the case 1, and the holding pieces 13 are brought into contact with the circumferential portion of the surface of the circuit board 2 on the opposite side from the support stand 12. This prevents the circuit board 2 from lifting off the bottom surface of the case 1.
【０００５】さらに、図１０に示すように、合成樹脂の
ような絶縁材料により形成された保持基台１４をスペー
サとして用いることもある。保持基台１４は、回路基板
２の裏面を全面に亙って覆う台板１４ａと、台板１４ａ
の周縁より回路基板２の裏面に直交して立ち上がる保持
片１４ｂとを一体に形成したものである。保持片１４ｂ
は回路基板２の周縁に当接するように立ち上がり、保持
片１４ｂの要所には台板１４ａとの間に回路基板２の周
部を挟持する保持爪１４ｃが突設されている。したがっ
て、保持片１４ｂに囲まれた部位に回路基板２を挿入す
れば保持基台１４に回路基板２が装着され、回路基板２
を装着した保持基台１４をケース１に納装すれば、回路
基板２の保持と絶縁とを同時に行うことができるのであ
る。また、台板１４ａの周面にはケース１に係合する取
付爪１４ｅが突設されている。ここに、台板１４ａには
回路基板２に実装された電子部品のリードに合わせて溝
部１４ｄが形成されている。また、この構成では、当然
のことながら絶縁シートは不要になっている。Furthermore, as shown in FIG. 10, a holding base 14 made of an insulating material such as synthetic resin may be used as a spacer. The holding base 14 includes a base plate 14a that covers the entire back surface of the circuit board 2, and a base plate 14a.
A holding piece 14b that stands up from the periphery of the circuit board 2 perpendicularly to the back surface of the circuit board 2 is integrally formed. Holding piece 14b
stands up so as to come into contact with the periphery of the circuit board 2, and holding claws 14c are protruded from key points of the holding piece 14b to hold the periphery of the circuit board 2 between the holding piece 14b and the base plate 14a. Therefore, if the circuit board 2 is inserted into the area surrounded by the holding piece 14b, the circuit board 2 is mounted on the holding base 14, and the circuit board 2
If the holding base 14 equipped with the circuit board 2 is placed in the case 1, the circuit board 2 can be held and insulated at the same time. Moreover, a mounting claw 14e that engages with the case 1 is provided on the peripheral surface of the base plate 14a. Here, groove portions 14d are formed in the base plate 14a to match the leads of electronic components mounted on the circuit board 2. Furthermore, with this configuration, an insulating sheet is naturally unnecessary.
【０００６】[0006]
【発明が解決しようとする課題】図８の構成では、ロッ
キングサポートなどの固定具１１をスペーサとして用い
るいるから、軸部１１ａの長さを大きくとれば、ケース
１と回路基板２との間の絶縁性能は確保され、また、ケ
ース１と回路基板２とが軸部１１ａで連結されているだ
けであるから、軸部１１ａを柔軟に形成しておけばケー
ス１に衝撃力が加わっても回路基板２には伝達されず、
回路基板２の破損が防止できるのである。反面、回路基
板２が大きくなると、固定具１１が複数個必要になり、
コスト高になるとともに、固定具１１の取付に要する工
数が多くなるという問題がある。[Problems to be Solved by the Invention] In the configuration shown in FIG. 8, since the fixture 11 such as a locking support is used as a spacer, if the length of the shaft portion 11a is increased, the distance between the case 1 and the circuit board 2 will be reduced. Insulation performance is ensured, and since the case 1 and the circuit board 2 are only connected by the shaft portion 11a, if the shaft portion 11a is made flexible, even if an impact force is applied to the case 1, the circuit will not be damaged. It is not transmitted to the substrate 2,
Damage to the circuit board 2 can be prevented. On the other hand, as the circuit board 2 becomes larger, a plurality of fixtures 11 are required.
There are problems in that the cost increases and the number of man-hours required to attach the fixture 11 increases.
