JPH04219939A - Solder dropping device - Google Patents
Solder dropping deviceInfo
- Publication number
- JPH04219939A JPH04219939A JP2404189A JP40418990A JPH04219939A JP H04219939 A JPH04219939 A JP H04219939A JP 2404189 A JP2404189 A JP 2404189A JP 40418990 A JP40418990 A JP 40418990A JP H04219939 A JPH04219939 A JP H04219939A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- gas
- supply port
- dripping
- gas supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 52
- 238000002844 melting Methods 0.000 claims abstract description 11
- 230000008018 melting Effects 0.000 claims abstract description 11
- 239000003963 antioxidant agent Substances 0.000 claims description 22
- 230000003078 antioxidant effect Effects 0.000 claims description 22
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000003449 preventive effect Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、半導体製造工程などに
利用される半田滴下装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder dropping device used in semiconductor manufacturing processes and the like.
【０００２】0002
【従来の技術】従来、半田滴下装置においては、半田溶
融部を加熱することによって半田を溶融させ、加熱され
た酸化防止ガスによって満された搬送部内を送られてく
る被ボンディング材の上に半田を一定量滴下して供給し
、次のステージでＩＣチップをその半田により被ボンデ
ィング材上にボンディングするという工程を繰り返すこ
とによりボンディングを行なっている。[Prior Art] Conventionally, in a solder dripping device, the solder is melted by heating the solder melting part, and the solder is placed on the material to be bonded that is sent through a conveying part filled with heated antioxidant gas. Bonding is performed by repeating the process of supplying a fixed amount of solder in drops and bonding the IC chip onto the material to be bonded using the solder in the next stage.
【０００３】0003
【発明が解決しようとする課題】しかしながら上記従来
の半田滴下装置では、その装置の立上げ，停止に各々約
３０分必要であり、この時間の間に半田滴下部のノズル
の半田の酸化によるつまりを防止するために、酸化防止
ガスを搬送部を含む装置全体に流し続けなければならず
、ガスの消費量が多いという課題があった。However, in the conventional solder dripping device described above, it takes about 30 minutes to start up and stop the device, and during this time, the nozzle in the solder dripping part is clogged due to solder oxidation. In order to prevent this, the antioxidant gas must be continuously flowed through the entire device including the transport section, resulting in a problem of high gas consumption.
【０００４】本発明は上記従来の課題を解決するもので
あり、装置の立上げ、停止時に酸化防止ガスの消費量の
少ない半田滴下装置を提供することを目的とする。The present invention is intended to solve the above-mentioned conventional problems, and it is an object of the present invention to provide a solder dripping device that consumes less antioxidant gas when starting up and stopping the device.
【０００５】[0005]
【課題を解決するための手段】本発明は上記目的を達成
するために、下部に半田滴下部を有する半田溶融部と、
装置全体に酸化防止ガスを供給する第１のガス供給口と
、半田溶融部の半田滴下部に酸化防止ガスを供給する第
２のガス供給口と、酸化防止ガスの供給を制御する制御
部とを備えたものである。[Means for Solving the Problems] In order to achieve the above object, the present invention includes a solder melting part having a solder dripping part at the lower part;
A first gas supply port that supplies antioxidant gas to the entire device, a second gas supply port that supplies antioxidant gas to the solder dripping part of the solder melting part, and a control unit that controls the supply of antioxidant gas. It is equipped with the following.
【０００６】[0006]
【作用】したがって本発明によれば、半田滴下装置の立
上げ，停止時に半田の酸化を防ぐために、半田滴下部に
のみ酸化防止ガスを供給することができるため、酸化防
止ガスの消費量を減少させることができる。[Operation] Therefore, according to the present invention, in order to prevent solder from oxidizing when the solder dripping device is started up or stopped, the antioxidant gas can be supplied only to the solder dripping part, thereby reducing the consumption of the antioxidant gas. can be done.