【０００７】図９の構成でも、回路基板２が大きくなる
と、複数個の支持台１２が必要になってコスト高につな
がり、取付に要する工数が多くなるという問題がある。
さらに、図１０の構成では、１枚の回路基板２に対して
保持基台１４が１つであるから、図８や図９の構成に比
較して工数が削減されるが、回路基板２の仕様に対応す
るような溝部１４ｄを台板１４ａに形成しなければなら
ないから、コスト高になるという問題がある。Even with the configuration shown in FIG. 9, there is a problem that when the circuit board 2 becomes large, a plurality of support stands 12 are required, which leads to an increase in cost and an increase in the number of man-hours required for installation. Furthermore, in the configuration of FIG. 10, since there is one holding base 14 for one circuit board 2, the number of man-hours is reduced compared to the configurations of FIGS. 8 and 9; Since the groove portion 14d must be formed in the base plate 14a in accordance with the specifications, there is a problem in that the cost is high.
【０００８】また、図９および図１０の構成では、支持
台１２や保持基台１４が比較的硬質であって、ケース１
に加わる衝撃力をあまり緩和することができないから、
ケース１が落下したときなどには、回路基板２に衝撃力
が加わって回路基板２が破損することもある。本発明は
上述の問題点を解決することを目的とするものであり、
ケースと回路基板との間のスペーサを比較的安価に設け
るとともに、ケースの落下等により生じる衝撃力を緩和
して回路基板の破損を防止した回路基板のケースへの収
納構造を提供しようとするものである。Furthermore, in the configurations shown in FIGS. 9 and 10, the support base 12 and the holding base 14 are relatively hard, and the case 1
Because it is not possible to reduce the impact force applied to the
When the case 1 is dropped, an impact force is applied to the circuit board 2 and the circuit board 2 may be damaged. The present invention aims to solve the above-mentioned problems,
An object of the present invention is to provide a structure for storing a circuit board in a case, which provides a spacer between the case and the circuit board at a relatively low cost, and prevents damage to the circuit board by mitigating the impact force caused by dropping the case, etc. It is.
【０００９】[0009]
【課題を解決するための手段】本発明では、上記目的を
達成するために、電子部品を実装した回路基板とケース
の内周面との間に絶縁シートを介在させるとともに、ケ
ースの内周面から回路基板を離間させた形で回路基板を
ケース内に納装する回路基板のケースへの収納構造にお
いて、絶縁シートは回路基板の周部の要所が載置される
段部を有した形状に合成樹脂によって形成され、ケース
と絶縁シートとの少なくともいずれか一方には、段部と
の間で回路基板の周部を挟持する押さえ片が形成されて
いるのである。[Means for Solving the Problems] In order to achieve the above object, in the present invention, an insulating sheet is interposed between the circuit board on which electronic components are mounted and the inner circumferential surface of the case, and the inner circumferential surface of the case In a circuit board storage structure in which the circuit board is stored in the case with the circuit board separated from the circuit board, the insulating sheet has a stepped part on which key points around the circuit board are placed. The case is made of synthetic resin, and at least one of the case and the insulating sheet is provided with a holding piece that holds the peripheral portion of the circuit board between the stepped portion and the holding piece.
【００１０】0010
【作用】上記構成によれば、ケースの内周面と回路基板
との間に介在する絶縁シートに段部を形成し、段部の上
に回路基板の周部を載置することによって、ケースの内
周面と回路基板との間を離間させているので、ケースの
内周面と回路基板との間を離間させるスペーサとして別
部材を設ける必要がなく、コストの増加を抑制すること
ができ、また、ケースに回路基板を納装する際の工数も
少なくなるのである。さらに、絶縁シートは薄肉の合成
樹脂であって柔軟性を有しているから、ケースの落下等
によってケースに衝撃力が作用しても、回路基板に加わ
る力を緩和することができ、回路基板の破損を防止する
ことができるのである。[Operation] According to the above structure, a step is formed in the insulating sheet interposed between the inner peripheral surface of the case and the circuit board, and the peripheral part of the circuit board is placed on the step. Since the inner peripheral surface of the case and the circuit board are spaced apart, there is no need to provide a separate member as a spacer to separate the inner peripheral surface of the case and the circuit board, and an increase in cost can be suppressed. Moreover, the number of man-hours required for mounting the circuit board in the case is also reduced. Furthermore, since the insulating sheet is made of thin synthetic resin and has flexibility, even if impact force is applied to the case due to a fall, etc., it can reduce the force applied to the circuit board. This can prevent damage to the product.
【００１１】[0011]
【実施例】（実施例１）図１に示すように、金属製のケ
ース１に電子部品３を実装したプリント基板よりなる回
路基板２が納装される。ケース１の内周面と回路基板２
との間には、薄肉の合成樹脂により形成された絶縁シー
ト４が介装される。絶縁シート４には回路基板２の周部
を載置することができる段部４ａが形成されている。す
なわち、段部４ａは、回路基板２の両側部を支持できる
ように２個所に形成される（図２参照）。ここにおいて
、段部４ａの高さ寸法Ｈを、回路基板２に実装された各
電子部品３のリード線の最大長さよりも大きく設定して
おけば、ケース１の内周面と回路基板２との間が離間さ
れて絶縁性能が保たれることになる。また、回路基板２
を段部４ａの上に載置しただけでは回路基板２が浮き上
がるから、ケース１の要所には、段部４ａとの間で回路
基板１の周部を挟持する押さえ片５が切り起こされる。Embodiment Embodiment 1 As shown in FIG. 1, a circuit board 2 made of a printed circuit board on which electronic components 3 are mounted is placed in a metal case 1. Inner peripheral surface of case 1 and circuit board 2
An insulating sheet 4 made of thin synthetic resin is interposed between the two. The insulating sheet 4 has a stepped portion 4a on which the peripheral portion of the circuit board 2 can be placed. That is, the step portions 4a are formed at two locations so as to be able to support both sides of the circuit board 2 (see FIG. 2). Here, if the height dimension H of the stepped portion 4a is set larger than the maximum length of the lead wire of each electronic component 3 mounted on the circuit board 2, the inner peripheral surface of the case 1 and the circuit board 2 can be This will maintain the insulation performance. In addition, the circuit board 2
If the circuit board 2 is simply placed on the stepped portion 4a, the circuit board 2 will rise, so presser pieces 5 are cut and raised at key points of the case 1 to sandwich the circumferential portion of the circuit board 1 between the stepped portion 4a and the stepped portion 4a. .
【００１２】絶縁シート４の段部４ａの高さＨと幅Ｗと
は（図３参照）、Ｈ＝Ｗとなるように設定するのが望ま
しい。これは、段部４ａを曲げ加工によって形成する際
に、高さＨと幅Ｗとに寸法差があると、寸法の大きい方
が撓みやすくなり、段部４ａの角を直角に折曲するのが
難しくなるからである。Ｈ＝Ｗという条件が満たされて
いれば、段部４ａの角を直角に折曲するのが容易になり
、回路基板２の支持強度を高くとることができるのであ
る。The height H and width W of the stepped portion 4a of the insulating sheet 4 (see FIG. 3) are preferably set so that H=W. This is because when forming the stepped portion 4a by bending, if there is a size difference between the height H and the width W, the larger dimension will bend more easily, so it is difficult to bend the corner of the stepped portion 4a at a right angle. This is because it becomes difficult. If the condition H=W is satisfied, it becomes easy to bend the corner of the stepped portion 4a at right angles, and the supporting strength of the circuit board 2 can be increased.
【００１３】以上の構成によれば、絶縁シート４を成形
して段部４ａを形成しているから、部品点数の増加がな
いという利点がある。しかも、絶縁シート４に回路基板
２を載置して押さえ片５を切り起こすだけであるから、
工数も少ないのである。ここに、絶縁シート４は薄肉の
合成樹脂によって形成されているから柔軟性を有し、ケ
ース１に落下衝撃などが加わっても衝撃が緩和され、回
路基板２の破損が防止されるのである。According to the above structure, since the step portion 4a is formed by molding the insulating sheet 4, there is an advantage that the number of parts does not increase. Moreover, since it is only necessary to place the circuit board 2 on the insulating sheet 4 and cut and raise the holding piece 5,
It also requires less man-hours. Since the insulating sheet 4 is made of thin synthetic resin, it has flexibility, and even if the case 1 is subjected to a drop impact, the impact is alleviated and the circuit board 2 is prevented from being damaged.