【０００７】[0007]
【実施例】以下、本発明の一実施例を図１，図２および
図３を参照しながら説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1, 2, and 3.
【０００８】図１は本発明の一実施例における半田滴下
装置の構造を示すものであり、図において、１は炉、２
はその炉１を加熱するためのヒータであり、センサ３に
より炉１の温度は一定の温度に制御されている。炉１の
上部には半田溶融部４が設けられている。FIG. 1 shows the structure of a solder dropping device according to an embodiment of the present invention, and in the figure, 1 is a furnace, 2 is
is a heater for heating the furnace 1, and the temperature of the furnace 1 is controlled to a constant temperature by a sensor 3. A solder melting section 4 is provided in the upper part of the furnace 1.
【０００９】５は炉１全体に酸化防止ガスを供給する第
１のガス供給口、６は半田溶融部４の先端に設けられて
いる半田滴下部７（図２に図示）に酸化防止ガスを供給
する第２のガス供給口である。図では示されていないが
、第１のガス供給口５と第２の供給口６への酸化防止ガ
ス供給元には酸化防止ガスを制御するための制御部が設
けられている。Reference numeral 5 indicates a first gas supply port for supplying antioxidant gas to the entire furnace 1, and reference numeral 6 indicates a first gas supply port for supplying antioxidant gas to the solder dripping part 7 (shown in FIG. 2) provided at the tip of the solder melting section 4. This is the second gas supply port. Although not shown in the figure, a control unit for controlling the antioxidant gas is provided at the antioxidant gas supply source to the first gas supply port 5 and the second gas supply port 6.
【００１０】８は被ボンディング材９を搬送するための
プレート、１０はＩＣチップである。被ボンディング材
９は一定ピッチでプレート８の上に載置されており、プ
レート８を一定ピッチで送り、半田を被ボンディング材
９の上に滴下し、ＩＣチップ１０をその上に置くことに
より、被ボンディング材９とＩＣチップ１０をボンディ
ングする。[0010] Reference numeral 8 represents a plate for conveying the bonding material 9, and reference numeral 10 represents an IC chip. The material to be bonded 9 is placed on the plate 8 at a constant pitch, and by feeding the plate 8 at a constant pitch, dropping solder onto the material to be bonded 9, and placing the IC chip 10 on it, Bonding material 9 and IC chip 10 are bonded.
【００１１】図２は半田溶融部４の先端に設けられてい
る半田滴下部７の構造を示す断面図であり、半田滴下部
７は、酸化防止ガスに満された炉１の内部に露出して設
けてあり、半田溶融部４内にある溶融した半田１１は半
田滴下部７の小孔より下に滴下する。１２は半田滴下部
７に酸化防止ガスを供給するための管路であり、第２の
ガス供給口６とつながっている。FIG. 2 is a sectional view showing the structure of the solder dripping part 7 provided at the tip of the solder melting part 4. The solder dripping part 7 is exposed inside the furnace 1 filled with antioxidant gas. The melted solder 11 in the solder melting part 4 drips below the small hole of the solder dripping part 7. 12 is a conduit for supplying antioxidant gas to the solder dripping part 7, and is connected to the second gas supply port 6.
【００１２】図３は上記構成における本実例の半田滴下
装置を動作させる時のフローチャートを示すものであり
、このように上記実施例の構成および図３のフローチャ
ートに示す動作によれば、必要とする時にのみ酸化防止
ガスを半田滴下部７に第２のガス供給口６を介して供給
できる。したがって酸化防止ガスの使用量を節約するこ
とができ、ＩＣチップ１０の被ボンディング材９への効
率的なボンディングを行うことが可能となる。FIG. 3 shows a flowchart for operating the solder dripping device of this example with the above configuration, and as described above, according to the configuration of the above embodiment and the operation shown in the flowchart of FIG. Only occasionally can antioxidant gas be supplied to the solder dripping section 7 via the second gas supply port 6 . Therefore, the amount of antioxidant gas used can be saved, and the IC chip 10 can be efficiently bonded to the bonding target material 9.