【００１４】また、回路基板２が図４のように細長い矩
形状である場合には、回路基板２の長いほうの辺の全長
に亙って段部４ａを形成しておけば、回路基板２をあま
り撓ませずに支持することができるのである。押さえ片
５は必要に応じて適宜設ければよい。なお、上記実施例
においては図２のように直方体状のケース１を例示して
いるが、ケース１が円筒状など他の形状であっても本発
明の技術思想を採用し得るのはいうまでもない。また、
押さえ片５をケース１に形成しているが、絶縁シート４
に形成するようにしてもよい。Further, when the circuit board 2 has an elongated rectangular shape as shown in FIG. can be supported without bending too much. The holding piece 5 may be provided as appropriate. In the above embodiment, the case 1 has a rectangular parallelepiped shape as shown in FIG. 2, but it goes without saying that the technical idea of the present invention can be applied even if the case 1 has other shapes such as a cylindrical shape. Nor. Also,
Although the holding piece 5 is formed on the case 1, the insulating sheet 4
It may be formed as follows.
【００１５】（実施例２）実施例１では、回路基板２を
絶縁シート４に形成した段部４ａによってのみ支持して
いるものであるから、回路基板２の重量が大きいときに
は支持強度が確保できない場合がある。そのような場合
には、図５に示すように、段部４ａの下方においてケー
ス１に支持片６を切り起し、回路基板３の支持強度を高
めるようにすればよい。他の構成は実施例１と同様であ
るから説明を省略する。(Embodiment 2) In Embodiment 1, since the circuit board 2 is supported only by the stepped portion 4a formed on the insulating sheet 4, supporting strength cannot be ensured when the weight of the circuit board 2 is large. There are cases. In such a case, as shown in FIG. 5, a support piece 6 may be cut and raised on the case 1 below the step portion 4a to increase the support strength of the circuit board 3. The other configurations are the same as those in the first embodiment, so their explanation will be omitted.
【００１６】（実施例３）本実施例では、支持片６を、
図６に示すように、段部４ａの内側面に沿うように先端
部を略Ｌ形に折曲している。このような構成では、段部
４ａが金属によって裏打ちされることになり、支持強度
が一層高くなるのである。他の構成は実施例２と同じで
あるから説明を省略する。(Embodiment 3) In this embodiment, the support piece 6 is
As shown in FIG. 6, the tip portion is bent into a substantially L shape along the inner surface of the stepped portion 4a. In such a configuration, the step portion 4a is lined with metal, and the supporting strength is further increased. Since the other configurations are the same as those in the second embodiment, their explanation will be omitted.
【００１７】（実施例４）本実施例では、支持片６を設
ける代わりに、図７のように、ケース１の底部の両隅を
内側に折曲加工して、ケース１と絶縁シート４とに段部
１ａ、４ａを同時に形成することによって、絶縁シート
４の段部４ａの裏打ちがなされるようにしている。この
ような構成とする場合には、ケース１を折曲加工する前
に絶縁シート４をケース１の内周面に積層しておけば、
ケース１と絶縁シート４とを同時に折曲加工して段部４
ａを形成することができるから、加工が容易になるとい
う利点がある。ここに、ケース１と絶縁シート４との位
置ずれを防止するためには、ケース１と絶縁シート４と
を、接着剤または両面粘着テープによって固定しておく
のがよい。(Embodiment 4) In this embodiment, instead of providing the support piece 6, both corners of the bottom of the case 1 are bent inward as shown in FIG. By forming the step portions 1a and 4a at the same time, the step portion 4a of the insulating sheet 4 is lined. In such a configuration, if the insulating sheet 4 is laminated on the inner peripheral surface of the case 1 before bending the case 1,
The case 1 and the insulating sheet 4 are bent at the same time to form the step part 4.
Since it is possible to form a shape, there is an advantage that processing becomes easy. In order to prevent the case 1 and the insulating sheet 4 from being misaligned, it is preferable to fix the case 1 and the insulating sheet 4 with an adhesive or double-sided adhesive tape.
【００１８】[0018]
【発明の効果】本発明は上述のように、電子部品を実装
した回路基板とケースの内周面との間に絶縁シートを介
在させるとともに、ケースの内周面から回路基板を離間
させた形で回路基板をケース内に納装する回路基板のケ
ースへの収納構造において、ケースの内周面と回路基板
との間に介在する絶縁シートに段部を形成し、段部の上
に回路基板の周部を載置することによって、ケースの内
周面と回路基板との間を離間させ、ケースと絶縁シート
との少なくともいずれか一方に設けた押さえ片によって
回路基板の浮き上がりを防止しているので、ケースの内
周面と回路基板との間を離間させるスペーサとして別途
に部材を設ける必要がなく、コストの増加を抑制するこ
とができるという利点があり、また、ケースに回路基板
を納装する際の工数も少ないという利点がある。さらに
、絶縁シートは薄肉の合成樹脂であって柔軟性を有して
いるから、ケースの落下等によってケースに衝撃力が作
用しても、回路基板に加わるる力を緩和することができ
、回路基板の破損を防止することができるという効果を
奏するのである。[Effects of the Invention] As described above, the present invention has a structure in which an insulating sheet is interposed between the circuit board on which electronic components are mounted and the inner peripheral surface of the case, and the circuit board is spaced apart from the inner peripheral surface of the case. In a circuit board storage structure in which a circuit board is housed in a case, a step is formed on the insulating sheet interposed between the inner peripheral surface of the case and the circuit board, and the circuit board is placed on top of the step. By placing the peripheral part of the case, the inner peripheral surface of the case and the circuit board are spaced apart, and a holding piece provided on at least one of the case and the insulating sheet prevents the circuit board from lifting up. Therefore, there is no need to provide a separate member as a spacer to separate the inner peripheral surface of the case and the circuit board, which has the advantage of suppressing increases in cost. It has the advantage of requiring less man-hours. Furthermore, since the insulating sheet is made of thin synthetic resin and has flexibility, even if an impact force is applied to the case due to a fall, etc., it can reduce the force applied to the circuit board. This has the effect of preventing damage to the substrate.
【図１】実施例１を示す断面図である。FIG. 1 is a sectional view showing Example 1.
【図２】実施例１を示す平面図である。FIG. 2 is a plan view showing Example 1.
【図３】実施例１に用いる絶縁シートを示す側面図であ
る。FIG. 3 is a side view showing an insulating sheet used in Example 1.
【図４】実施例１において回路基板が細長い場合の平面
図である。FIG. 4 is a plan view of a case where the circuit board is elongated in Example 1.
【図５】実施例２を示す断面図である。FIG. 5 is a sectional view showing Example 2.
【図６】実施例３を示す断面図である。FIG. 6 is a cross-sectional view showing Example 3.
【図７】実施例４を示す断面図である。FIG. 7 is a cross-sectional view showing Example 4.
【図８】従来例を示す断面図である。FIG. 8 is a sectional view showing a conventional example.
【図９】他の従来例を示す断面図である。FIG. 9 is a sectional view showing another conventional example.
【図１０】さらに他の従来例を示す断面図である。FIG. 10 is a sectional view showing still another conventional example.