【００１３】[0013]
【発明の効果】本発明は上記実施例より明らかなように
、半田滴下装置の立上げ，停止時に半田の酸化を防ぐた
めに半田滴下部にのみ酸化防止ガスを供給することによ
り酸化防止ガスの消費量を減少させ、コスト低減の効果
を発揮できるものである。Effects of the Invention As is clear from the above embodiments, the present invention reduces the consumption of antioxidant gas by supplying antioxidant gas only to the solder dripping part in order to prevent solder from oxidizing when the solder dripping device is started up and stopped. It is possible to reduce the amount and achieve the effect of cost reduction.
【図１】本発明の一実施例における半田滴下装置の要部
斜視図[Fig. 1] A perspective view of the main parts of a solder dripping device in an embodiment of the present invention.
【図２】同半田滴下装置の半田滴下部の断面図[Figure 2] Cross-sectional view of the solder dripping part of the same solder dripping device
【図３】
同半田滴下装置の動作時における酸化防止ガスの制御を
行うためのフローチャート[Figure 3]
Flowchart for controlling the antioxidant gas during operation of the solder dripping device
４ 半田溶融部 ５ 第１のガス供給口 ６ 第２のガス供給口 ７ 半田滴下部 １１ 半田 4 Solder melting part 5 First gas supply port 6 Second gas supply port 7 Solder dripping part 11 Solder
Claims (1)
装置全体に酸化防止ガスを供給する第１のガス供給口と
、前記半田溶融部の半田滴下部に酸化防止ガスを供給す
る第２のガス供給口と、酸化防止ガスの供給を制御する
制御部とを備えた半田滴下装置。Claim 1: A solder melting part having a solder dripping part at the lower part;
A first gas supply port that supplies antioxidant gas to the entire device, a second gas supply port that supplies antioxidant gas to the solder dripping portion of the solder melting part, and a control unit that controls the supply of antioxidant gas. Solder dripping device equipped with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2404189A JPH04219939A (en) | 1990-12-20 | 1990-12-20 | Solder dropping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2404189A JPH04219939A (en) | 1990-12-20 | 1990-12-20 | Solder dropping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04219939A true JPH04219939A (en) | 1992-08-11 |
Family
ID=18513884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2404189A Pending JPH04219939A (en) | 1990-12-20 | 1990-12-20 | Solder dropping device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04219939A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4899988A (en) * | 1972-03-30 | 1973-12-17 | ||
| JPS5049730A (en) * | 1973-07-09 | 1975-05-02 | ||
| JPS5749457A (en) * | 1980-05-20 | 1982-03-23 | Haemoneteitsukusu Corp | Suction type liquid collecting structure |
| JPS58109061A (en) * | 1981-12-21 | 1983-06-29 | フリ−ドリツヒ・ゲルト・ラウテルユング | Suction bottle for medical purpose |
| JPS611827A (en) * | 1984-06-12 | 1986-01-07 | Yamaha Motor Co Ltd | Intake apparatus of 2-cycle engine |
-
1990
- 1990-12-20 JP JP2404189A patent/JPH04219939A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4899988A (en) * | 1972-03-30 | 1973-12-17 | ||
| JPS5049730A (en) * | 1973-07-09 | 1975-05-02 | ||
| JPS5749457A (en) * | 1980-05-20 | 1982-03-23 | Haemoneteitsukusu Corp | Suction type liquid collecting structure |
| JPS58109061A (en) * | 1981-12-21 | 1983-06-29 | フリ−ドリツヒ・ゲルト・ラウテルユング | Suction bottle for medical purpose |
| JPS611827A (en) * | 1984-06-12 | 1986-01-07 | Yamaha Motor Co Ltd | Intake apparatus of 2-cycle engine |
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