１ ケース ２ 回路基板 ３ 電子部品 ４ 絶縁シート ４ａ 段部 ５ 押さえ片 1 Case 2 Circuit board ３ Electronic parts 4 Insulating sheet 4a Stepped part 5 Holding piece
Claims (1)
の内周面との間に絶縁シートを介在させるとともに、ケ
ースの内周面から回路基板を離間させた形で回路基板を
ケース内に納装する回路基板のケースへの収納構造にお
いて、絶縁シートは回路基板の周部の要所が載置される
段部を有した形状に合成樹脂によって形成され、ケース
と絶縁シートとの少なくともいずれか一方には、段部と
の間で回路基板の周部を挟持する押さえ片が形成されて
成ることを特徴とする回路基板のケースへの収納構造。[Claim 1] An insulating sheet is interposed between the circuit board on which electronic components are mounted and the inner peripheral surface of the case, and the circuit board is housed in the case with the circuit board spaced apart from the inner peripheral surface of the case. In a structure for storing a circuit board to be installed in a case, the insulating sheet is made of synthetic resin and has a stepped part on which important parts of the circuit board are placed, and at least one of the case and the insulating sheet is A structure for storing a circuit board in a case, characterized in that a holding piece is formed on one side of the case and holds the peripheral part of the circuit board between the stepped part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2404529A JP2511574B2 (en) | 1990-12-20 | 1990-12-20 | Storage structure for circuit board in case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2404529A JP2511574B2 (en) | 1990-12-20 | 1990-12-20 | Storage structure for circuit board in case |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04219996A true JPH04219996A (en) | 1992-08-11 |
| JP2511574B2 JP2511574B2 (en) | 1996-06-26 |
Family
ID=18514194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2404529A Expired - Fee Related JP2511574B2 (en) | 1990-12-20 | 1990-12-20 | Storage structure for circuit board in case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2511574B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110258A (en) * | 2001-09-28 | 2003-04-11 | Nec Corp | Structure and method for preventing warpage of circuit board |
| US6841732B2 (en) | 2000-10-25 | 2005-01-11 | Nec Lcd Technologies, Ltd. | Protection structure of a circuit board and method for manufacturing the same |
| JP2009141162A (en) * | 2007-12-07 | 2009-06-25 | Hitachi Ltd | Circuit board and image display unit |
| JP2011197689A (en) * | 2011-05-26 | 2011-10-06 | Toshiba Corp | Display device and electronic equipment |
| WO2017145321A1 (en) * | 2016-02-25 | 2017-08-31 | 新電元工業株式会社 | Circuit board mounting structure and circuit board mounting method |
| WO2023054179A1 (en) * | 2021-09-30 | 2023-04-06 | 三菱電機株式会社 | Electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56121296U (en) * | 1980-02-15 | 1981-09-16 | ||
| JPS63157990U (en) * | 1987-04-06 | 1988-10-17 | ||
| JPS6420787U (en) * | 1987-07-28 | 1989-02-01 | ||
| JPH01114796A (en) * | 1987-10-29 | 1989-05-08 | Mitsubishi Electric Corp | Power supply equipment for coolant pump driving motor for nuclear power generation |
-
1990
- 1990-12-20 JP JP2404529A patent/JP2511574B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56121296U (en) * | 1980-02-15 | 1981-09-16 | ||
| JPS63157990U (en) * | 1987-04-06 | 1988-10-17 | ||
| JPS6420787U (en) * | 1987-07-28 | 1989-02-01 | ||
| JPH01114796A (en) * | 1987-10-29 | 1989-05-08 | Mitsubishi Electric Corp | Power supply equipment for coolant pump driving motor for nuclear power generation |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6841732B2 (en) | 2000-10-25 | 2005-01-11 | Nec Lcd Technologies, Ltd. | Protection structure of a circuit board and method for manufacturing the same |
| JP2003110258A (en) * | 2001-09-28 | 2003-04-11 | Nec Corp | Structure and method for preventing warpage of circuit board |
| JP2009141162A (en) * | 2007-12-07 | 2009-06-25 | Hitachi Ltd | Circuit board and image display unit |
| US8153903B2 (en) | 2007-12-07 | 2012-04-10 | Hitachi, Ltd. | Circuit board and image display apparatus |
| JP2011197689A (en) * | 2011-05-26 | 2011-10-06 | Toshiba Corp | Display device and electronic equipment |
| WO2017145321A1 (en) * | 2016-02-25 | 2017-08-31 | 新電元工業株式会社 | Circuit board mounting structure and circuit board mounting method |
| JPWO2017145321A1 (en) * | 2016-02-25 | 2018-03-01 | 新電元工業株式会社 | Circuit board mounting structure and circuit board mounting method |
| WO2023054179A1 (en) * | 2021-09-30 | 2023-04-06 | 三菱電機株式会社 | Electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2511574B2 (en) | 1996-06-26 |
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